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Global BGA Solder Ball Market Research Report 2025
Synopsis
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
The global BGA Solder Ball market was valued at US$ 116 million in 2023 and is anticipated to reach US$ 176.9 million by 2030, witnessing a CAGR of 6.3% during the forecast period 2024-2030.
North American market for BGA Solder Ball is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for BGA Solder Ball is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of BGA Solder Ball include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for BGA Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Solder Ball.
Report Scope
The BGA Solder Ball market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global BGA Solder Ball market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the BGA Solder Ball manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Jovy Systems
SK Hynix
MacDermid Alpha Electronics Solutions
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
Lead-Free BGA Package
Lead BGA Package
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of BGA Solder Ball manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of BGA Solder Ball by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of BGA Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
The global BGA Solder Ball market was valued at US$ 116 million in 2023 and is anticipated to reach US$ 176.9 million by 2030, witnessing a CAGR of 6.3% during the forecast period 2024-2030.
North American market for BGA Solder Ball is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for BGA Solder Ball is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of BGA Solder Ball include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for BGA Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Solder Ball.
Report Scope
The BGA Solder Ball market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global BGA Solder Ball market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the BGA Solder Ball manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Jovy Systems
SK Hynix
MacDermid Alpha Electronics Solutions
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
Lead-Free BGA Package
Lead BGA Package
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of BGA Solder Ball manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of BGA Solder Ball by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of BGA Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 BGA Solder Ball Market Overview
1.1 Product Definition
1.2 BGA Solder Ball Segment by Type
1.2.1 Global BGA Solder Ball Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Lead Solder Ball
1.2.3 Lead Free Solder Ball
1.3 BGA Solder Ball Segment by Application
1.3.1 Global BGA Solder Ball Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Lead-Free BGA Package
1.3.3 Lead BGA Package
1.4 Global Market Growth Prospects
1.4.1 Global BGA Solder Ball Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global BGA Solder Ball Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global BGA Solder Ball Production Estimates and Forecasts (2019-2030)
1.4.4 Global BGA Solder Ball Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global BGA Solder Ball Production Market Share by Manufacturers (2019-2024)
2.2 Global BGA Solder Ball Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of BGA Solder Ball, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global BGA Solder Ball Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global BGA Solder Ball Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of BGA Solder Ball, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of BGA Solder Ball, Product Offered and Application
2.8 Global Key Manufacturers of BGA Solder Ball, Date of Enter into This Industry
2.9 BGA Solder Ball Market Competitive Situation and Trends
2.9.1 BGA Solder Ball Market Concentration Rate
2.9.2 Global 5 and 10 Largest BGA Solder Ball Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 BGA Solder Ball Production by Region
3.1 Global BGA Solder Ball Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global BGA Solder Ball Production Value by Region (2019-2030)
3.2.1 Global BGA Solder Ball Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of BGA Solder Ball by Region (2025-2030)
3.3 Global BGA Solder Ball Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global BGA Solder Ball Production by Region (2019-2030)
3.4.1 Global BGA Solder Ball Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of BGA Solder Ball by Region (2025-2030)
3.5 Global BGA Solder Ball Market Price Analysis by Region (2019-2024)
3.6 Global BGA Solder Ball Production and Value, Year-over-Year Growth
3.6.1 North America BGA Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe BGA Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.3 China BGA Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan BGA Solder Ball Production Value Estimates and Forecasts (2019-2030)
4 BGA Solder Ball Consumption by Region
4.1 Global BGA Solder Ball Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global BGA Solder Ball Consumption by Region (2019-2030)
4.2.1 Global BGA Solder Ball Consumption by Region (2019-2024)
4.2.2 Global BGA Solder Ball Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America BGA Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America BGA Solder Ball Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe BGA Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe BGA Solder Ball Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific BGA Solder Ball Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific BGA Solder Ball Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa BGA Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa BGA Solder Ball Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global BGA Solder Ball Production by Type (2019-2030)
