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Global Chip Scale Package (CSP) Market Research Report 2025
Synopsis
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The global Chip Scale Package (CSP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Chip Scale Package (CSP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Scale Package (CSP).
Report Scope
The Chip Scale Package (CSP) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Scale Package (CSP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Scale Package (CSP) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Group
Amkor Technology
JCET
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Segment by Type
Traditional Packaging
Advanced Packaging
Segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Scale Package (CSP) companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
The global Chip Scale Package (CSP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Chip Scale Package (CSP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Scale Package (CSP).
Report Scope
The Chip Scale Package (CSP) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Scale Package (CSP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Scale Package (CSP) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Group
Amkor Technology
JCET
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Segment by Type
Traditional Packaging
Advanced Packaging
Segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Scale Package (CSP) companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Scale Package (CSP) Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Traditional Packaging
1.2.3 Advanced Packaging
1.3 Market by Application
1.3.1 Global Chip Scale Package (CSP) Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive and Traffic
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Scale Package (CSP) Market Perspective (2019-2030)
2.2 Chip Scale Package (CSP) Growth Trends by Region
2.2.1 Global Chip Scale Package (CSP) Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Scale Package (CSP) Historic Market Size by Region (2019-2024)
2.2.3 Chip Scale Package (CSP) Forecasted Market Size by Region (2025-2030)
2.3 Chip Scale Package (CSP) Market Dynamics
2.3.1 Chip Scale Package (CSP) Industry Trends
2.3.2 Chip Scale Package (CSP) Market Drivers
2.3.3 Chip Scale Package (CSP) Market Challenges
2.3.4 Chip Scale Package (CSP) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip Scale Package (CSP) Players by Revenue
3.1.1 Global Top Chip Scale Package (CSP) Players by Revenue (2019-2024)
3.1.2 Global Chip Scale Package (CSP) Revenue Market Share by Players (2019-2024)
3.2 Global Chip Scale Package (CSP) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip Scale Package (CSP) Revenue
3.4 Global Chip Scale Package (CSP) Market Concentration Ratio
3.4.1 Global Chip Scale Package (CSP) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Scale Package (CSP) Revenue in 2023
3.5 Chip Scale Package (CSP) Key Players Head office and Area Served
3.6 Key Players Chip Scale Package (CSP) Product Solution and Service
3.7 Date of Enter into Chip Scale Package (CSP) Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Scale Package (CSP) Breakdown Data by Type
4.1 Global Chip Scale Package (CSP) Historic Market Size by Type (2019-2024)
4.2 Global Chip Scale Package (CSP) Forecasted Market Size by Type (2025-2030)
5 Chip Scale Package (CSP) Breakdown Data by Application
5.1 Global Chip Scale Package (CSP) Historic Market Size by Application (2019-2024)
5.2 Global Chip Scale Package (CSP) Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Scale Package (CSP) Market Size (2019-2030)
6.2 North America Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Chip Scale Package (CSP) Market Size by Country (2019-2024)
6.4 North America Chip Scale Package (CSP) Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip Scale Package (CSP) Market Size (2019-2030)
7.2 Europe Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Chip Scale Package (CSP) Market Size by Country (2019-2024)
7.4 Europe Chip Scale Package (CSP) Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip Scale Package (CSP) Market Size (2019-2030)
8.2 Asia-Pacific Chip Scale Package (CSP) Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Chip Scale Package (CSP) Market Size by Region (2019-2024)
8.4 Asia-Pacific Chip Scale Package (CSP) Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip Scale Package (CSP) Market Size (2019-2030)
