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Global Circuit Board Heat Sink Market Research Report 2025
Synopsis
A circuit board heat sink is a cooling device attached to the circuit boards of electronic equipment and computers. They are used to stabilize circuit operation by dissipating heat generated by electronic and electrical components mounted on printed circuit boards. Semiconductor components in various circuits tend to generate large amounts of heat when large drive power is required.
With the evolution of semiconductor processes, large-scale integrated circuits have been realized in extremely small sizes. In devices that realize such complex and advanced functions and performance, the amount of heat generated is also often large. To reduce the amount of heat generated, various efforts are being made on the semiconductor device side to reduce power consumption. However, in most cases, heat sinks are required to maintain stable operation when used in various environments.
The global Circuit Board Heat Sink market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Circuit Board Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Circuit Board Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Circuit Board Heat Sink include Nishimura Advanced Ceramics, Millennium Circuits Limited, Epec, A.L.M.T. Corp., Nippon Electric Glass, Resonac Holdings Corporation, RayMing Technology, Himalay Engineering, PW Circuits Ltd, Zaward Corporation, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Circuit Board Heat Sink, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Circuit Board Heat Sink.
The Circuit Board Heat Sink market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Circuit Board Heat Sink market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Circuit Board Heat Sink manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Nishimura Advanced Ceramics
Millennium Circuits Limited
Epec
A.L.M.T. Corp.
Nippon Electric Glass
Resonac Holdings Corporation
RayMing Technology
Himalay Engineering
PW Circuits Ltd
Zaward Corporation
db Electronic
TAKAGI MFG.CO.,LTD.
by Type
Natural Air Cooling
Forced Air Cooling
by Application
Industrial Equipment
Consumer Electronics
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Circuit Board Heat Sink manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Circuit Board Heat Sink by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Circuit Board Heat Sink in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
A circuit board heat sink is a cooling device attached to the circuit boards of electronic equipment and computers. They are used to stabilize circuit operation by dissipating heat generated by electronic and electrical components mounted on printed circuit boards. Semiconductor components in various circuits tend to generate large amounts of heat when large drive power is required.
With the evolution of semiconductor processes, large-scale integrated circuits have been realized in extremely small sizes. In devices that realize such complex and advanced functions and performance, the amount of heat generated is also often large. To reduce the amount of heat generated, various efforts are being made on the semiconductor device side to reduce power consumption. However, in most cases, heat sinks are required to maintain stable operation when used in various environments.
The global Circuit Board Heat Sink market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Circuit Board Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Circuit Board Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Circuit Board Heat Sink include Nishimura Advanced Ceramics, Millennium Circuits Limited, Epec, A.L.M.T. Corp., Nippon Electric Glass, Resonac Holdings Corporation, RayMing Technology, Himalay Engineering, PW Circuits Ltd, Zaward Corporation, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Circuit Board Heat Sink, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Circuit Board Heat Sink.
The Circuit Board Heat Sink market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Circuit Board Heat Sink market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Circuit Board Heat Sink manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Nishimura Advanced Ceramics
Millennium Circuits Limited
Epec
A.L.M.T. Corp.
Nippon Electric Glass
Resonac Holdings Corporation
RayMing Technology
Himalay Engineering
PW Circuits Ltd
Zaward Corporation
db Electronic
TAKAGI MFG.CO.,LTD.
