The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Global BGA Packaging Solder Ball Market Research Report 2025
Synopsis
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial role in connecting the integrated circuit to the printed circuit board (PCB).
The global BGA Packaging Solder Ball market was valued at US$ 154.3 million in 2023 and is anticipated to reach US$ 236.3 million by 2030, witnessing a CAGR of 6.2% during the forecast period 2024-2030.
Market Drivers: Miniaturization of Electronic Devices: The trend toward smaller and more compact electronic devices, such as smartphones, tablets, and wearables, drives the demand for BGA packaging with solder balls. BGA offers a high pin count in a smaller footprint, making it suitable for miniaturized electronics.
Increasing Demand for High-Performance Computing: Growing demand for high-performance computing, data centers, and graphics processing units (GPUs) fuels the adoption of advanced packaging solutions like BGA. Solder balls contribute to the reliability and thermal performance of these high-power components.
Advancements in Semiconductor Technology: Ongoing advancements in semiconductor manufacturing technologies, including finer pitch and higher pin counts, necessitate the development of solder balls with improved materials and manufacturing processes to meet the requirements of next-generation electronic devices.
Rise in Internet of Things (IoT) Devices: The proliferation of IoT devices, which require compact and efficient packaging solutions, boosts the demand for BGA packaging with solder balls. BGA technology supports the integration of sensors and processors in small form factors.
Consumer Electronics Industry Growth: The consumer electronics industry's continual growth, driven by innovations in smartphones, laptops, gaming consoles, and other electronic gadgets, contributes significantly to the demand for BGA packaging solder balls.
Market Restrictions: Cost and Complexity of Manufacturing: The manufacturing processes involved in producing BGA packaging with solder balls can be complex and may require advanced equipment. The associated costs, including material and manufacturing expenses, could be a limitation for some manufacturers or applications.
Stringent Quality and Compliance Standards: Industries such as aerospace and automotive have stringent quality and compliance standards. Meeting these standards, including requirements for high-reliability solder joints, can be challenging and may act as a restriction for certain applications.
This report aims to provide a comprehensive presentation of the global market for BGA Packaging Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Packaging Solder Ball.
Report Scope
The BGA Packaging Solder Ball market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global BGA Packaging Solder Ball market comprehensively. Regional market sizes, concerning products by Diameter, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the BGA Packaging Solder Ball manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Diameter, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
Segment by Diameter
Up to 0.2 mm
0.2-0.5 mm
Above 0.5 mm
Segment by Application
IDM
OSAT
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Diameter, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of BGA Packaging Solder Ball manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of BGA Packaging Solder Ball by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of BGA Packaging Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Diameter, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial role in connecting the integrated circuit to the printed circuit board (PCB).
The global BGA Packaging Solder Ball market was valued at US$ 154.3 million in 2023 and is anticipated to reach US$ 236.3 million by 2030, witnessing a CAGR of 6.2% during the forecast period 2024-2030.
Market Drivers: Miniaturization of Electronic Devices: The trend toward smaller and more compact electronic devices, such as smartphones, tablets, and wearables, drives the demand for BGA packaging with solder balls. BGA offers a high pin count in a smaller footprint, making it suitable for miniaturized electronics.
Increasing Demand for High-Performance Computing: Growing demand for high-performance computing, data centers, and graphics processing units (GPUs) fuels the adoption of advanced packaging solutions like BGA. Solder balls contribute to the reliability and thermal performance of these high-power components.
Advancements in Semiconductor Technology: Ongoing advancements in semiconductor manufacturing technologies, including finer pitch and higher pin counts, necessitate the development of solder balls with improved materials and manufacturing processes to meet the requirements of next-generation electronic devices.
Rise in Internet of Things (IoT) Devices: The proliferation of IoT devices, which require compact and efficient packaging solutions, boosts the demand for BGA packaging with solder balls. BGA technology supports the integration of sensors and processors in small form factors.
Consumer Electronics Industry Growth: The consumer electronics industry's continual growth, driven by innovations in smartphones, laptops, gaming consoles, and other electronic gadgets, contributes significantly to the demand for BGA packaging solder balls.
Market Restrictions: Cost and Complexity of Manufacturing: The manufacturing processes involved in producing BGA packaging with solder balls can be complex and may require advanced equipment. The associated costs, including material and manufacturing expenses, could be a limitation for some manufacturers or applications.
