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Global 3D TSV and 2.5D Market Research Report 2025
Synopsis
3D TSV or silicon through-hole technology is one of the important technologies used in the semiconductor industry.A silicon through-hole is an electrical connection that passes vertically through a stack of silicon wafers or chips.3D TSV replaces 2D packaging techniques such as lead bonding and flip chip.It is widely used to improve non-memory and CMOS logic functions and memory in electronic devices such as tablets, smartphones and televisions.TSV is an enhanced performance interconnection, made of a columnar structure of silicon, copper, tungsten or polysilicon, that can be electrically interlinked via silicon chips or wafers.In the 2.5d structure, the bare sheet is not assembled on the bare sheet.
The global 3D TSV and 2.5D market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for 3D TSV and 2.5D is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for 3D TSV and 2.5D is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for 3D TSV and 2.5D in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of 3D TSV and 2.5D include Toshiba, Taiwan Semiconductor, Samsung Electronics, Pure Storage, ASE Group, Amkor Technology, United Microelectronics, STMicroelectronics and Broadcom, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for 3D TSV and 2.5D, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D TSV and 2.5D.
Report Scope
The 3D TSV and 2.5D market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D TSV and 2.5D market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D TSV and 2.5D companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Toshiba
Taiwan Semiconductor
Samsung Electronics
Pure Storage
ASE Group
Amkor Technology
United Microelectronics
STMicroelectronics
Broadcom
Intel Corporation
Jiangsu Changing Electronics Technology
Segment by Type
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
Segment by Application
Consumer Electronics
Information and Communication Technology
Automotive
Military
Aerospace and Defense
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D TSV and 2.5D companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
3D TSV or silicon through-hole technology is one of the important technologies used in the semiconductor industry.A silicon through-hole is an electrical connection that passes vertically through a stack of silicon wafers or chips.3D TSV replaces 2D packaging techniques such as lead bonding and flip chip.It is widely used to improve non-memory and CMOS logic functions and memory in electronic devices such as tablets, smartphones and televisions.TSV is an enhanced performance interconnection, made of a columnar structure of silicon, copper, tungsten or polysilicon, that can be electrically interlinked via silicon chips or wafers.In the 2.5d structure, the bare sheet is not assembled on the bare sheet.
The global 3D TSV and 2.5D market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for 3D TSV and 2.5D is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for 3D TSV and 2.5D is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for 3D TSV and 2.5D in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of 3D TSV and 2.5D include Toshiba, Taiwan Semiconductor, Samsung Electronics, Pure Storage, ASE Group, Amkor Technology, United Microelectronics, STMicroelectronics and Broadcom, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for 3D TSV and 2.5D, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D TSV and 2.5D.
Report Scope
The 3D TSV and 2.5D market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D TSV and 2.5D market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D TSV and 2.5D companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Toshiba
Taiwan Semiconductor
Samsung Electronics
Pure Storage
ASE Group
Amkor Technology
United Microelectronics
STMicroelectronics
Broadcom
Intel Corporation
Jiangsu Changing Electronics Technology
Segment by Type
Memory
MEMS
CMOS Image Sensors
Imaging and Optoelectronics
Advanced LED Packaging
Others
Segment by Application
Consumer Electronics
Information and Communication Technology
Automotive
Military
Aerospace and Defense
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D TSV and 2.5D companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 3D TSV and 2.5D Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Memory
1.2.3 MEMS
1.2.4 CMOS Image Sensors
1.2.5 Imaging and Optoelectronics
1.2.6 Advanced LED Packaging
1.2.7 Others
1.3 Market by Application
1.3.1 Global 3D TSV and 2.5D Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Information and Communication Technology
1.3.4 Automotive
1.3.5 Military
1.3.6 Aerospace and Defense
1.3.7 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 3D TSV and 2.5D Market Perspective (2019-2030)
2.2 3D TSV and 2.5D Growth Trends by Region
2.2.1 Global 3D TSV and 2.5D Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 3D TSV and 2.5D Historic Market Size by Region (2019-2024)
2.2.3 3D TSV and 2.5D Forecasted Market Size by Region (2025-2030)
2.3 3D TSV and 2.5D Market Dynamics
2.3.1 3D TSV and 2.5D Industry Trends
2.3.2 3D TSV and 2.5D Market Drivers
2.3.3 3D TSV and 2.5D Market Challenges
2.3.4 3D TSV and 2.5D Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top 3D TSV and 2.5D Players by Revenue