9.2 Latin America Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Chip Scale Package (CSP) Market Size by Country (2019-2024)
9.4 Latin America Chip Scale Package (CSP) Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip Scale Package (CSP) Market Size (2019-2030)
10.2 Middle East & Africa Chip Scale Package (CSP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Chip Scale Package (CSP) Market Size by Country (2019-2024)
10.4 Middle East & Africa Chip Scale Package (CSP) Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Group
11.1.1 ASE Group Company Detail
11.1.2 ASE Group Business Overview
11.1.3 ASE Group Chip Scale Package (CSP) Introduction
11.1.4 ASE Group Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.1.5 ASE Group Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Chip Scale Package (CSP) Introduction
11.2.4 Amkor Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 JCET
11.3.1 JCET Company Detail
11.3.2 JCET Business Overview
11.3.3 JCET Chip Scale Package (CSP) Introduction
11.3.4 JCET Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.3.5 JCET Recent Development
11.4 Powertech Technology
11.4.1 Powertech Technology Company Detail
11.4.2 Powertech Technology Business Overview
11.4.3 Powertech Technology Chip Scale Package (CSP) Introduction
11.4.4 Powertech Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.4.5 Powertech Technology Recent Development
11.5 TongFu Microelectronics
11.5.1 TongFu Microelectronics Company Detail
11.5.2 TongFu Microelectronics Business Overview
11.5.3 TongFu Microelectronics Chip Scale Package (CSP) Introduction
11.5.4 TongFu Microelectronics Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.5.5 TongFu Microelectronics Recent Development
11.6 Tianshui Huatian Technology
11.6.1 Tianshui Huatian Technology Company Detail
11.6.2 Tianshui Huatian Technology Business Overview
11.6.3 Tianshui Huatian Technology Chip Scale Package (CSP) Introduction
11.6.4 Tianshui Huatian Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.6.5 Tianshui Huatian Technology Recent Development
11.7 UTAC
11.7.1 UTAC Company Detail
11.7.2 UTAC Business Overview
11.7.3 UTAC Chip Scale Package (CSP) Introduction
11.7.4 UTAC Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.7.5 UTAC Recent Development
11.8 Chipbond Technology
11.8.1 Chipbond Technology Company Detail
11.8.2 Chipbond Technology Business Overview
11.8.3 Chipbond Technology Chip Scale Package (CSP) Introduction
11.8.4 Chipbond Technology Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.8.5 Chipbond Technology Recent Development
11.9 Hana Micron
11.9.1 Hana Micron Company Detail
11.9.2 Hana Micron Business Overview
11.9.3 Hana Micron Chip Scale Package (CSP) Introduction
11.9.4 Hana Micron Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.9.5 Hana Micron Recent Development
11.10 OSE
11.10.1 OSE Company Detail
11.10.2 OSE Business Overview
11.10.3 OSE Chip Scale Package (CSP) Introduction
11.10.4 OSE Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.10.5 OSE Recent Development
11.11 Walton Advanced Engineering
11.11.1 Walton Advanced Engineering Company Detail
11.11.2 Walton Advanced Engineering Business Overview
11.11.3 Walton Advanced Engineering Chip Scale Package (CSP) Introduction
11.11.4 Walton Advanced Engineering Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.11.5 Walton Advanced Engineering Recent Development
11.12 NEPES
11.12.1 NEPES Company Detail
11.12.2 NEPES Business Overview
11.12.3 NEPES Chip Scale Package (CSP) Introduction
11.12.4 NEPES Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.12.5 NEPES Recent Development
11.13 Unisem
11.13.1 Unisem Company Detail
11.13.2 Unisem Business Overview
11.13.3 Unisem Chip Scale Package (CSP) Introduction
11.13.4 Unisem Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.13.5 Unisem Recent Development
11.14 ChipMOS
11.14.1 ChipMOS Company Detail
11.14.2 ChipMOS Business Overview
11.14.3 ChipMOS Chip Scale Package (CSP) Introduction
11.14.4 ChipMOS Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.14.5 ChipMOS Recent Development
11.15 Signetics
11.15.1 Signetics Company Detail
11.15.2 Signetics Business Overview
11.15.3 Signetics Chip Scale Package (CSP) Introduction
11.15.4 Signetics Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.15.5 Signetics Recent Development
11.16 Carsem
11.16.1 Carsem Company Detail
11.16.2 Carsem Business Overview
11.16.3 Carsem Chip Scale Package (CSP) Introduction
