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Global Electrodeposited Copper Foil for Printed Circuit Boards Market Research Report 2025
Synopsis
Global Electrodeposited Copper Foil for Printed Circuit Boards market is projected to reach US$ 488.9 million in 2029, increasing from US$ 334 million in 2022, with the CAGR of 4.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Electrodeposited Copper Foil for Printed Circuit Boards market research.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Electrodeposited Copper Foil for Printed Circuit Boards market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Mitsui Mining & Smelting
JX Nippon Mining & Metals
Jiangxi Copper
Furukawa Electric
Nan Ya Plastics
Arcotech
Kingboard Copper Foil
Guangdong Chaohua Technology
Ls Mtron
Chang Chun Petrochemical
Minerex
Circuit Foil Luxembourg
Suzhou Fukuda Metal
LingBao Wason Copper Foil
Targray Technology International
Shandong Jinbao Electronics
Segment by Type
Below 20 μm
20-50 μm
Above 50 μm
Segment by Application
Single Sided Board
Double Sided Board
Multi Layered Board
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Electrodeposited Copper Foil for Printed Circuit Boards report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Global Electrodeposited Copper Foil for Printed Circuit Boards market is projected to reach US$ 488.9 million in 2029, increasing from US$ 334 million in 2022, with the CAGR of 4.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Electrodeposited Copper Foil for Printed Circuit Boards market research.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Electrodeposited Copper Foil for Printed Circuit Boards market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Mitsui Mining & Smelting
JX Nippon Mining & Metals
Jiangxi Copper
Furukawa Electric
Nan Ya Plastics
Arcotech
Kingboard Copper Foil
Guangdong Chaohua Technology
Ls Mtron
Chang Chun Petrochemical
Minerex
Circuit Foil Luxembourg
Suzhou Fukuda Metal
LingBao Wason Copper Foil
Targray Technology International
Shandong Jinbao Electronics
Segment by Type
Below 20 μm
20-50 μm
Above 50 μm
Segment by Application
Single Sided Board
Double Sided Board
Multi Layered Board
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Electrodeposited Copper Foil for Printed Circuit Boards report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Electrodeposited Copper Foil for Printed Circuit Boards Market Overview
1.1 Product Definition
1.2 Electrodeposited Copper Foil for Printed Circuit Boards Segment by Type
1.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Below 20 μm
1.2.3 20-50 μm
1.2.4 Above 50 μm
1.3 Electrodeposited Copper Foil for Printed Circuit Boards Segment by Application
1.3.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Single Sided Board
1.3.3 Double Sided Board
1.3.4 Multi Layered Board
1.4 Global Market Growth Prospects
1.4.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Estimates and Forecasts (2018-2029)
1.4.4 Global Electrodeposited Copper Foil for Printed Circuit Boards Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Market Share by Manufacturers (2018-2023)
2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Electrodeposited Copper Foil for Printed Circuit Boards, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Electrodeposited Copper Foil for Printed Circuit Boards Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Electrodeposited Copper Foil for Printed Circuit Boards Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Electrodeposited Copper Foil for Printed Circuit Boards, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electrodeposited Copper Foil for Printed Circuit Boards, Product Offered and Application
2.8 Global Key Manufacturers of Electrodeposited Copper Foil for Printed Circuit Boards, Date of Enter into This Industry
2.9 Electrodeposited Copper Foil for Printed Circuit Boards Market Competitive Situation and Trends
2.9.1 Electrodeposited Copper Foil for Printed Circuit Boards Market Concentration Rate
2.9.2 Global 5 and 10 Largest Electrodeposited Copper Foil for Printed Circuit Boards Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electrodeposited Copper Foil for Printed Circuit Boards Production by Region
3.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Region (2018-2029)
3.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Electrodeposited Copper Foil for Printed Circuit Boards by Region (2024-2029)
3.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Region (2018-2029)
3.4.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Electrodeposited Copper Foil for Printed Circuit Boards by Region (2024-2029)
3.5 Global Electrodeposited Copper Foil for Printed Circuit Boards Market Price Analysis by Region (2018-2023)
3.6 Global Electrodeposited Copper Foil for Printed Circuit Boards Production and Value, Year-over-Year Growth
3.6.1 North America Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2018-2029)
4 Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region
4.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region (2018-2029)
4.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region (2018-2023)
4.2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Type (2018-2029)
5.1.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Type (2018-2023)
5.1.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Type (2024-2029)
5.1.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Market Share by Type (2018-2029)
5.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Type (2018-2029)
5.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Type (2018-2023)
5.2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Type (2024-2029)
5.2.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Market Share by Type (2018-2029)
5.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Price by Type (2018-2029)
6 Segment by Application
6.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Application (2018-2029)
6.1.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Application (2018-2023)
6.1.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Application (2024-2029)
6.1.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Market Share by Application (2018-2029)
6.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Application (2018-2029)
6.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Application (2018-2023)
6.2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Application (2024-2029)
6.2.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Market Share by Application (2018-2029)
6.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Mitsui Mining & Smelting
