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Global Communication HDI PCB Market Research Report 2025
Synopsis
Communication HDI (High-Density Interconnect) PCBs are specialized printed circuit boards tailored for communication systems, offering advanced multilayer designs with microvias, buried vias, and blind vias to enable high-density routing and compact layouts. These PCBs are optimized for high-speed signal transmission, low signal loss, and enhanced signal integrity, making them ideal for applications in telecommunications, networking equipment, wireless devices, and high-frequency RF/microwave systems. Communication HDI PCBs facilitate the integration of complex communication circuits, reduce electromagnetic interference (EMI), and support reliable data transmission, meeting the demanding performance requirements of modern communication technologies.
The global Communication HDI PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Communication HDI PCB is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Communication HDI PCB is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Communication HDI PCB include CMK, MEKTRON, TTM Technologies, Meiko Electronics, CHIN POON, Kingboard, Tripod, Unimicron, KCE Electronics, Shenzhen Kinwong Electronic, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Communication HDI PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Communication HDI PCB.
The Communication HDI PCB market size, estimations, and forecasts are provided in terms of output/shipments (Sq m) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Communication HDI PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Communication HDI PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
CMK
MEKTRON
TTM Technologies
Meiko Electronics
CHIN POON
Kingboard
Tripod
Unimicron
KCE Electronics
Shenzhen Kinwong Electronic
Uniteck
WUS Printed Circuit (Kunshan)
AT&S
Olympic Circuit Technology
by Type
Single Layer
Multi-Layer
by Application
Communication Device
Mobile Terminal
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Communication HDI PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Communication HDI PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Communication HDI PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Communication HDI (High-Density Interconnect) PCBs are specialized printed circuit boards tailored for communication systems, offering advanced multilayer designs with microvias, buried vias, and blind vias to enable high-density routing and compact layouts. These PCBs are optimized for high-speed signal transmission, low signal loss, and enhanced signal integrity, making them ideal for applications in telecommunications, networking equipment, wireless devices, and high-frequency RF/microwave systems. Communication HDI PCBs facilitate the integration of complex communication circuits, reduce electromagnetic interference (EMI), and support reliable data transmission, meeting the demanding performance requirements of modern communication technologies.
The global Communication HDI PCB market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Communication HDI PCB is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Communication HDI PCB is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Communication HDI PCB include CMK, MEKTRON, TTM Technologies, Meiko Electronics, CHIN POON, Kingboard, Tripod, Unimicron, KCE Electronics, Shenzhen Kinwong Electronic, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Communication HDI PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Communication HDI PCB.
The Communication HDI PCB market size, estimations, and forecasts are provided in terms of output/shipments (Sq m) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Communication HDI PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Communication HDI PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
CMK
MEKTRON
TTM Technologies
Meiko Electronics
CHIN POON
Kingboard
Tripod
Unimicron
KCE Electronics
Shenzhen Kinwong Electronic
Uniteck
WUS Printed Circuit (Kunshan)
AT&S
Olympic Circuit Technology
by Type
Single Layer
Multi-Layer
by Application
Communication Device
Mobile Terminal
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Communication HDI PCB manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Communication HDI PCB by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Communication HDI PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Communication HDI PCB Market Overview
1.1 Product Definition
1.2 Communication HDI PCB by Type
1.2.1 Global Communication HDI PCB Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Single Layer
1.2.3 Multi-Layer
1.3 Communication HDI PCB by Application
1.3.1 Global Communication HDI PCB Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Communication Device
1.3.3 Mobile Terminal
1.4 Global Market Growth Prospects