3.1.1 Global Top 3D TSV and 2.5D Players by Revenue (2019-2024)
3.1.2 Global 3D TSV and 2.5D Revenue Market Share by Players (2019-2024)
3.2 Global 3D TSV and 2.5D Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 3D TSV and 2.5D Revenue
3.4 Global 3D TSV and 2.5D Market Concentration Ratio
3.4.1 Global 3D TSV and 2.5D Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 3D TSV and 2.5D Revenue in 2023
3.5 3D TSV and 2.5D Key Players Head office and Area Served
3.6 Key Players 3D TSV and 2.5D Product Solution and Service
3.7 Date of Enter into 3D TSV and 2.5D Market
3.8 Mergers & Acquisitions, Expansion Plans
4 3D TSV and 2.5D Breakdown Data by Type
4.1 Global 3D TSV and 2.5D Historic Market Size by Type (2019-2024)
4.2 Global 3D TSV and 2.5D Forecasted Market Size by Type (2025-2030)
5 3D TSV and 2.5D Breakdown Data by Application
5.1 Global 3D TSV and 2.5D Historic Market Size by Application (2019-2024)
5.2 Global 3D TSV and 2.5D Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America 3D TSV and 2.5D Market Size (2019-2030)
6.2 North America 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America 3D TSV and 2.5D Market Size by Country (2019-2024)
6.4 North America 3D TSV and 2.5D Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 3D TSV and 2.5D Market Size (2019-2030)
7.2 Europe 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe 3D TSV and 2.5D Market Size by Country (2019-2024)
7.4 Europe 3D TSV and 2.5D Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 3D TSV and 2.5D Market Size (2019-2030)
8.2 Asia-Pacific 3D TSV and 2.5D Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific 3D TSV and 2.5D Market Size by Region (2019-2024)
8.4 Asia-Pacific 3D TSV and 2.5D Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 3D TSV and 2.5D Market Size (2019-2030)
9.2 Latin America 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America 3D TSV and 2.5D Market Size by Country (2019-2024)
9.4 Latin America 3D TSV and 2.5D Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 3D TSV and 2.5D Market Size (2019-2030)
10.2 Middle East & Africa 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa 3D TSV and 2.5D Market Size by Country (2019-2024)
10.4 Middle East & Africa 3D TSV and 2.5D Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Toshiba
11.1.1 Toshiba Company Detail
11.1.2 Toshiba Business Overview
11.1.3 Toshiba 3D TSV and 2.5D Introduction
11.1.4 Toshiba Revenue in 3D TSV and 2.5D Business (2019-2024)
11.1.5 Toshiba Recent Development
11.2 Taiwan Semiconductor
11.2.1 Taiwan Semiconductor Company Detail
11.2.2 Taiwan Semiconductor Business Overview
11.2.3 Taiwan Semiconductor 3D TSV and 2.5D Introduction
11.2.4 Taiwan Semiconductor Revenue in 3D TSV and 2.5D Business (2019-2024)
11.2.5 Taiwan Semiconductor Recent Development
11.3 Samsung Electronics
11.3.1 Samsung Electronics Company Detail
11.3.2 Samsung Electronics Business Overview
11.3.3 Samsung Electronics 3D TSV and 2.5D Introduction
11.3.4 Samsung Electronics Revenue in 3D TSV and 2.5D Business (2019-2024)
11.3.5 Samsung Electronics Recent Development
11.4 Pure Storage
11.4.1 Pure Storage Company Detail
11.4.2 Pure Storage Business Overview
11.4.3 Pure Storage 3D TSV and 2.5D Introduction
11.4.4 Pure Storage Revenue in 3D TSV and 2.5D Business (2019-2024)
11.4.5 Pure Storage Recent Development
11.5 ASE Group
11.5.1 ASE Group Company Detail
11.5.2 ASE Group Business Overview
11.5.3 ASE Group 3D TSV and 2.5D Introduction
11.5.4 ASE Group Revenue in 3D TSV and 2.5D Business (2019-2024)
11.5.5 ASE Group Recent Development
11.6 Amkor Technology
11.6.1 Amkor Technology Company Detail
11.6.2 Amkor Technology Business Overview
11.6.3 Amkor Technology 3D TSV and 2.5D Introduction
11.6.4 Amkor Technology Revenue in 3D TSV and 2.5D Business (2019-2024)
11.6.5 Amkor Technology Recent Development
11.7 United Microelectronics
11.7.1 United Microelectronics Company Detail
11.7.2 United Microelectronics Business Overview
11.7.3 United Microelectronics 3D TSV and 2.5D Introduction
11.7.4 United Microelectronics Revenue in 3D TSV and 2.5D Business (2019-2024)
11.7.5 United Microelectronics Recent Development
11.8 STMicroelectronics
11.8.1 STMicroelectronics Company Detail
11.8.2 STMicroelectronics Business Overview
11.8.3 STMicroelectronics 3D TSV and 2.5D Introduction
11.8.4 STMicroelectronics Revenue in 3D TSV and 2.5D Business (2019-2024)
11.8.5 STMicroelectronics Recent Development
11.9 Broadcom
11.9.1 Broadcom Company Detail
11.9.2 Broadcom Business Overview
11.9.3 Broadcom 3D TSV and 2.5D Introduction
11.9.4 Broadcom Revenue in 3D TSV and 2.5D Business (2019-2024)
11.9.5 Broadcom Recent Development
11.10 Intel Corporation
11.10.1 Intel Corporation Company Detail
11.10.2 Intel Corporation Business Overview
11.10.3 Intel Corporation 3D TSV and 2.5D Introduction
11.10.4 Intel Corporation Revenue in 3D TSV and 2.5D Business (2019-2024)
11.10.5 Intel Corporation Recent Development
11.11 Jiangsu Changing Electronics Technology
11.11.1 Jiangsu Changing Electronics Technology Company Detail
11.11.2 Jiangsu Changing Electronics Technology Business Overview
11.11.3 Jiangsu Changing Electronics Technology 3D TSV and 2.5D Introduction
11.11.4 Jiangsu Changing Electronics Technology Revenue in 3D TSV and 2.5D Business (2019-2024)
11.11.5 Jiangsu Changing Electronics Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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