Stringent Quality and Compliance Standards: Industries such as aerospace and automotive have stringent quality and compliance standards. Meeting these standards, including requirements for high-reliability solder joints, can be challenging and may act as a restriction for certain applications.
This report aims to provide a comprehensive presentation of the global market for BGA Packaging Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Packaging Solder Ball.
Report Scope
The BGA Packaging Solder Ball market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global BGA Packaging Solder Ball market comprehensively. Regional market sizes, concerning products by Diameter, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the BGA Packaging Solder Ball manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Diameter, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
Segment by Diameter
Up to 0.2 mm
0.2-0.5 mm
Above 0.5 mm
Segment by Application
IDM
OSAT
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Diameter, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of BGA Packaging Solder Ball manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of BGA Packaging Solder Ball by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of BGA Packaging Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Diameter, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 BGA Packaging Solder Ball Market Overview
1.1 Product Definition
1.2 BGA Packaging Solder Ball Segment by Diameter
1.2.1 Global BGA Packaging Solder Ball Market Value Growth Rate Analysis by Diameter 2023 VS 2030
1.2.2 Up to 0.2 mm
1.2.3 0.2-0.5 mm
1.2.4 Above 0.5 mm
1.3 BGA Packaging Solder Ball Segment by Application
1.3.1 Global BGA Packaging Solder Ball Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IDM
1.3.3 OSAT
1.4 Global Market Growth Prospects
1.4.1 Global BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global BGA Packaging Solder Ball Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global BGA Packaging Solder Ball Production Estimates and Forecasts (2019-2030)
1.4.4 Global BGA Packaging Solder Ball Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global BGA Packaging Solder Ball Production Market Share by Manufacturers (2019-2024)
2.2 Global BGA Packaging Solder Ball Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of BGA Packaging Solder Ball, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global BGA Packaging Solder Ball Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global BGA Packaging Solder Ball Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of BGA Packaging Solder Ball, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of BGA Packaging Solder Ball, Product Offered and Application
2.8 Global Key Manufacturers of BGA Packaging Solder Ball, Date of Enter into This Industry
2.9 BGA Packaging Solder Ball Market Competitive Situation and Trends
2.9.1 BGA Packaging Solder Ball Market Concentration Rate
2.9.2 Global 5 and 10 Largest BGA Packaging Solder Ball Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 BGA Packaging Solder Ball Production by Region
3.1 Global BGA Packaging Solder Ball Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global BGA Packaging Solder Ball Production Value by Region (2019-2030)
3.2.1 Global BGA Packaging Solder Ball Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of BGA Packaging Solder Ball by Region (2025-2030)
3.3 Global BGA Packaging Solder Ball Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global BGA Packaging Solder Ball Production by Region (2019-2030)
3.4.1 Global BGA Packaging Solder Ball Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of BGA Packaging Solder Ball by Region (2025-2030)
3.5 Global BGA Packaging Solder Ball Market Price Analysis by Region (2019-2024)
3.6 Global BGA Packaging Solder Ball Production and Value, Year-over-Year Growth
3.6.1 North America BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.3 China BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
4 BGA Packaging Solder Ball Consumption by Region
4.1 Global BGA Packaging Solder Ball Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global BGA Packaging Solder Ball Consumption by Region (2019-2030)
4.2.1 Global BGA Packaging Solder Ball Consumption by Region (2019-2024)
4.2.2 Global BGA Packaging Solder Ball Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America BGA Packaging Solder Ball Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe BGA Packaging Solder Ball Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific BGA Packaging Solder Ball Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific BGA Packaging Solder Ball Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Diameter
5.1 Global BGA Packaging Solder Ball Production by Diameter (2019-2030)
5.1.1 Global BGA Packaging Solder Ball Production by Diameter (2019-2024)