1.4.1 Global Communication HDI PCB Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Communication HDI PCB Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Communication HDI PCB Production Estimates and Forecasts (2019-2030)
1.4.4 Global Communication HDI PCB Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Communication HDI PCB Production Market Share by Manufacturers (2019-2024)
2.2 Global Communication HDI PCB Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Communication HDI PCB, Industry Ranking, 2022 VS 2023
2.4 Global Communication HDI PCB Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Communication HDI PCB Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Communication HDI PCB, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Communication HDI PCB, Product Offered and Application
2.8 Global Key Manufacturers of Communication HDI PCB, Date of Enter into This Industry
2.9 Communication HDI PCB Market Competitive Situation and Trends
2.9.1 Communication HDI PCB Market Concentration Rate
2.9.2 Global 5 and 10 Largest Communication HDI PCB Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Communication HDI PCB Production by Region
3.1 Global Communication HDI PCB Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Communication HDI PCB Production Value by Region (2019-2030)
3.2.1 Global Communication HDI PCB Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Communication HDI PCB by Region (2025-2030)
3.3 Global Communication HDI PCB Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Communication HDI PCB Production by Region (2019-2030)
3.4.1 Global Communication HDI PCB Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Communication HDI PCB by Region (2025-2030)
3.5 Global Communication HDI PCB Market Price Analysis by Region (2019-2024)
3.6 Global Communication HDI PCB Production and Value, Year-over-Year Growth
3.6.1 North America Communication HDI PCB Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Communication HDI PCB Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Communication HDI PCB Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Communication HDI PCB Production Value Estimates and Forecasts (2019-2030)
4 Communication HDI PCB Consumption by Region
4.1 Global Communication HDI PCB Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Communication HDI PCB Consumption by Region (2019-2030)
4.2.1 Global Communication HDI PCB Consumption by Region (2019-2030)
4.2.2 Global Communication HDI PCB Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Communication HDI PCB Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Communication HDI PCB Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Communication HDI PCB Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Communication HDI PCB Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Communication HDI PCB Production by Type (2019-2030)
5.1.1 Global Communication HDI PCB Production by Type (2019-2024)
5.1.2 Global Communication HDI PCB Production by Type (2025-2030)
5.1.3 Global Communication HDI PCB Production Market Share by Type (2019-2030)
5.2 Global Communication HDI PCB Production Value by Type (2019-2030)
5.2.1 Global Communication HDI PCB Production Value by Type (2019-2024)
5.2.2 Global Communication HDI PCB Production Value by Type (2025-2030)
5.2.3 Global Communication HDI PCB Production Value Market Share by Type (2019-2030)
5.3 Global Communication HDI PCB Price by Type (2019-2030)
6 Segment by Application
6.1 Global Communication HDI PCB Production by Application (2019-2030)
6.1.1 Global Communication HDI PCB Production by Application (2019-2024)
6.1.2 Global Communication HDI PCB Production by Application (2025-2030)
6.1.3 Global Communication HDI PCB Production Market Share by Application (2019-2030)
6.2 Global Communication HDI PCB Production Value by Application (2019-2030)
6.2.1 Global Communication HDI PCB Production Value by Application (2019-2024)
6.2.2 Global Communication HDI PCB Production Value by Application (2025-2030)
6.2.3 Global Communication HDI PCB Production Value Market Share by Application (2019-2030)
6.3 Global Communication HDI PCB Price by Application (2019-2030)
7 Key Companies Profiled
7.1 CMK
7.1.1 CMK Communication HDI PCB Company Information
7.1.2 CMK Communication HDI PCB Product Portfolio
7.1.3 CMK Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.1.4 CMK Main Business and Markets Served
7.1.5 CMK Recent Developments/Updates
7.2 MEKTRON
7.2.1 MEKTRON Communication HDI PCB Company Information
7.2.2 MEKTRON Communication HDI PCB Product Portfolio
7.2.3 MEKTRON Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.2.4 MEKTRON Main Business and Markets Served
7.2.5 MEKTRON Recent Developments/Updates
7.3 TTM Technologies
7.3.1 TTM Technologies Communication HDI PCB Company Information
7.3.2 TTM Technologies Communication HDI PCB Product Portfolio
7.3.3 TTM Technologies Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.3.4 TTM Technologies Main Business and Markets Served