by Type
Natural Air Cooling
Forced Air Cooling
by Application
Industrial Equipment
Consumer Electronics
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Circuit Board Heat Sink manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Circuit Board Heat Sink by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Circuit Board Heat Sink in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Circuit Board Heat Sink Market Overview
1.1 Product Definition
1.2 Circuit Board Heat Sink by Type
1.2.1 Global Circuit Board Heat Sink Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Natural Air Cooling
1.2.3 Forced Air Cooling
1.3 Circuit Board Heat Sink by Application
1.3.1 Global Circuit Board Heat Sink Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Industrial Equipment
1.3.3 Consumer Electronics
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Circuit Board Heat Sink Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Circuit Board Heat Sink Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Circuit Board Heat Sink Production Estimates and Forecasts (2019-2030)
1.4.4 Global Circuit Board Heat Sink Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Circuit Board Heat Sink Production Market Share by Manufacturers (2019-2024)
2.2 Global Circuit Board Heat Sink Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Circuit Board Heat Sink, Industry Ranking, 2022 VS 2023
2.4 Global Circuit Board Heat Sink Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Circuit Board Heat Sink Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Circuit Board Heat Sink, Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Circuit Board Heat Sink, Product Type & Application
2.8 Global Key Manufacturers of Circuit Board Heat Sink, Date of Enter into This Industry
2.9 Global Circuit Board Heat Sink Market Competitive Situation and Trends
2.9.1 Global Circuit Board Heat Sink Market Concentration Rate
2.9.2 Global 5 and 10 Largest Circuit Board Heat Sink Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Circuit Board Heat Sink Production by Region
3.1 Global Circuit Board Heat Sink Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Circuit Board Heat Sink Production Value by Region (2019-2030)
3.2.1 Global Circuit Board Heat Sink Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Circuit Board Heat Sink by Region (2025-2030)
3.3 Global Circuit Board Heat Sink Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Circuit Board Heat Sink Production by Region (2019-2030)
3.4.1 Global Circuit Board Heat Sink Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Circuit Board Heat Sink by Region (2025-2030)
3.5 Global Circuit Board Heat Sink Market Price Analysis by Region (2019-2024)
3.6 Global Circuit Board Heat Sink Production and Value, Year-over-Year Growth
3.6.1 North America Circuit Board Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Circuit Board Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Circuit Board Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Circuit Board Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Circuit Board Heat Sink Production Value Estimates and Forecasts (2019-2030)
4 Circuit Board Heat Sink Consumption by Region
4.1 Global Circuit Board Heat Sink Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Circuit Board Heat Sink Consumption by Region (2019-2030)
4.2.1 Global Circuit Board Heat Sink Consumption by Region (2019-2030)
4.2.2 Global Circuit Board Heat Sink Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Circuit Board Heat Sink Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Circuit Board Heat Sink Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Circuit Board Heat Sink Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Circuit Board Heat Sink Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Circuit Board Heat Sink Production by Type (2019-2030)
5.1.1 Global Circuit Board Heat Sink Production by Type (2019-2024)
5.1.2 Global Circuit Board Heat Sink Production by Type (2025-2030)
5.1.3 Global Circuit Board Heat Sink Production Market Share by Type (2019-2030)
5.2 Global Circuit Board Heat Sink Production Value by Type (2019-2030)
5.2.1 Global Circuit Board Heat Sink Production Value by Type (2019-2024)
5.2.2 Global Circuit Board Heat Sink Production Value by Type (2025-2030)
5.2.3 Global Circuit Board Heat Sink Production Value Market Share by Type (2019-2030)
5.3 Global Circuit Board Heat Sink Price by Type (2019-2030)
6 Segment by Application
6.1 Global Circuit Board Heat Sink Production by Application (2019-2030)
6.1.1 Global Circuit Board Heat Sink Production by Application (2019-2024)
6.1.2 Global Circuit Board Heat Sink Production by Application (2025-2030)
6.1.3 Global Circuit Board Heat Sink Production Market Share by Application (2019-2030)
6.2 Global Circuit Board Heat Sink Production Value by Application (2019-2030)
6.2.1 Global Circuit Board Heat Sink Production Value by Application (2019-2024)
6.2.2 Global Circuit Board Heat Sink Production Value by Application (2025-2030)
6.2.3 Global Circuit Board Heat Sink Production Value Market Share by Application (2019-2030)
6.3 Global Circuit Board Heat Sink Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Nishimura Advanced Ceramics
7.1.1 Nishimura Advanced Ceramics Circuit Board Heat Sink Company Information
7.1.2 Nishimura Advanced Ceramics Circuit Board Heat Sink Product Portfolio
7.1.3 Nishimura Advanced Ceramics Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Nishimura Advanced Ceramics Main Business and Markets Served
7.1.5 Nishimura Advanced Ceramics Recent Developments/Updates
7.2 Millennium Circuits Limited
7.2.1 Millennium Circuits Limited Circuit Board Heat Sink Company Information
7.2.2 Millennium Circuits Limited Circuit Board Heat Sink Product Portfolio
7.2.3 Millennium Circuits Limited Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Millennium Circuits Limited Main Business and Markets Served