5.1.2 Global BGA Packaging Solder Ball Production by Diameter (2025-2030)
5.1.3 Global BGA Packaging Solder Ball Production Market Share by Diameter (2019-2030)
5.2 Global BGA Packaging Solder Ball Production Value by Diameter (2019-2030)
5.2.1 Global BGA Packaging Solder Ball Production Value by Diameter (2019-2024)
5.2.2 Global BGA Packaging Solder Ball Production Value by Diameter (2025-2030)
5.2.3 Global BGA Packaging Solder Ball Production Value Market Share by Diameter (2019-2030)
5.3 Global BGA Packaging Solder Ball Price by Diameter (2019-2030)
6 Segment by Application
6.1 Global BGA Packaging Solder Ball Production by Application (2019-2030)
6.1.1 Global BGA Packaging Solder Ball Production by Application (2019-2024)
6.1.2 Global BGA Packaging Solder Ball Production by Application (2025-2030)
6.1.3 Global BGA Packaging Solder Ball Production Market Share by Application (2019-2030)
6.2 Global BGA Packaging Solder Ball Production Value by Application (2019-2030)
6.2.1 Global BGA Packaging Solder Ball Production Value by Application (2019-2024)
6.2.2 Global BGA Packaging Solder Ball Production Value by Application (2025-2030)
6.2.3 Global BGA Packaging Solder Ball Production Value Market Share by Application (2019-2030)
6.3 Global BGA Packaging Solder Ball Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Senju Metal
7.1.1 Senju Metal BGA Packaging Solder Ball Corporation Information
7.1.2 Senju Metal BGA Packaging Solder Ball Product Portfolio
7.1.3 Senju Metal BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Senju Metal Main Business and Markets Served
7.1.5 Senju Metal Recent Developments/Updates
7.2 Accurus
7.2.1 Accurus BGA Packaging Solder Ball Corporation Information
7.2.2 Accurus BGA Packaging Solder Ball Product Portfolio
7.2.3 Accurus BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Accurus Main Business and Markets Served
7.2.5 Accurus Recent Developments/Updates
7.3 DS HiMetal
7.3.1 DS HiMetal BGA Packaging Solder Ball Corporation Information
7.3.2 DS HiMetal BGA Packaging Solder Ball Product Portfolio
7.3.3 DS HiMetal BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.3.4 DS HiMetal Main Business and Markets Served
7.3.5 DS HiMetal Recent Developments/Updates
7.4 NMC
7.4.1 NMC BGA Packaging Solder Ball Corporation Information
7.4.2 NMC BGA Packaging Solder Ball Product Portfolio
7.4.3 NMC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.4.4 NMC Main Business and Markets Served
7.4.5 NMC Recent Developments/Updates
7.5 MKE
7.5.1 MKE BGA Packaging Solder Ball Corporation Information
7.5.2 MKE BGA Packaging Solder Ball Product Portfolio
7.5.3 MKE BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.5.4 MKE Main Business and Markets Served
7.5.5 MKE Recent Developments/Updates
7.6 PMTC
7.6.1 PMTC BGA Packaging Solder Ball Corporation Information
7.6.2 PMTC BGA Packaging Solder Ball Product Portfolio
7.6.3 PMTC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.6.4 PMTC Main Business and Markets Served
7.6.5 PMTC Recent Developments/Updates
7.7 Indium Corporation
7.7.1 Indium Corporation BGA Packaging Solder Ball Corporation Information
7.7.2 Indium Corporation BGA Packaging Solder Ball Product Portfolio
7.7.3 Indium Corporation BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Indium Corporation Main Business and Markets Served
7.7.5 Indium Corporation Recent Developments/Updates
7.8 YCTC
7.8.1 YCTC BGA Packaging Solder Ball Corporation Information
7.8.2 YCTC BGA Packaging Solder Ball Product Portfolio
7.8.3 YCTC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.8.4 YCTC Main Business and Markets Served
7.7.5 YCTC Recent Developments/Updates
7.9 Shenmao Technology
7.9.1 Shenmao Technology BGA Packaging Solder Ball Corporation Information
7.9.2 Shenmao Technology BGA Packaging Solder Ball Product Portfolio
7.9.3 Shenmao Technology BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Shenmao Technology Main Business and Markets Served
7.9.5 Shenmao Technology Recent Developments/Updates
7.10 Shanghai hiking solder material
7.10.1 Shanghai hiking solder material BGA Packaging Solder Ball Corporation Information
7.10.2 Shanghai hiking solder material BGA Packaging Solder Ball Product Portfolio
7.10.3 Shanghai hiking solder material BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Shanghai hiking solder material Main Business and Markets Served
7.10.5 Shanghai hiking solder material Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 BGA Packaging Solder Ball Industry Chain Analysis
8.2 BGA Packaging Solder Ball Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 BGA Packaging Solder Ball Production Mode & Process
8.4 BGA Packaging Solder Ball Sales and Marketing
8.4.1 BGA Packaging Solder Ball Sales Channels
8.4.2 BGA Packaging Solder Ball Distributors
8.5 BGA Packaging Solder Ball Customers
9 BGA Packaging Solder Ball Market Dynamics