7.3.5 TTM Technologies Recent Developments/Updates
7.4 Meiko Electronics
7.4.1 Meiko Electronics Communication HDI PCB Company Information
7.4.2 Meiko Electronics Communication HDI PCB Product Portfolio
7.4.3 Meiko Electronics Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Meiko Electronics Main Business and Markets Served
7.4.5 Meiko Electronics Recent Developments/Updates
7.5 CHIN POON
7.5.1 CHIN POON Communication HDI PCB Company Information
7.5.2 CHIN POON Communication HDI PCB Product Portfolio
7.5.3 CHIN POON Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.5.4 CHIN POON Main Business and Markets Served
7.5.5 CHIN POON Recent Developments/Updates
7.6 Kingboard
7.6.1 Kingboard Communication HDI PCB Company Information
7.6.2 Kingboard Communication HDI PCB Product Portfolio
7.6.3 Kingboard Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Kingboard Main Business and Markets Served
7.6.5 Kingboard Recent Developments/Updates
7.7 Tripod
7.7.1 Tripod Communication HDI PCB Company Information
7.7.2 Tripod Communication HDI PCB Product Portfolio
7.7.3 Tripod Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Tripod Main Business and Markets Served
7.7.5 Tripod Recent Developments/Updates
7.8 Unimicron
7.8.1 Unimicron Communication HDI PCB Company Information
7.8.2 Unimicron Communication HDI PCB Product Portfolio
7.8.3 Unimicron Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Unimicron Main Business and Markets Served
7.8.5 Unimicron Recent Developments/Updates
7.9 KCE Electronics
7.9.1 KCE Electronics Communication HDI PCB Company Information
7.9.2 KCE Electronics Communication HDI PCB Product Portfolio
7.9.3 KCE Electronics Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.9.4 KCE Electronics Main Business and Markets Served
7.9.5 KCE Electronics Recent Developments/Updates
7.10 Shenzhen Kinwong Electronic
7.10.1 Shenzhen Kinwong Electronic Communication HDI PCB Company Information
7.10.2 Shenzhen Kinwong Electronic Communication HDI PCB Product Portfolio
7.10.3 Shenzhen Kinwong Electronic Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Shenzhen Kinwong Electronic Main Business and Markets Served
7.10.5 Shenzhen Kinwong Electronic Recent Developments/Updates
7.11 Uniteck
7.11.1 Uniteck Communication HDI PCB Company Information
7.11.2 Uniteck Communication HDI PCB Product Portfolio
7.11.3 Uniteck Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Uniteck Main Business and Markets Served
7.11.5 Uniteck Recent Developments/Updates
7.12 WUS Printed Circuit (Kunshan)
7.12.1 WUS Printed Circuit (Kunshan) Communication HDI PCB Company Information
7.12.2 WUS Printed Circuit (Kunshan) Communication HDI PCB Product Portfolio
7.12.3 WUS Printed Circuit (Kunshan) Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.12.4 WUS Printed Circuit (Kunshan) Main Business and Markets Served
7.12.5 WUS Printed Circuit (Kunshan) Recent Developments/Updates
7.13 AT&S
7.13.1 AT&S Communication HDI PCB Company Information
7.13.2 AT&S Communication HDI PCB Product Portfolio
7.13.3 AT&S Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.13.4 AT&S Main Business and Markets Served
7.13.5 AT&S Recent Developments/Updates
7.14 Olympic Circuit Technology
7.14.1 Olympic Circuit Technology Communication HDI PCB Company Information
7.14.2 Olympic Circuit Technology Communication HDI PCB Product Portfolio
7.14.3 Olympic Circuit Technology Communication HDI PCB Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Olympic Circuit Technology Main Business and Markets Served
7.14.5 Olympic Circuit Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Communication HDI PCB Industry Chain Analysis
8.2 Communication HDI PCB Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Communication HDI PCB Production Mode & Process
8.4 Communication HDI PCB Sales and Marketing
8.4.1 Communication HDI PCB Sales Channels
8.4.2 Communication HDI PCB Distributors
8.5 Communication HDI PCB Customers
9 Communication HDI PCB Market Dynamics
9.1 Communication HDI PCB Industry Trends
9.2 Communication HDI PCB Market Drivers
9.3 Communication HDI PCB Market Challenges
9.4 Communication HDI PCB Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Communication HDI PCB Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Communication HDI PCB Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Communication HDI PCB Production Capacity (Sq m) by Manufacturers in 2023
Table 4. Global Communication HDI PCB Production by Manufacturers (2019-2024) & (Sq m)
Table 5. Global Communication HDI PCB Production Market Share by Manufacturers (2019-2024)
Table 6. Global Communication HDI PCB Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Communication HDI PCB Production Value Share by Manufacturers (2019-2024)
Table 8. Global Key Players of Communication HDI PCB, Industry Ranking, 2022 VS 2023
Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Communication HDI PCB as of 2023)