7.2.5 Millennium Circuits Limited Recent Developments/Updates
7.3 Epec
7.3.1 Epec Circuit Board Heat Sink Company Information
7.3.2 Epec Circuit Board Heat Sink Product Portfolio
7.3.3 Epec Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Epec Main Business and Markets Served
7.3.5 Epec Recent Developments/Updates
7.4 A.L.M.T. Corp.
7.4.1 A.L.M.T. Corp. Circuit Board Heat Sink Company Information
7.4.2 A.L.M.T. Corp. Circuit Board Heat Sink Product Portfolio
7.4.3 A.L.M.T. Corp. Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.4.4 A.L.M.T. Corp. Main Business and Markets Served
7.4.5 A.L.M.T. Corp. Recent Developments/Updates
7.5 Nippon Electric Glass
7.5.1 Nippon Electric Glass Circuit Board Heat Sink Company Information
7.5.2 Nippon Electric Glass Circuit Board Heat Sink Product Portfolio
7.5.3 Nippon Electric Glass Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Nippon Electric Glass Main Business and Markets Served
7.5.5 Nippon Electric Glass Recent Developments/Updates
7.6 Resonac Holdings Corporation
7.6.1 Resonac Holdings Corporation Circuit Board Heat Sink Company Information
7.6.2 Resonac Holdings Corporation Circuit Board Heat Sink Product Portfolio
7.6.3 Resonac Holdings Corporation Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Resonac Holdings Corporation Main Business and Markets Served
7.6.5 Resonac Holdings Corporation Recent Developments/Updates
7.7 RayMing Technology
7.7.1 RayMing Technology Circuit Board Heat Sink Company Information
7.7.2 RayMing Technology Circuit Board Heat Sink Product Portfolio
7.7.3 RayMing Technology Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.7.4 RayMing Technology Main Business and Markets Served
7.7.5 RayMing Technology Recent Developments/Updates
7.8 Himalay Engineering
7.8.1 Himalay Engineering Circuit Board Heat Sink Company Information
7.8.2 Himalay Engineering Circuit Board Heat Sink Product Portfolio
7.8.3 Himalay Engineering Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Himalay Engineering Main Business and Markets Served
7.8.5 Himalay Engineering Recent Developments/Updates
7.9 PW Circuits Ltd
7.9.1 PW Circuits Ltd Circuit Board Heat Sink Company Information
7.9.2 PW Circuits Ltd Circuit Board Heat Sink Product Portfolio
7.9.3 PW Circuits Ltd Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.9.4 PW Circuits Ltd Main Business and Markets Served
7.9.5 PW Circuits Ltd Recent Developments/Updates
7.10 Zaward Corporation
7.10.1 Zaward Corporation Circuit Board Heat Sink Company Information
7.10.2 Zaward Corporation Circuit Board Heat Sink Product Portfolio
7.10.3 Zaward Corporation Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Zaward Corporation Main Business and Markets Served
7.10.5 Zaward Corporation Recent Developments/Updates
7.11 db Electronic
7.11.1 db Electronic Circuit Board Heat Sink Company Information
7.11.2 db Electronic Circuit Board Heat Sink Product Portfolio
7.11.3 db Electronic Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.11.4 db Electronic Main Business and Markets Served