5.1.1 Global BGA Solder Ball Production by Type (2019-2024)
5.1.2 Global BGA Solder Ball Production by Type (2025-2030)
5.1.3 Global BGA Solder Ball Production Market Share by Type (2019-2030)
5.2 Global BGA Solder Ball Production Value by Type (2019-2030)
5.2.1 Global BGA Solder Ball Production Value by Type (2019-2024)
5.2.2 Global BGA Solder Ball Production Value by Type (2025-2030)
5.2.3 Global BGA Solder Ball Production Value Market Share by Type (2019-2030)
5.3 Global BGA Solder Ball Price by Type (2019-2030)
6 Segment by Application
6.1 Global BGA Solder Ball Production by Application (2019-2030)
6.1.1 Global BGA Solder Ball Production by Application (2019-2024)
6.1.2 Global BGA Solder Ball Production by Application (2025-2030)
6.1.3 Global BGA Solder Ball Production Market Share by Application (2019-2030)
6.2 Global BGA Solder Ball Production Value by Application (2019-2030)
6.2.1 Global BGA Solder Ball Production Value by Application (2019-2024)
6.2.2 Global BGA Solder Ball Production Value by Application (2025-2030)
6.2.3 Global BGA Solder Ball Production Value Market Share by Application (2019-2030)
6.3 Global BGA Solder Ball Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Senju Metal
7.1.1 Senju Metal BGA Solder Ball Corporation Information
7.1.2 Senju Metal BGA Solder Ball Product Portfolio
7.1.3 Senju Metal BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Senju Metal Main Business and Markets Served
7.1.5 Senju Metal Recent Developments/Updates
7.2 DS HiMetal
7.2.1 DS HiMetal BGA Solder Ball Corporation Information
7.2.2 DS HiMetal BGA Solder Ball Product Portfolio
7.2.3 DS HiMetal BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.2.4 DS HiMetal Main Business and Markets Served
7.2.5 DS HiMetal Recent Developments/Updates
7.3 MKE
7.3.1 MKE BGA Solder Ball Corporation Information
7.3.2 MKE BGA Solder Ball Product Portfolio
7.3.3 MKE BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.3.4 MKE Main Business and Markets Served
7.3.5 MKE Recent Developments/Updates
7.4 YCTC
7.4.1 YCTC BGA Solder Ball Corporation Information
7.4.2 YCTC BGA Solder Ball Product Portfolio
7.4.3 YCTC BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.4.4 YCTC Main Business and Markets Served
7.4.5 YCTC Recent Developments/Updates
7.5 Accurus
7.5.1 Accurus BGA Solder Ball Corporation Information
7.5.2 Accurus BGA Solder Ball Product Portfolio
7.5.3 Accurus BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Accurus Main Business and Markets Served
7.5.5 Accurus Recent Developments/Updates
7.6 PMTC
7.6.1 PMTC BGA Solder Ball Corporation Information
7.6.2 PMTC BGA Solder Ball Product Portfolio
7.6.3 PMTC BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.6.4 PMTC Main Business and Markets Served
7.6.5 PMTC Recent Developments/Updates
7.7 Shanghai hiking solder material
7.7.1 Shanghai hiking solder material BGA Solder Ball Corporation Information
7.7.2 Shanghai hiking solder material BGA Solder Ball Product Portfolio
7.7.3 Shanghai hiking solder material BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Shanghai hiking solder material Main Business and Markets Served
7.7.5 Shanghai hiking solder material Recent Developments/Updates
7.8 Shenmao Technology
7.8.1 Shenmao Technology BGA Solder Ball Corporation Information
7.8.2 Shenmao Technology BGA Solder Ball Product Portfolio
7.8.3 Shenmao Technology BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Shenmao Technology Main Business and Markets Served
7.7.5 Shenmao Technology Recent Developments/Updates
7.9 Nippon Micrometal
7.9.1 Nippon Micrometal BGA Solder Ball Corporation Information
7.9.2 Nippon Micrometal BGA Solder Ball Product Portfolio
7.9.3 Nippon Micrometal BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Nippon Micrometal Main Business and Markets Served
7.9.5 Nippon Micrometal Recent Developments/Updates
7.10 Indium Corporation
7.10.1 Indium Corporation BGA Solder Ball Corporation Information
7.10.2 Indium Corporation BGA Solder Ball Product Portfolio
7.10.3 Indium Corporation BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Indium Corporation Main Business and Markets Served
7.10.5 Indium Corporation Recent Developments/Updates
7.11 Jovy Systems
7.11.1 Jovy Systems BGA Solder Ball Corporation Information
7.11.2 Jovy Systems BGA Solder Ball Product Portfolio
7.11.3 Jovy Systems BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Jovy Systems Main Business and Markets Served
7.11.5 Jovy Systems Recent Developments/Updates
7.12 SK Hynix
7.12.1 SK Hynix BGA Solder Ball Corporation Information
7.12.2 SK Hynix BGA Solder Ball Product Portfolio
7.12.3 SK Hynix BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.12.4 SK Hynix Main Business and Markets Served
7.12.5 SK Hynix Recent Developments/Updates
7.13 MacDermid Alpha Electronics Solutions
7.13.1 MacDermid Alpha Electronics Solutions BGA Solder Ball Corporation Information
7.13.2 MacDermid Alpha Electronics Solutions BGA Solder Ball Product Portfolio
7.13.3 MacDermid Alpha Electronics Solutions BGA Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.13.4 MacDermid Alpha Electronics Solutions Main Business and Markets Served
7.13.5 MacDermid Alpha Electronics Solutions Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 BGA Solder Ball Industry Chain Analysis
8.2 BGA Solder Ball Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 BGA Solder Ball Production Mode & Process
8.4 BGA Solder Ball Sales and Marketing
8.4.1 BGA Solder Ball Sales Channels
8.4.2 BGA Solder Ball Distributors
8.5 BGA Solder Ball Customers
9 BGA Solder Ball Market Dynamics
9.1 BGA Solder Ball Industry Trends
9.2 BGA Solder Ball Market Drivers
9.3 BGA Solder Ball Market Challenges
9.4 BGA Solder Ball Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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