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Global Chip Die Bonding Conductive Adhesive Market Research Report 2025

Global Chip Die Bonding Conductive Adhesive Market Research Report 2025

Publishing Date : Mar, 2025

License Type :

Report Code : 1790857

No of Pages : 106

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Report Description
Table of Content

Synopsis
Chip solid crystal conductive adhesive is a high conductivity and thermal conductivity adhesive containing fine silver powder, which can quickly cure at low temperatures, forming a strong bond and good electrical connection. Chip solid crystal conductive adhesive is mainly used for vertically structured LED chips, as it can achieve direct conductivity between the chip and the bracket without the need for additional wire bonding processes. The disadvantage of chip fixed crystal conductive adhesive is that it absorbs some light, reducing the brightness and efficiency of LEDs. Therefore, for horizontally structured LED chips, transparent insulation adhesive is usually used as the solid crystal adhesive.
Global Chip Die Bonding Conductive Adhesive market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Chip Die Bonding Conductive Adhesive market research.
Key manufacturers engaged in the Chip Die Bonding Conductive Adhesive industry include DARBOND TECHNOLOGY CO.LTD, Henkel, 3M, AI Technology, Inc., Panacol-Elosol GmbH, Permabond, Master Bond, ITW Plexus and Parson Adhesives, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Chip Die Bonding Conductive Adhesive production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Chip Die Bonding Conductive Adhesive were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Chip Die Bonding Conductive Adhesive market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Chip Die Bonding Conductive Adhesive market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
DARBOND TECHNOLOGY CO.LTD
Henkel
3M
AI Technology, Inc.
Panacol-Elosol GmbH
Permabond
Master Bond
ITW Plexus
Parson Adhesives
Huntsman
LORD Corporation
H.B. Fuller
Sika
Dow
Ashland
Jowat
Segment by Type
Silver Glue
Copper Glue
Palladium Glue
Segment by Application
LED Industry
Semiconductor Industry
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Chip Die Bonding Conductive Adhesive report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Index