Table 10. Global Market Communication HDI PCB Average Price by Manufacturers (US$/Sq m) & (2019-2024)
Table 11. Global Key Manufacturers of Communication HDI PCB, Manufacturing Base Distribution and Headquarters
Table 12. Global Key Manufacturers of Communication HDI PCB, Product Offered and Application
Table 13. Global Key Manufacturers of Communication HDI PCB, Date of Enter into This Industry
Table 14. Global Communication HDI PCB Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global Communication HDI PCB Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 17. Global Communication HDI PCB Production Value (US$ Million) by Region (2019-2024)
Table 18. Global Communication HDI PCB Production Value Market Share by Region (2019-2024)
Table 19. Global Communication HDI PCB Production Value (US$ Million) Forecast by Region (2025-2030)
Table 20. Global Communication HDI PCB Production Value Market Share Forecast by Region (2025-2030)
Table 21. Global Communication HDI PCB Production Comparison by Region: 2019 VS 2023 VS 2030 (Sq m)
Table 22. Global Communication HDI PCB Production (Sq m) by Region (2019-2024)
Table 23. Global Communication HDI PCB Production Market Share by Region (2019-2024)
Table 24. Global Communication HDI PCB Production (Sq m) Forecast by Region (2025-2030)
Table 25. Global Communication HDI PCB Production Market Share Forecast by Region (2025-2030)
Table 26. Global Communication HDI PCB Market Average Price (US$/Sq m) by Region (2019-2024)
Table 27. Global Communication HDI PCB Market Average Price (US$/Sq m) by Region (2025-2030)
Table 28. Global Communication HDI PCB Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Sq m)
Table 29. Global Communication HDI PCB Consumption by Region (2019-2024) & (Sq m)
Table 30. Global Communication HDI PCB Consumption Market Share by Region (2019-2024)
Table 31. Global Communication HDI PCB Forecasted Consumption by Region (2025-2030) & (Sq m)
Table 32. Global Communication HDI PCB Forecasted Consumption Market Share by Region (2019-2024)
Table 33. North America Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Sq m)
Table 34. North America Communication HDI PCB Consumption by Country (2019-2024) & (Sq m)
Table 35. North America Communication HDI PCB Consumption by Country (2025-2030) & (Sq m)
Table 36. Europe Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Sq m)
Table 37. Europe Communication HDI PCB Consumption by Country (2019-2024) & (Sq m)
Table 38. Europe Communication HDI PCB Consumption by Country (2025-2030) & (Sq m)
Table 39. Asia Pacific Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Sq m)
Table 40. Asia Pacific Communication HDI PCB Consumption by Region (2019-2024) & (Sq m)
Table 41. Asia Pacific Communication HDI PCB Consumption by Region (2025-2030) & (Sq m)
Table 42. Latin America, Middle East & Africa Communication HDI PCB Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Sq m)
Table 43. Latin America, Middle East & Africa Communication HDI PCB Consumption by Country (2019-2024) & (Sq m)
Table 44. Latin America, Middle East & Africa Communication HDI PCB Consumption by Country (2025-2030) & (Sq m)
Table 45. Global Communication HDI PCB Production (Sq m) by Type (2019-2024)
Table 46. Global Communication HDI PCB Production (Sq m) by Type (2025-2030)
Table 47. Global Communication HDI PCB Production Market Share by Type (2019-2024)
Table 48. Global Communication HDI PCB Production Market Share by Type (2025-2030)
Table 49. Global Communication HDI PCB Production Value (US$ Million) by Type (2019-2024)
Table 50. Global Communication HDI PCB Production Value (US$ Million) by Type (2025-2030)
Table 51. Global Communication HDI PCB Production Value Market Share by Type (2019-2024)
Table 52. Global Communication HDI PCB Production Value Market Share by Type (2025-2030)
Table 53. Global Communication HDI PCB Price (US$/Sq m) by Type (2019-2024)
Table 54. Global Communication HDI PCB Price (US$/Sq m) by Type (2025-2030)
Table 55. Global Communication HDI PCB Production (Sq m) by Application (2019-2024)
Table 56. Global Communication HDI PCB Production (Sq m) by Application (2025-2030)
Table 57. Global Communication HDI PCB Production Market Share by Application (2019-2024)
Table 58. Global Communication HDI PCB Production Market Share by Application (2025-2030)
Table 59. Global Communication HDI PCB Production Value (US$ Million) by Application (2019-2024)
Table 60. Global Communication HDI PCB Production Value (US$ Million) by Application (2025-2030)
Table 61. Global Communication HDI PCB Production Value Market Share by Application (2019-2024)
Table 62. Global Communication HDI PCB Production Value Market Share by Application (2025-2030)
Table 63. Global Communication HDI PCB Price (US$/Sq m) by Application (2019-2024)
Table 64. Global Communication HDI PCB Price (US$/Sq m) by Application (2025-2030)
Table 65. CMK Communication HDI PCB Company Information