9.1 BGA Packaging Solder Ball Industry Trends
9.2 BGA Packaging Solder Ball Market Drivers
9.3 BGA Packaging Solder Ball Market Challenges
9.4 BGA Packaging Solder Ball Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global BGA Packaging Solder Ball Market Value by Diameter, (US$ Million) & (2023 VS 2030)
Table 2. Global BGA Packaging Solder Ball Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global BGA Packaging Solder Ball Production Capacity (Million Units) by Manufacturers in 2023
Table 4. Global BGA Packaging Solder Ball Production by Manufacturers (2019-2024) & (Million Units)
Table 5. Global BGA Packaging Solder Ball Production Market Share by Manufacturers (2019-2024)
Table 6. Global BGA Packaging Solder Ball Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global BGA Packaging Solder Ball Production Value Share by Manufacturers (2019-2024)
Table 8. Global BGA Packaging Solder Ball Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in BGA Packaging Solder Ball as of 2023)
Table 10. Global Market BGA Packaging Solder Ball Average Price by Manufacturers (US$/K Units) & (2019-2024)
Table 11. Manufacturers BGA Packaging Solder Ball Production Sites and Area Served
Table 12. Manufacturers BGA Packaging Solder Ball Product Types
Table 13. Global BGA Packaging Solder Ball Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global BGA Packaging Solder Ball Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global BGA Packaging Solder Ball Production Value (US$ Million) by Region (2019-2024)
Table 17. Global BGA Packaging Solder Ball Production Value Market Share by Region (2019-2024)
Table 18. Global BGA Packaging Solder Ball Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global BGA Packaging Solder Ball Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global BGA Packaging Solder Ball Production Comparison by Region: 2019 VS 2023 VS 2030 (Million Units)
Table 21. Global BGA Packaging Solder Ball Production (Million Units) by Region (2019-2024)
Table 22. Global BGA Packaging Solder Ball Production Market Share by Region (2019-2024)
Table 23. Global BGA Packaging Solder Ball Production (Million Units) Forecast by Region (2025-2030)
Table 24. Global BGA Packaging Solder Ball Production Market Share Forecast by Region (2025-2030)
Table 25. Global BGA Packaging Solder Ball Market Average Price (US$/K Units) by Region (2019-2024)
Table 26. Global BGA Packaging Solder Ball Market Average Price (US$/K Units) by Region (2025-2030)
Table 27. Global BGA Packaging Solder Ball Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Million Units)
Table 28. Global BGA Packaging Solder Ball Consumption by Region (2019-2024) & (Million Units)
Table 29. Global BGA Packaging Solder Ball Consumption Market Share by Region (2019-2024)
Table 30. Global BGA Packaging Solder Ball Forecasted Consumption by Region (2025-2030) & (Million Units)
Table 31. Global BGA Packaging Solder Ball Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Million Units)
Table 33. North America BGA Packaging Solder Ball Consumption by Country (2019-2024) & (Million Units)
Table 34. North America BGA Packaging Solder Ball Consumption by Country (2025-2030) & (Million Units)
Table 35. Europe BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Million Units)
Table 36. Europe BGA Packaging Solder Ball Consumption by Country (2019-2024) & (Million Units)
Table 37. Europe BGA Packaging Solder Ball Consumption by Country (2025-2030) & (Million Units)
Table 38. Asia Pacific BGA Packaging Solder Ball Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Million Units)
Table 39. Asia Pacific BGA Packaging Solder Ball Consumption by Region (2019-2024) & (Million Units)
Table 40. Asia Pacific BGA Packaging Solder Ball Consumption by Region (2025-2030) & (Million Units)
Table 41. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Million Units)
Table 42. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption by Country (2019-2024) & (Million Units)
Table 43. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption by Country (2025-2030) & (Million Units)
Table 44. Global BGA Packaging Solder Ball Production (Million Units) by Diameter (2019-2024)
Table 45. Global BGA Packaging Solder Ball Production (Million Units) by Diameter (2025-2030)
Table 46. Global BGA Packaging Solder Ball Production Market Share by Diameter (2019-2024)
Table 47. Global BGA Packaging Solder Ball Production Market Share by Diameter (2025-2030)
Table 48. Global BGA Packaging Solder Ball Production Value (US$ Million) by Diameter (2019-2024)
Table 49. Global BGA Packaging Solder Ball Production Value (US$ Million) by Diameter (2025-2030)
Table 50. Global BGA Packaging Solder Ball Production Value Share by Diameter (2019-2024)
Table 51. Global BGA Packaging Solder Ball Production Value Share by Diameter (2025-2030)