7.11.5 db Electronic Recent Developments/Updates
7.12 TAKAGI MFG.CO.,LTD.
7.12.1 TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Company Information
7.12.2 TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Product Portfolio
7.12.3 TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.12.4 TAKAGI MFG.CO.,LTD. Main Business and Markets Served
7.12.5 TAKAGI MFG.CO.,LTD. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Circuit Board Heat Sink Industry Chain Analysis
8.2 Circuit Board Heat Sink Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Circuit Board Heat Sink Production Mode & Process
8.4 Circuit Board Heat Sink Sales and Marketing
8.4.1 Circuit Board Heat Sink Sales Channels
8.4.2 Circuit Board Heat Sink Distributors
8.5 Circuit Board Heat Sink Customers
9 Circuit Board Heat Sink Market Dynamics
9.1 Circuit Board Heat Sink Industry Trends
9.2 Circuit Board Heat Sink Market Drivers
9.3 Circuit Board Heat Sink Market Challenges
9.4 Circuit Board Heat Sink Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Circuit Board Heat Sink Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Circuit Board Heat Sink Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Circuit Board Heat Sink Production by Manufacturers (2019-2024) & (K Units)
Table 4. Global Circuit Board Heat Sink Production Market Share by Manufacturers (2019-2024)
Table 5. Global Circuit Board Heat Sink Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 6. Global Circuit Board Heat Sink Production Value Share by Manufacturers (2019-2024)
Table 7. Global Key Players of Circuit Board Heat Sink, Industry Ranking, 2022 VS 2023
Table 8. Global Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Circuit Board Heat Sink as of 2023)
Table 9. Global Market Circuit Board Heat Sink Average Price by Manufacturers (US$/Unit) & (2019-2024)
Table 10. Global Key Manufacturers of Circuit Board Heat Sink, Manufacturing Sites & Headquarters
Table 11. Global Key Manufacturers of Circuit Board Heat Sink, Product Type & Application
Table 12. Global Key Manufacturers of Circuit Board Heat Sink, Date of Enter into This Industry
Table 13. Global Circuit Board Heat Sink Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion Plans
Table 15. Global Circuit Board Heat Sink Production Value Growth Rate by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Circuit Board Heat Sink Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Circuit Board Heat Sink Production Value Market Share by Region (2019-2024)
Table 18. Global Circuit Board Heat Sink Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Circuit Board Heat Sink Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Circuit Board Heat Sink Production Comparison by Region: 2019 VS 2023 VS 2030 (K Units)
Table 21. Global Circuit Board Heat Sink Production (K Units) by Region (2019-2024)
Table 22. Global Circuit Board Heat Sink Production Market Share by Region (2019-2024)
Table 23. Global Circuit Board Heat Sink Production (K Units) Forecast by Region (2025-2030)
Table 24. Global Circuit Board Heat Sink Production Market Share Forecast by Region (2025-2030)
Table 25. Global Circuit Board Heat Sink Market Average Price (US$/Unit) by Region (2019-2024)
Table 26. Global Circuit Board Heat Sink Market Average Price (US$/Unit) by Region (2025-2030)
Table 27. Global Circuit Board Heat Sink Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Units)
Table 28. Global Circuit Board Heat Sink Consumption by Region (2019-2024) & (K Units)
Table 29. Global Circuit Board Heat Sink Consumption Market Share by Region (2019-2024)
Table 30. Global Circuit Board Heat Sink Forecasted Consumption by Region (2025-2030) & (K Units)
Table 31. Global Circuit Board Heat Sink Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Units)
Table 33. North America Circuit Board Heat Sink Consumption by Country (2019-2024) & (K Units)
Table 34. North America Circuit Board Heat Sink Consumption by Country (2025-2030) & (K Units)
Table 35. Europe Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Units)
Table 36. Europe Circuit Board Heat Sink Consumption by Country (2019-2024) & (K Units)
Table 37. Europe Circuit Board Heat Sink Consumption by Country (2025-2030) & (K Units)
Table 38. Asia Pacific Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Units)
Table 39. Asia Pacific Circuit Board Heat Sink Consumption by Region (2019-2024) & (K Units)
Table 40. Asia Pacific Circuit Board Heat Sink Consumption by Region (2025-2030) & (K Units)
Table 41. Latin America, Middle East & Africa Circuit Board Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Units)
Table 42. Latin America, Middle East & Africa Circuit Board Heat Sink Consumption by Country (2019-2024) & (K Units)
Table 43. Latin America, Middle East & Africa Circuit Board Heat Sink Consumption by Country (2025-2030) & (K Units)
Table 44. Global Circuit Board Heat Sink Production (K Units) by Type (2019-2024)
Table 45. Global Circuit Board Heat Sink Production (K Units) by Type (2025-2030)
Table 46. Global Circuit Board Heat Sink Production Market Share by Type (2019-2024)
Table 47. Global Circuit Board Heat Sink Production Market Share by Type (2025-2030)
Table 48. Global Circuit Board Heat Sink Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Circuit Board Heat Sink Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Circuit Board Heat Sink Production Value Market Share by Type (2019-2024)
Table 51. Global Circuit Board Heat Sink Production Value Market Share by Type (2025-2030)