11.16.4 Carsem Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.16.5 Carsem Recent Development
11.17 King Yuan ELECTRONICS
11.17.1 King Yuan ELECTRONICS Company Detail
11.17.2 King Yuan ELECTRONICS Business Overview
11.17.3 King Yuan ELECTRONICS Chip Scale Package (CSP) Introduction
11.17.4 King Yuan ELECTRONICS Revenue in Chip Scale Package (CSP) Business (2019-2024)
11.17.5 King Yuan ELECTRONICS Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
List of TablesList of Tables
Table 1. Global Chip Scale Package (CSP) Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
Table 2. Key Players of Traditional Packaging
Table 3. Key Players of Advanced Packaging
Table 4. Global Chip Scale Package (CSP) Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
Table 5. Global Chip Scale Package (CSP) Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 6. Global Chip Scale Package (CSP) Market Size by Region (2019-2024) & (US$ Million)
Table 7. Global Chip Scale Package (CSP) Market Share by Region (2019-2024)
Table 8. Global Chip Scale Package (CSP) Forecasted Market Size by Region (2025-2030) & (US$ Million)
Table 9. Global Chip Scale Package (CSP) Market Share by Region (2025-2030)
Table 10. Chip Scale Package (CSP) Market Trends
Table 11. Chip Scale Package (CSP) Market Drivers
Table 12. Chip Scale Package (CSP) Market Challenges
Table 13. Chip Scale Package (CSP) Market Restraints
Table 14. Global Chip Scale Package (CSP) Revenue by Players (2019-2024) & (US$ Million)
Table 15. Global Chip Scale Package (CSP) Market Share by Players (2019-2024)
Table 16. Global Top Chip Scale Package (CSP) Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Chip Scale Package (CSP) as of 2023)
Table 17. Ranking of Global Top Chip Scale Package (CSP) Companies by Revenue (US$ Million) in 2023
Table 18. Global 5 Largest Players Market Share by Chip Scale Package (CSP) Revenue (CR5 and HHI) & (2019-2024)
Table 19. Key Players Headquarters and Area Served
Table 20. Key Players Chip Scale Package (CSP) Product Solution and Service
Table 21. Date of Enter into Chip Scale Package (CSP) Market
Table 22. Mergers & Acquisitions, Expansion Plans
Table 23. Global Chip Scale Package (CSP) Market Size by Type (2019-2024) & (US$ Million)
Table 24. Global Chip Scale Package (CSP) Revenue Market Share by Type (2019-2024)
Table 25. Global Chip Scale Package (CSP) Forecasted Market Size by Type (2025-2030) & (US$ Million)
Table 26. Global Chip Scale Package (CSP) Revenue Market Share by Type (2025-2030)
Table 27. Global Chip Scale Package (CSP) Market Size by Application (2019-2024) & (US$ Million)
Table 28. Global Chip Scale Package (CSP) Revenue Market Share by Application (2019-2024)
Table 29. Global Chip Scale Package (CSP) Forecasted Market Size by Application (2025-2030) & (US$ Million)
Table 30. Global Chip Scale Package (CSP) Revenue Market Share by Application (2025-2030)
Table 31. North America Chip Scale Package (CSP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 32. North America Chip Scale Package (CSP) Market Size by Country (2019-2024) & (US$ Million)
Table 33. North America Chip Scale Package (CSP) Market Size by Country (2025-2030) & (US$ Million)
Table 34. Europe Chip Scale Package (CSP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 35. Europe Chip Scale Package (CSP) Market Size by Country (2019-2024) & (US$ Million)
Table 36. Europe Chip Scale Package (CSP) Market Size by Country (2025-2030) & (US$ Million)
Table 37. Asia-Pacific Chip Scale Package (CSP) Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
Table 38. Asia-Pacific Chip Scale Package (CSP) Market Size by Region (2019-2024) & (US$ Million)
Table 39. Asia-Pacific Chip Scale Package (CSP) Market Size by Region (2025-2030) & (US$ Million)
Table 40. Latin America Chip Scale Package (CSP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 41. Latin America Chip Scale Package (CSP) Market Size by Country (2019-2024) & (US$ Million)
Table 42. Latin America Chip Scale Package (CSP) Market Size by Country (2025-2030) & (US$ Million)
Table 43. Middle East & Africa Chip Scale Package (CSP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 44. Middle East & Africa Chip Scale Package (CSP) Market Size by Country (2019-2024) & (US$ Million)
Table 45. Middle East & Africa Chip Scale Package (CSP) Market Size by Country (2025-2030) & (US$ Million)
Table 46. ASE Group Company Detail
Table 47. ASE Group Business Overview
Table 48. ASE Group Chip Scale Package (CSP) Product