Table 66. CMK Communication HDI PCB Specification and Application
Table 67. CMK Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 68. CMK Main Business and Markets Served
Table 69. CMK Recent Developments/Updates
Table 70. MEKTRON Communication HDI PCB Company Information
Table 71. MEKTRON Communication HDI PCB Specification and Application
Table 72. MEKTRON Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 73. MEKTRON Main Business and Markets Served
Table 74. MEKTRON Recent Developments/Updates
Table 75. TTM Technologies Communication HDI PCB Company Information
Table 76. TTM Technologies Communication HDI PCB Specification and Application
Table 77. TTM Technologies Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 78. TTM Technologies Main Business and Markets Served
Table 79. TTM Technologies Recent Developments/Updates
Table 80. Meiko Electronics Communication HDI PCB Company Information
Table 81. Meiko Electronics Communication HDI PCB Specification and Application
Table 82. Meiko Electronics Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 83. Meiko Electronics Main Business and Markets Served
Table 84. Meiko Electronics Recent Developments/Updates
Table 85. CHIN POON Communication HDI PCB Company Information
Table 86. CHIN POON Communication HDI PCB Specification and Application
Table 87. CHIN POON Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 88. CHIN POON Main Business and Markets Served
Table 89. CHIN POON Recent Developments/Updates
Table 90. Kingboard Communication HDI PCB Company Information
Table 91. Kingboard Communication HDI PCB Specification and Application
Table 92. Kingboard Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 93. Kingboard Main Business and Markets Served
Table 94. Kingboard Recent Developments/Updates
Table 95. Tripod Communication HDI PCB Company Information
Table 96. Tripod Communication HDI PCB Specification and Application
Table 97. Tripod Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 98. Tripod Main Business and Markets Served
Table 99. Tripod Recent Developments/Updates
Table 100. Unimicron Communication HDI PCB Company Information
Table 101. Unimicron Communication HDI PCB Specification and Application
Table 102. Unimicron Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 103. Unimicron Main Business and Markets Served
Table 104. Unimicron Recent Developments/Updates
Table 105. KCE Electronics Communication HDI PCB Company Information
Table 106. KCE Electronics Communication HDI PCB Specification and Application
Table 107. KCE Electronics Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 108. KCE Electronics Main Business and Markets Served
Table 109. KCE Electronics Recent Developments/Updates
Table 110. Shenzhen Kinwong Electronic Communication HDI PCB Company Information
Table 111. Shenzhen Kinwong Electronic Communication HDI PCB Specification and Application
Table 112. Shenzhen Kinwong Electronic Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 113. Shenzhen Kinwong Electronic Main Business and Markets Served
Table 114. Shenzhen Kinwong Electronic Recent Developments/Updates
Table 115. Uniteck Communication HDI PCB Company Information
Table 116. Uniteck Communication HDI PCB Specification and Application
Table 117. Uniteck Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 118. Uniteck Main Business and Markets Served
Table 119. Uniteck Recent Developments/Updates
Table 120. WUS Printed Circuit (Kunshan) Communication HDI PCB Company Information
Table 121. WUS Printed Circuit (Kunshan) Communication HDI PCB Specification and Application
Table 122. WUS Printed Circuit (Kunshan) Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 123. WUS Printed Circuit (Kunshan) Main Business and Markets Served
Table 124. WUS Printed Circuit (Kunshan) Recent Developments/Updates
Table 125. AT&S Communication HDI PCB Company Information
Table 126. AT&S Communication HDI PCB Specification and Application
Table 127. AT&S Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 128. AT&S Main Business and Markets Served
Table 129. AT&S Recent Developments/Updates
Table 130. Olympic Circuit Technology Communication HDI PCB Company Information
Table 131. Olympic Circuit Technology Communication HDI PCB Specification and Application
Table 132. Olympic Circuit Technology Communication HDI PCB Production (Sq m), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
Table 133. Olympic Circuit Technology Main Business and Markets Served
Table 134. Olympic Circuit Technology Recent Developments/Updates
Table 135. Key Raw Materials Lists
Table 136. Raw Materials Key Suppliers Lists
Table 137. Communication HDI PCB Distributors List
Table 138. Communication HDI PCB Customers List
Table 139. Communication HDI PCB Market Trends
Table 140. Communication HDI PCB Market Drivers
Table 141. Communication HDI PCB Market Challenges
Table 142. Communication HDI PCB Market Restraints
Table 143. Research Programs/Design for This Report