1 Chip Die Bonding Conductive Adhesive Market Overview
1.1 Product Definition
1.2 Chip Die Bonding Conductive Adhesive Segment by Type
1.2.1 Global Chip Die Bonding Conductive Adhesive Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Silver Glue
1.2.3 Copper Glue
1.2.4 Palladium Glue
1.3 Chip Die Bonding Conductive Adhesive Segment by Application
1.3.1 Global Chip Die Bonding Conductive Adhesive Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 LED Industry
1.3.3 Semiconductor Industry
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Chip Die Bonding Conductive Adhesive Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Chip Die Bonding Conductive Adhesive Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Chip Die Bonding Conductive Adhesive Production Estimates and Forecasts (2018-2029)
1.4.4 Global Chip Die Bonding Conductive Adhesive Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Chip Die Bonding Conductive Adhesive Production Market Share by Manufacturers (2018-2023)
2.2 Global Chip Die Bonding Conductive Adhesive Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Chip Die Bonding Conductive Adhesive, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Chip Die Bonding Conductive Adhesive Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Chip Die Bonding Conductive Adhesive Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Chip Die Bonding Conductive Adhesive, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Chip Die Bonding Conductive Adhesive, Product Offered and Application
2.8 Global Key Manufacturers of Chip Die Bonding Conductive Adhesive, Date of Enter into This Industry
2.9 Chip Die Bonding Conductive Adhesive Market Competitive Situation and Trends
2.9.1 Chip Die Bonding Conductive Adhesive Market Concentration Rate
2.9.2 Global 5 and 10 Largest Chip Die Bonding Conductive Adhesive Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Chip Die Bonding Conductive Adhesive Production by Region
3.1 Global Chip Die Bonding Conductive Adhesive Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Chip Die Bonding Conductive Adhesive Production Value by Region (2018-2029)
3.2.1 Global Chip Die Bonding Conductive Adhesive Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Chip Die Bonding Conductive Adhesive by Region (2024-2029)
3.3 Global Chip Die Bonding Conductive Adhesive Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Chip Die Bonding Conductive Adhesive Production by Region (2018-2029)
3.4.1 Global Chip Die Bonding Conductive Adhesive Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Chip Die Bonding Conductive Adhesive by Region (2024-2029)
3.5 Global Chip Die Bonding Conductive Adhesive Market Price Analysis by Region (2018-2023)
3.6 Global Chip Die Bonding Conductive Adhesive Production and Value, Year-over-Year Growth
3.6.1 North America Chip Die Bonding Conductive Adhesive Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Chip Die Bonding Conductive Adhesive Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Chip Die Bonding Conductive Adhesive Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Chip Die Bonding Conductive Adhesive Production Value Estimates and Forecasts (2018-2029)
4 Chip Die Bonding Conductive Adhesive Consumption by Region
4.1 Global Chip Die Bonding Conductive Adhesive Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Chip Die Bonding Conductive Adhesive Consumption by Region (2018-2029)
4.2.1 Global Chip Die Bonding Conductive Adhesive Consumption by Region (2018-2023)
4.2.2 Global Chip Die Bonding Conductive Adhesive Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Chip Die Bonding Conductive Adhesive Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Chip Die Bonding Conductive Adhesive Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Chip Die Bonding Conductive Adhesive Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Chip Die Bonding Conductive Adhesive Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Chip Die Bonding Conductive Adhesive Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Chip Die Bonding Conductive Adhesive Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Chip Die Bonding Conductive Adhesive Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Chip Die Bonding Conductive Adhesive Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Chip Die Bonding Conductive Adhesive Production by Type (2018-2029)
5.1.1 Global Chip Die Bonding Conductive Adhesive Production by Type (2018-2023)
5.1.2 Global Chip Die Bonding Conductive Adhesive Production by Type (2024-2029)
5.1.3 Global Chip Die Bonding Conductive Adhesive Production Market Share by Type (2018-2029)
5.2 Global Chip Die Bonding Conductive Adhesive Production Value by Type (2018-2029)
5.2.1 Global Chip Die Bonding Conductive Adhesive Production Value by Type (2018-2023)
5.2.2 Global Chip Die Bonding Conductive Adhesive Production Value by Type (2024-2029)
5.2.3 Global Chip Die Bonding Conductive Adhesive Production Value Market Share by Type (2018-2029)
5.3 Global Chip Die Bonding Conductive Adhesive Price by Type (2018-2029)
6 Segment by Application
6.1 Global Chip Die Bonding Conductive Adhesive Production by Application (2018-2029)
6.1.1 Global Chip Die Bonding Conductive Adhesive Production by Application (2018-2023)
6.1.2 Global Chip Die Bonding Conductive Adhesive Production by Application (2024-2029)
6.1.3 Global Chip Die Bonding Conductive Adhesive Production Market Share by Application (2018-2029)
6.2 Global Chip Die Bonding Conductive Adhesive Production Value by Application (2018-2029)
6.2.1 Global Chip Die Bonding Conductive Adhesive Production Value by Application (2018-2023)
6.2.2 Global Chip Die Bonding Conductive Adhesive Production Value by Application (2024-2029)
6.2.3 Global Chip Die Bonding Conductive Adhesive Production Value Market Share by Application (2018-2029)
6.3 Global Chip Die Bonding Conductive Adhesive Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DARBOND TECHNOLOGY CO.LTD
7.1.1 DARBOND TECHNOLOGY CO.LTD Chip Die Bonding Conductive Adhesive Corporation Information