Table 49. ASE Group Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 50. ASE Group Recent Development
Table 51. Amkor Technology Company Detail
Table 52. Amkor Technology Business Overview
Table 53. Amkor Technology Chip Scale Package (CSP) Product
Table 54. Amkor Technology Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 55. Amkor Technology Recent Development
Table 56. JCET Company Detail
Table 57. JCET Business Overview
Table 58. JCET Chip Scale Package (CSP) Product
Table 59. JCET Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 60. JCET Recent Development
Table 61. Powertech Technology Company Detail
Table 62. Powertech Technology Business Overview
Table 63. Powertech Technology Chip Scale Package (CSP) Product
Table 64. Powertech Technology Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 65. Powertech Technology Recent Development
Table 66. TongFu Microelectronics Company Detail
Table 67. TongFu Microelectronics Business Overview
Table 68. TongFu Microelectronics Chip Scale Package (CSP) Product
Table 69. TongFu Microelectronics Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 70. TongFu Microelectronics Recent Development
Table 71. Tianshui Huatian Technology Company Detail
Table 72. Tianshui Huatian Technology Business Overview
Table 73. Tianshui Huatian Technology Chip Scale Package (CSP) Product
Table 74. Tianshui Huatian Technology Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 75. Tianshui Huatian Technology Recent Development
Table 76. UTAC Company Detail
Table 77. UTAC Business Overview
Table 78. UTAC Chip Scale Package (CSP) Product
Table 79. UTAC Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 80. UTAC Recent Development
Table 81. Chipbond Technology Company Detail
Table 82. Chipbond Technology Business Overview
Table 83. Chipbond Technology Chip Scale Package (CSP) Product
Table 84. Chipbond Technology Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 85. Chipbond Technology Recent Development
Table 86. Hana Micron Company Detail
Table 87. Hana Micron Business Overview
Table 88. Hana Micron Chip Scale Package (CSP) Product
Table 89. Hana Micron Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 90. Hana Micron Recent Development
Table 91. OSE Company Detail
Table 92. OSE Business Overview
Table 93. OSE Chip Scale Package (CSP) Product
Table 94. OSE Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 95. OSE Recent Development
Table 96. Walton Advanced Engineering Company Detail
Table 97. Walton Advanced Engineering Business Overview
Table 98. Walton Advanced Engineering Chip Scale Package (CSP) Product
Table 99. Walton Advanced Engineering Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 100. Walton Advanced Engineering Recent Development
Table 101. NEPES Company Detail
Table 102. NEPES Business Overview
Table 103. NEPES Chip Scale Package (CSP) Product
Table 104. NEPES Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 105. NEPES Recent Development
Table 106. Unisem Company Detail
Table 107. Unisem Business Overview
Table 108. Unisem Chip Scale Package (CSP) Product
Table 109. Unisem Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 110. Unisem Recent Development
Table 111. ChipMOS Company Detail
Table 112. ChipMOS Business Overview
Table 113. ChipMOS Chip Scale Package (CSP) Product
Table 114. ChipMOS Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 115. ChipMOS Recent Development
Table 116. Signetics Company Detail
Table 117. Signetics Business Overview
Table 118. Signetics Chip Scale Package (CSP) Product
Table 119. Signetics Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 120. Signetics Recent Development
Table 121. Carsem Company Detail
Table 122. Carsem Business Overview
Table 123. Carsem Chip Scale Package (CSP) Product
Table 124. Carsem Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 125. Carsem Recent Development
Table 126. King Yuan ELECTRONICS Company Detail
Table 127. King Yuan ELECTRONICS Business Overview
Table 128. King Yuan ELECTRONICS Chip Scale Package (CSP) Product
Table 129. King Yuan ELECTRONICS Revenue in Chip Scale Package (CSP) Business (2019-2024) & (US$ Million)
Table 130. King Yuan ELECTRONICS Recent Development
Table 131. Research Programs/Design for This Report
Table 132. Key Data Information from Secondary Sources
Table 133. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Chip Scale Package (CSP) Market Size Comparison by Type (2024-2030) & (US$ Million)
Figure 2. Global Chip Scale Package (CSP) Market Share by Type: 2023 VS 2030