Table 52. Global Circuit Board Heat Sink Price (US$/Unit) by Type (2019-2024)
Table 53. Global Circuit Board Heat Sink Price (US$/Unit) by Type (2025-2030)
Table 54. Global Circuit Board Heat Sink Production (K Units) by Application (2019-2024)
Table 55. Global Circuit Board Heat Sink Production (K Units) by Application (2025-2030)
Table 56. Global Circuit Board Heat Sink Production Market Share by Application (2019-2024)
Table 57. Global Circuit Board Heat Sink Production Market Share by Application (2025-2030)
Table 58. Global Circuit Board Heat Sink Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Circuit Board Heat Sink Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Circuit Board Heat Sink Production Value Market Share by Application (2019-2024)
Table 61. Global Circuit Board Heat Sink Production Value Market Share by Application (2025-2030)
Table 62. Global Circuit Board Heat Sink Price (US$/Unit) by Application (2019-2024)
Table 63. Global Circuit Board Heat Sink Price (US$/Unit) by Application (2025-2030)
Table 64. Nishimura Advanced Ceramics Circuit Board Heat Sink Company Information
Table 65. Nishimura Advanced Ceramics Circuit Board Heat Sink Specification and Application
Table 66. Nishimura Advanced Ceramics Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 67. Nishimura Advanced Ceramics Main Business and Markets Served
Table 68. Nishimura Advanced Ceramics Recent Developments/Updates
Table 69. Millennium Circuits Limited Circuit Board Heat Sink Company Information
Table 70. Millennium Circuits Limited Circuit Board Heat Sink Specification and Application
Table 71. Millennium Circuits Limited Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 72. Millennium Circuits Limited Main Business and Markets Served
Table 73. Millennium Circuits Limited Recent Developments/Updates
Table 74. Epec Circuit Board Heat Sink Company Information
Table 75. Epec Circuit Board Heat Sink Specification and Application
Table 76. Epec Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 77. Epec Main Business and Markets Served
Table 78. Epec Recent Developments/Updates
Table 79. A.L.M.T. Corp. Circuit Board Heat Sink Company Information
Table 80. A.L.M.T. Corp. Circuit Board Heat Sink Specification and Application
Table 81. A.L.M.T. Corp. Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 82. A.L.M.T. Corp. Main Business and Markets Served
Table 83. A.L.M.T. Corp. Recent Developments/Updates
Table 84. Nippon Electric Glass Circuit Board Heat Sink Company Information
Table 85. Nippon Electric Glass Circuit Board Heat Sink Specification and Application
Table 86. Nippon Electric Glass Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 87. Nippon Electric Glass Main Business and Markets Served
Table 88. Nippon Electric Glass Recent Developments/Updates
Table 89. Resonac Holdings Corporation Circuit Board Heat Sink Company Information
Table 90. Resonac Holdings Corporation Circuit Board Heat Sink Specification and Application
Table 91. Resonac Holdings Corporation Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 92. Resonac Holdings Corporation Main Business and Markets Served
Table 93. Resonac Holdings Corporation Recent Developments/Updates
Table 94. RayMing Technology Circuit Board Heat Sink Company Information
Table 95. RayMing Technology Circuit Board Heat Sink Specification and Application
Table 96. RayMing Technology Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 97. RayMing Technology Main Business and Markets Served
Table 98. RayMing Technology Recent Developments/Updates
Table 99. Himalay Engineering Circuit Board Heat Sink Company Information
Table 100. Himalay Engineering Circuit Board Heat Sink Specification and Application
Table 101. Himalay Engineering Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 102. Himalay Engineering Main Business and Markets Served
Table 103. Himalay Engineering Recent Developments/Updates
Table 104. PW Circuits Ltd Circuit Board Heat Sink Company Information
Table 105. PW Circuits Ltd Circuit Board Heat Sink Specification and Application
Table 106. PW Circuits Ltd Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 107. PW Circuits Ltd Main Business and Markets Served
Table 108. PW Circuits Ltd Recent Developments/Updates
Table 109. Zaward Corporation Circuit Board Heat Sink Company Information
Table 110. Zaward Corporation Circuit Board Heat Sink Specification and Application
Table 111. Zaward Corporation Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 112. Zaward Corporation Main Business and Markets Served
Table 113. Zaward Corporation Recent Developments/Updates
Table 114. db Electronic Circuit Board Heat Sink Company Information
Table 115. db Electronic Circuit Board Heat Sink Specification and Application
Table 116. db Electronic Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 117. db Electronic Main Business and Markets Served
Table 118. db Electronic Recent Developments/Updates
Table 119. TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Company Information
Table 120. TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Specification and Application
Table 121. TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
Table 122. TAKAGI MFG.CO.,LTD. Main Business and Markets Served
Table 123. TAKAGI MFG.CO.,LTD. Recent Developments/Updates
Table 124. Key Raw Materials Lists
Table 125. Raw Materials Key Suppliers Lists
Table 126. Circuit Board Heat Sink Distributors List