7.1.2 DARBOND TECHNOLOGY CO.LTD Chip Die Bonding Conductive Adhesive Product Portfolio
7.1.3 DARBOND TECHNOLOGY CO.LTD Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DARBOND TECHNOLOGY CO.LTD Main Business and Markets Served
7.1.5 DARBOND TECHNOLOGY CO.LTD Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Chip Die Bonding Conductive Adhesive Corporation Information
7.2.2 Henkel Chip Die Bonding Conductive Adhesive Product Portfolio
7.2.3 Henkel Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Henkel Main Business and Markets Served
7.2.5 Henkel Recent Developments/Updates
7.3 3M
7.3.1 3M Chip Die Bonding Conductive Adhesive Corporation Information
7.3.2 3M Chip Die Bonding Conductive Adhesive Product Portfolio
7.3.3 3M Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.3.4 3M Main Business and Markets Served
7.3.5 3M Recent Developments/Updates
7.4 AI Technology, Inc.
7.4.1 AI Technology, Inc. Chip Die Bonding Conductive Adhesive Corporation Information
7.4.2 AI Technology, Inc. Chip Die Bonding Conductive Adhesive Product Portfolio
7.4.3 AI Technology, Inc. Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.4.4 AI Technology, Inc. Main Business and Markets Served
7.4.5 AI Technology, Inc. Recent Developments/Updates
7.5 Panacol-Elosol GmbH
7.5.1 Panacol-Elosol GmbH Chip Die Bonding Conductive Adhesive Corporation Information
7.5.2 Panacol-Elosol GmbH Chip Die Bonding Conductive Adhesive Product Portfolio
7.5.3 Panacol-Elosol GmbH Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Panacol-Elosol GmbH Main Business and Markets Served
7.5.5 Panacol-Elosol GmbH Recent Developments/Updates
7.6 Permabond
7.6.1 Permabond Chip Die Bonding Conductive Adhesive Corporation Information
7.6.2 Permabond Chip Die Bonding Conductive Adhesive Product Portfolio
7.6.3 Permabond Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Permabond Main Business and Markets Served
7.6.5 Permabond Recent Developments/Updates
7.7 Master Bond
7.7.1 Master Bond Chip Die Bonding Conductive Adhesive Corporation Information
7.7.2 Master Bond Chip Die Bonding Conductive Adhesive Product Portfolio
7.7.3 Master Bond Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Master Bond Main Business and Markets Served
7.7.5 Master Bond Recent Developments/Updates
7.8 ITW Plexus
7.8.1 ITW Plexus Chip Die Bonding Conductive Adhesive Corporation Information
7.8.2 ITW Plexus Chip Die Bonding Conductive Adhesive Product Portfolio
7.8.3 ITW Plexus Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.8.4 ITW Plexus Main Business and Markets Served
7.7.5 ITW Plexus Recent Developments/Updates
7.9 Parson Adhesives
7.9.1 Parson Adhesives Chip Die Bonding Conductive Adhesive Corporation Information
7.9.2 Parson Adhesives Chip Die Bonding Conductive Adhesive Product Portfolio
7.9.3 Parson Adhesives Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Parson Adhesives Main Business and Markets Served
7.9.5 Parson Adhesives Recent Developments/Updates
7.10 Huntsman
7.10.1 Huntsman Chip Die Bonding Conductive Adhesive Corporation Information
7.10.2 Huntsman Chip Die Bonding Conductive Adhesive Product Portfolio
7.10.3 Huntsman Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Huntsman Main Business and Markets Served
7.10.5 Huntsman Recent Developments/Updates
7.11 LORD Corporation
7.11.1 LORD Corporation Chip Die Bonding Conductive Adhesive Corporation Information
7.11.2 LORD Corporation Chip Die Bonding Conductive Adhesive Product Portfolio
7.11.3 LORD Corporation Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.11.4 LORD Corporation Main Business and Markets Served
7.11.5 LORD Corporation Recent Developments/Updates
7.12 H.B. Fuller
7.12.1 H.B. Fuller Chip Die Bonding Conductive Adhesive Corporation Information
7.12.2 H.B. Fuller Chip Die Bonding Conductive Adhesive Product Portfolio
7.12.3 H.B. Fuller Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.12.4 H.B. Fuller Main Business and Markets Served
7.12.5 H.B. Fuller Recent Developments/Updates
7.13 Sika
7.13.1 Sika Chip Die Bonding Conductive Adhesive Corporation Information
7.13.2 Sika Chip Die Bonding Conductive Adhesive Product Portfolio
7.13.3 Sika Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Sika Main Business and Markets Served
7.13.5 Sika Recent Developments/Updates
7.14 Dow
7.14.1 Dow Chip Die Bonding Conductive Adhesive Corporation Information
7.14.2 Dow Chip Die Bonding Conductive Adhesive Product Portfolio
7.14.3 Dow Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Dow Main Business and Markets Served
7.14.5 Dow Recent Developments/Updates
7.15 Ashland
7.15.1 Ashland Chip Die Bonding Conductive Adhesive Corporation Information
7.15.2 Ashland Chip Die Bonding Conductive Adhesive Product Portfolio
7.15.3 Ashland Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Ashland Main Business and Markets Served
7.15.5 Ashland Recent Developments/Updates
7.16 Jowat
7.16.1 Jowat Chip Die Bonding Conductive Adhesive Corporation Information
7.16.2 Jowat Chip Die Bonding Conductive Adhesive Product Portfolio
7.16.3 Jowat Chip Die Bonding Conductive Adhesive Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Jowat Main Business and Markets Served
7.16.5 Jowat Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Chip Die Bonding Conductive Adhesive Industry Chain Analysis
8.2 Chip Die Bonding Conductive Adhesive Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Chip Die Bonding Conductive Adhesive Production Mode & Process
8.4 Chip Die Bonding Conductive Adhesive Sales and Marketing
8.4.1 Chip Die Bonding Conductive Adhesive Sales Channels
8.4.2 Chip Die Bonding Conductive Adhesive Distributors
8.5 Chip Die Bonding Conductive Adhesive Customers
9 Chip Die Bonding Conductive Adhesive Market Dynamics
9.1 Chip Die Bonding Conductive Adhesive Industry Trends
9.2 Chip Die Bonding Conductive Adhesive Market Drivers
9.3 Chip Die Bonding Conductive Adhesive Market Challenges
9.4 Chip Die Bonding Conductive Adhesive Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

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