Figure 3. Traditional Packaging Features
Figure 4. Advanced Packaging Features
Figure 5. Global Chip Scale Package (CSP) Market Size Comparison by Application (2024-2030) & (US$ Million)
Figure 6. Global Chip Scale Package (CSP) Market Share by Application: 2023 VS 2030
Figure 7. Automotive and Traffic Case Studies
Figure 8. Consumer Electronics Case Studies
Figure 9. Communication Case Studies
Figure 10. Other Case Studies
Figure 11. Chip Scale Package (CSP) Report Years Considered
Figure 12. Global Chip Scale Package (CSP) Market Size (US$ Million), Year-over-Year: 2019-2030
Figure 13. Global Chip Scale Package (CSP) Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 14. Global Chip Scale Package (CSP) Market Share by Region: 2023 VS 2030
Figure 15. Global Chip Scale Package (CSP) Market Share by Players in 2023
Figure 16. Global Top Chip Scale Package (CSP) Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Chip Scale Package (CSP) as of 2023)
Figure 17. The Top 10 and 5 Players Market Share by Chip Scale Package (CSP) Revenue in 2023
Figure 18. North America Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 19. North America Chip Scale Package (CSP) Market Share by Country (2019-2030)
Figure 20. United States Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 21. Canada Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 22. Europe Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 23. Europe Chip Scale Package (CSP) Market Share by Country (2019-2030)
Figure 24. Germany Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 25. France Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 26. U.K. Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 27. Italy Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 28. Russia Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 29. Nordic Countries Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 30. Asia-Pacific Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 31. Asia-Pacific Chip Scale Package (CSP) Market Share by Region (2019-2030)
Figure 32. China Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 33. Japan Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 34. South Korea Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 35. Southeast Asia Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 36. India Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 37. Australia Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 38. Latin America Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 39. Latin America Chip Scale Package (CSP) Market Share by Country (2019-2030)
Figure 40. Mexico Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 41. Brazil Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 42. Middle East & Africa Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 43. Middle East & Africa Chip Scale Package (CSP) Market Share by Country (2019-2030)
Figure 44. Turkey Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 45. Saudi Arabia Chip Scale Package (CSP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 46. ASE Group Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 47. Amkor Technology Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 48. JCET Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 49. Powertech Technology Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 50. TongFu Microelectronics Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 51. Tianshui Huatian Technology Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 52. UTAC Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 53. Chipbond Technology Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 54. Hana Micron Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 55. OSE Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 56. Walton Advanced Engineering Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 57. NEPES Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 58. Unisem Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 59. ChipMOS Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 60. Signetics Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 61. Carsem Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 62. King Yuan ELECTRONICS Revenue Growth Rate in Chip Scale Package (CSP) Business (2019-2024)
Figure 63. Bottom-up and Top-down Approaches for This Report
Figure 64. Data Triangulation
Figure 65. Key Executives Interviewed
Published By : QY Research
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