Table 52. Global BGA Packaging Solder Ball Price (US$/K Units) by Diameter (2019-2024)
Table 53. Global BGA Packaging Solder Ball Price (US$/K Units) by Diameter (2025-2030)
Table 54. Global BGA Packaging Solder Ball Production (Million Units) by Application (2019-2024)
Table 55. Global BGA Packaging Solder Ball Production (Million Units) by Application (2025-2030)
Table 56. Global BGA Packaging Solder Ball Production Market Share by Application (2019-2024)
Table 57. Global BGA Packaging Solder Ball Production Market Share by Application (2025-2030)
Table 58. Global BGA Packaging Solder Ball Production Value (US$ Million) by Application (2019-2024)
Table 59. Global BGA Packaging Solder Ball Production Value (US$ Million) by Application (2025-2030)
Table 60. Global BGA Packaging Solder Ball Production Value Share by Application (2019-2024)
Table 61. Global BGA Packaging Solder Ball Production Value Share by Application (2025-2030)
Table 62. Global BGA Packaging Solder Ball Price (US$/K Units) by Application (2019-2024)
Table 63. Global BGA Packaging Solder Ball Price (US$/K Units) by Application (2025-2030)
Table 64. Senju Metal BGA Packaging Solder Ball Corporation Information
Table 65. Senju Metal Specification and Application
Table 66. Senju Metal BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 67. Senju Metal Main Business and Markets Served
Table 68. Senju Metal Recent Developments/Updates
Table 69. Accurus BGA Packaging Solder Ball Corporation Information
Table 70. Accurus Specification and Application
Table 71. Accurus BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 72. Accurus Main Business and Markets Served
Table 73. Accurus Recent Developments/Updates
Table 74. DS HiMetal BGA Packaging Solder Ball Corporation Information
Table 75. DS HiMetal Specification and Application
Table 76. DS HiMetal BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 77. DS HiMetal Main Business and Markets Served
Table 78. DS HiMetal Recent Developments/Updates
Table 79. NMC BGA Packaging Solder Ball Corporation Information
Table 80. NMC Specification and Application
Table 81. NMC BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 82. NMC Main Business and Markets Served
Table 83. NMC Recent Developments/Updates
Table 84. MKE BGA Packaging Solder Ball Corporation Information
Table 85. MKE Specification and Application
Table 86. MKE BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 87. MKE Main Business and Markets Served
Table 88. MKE Recent Developments/Updates
Table 89. PMTC BGA Packaging Solder Ball Corporation Information
Table 90. PMTC Specification and Application
Table 91. PMTC BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 92. PMTC Main Business and Markets Served
Table 93. PMTC Recent Developments/Updates
Table 94. Indium Corporation BGA Packaging Solder Ball Corporation Information
Table 95. Indium Corporation Specification and Application
Table 96. Indium Corporation BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 97. Indium Corporation Main Business and Markets Served
Table 98. Indium Corporation Recent Developments/Updates
Table 99. YCTC BGA Packaging Solder Ball Corporation Information
Table 100. YCTC Specification and Application
Table 101. YCTC BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 102. YCTC Main Business and Markets Served
Table 103. YCTC Recent Developments/Updates
Table 104. Shenmao Technology BGA Packaging Solder Ball Corporation Information
Table 105. Shenmao Technology Specification and Application
Table 106. Shenmao Technology BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 107. Shenmao Technology Main Business and Markets Served
Table 108. Shenmao Technology Recent Developments/Updates
Table 109. Shanghai hiking solder material BGA Packaging Solder Ball Corporation Information
Table 110. Shanghai hiking solder material Specification and Application
Table 111. Shanghai hiking solder material BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2019-2024)
Table 112. Shanghai hiking solder material Main Business and Markets Served
Table 113. Shanghai hiking solder material Recent Developments/Updates
Table 114. Key Raw Materials Lists
Table 115. Raw Materials Key Suppliers Lists
Table 116. BGA Packaging Solder Ball Distributors List
Table 117. BGA Packaging Solder Ball Customers List
Table 118. BGA Packaging Solder Ball Market Trends
Table 119. BGA Packaging Solder Ball Market Drivers
Table 120. BGA Packaging Solder Ball Market Challenges
Table 121. BGA Packaging Solder Ball Market Restraints
Table 122. Research Programs/Design for This Report
Table 123. Key Data Information from Secondary Sources
Table 124. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of BGA Packaging Solder Ball
Figure 2. Global BGA Packaging Solder Ball Market Value by Diameter, (US$ Million) & (2023 VS 2030)
Figure 3. Global BGA Packaging Solder Ball Market Share by Diameter: 2023 VS 2030