7.1.1 Mitsui Mining & Smelting Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.1.2 Mitsui Mining & Smelting Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.1.3 Mitsui Mining & Smelting Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Mitsui Mining & Smelting Main Business and Markets Served
7.1.5 Mitsui Mining & Smelting Recent Developments/Updates
7.2 JX Nippon Mining & Metals
7.2.1 JX Nippon Mining & Metals Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.2.2 JX Nippon Mining & Metals Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.2.3 JX Nippon Mining & Metals Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.2.4 JX Nippon Mining & Metals Main Business and Markets Served
7.2.5 JX Nippon Mining & Metals Recent Developments/Updates
7.3 Jiangxi Copper
7.3.1 Jiangxi Copper Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.3.2 Jiangxi Copper Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.3.3 Jiangxi Copper Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Jiangxi Copper Main Business and Markets Served
7.3.5 Jiangxi Copper Recent Developments/Updates
7.4 Furukawa Electric
7.4.1 Furukawa Electric Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.4.2 Furukawa Electric Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.4.3 Furukawa Electric Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Furukawa Electric Main Business and Markets Served
7.4.5 Furukawa Electric Recent Developments/Updates
7.5 Nan Ya Plastics
7.5.1 Nan Ya Plastics Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.5.2 Nan Ya Plastics Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.5.3 Nan Ya Plastics Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Nan Ya Plastics Main Business and Markets Served
7.5.5 Nan Ya Plastics Recent Developments/Updates
7.6 Arcotech
7.6.1 Arcotech Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.6.2 Arcotech Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.6.3 Arcotech Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Arcotech Main Business and Markets Served
7.6.5 Arcotech Recent Developments/Updates
7.7 Kingboard Copper Foil
7.7.1 Kingboard Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.7.2 Kingboard Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.7.3 Kingboard Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Kingboard Copper Foil Main Business and Markets Served
7.7.5 Kingboard Copper Foil Recent Developments/Updates
7.8 Guangdong Chaohua Technology
7.8.1 Guangdong Chaohua Technology Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.8.2 Guangdong Chaohua Technology Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.8.3 Guangdong Chaohua Technology Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Guangdong Chaohua Technology Main Business and Markets Served
7.7.5 Guangdong Chaohua Technology Recent Developments/Updates
7.9 Ls Mtron
7.9.1 Ls Mtron Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.9.2 Ls Mtron Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.9.3 Ls Mtron Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Ls Mtron Main Business and Markets Served
7.9.5 Ls Mtron Recent Developments/Updates
7.10 Chang Chun Petrochemical
7.10.1 Chang Chun Petrochemical Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.10.2 Chang Chun Petrochemical Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.10.3 Chang Chun Petrochemical Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Chang Chun Petrochemical Main Business and Markets Served
7.10.5 Chang Chun Petrochemical Recent Developments/Updates
7.11 Minerex
7.11.1 Minerex Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.11.2 Minerex Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.11.3 Minerex Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Minerex Main Business and Markets Served
7.11.5 Minerex Recent Developments/Updates
7.12 Circuit Foil Luxembourg
7.12.1 Circuit Foil Luxembourg Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.12.2 Circuit Foil Luxembourg Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.12.3 Circuit Foil Luxembourg Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Circuit Foil Luxembourg Main Business and Markets Served
7.12.5 Circuit Foil Luxembourg Recent Developments/Updates
7.13 Suzhou Fukuda Metal
7.13.1 Suzhou Fukuda Metal Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.13.2 Suzhou Fukuda Metal Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.13.3 Suzhou Fukuda Metal Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Suzhou Fukuda Metal Main Business and Markets Served
7.13.5 Suzhou Fukuda Metal Recent Developments/Updates
7.14 LingBao Wason Copper Foil
7.14.1 LingBao Wason Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.14.2 LingBao Wason Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.14.3 LingBao Wason Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.14.4 LingBao Wason Copper Foil Main Business and Markets Served
7.14.5 LingBao Wason Copper Foil Recent Developments/Updates
7.15 Targray Technology International
7.15.1 Targray Technology International Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.15.2 Targray Technology International Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.15.3 Targray Technology International Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Targray Technology International Main Business and Markets Served
7.15.5 Targray Technology International Recent Developments/Updates
7.16 Shandong Jinbao Electronics
7.16.1 Shandong Jinbao Electronics Electrodeposited Copper Foil for Printed Circuit Boards Corporation Information
7.16.2 Shandong Jinbao Electronics Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.16.3 Shandong Jinbao Electronics Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Shandong Jinbao Electronics Main Business and Markets Served
7.16.5 Shandong Jinbao Electronics Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electrodeposited Copper Foil for Printed Circuit Boards Industry Chain Analysis
8.2 Electrodeposited Copper Foil for Printed Circuit Boards Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electrodeposited Copper Foil for Printed Circuit Boards Production Mode & Process
8.4 Electrodeposited Copper Foil for Printed Circuit Boards Sales and Marketing
8.4.1 Electrodeposited Copper Foil for Printed Circuit Boards Sales Channels
8.4.2 Electrodeposited Copper Foil for Printed Circuit Boards Distributors
8.5 Electrodeposited Copper Foil for Printed Circuit Boards Customers
9 Electrodeposited Copper Foil for Printed Circuit Boards Market Dynamics
9.1 Electrodeposited Copper Foil for Printed Circuit Boards Industry Trends
9.2 Electrodeposited Copper Foil for Printed Circuit Boards Market Drivers
9.3 Electrodeposited Copper Foil for Printed Circuit Boards Market Challenges
9.4 Electrodeposited Copper Foil for Printed Circuit Boards Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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