Table 144. Key Data Information from Secondary Sources
Table 145. Key Data Information from Primary Sources
Table 146. Authors List of This Report
List of Figures
Figure 1. Product Picture of Communication HDI PCB
Figure 2. Global Communication HDI PCB Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Communication HDI PCB Market Share by Type: 2023 VS 2030
Figure 4. Single Layer Product Picture
Figure 5. Multi-Layer Product Picture
Figure 6. Global Communication HDI PCB Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 7. Global Communication HDI PCB Market Share by Application: 2023 VS 2030
Figure 8. Communication Device
Figure 9. Mobile Terminal
Figure 10. Global Communication HDI PCB Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 11. Global Communication HDI PCB Production Value (US$ Million) & (2019-2030)
Figure 12. Global Communication HDI PCB Production Capacity (Sq m) & (2019-2030)
Figure 13. Global Communication HDI PCB Production (Sq m) & (2019-2030)
Figure 14. Global Communication HDI PCB Average Price (US$/Sq m) & (2019-2030)
Figure 15. Communication HDI PCB Report Years Considered
Figure 16. Communication HDI PCB Production Share by Manufacturers in 2023
Figure 17. Communication HDI PCB Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 18. The Global 5 and 10 Largest Players: Market Share by Communication HDI PCB Revenue in 2023
Figure 19. Global Communication HDI PCB Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 20. Global Communication HDI PCB Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 21. Global Communication HDI PCB Production Comparison by Region: 2019 VS 2023 VS 2030 (Sq m)
Figure 22. Global Communication HDI PCB Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. North America Communication HDI PCB Production Value (US$ Million) Growth Rate (2019-2030)
Figure 24. Europe Communication HDI PCB Production Value (US$ Million) Growth Rate (2019-2030)
Figure 25. China Communication HDI PCB Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Japan Communication HDI PCB Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. Global Communication HDI PCB Consumption by Region: 2019 VS 2023 VS 2030 (Sq m)
Figure 28. Global Communication HDI PCB Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 29. North America Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 30. North America Communication HDI PCB Consumption Market Share by Country (2019-2030)
Figure 31. U.S. Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 32. Canada Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 33. Europe Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 34. Europe Communication HDI PCB Consumption Market Share by Country (2019-2030)
Figure 35. Germany Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 36. France Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 37. U.K. Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 38. Italy Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 39. Russia Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 40. Asia Pacific Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 41. Asia Pacific Communication HDI PCB Consumption Market Share by Region (2025-2030)
Figure 42. China Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 43. Japan Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 44. South Korea Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 45. China Taiwan Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 46. Southeast Asia Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 47. India Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 48. Latin America, Middle East & Africa Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 49. Latin America, Middle East & Africa Communication HDI PCB Consumption Market Share by Country (2019-2030)
Figure 50. Mexico Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 51. Brazil Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 52. Turkey Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 53. GCC Countries Communication HDI PCB Consumption and Growth Rate (2019-2030) & (Sq m)
Figure 54. Global Production Market Share of Communication HDI PCB by Type (2019-2030)
Figure 55. Global Production Value Market Share of Communication HDI PCB by Type (2019-2030)
Figure 56. Global Communication HDI PCB Price (US$/Sq m) by Type (2019-2030)
Figure 57. Global Production Market Share of Communication HDI PCB by Application (2019-2030)
Figure 58. Global Production Value Market Share of Communication HDI PCB by Application (2019-2030)
Figure 59. Global Communication HDI PCB Price (US$/Sq m) by Application (2019-2030)
Figure 60. Communication HDI PCB Value Chain
Figure 61. Communication HDI PCB Production Process
Figure 62. Channels of Distribution (Direct Vs Distribution)
Figure 63. Bottom-up and Top-down Approaches for This Report
Figure 64. Data Triangulation
Published By : QY Research
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