Figure 4. Up to 0.2 mm Product Picture
Figure 5. 0.2-0.5 mm Product Picture
Figure 6. Above 0.5 mm Product Picture
Figure 7. Global BGA Packaging Solder Ball Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 8. Global BGA Packaging Solder Ball Market Share by Application: 2023 VS 2030
Figure 9. IDM
Figure 10. OSAT
Figure 11. Global BGA Packaging Solder Ball Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 12. Global BGA Packaging Solder Ball Production Value (US$ Million) & (2019-2030)
Figure 13. Global BGA Packaging Solder Ball Production (Million Units) & (2019-2030)
Figure 14. Global BGA Packaging Solder Ball Average Price (US$/K Units) & (2019-2030)
Figure 15. BGA Packaging Solder Ball Report Years Considered
Figure 16. BGA Packaging Solder Ball Production Share by Manufacturers in 2023
Figure 17. BGA Packaging Solder Ball Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 18. The Global 5 and 10 Largest Players: Market Share by BGA Packaging Solder Ball Revenue in 2023
Figure 19. Global BGA Packaging Solder Ball Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 20. Global BGA Packaging Solder Ball Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 21. Global BGA Packaging Solder Ball Production Comparison by Region: 2019 VS 2023 VS 2030 (Million Units)
Figure 22. Global BGA Packaging Solder Ball Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. North America BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2019-2030)
Figure 24. Europe BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2019-2030)
Figure 25. China BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Japan BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. South Korea BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Taiwan BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. Global BGA Packaging Solder Ball Consumption by Region: 2019 VS 2023 VS 2030 (Million Units)
Figure 30. Global BGA Packaging Solder Ball Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 31. North America BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 32. North America BGA Packaging Solder Ball Consumption Market Share by Country (2019-2030)
Figure 33. Canada BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 34. U.S. BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 35. Europe BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 36. Europe BGA Packaging Solder Ball Consumption Market Share by Country (2019-2030)
Figure 37. Germany BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 38. France BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 39. U.K. BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 40. Italy BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 41. Russia BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 42. Asia Pacific BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 43. Asia Pacific BGA Packaging Solder Ball Consumption Market Share by Regions (2019-2030)
Figure 44. China BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 45. Japan BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 46. South Korea BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 47. China Taiwan BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 48. Southeast Asia BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 49. India BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 50. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 51. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption Market Share by Country (2019-2030)
Figure 52. Mexico BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 53. Brazil BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 54. Turkey BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 55. GCC Countries BGA Packaging Solder Ball Consumption and Growth Rate (2019-2024) & (Million Units)
Figure 56. Global Production Market Share of BGA Packaging Solder Ball by Diameter (2019-2030)
Figure 57. Global Production Value Market Share of BGA Packaging Solder Ball by Diameter (2019-2030)
Figure 58. Global BGA Packaging Solder Ball Price (US$/K Units) by Diameter (2019-2030)
Figure 59. Global Production Market Share of BGA Packaging Solder Ball by Application (2019-2030)
Figure 60. Global Production Value Market Share of BGA Packaging Solder Ball by Application (2019-2030)
Figure 61. Global BGA Packaging Solder Ball Price (US$/K Units) by Application (2019-2030)
Figure 62. BGA Packaging Solder Ball Value Chain
Figure 63. BGA Packaging Solder Ball Production Process
Figure 64. Channels of Distribution (Direct Vs Distribution)
Figure 65. Distributors Profiles
Figure 66. Bottom-up and Top-down Approaches for This Report
Figure 67. Data Triangulation
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest IT & Electronics Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