Table 127. Circuit Board Heat Sink Customers List
Table 128. Circuit Board Heat Sink Market Trends
Table 129. Circuit Board Heat Sink Market Drivers
Table 130. Circuit Board Heat Sink Market Challenges
Table 131. Circuit Board Heat Sink Market Restraints
Table 132. Research Programs/Design for This Report
Table 133. Key Data Information from Secondary Sources
Table 134. Key Data Information from Primary Sources
Table 135. Authors List of This Report
List of Figures
Figure 1. Product Picture of Circuit Board Heat Sink
Figure 2. Global Circuit Board Heat Sink Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Circuit Board Heat Sink Market Share by Type: 2023 VS 2030
Figure 4. Natural Air Cooling Product Picture
Figure 5. Forced Air Cooling Product Picture
Figure 6. Global Circuit Board Heat Sink Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 7. Global Circuit Board Heat Sink Market Share by Application: 2023 VS 2030
Figure 8. Industrial Equipment
Figure 9. Consumer Electronics
Figure 10. Others
Figure 11. Global Circuit Board Heat Sink Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 12. Global Circuit Board Heat Sink Production Value (US$ Million) & (2019-2030)
Figure 13. Global Circuit Board Heat Sink Production Capacity (K Units) & (2019-2030)
Figure 14. Global Circuit Board Heat Sink Production (K Units) & (2019-2030)
Figure 15. Global Circuit Board Heat Sink Average Price (US$/Unit) & (2019-2030)
Figure 16. Circuit Board Heat Sink Report Years Considered
Figure 17. Circuit Board Heat Sink Production Share by Manufacturers in 2023
Figure 18. Global Circuit Board Heat Sink Production Value Share by Manufacturers (2023)
Figure 19. Circuit Board Heat Sink Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 20. The Global 5 and 10 Largest Players: Market Share by Circuit Board Heat Sink Revenue in 2023
Figure 21. Global Circuit Board Heat Sink Production Value Comparison by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 22. Global Circuit Board Heat Sink Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. Global Circuit Board Heat Sink Production Comparison by Region: 2019 VS 2023 VS 2030 (K Units)
Figure 24. Global Circuit Board Heat Sink Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. North America Circuit Board Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Europe Circuit Board Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. China Circuit Board Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Japan Circuit Board Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. South Korea Circuit Board Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Global Circuit Board Heat Sink Consumption by Region: 2019 VS 2023 VS 2030 (K Units)
Figure 31. Global Circuit Board Heat Sink Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 32. North America Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 33. North America Circuit Board Heat Sink Consumption Market Share by Country (2019-2030)
Figure 34. U.S. Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 35. Canada Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 36. Europe Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 37. Europe Circuit Board Heat Sink Consumption Market Share by Country (2019-2030)
Figure 38. Germany Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 39. France Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 40. U.K. Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 41. Italy Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 42. Netherlands Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 43. Asia Pacific Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 44. Asia Pacific Circuit Board Heat Sink Consumption Market Share by Region (2025-2030)
Figure 45. China Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 46. Japan Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 47. South Korea Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 48. China Taiwan Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 49. Southeast Asia Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 50. India Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 51. Latin America, Middle East & Africa Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 52. Latin America, Middle East & Africa Circuit Board Heat Sink Consumption Market Share by Country (2019-2030)
Figure 53. Mexico Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 54. Brazil Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 55. Israel Circuit Board Heat Sink Consumption and Growth Rate (2019-2030) & (K Units)
Figure 56. Global Production Market Share of Circuit Board Heat Sink by Type (2019-2030)
Figure 57. Global Production Value Market Share of Circuit Board Heat Sink by Type (2019-2030)
Figure 58. Global Circuit Board Heat Sink Price (US$/Unit) by Type (2019-2030)
Figure 59. Global Production Market Share of Circuit Board Heat Sink by Application (2019-2030)
Figure 60. Global Production Value Market Share of Circuit Board Heat Sink by Application (2019-2030)
Figure 61. Global Circuit Board Heat Sink Price (US$/Unit) by Application (2019-2030)
Figure 62. Circuit Board Heat Sink Value Chain
Figure 63. Circuit Board Heat Sink Production Process
Figure 64. Channels of Distribution (Direct Vs Distribution)
Figure 65. Bottom-up and Top-down Approaches for This Report
Figure 66. Data Triangulation
Published By : QY Research
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