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Global Electronic Board Level Underfill and Encapsulation Material Market Research Report 2025
Synopsis
Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
The global Electronic Board Level Underfill and Encapsulation Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Electronic Board Level Underfill and Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Board Level Underfill and Encapsulation Material.
Report Scope
The Electronic Board Level Underfill and Encapsulation Material market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Electronic Board Level Underfill and Encapsulation Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Board Level Underfill and Encapsulation Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel
Segment by Type
No Flow Underfill
Capillary Underfill
Molded Underfill
Wafer level Underfill
Segment by Application
Semiconductor Electronics Device
Aviation & Aerospace
Medical Devices
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Board Level Underfill and Encapsulation Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Board Level Underfill and Encapsulation Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Board Level Underfill and Encapsulation Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
The global Electronic Board Level Underfill and Encapsulation Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Electronic Board Level Underfill and Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Board Level Underfill and Encapsulation Material.
Report Scope
The Electronic Board Level Underfill and Encapsulation Material market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Electronic Board Level Underfill and Encapsulation Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Board Level Underfill and Encapsulation Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel
Segment by Type
No Flow Underfill
Capillary Underfill
Molded Underfill
Wafer level Underfill
Segment by Application
Semiconductor Electronics Device
Aviation & Aerospace
Medical Devices
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Board Level Underfill and Encapsulation Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Board Level Underfill and Encapsulation Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Board Level Underfill and Encapsulation Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Electronic Board Level Underfill and Encapsulation Material Market Overview
1.1 Product Definition
1.2 Electronic Board Level Underfill and Encapsulation Material Segment by Type
1.2.1 Global Electronic Board Level Underfill and Encapsulation Material Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 No Flow Underfill
1.2.3 Capillary Underfill
1.2.4 Molded Underfill
1.2.5 Wafer level Underfill
1.3 Electronic Board Level Underfill and Encapsulation Material Segment by Application
1.3.1 Global Electronic Board Level Underfill and Encapsulation Material Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Semiconductor Electronics Device
1.3.3 Aviation & Aerospace
1.3.4 Medical Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Electronic Board Level Underfill and Encapsulation Material Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Electronic Board Level Underfill and Encapsulation Material Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Electronic Board Level Underfill and Encapsulation Material Production Estimates and Forecasts (2019-2030)
1.4.4 Global Electronic Board Level Underfill and Encapsulation Material Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Electronic Board Level Underfill and Encapsulation Material Production Market Share by Manufacturers (2019-2024)
2.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Electronic Board Level Underfill and Encapsulation Material, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Electronic Board Level Underfill and Encapsulation Material Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Electronic Board Level Underfill and Encapsulation Material Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Electronic Board Level Underfill and Encapsulation Material, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electronic Board Level Underfill and Encapsulation Material, Product Offered and Application
2.8 Global Key Manufacturers of Electronic Board Level Underfill and Encapsulation Material, Date of Enter into This Industry
2.9 Electronic Board Level Underfill and Encapsulation Material Market Competitive Situation and Trends
2.9.1 Electronic Board Level Underfill and Encapsulation Material Market Concentration Rate
2.9.2 Global 5 and 10 Largest Electronic Board Level Underfill and Encapsulation Material Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electronic Board Level Underfill and Encapsulation Material Production by Region
3.1 Global Electronic Board Level Underfill and Encapsulation Material Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value by Region (2019-2030)
3.2.1 Global Electronic Board Level Underfill and Encapsulation Material Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Electronic Board Level Underfill and Encapsulation Material by Region (2025-2030)
3.3 Global Electronic Board Level Underfill and Encapsulation Material Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Electronic Board Level Underfill and Encapsulation Material Production by Region (2019-2030)
3.4.1 Global Electronic Board Level Underfill and Encapsulation Material Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Electronic Board Level Underfill and Encapsulation Material by Region (2025-2030)
3.5 Global Electronic Board Level Underfill and Encapsulation Material Market Price Analysis by Region (2019-2024)
3.6 Global Electronic Board Level Underfill and Encapsulation Material Production and Value, Year-over-Year Growth
3.6.1 North America Electronic Board Level Underfill and Encapsulation Material Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Electronic Board Level Underfill and Encapsulation Material Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Electronic Board Level Underfill and Encapsulation Material Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Electronic Board Level Underfill and Encapsulation Material Production Value Estimates and Forecasts (2019-2030)
4 Electronic Board Level Underfill and Encapsulation Material Consumption by Region
4.1 Global Electronic Board Level Underfill and Encapsulation Material Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Electronic Board Level Underfill and Encapsulation Material Consumption by Region (2019-2030)
4.2.1 Global Electronic Board Level Underfill and Encapsulation Material Consumption by Region (2019-2024)
4.2.2 Global Electronic Board Level Underfill and Encapsulation Material Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Electronic Board Level Underfill and Encapsulation Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Electronic Board Level Underfill and Encapsulation Material Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electronic Board Level Underfill and Encapsulation Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Electronic Board Level Underfill and Encapsulation Material Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Electronic Board Level Underfill and Encapsulation Material Production by Type (2019-2030)
5.1.1 Global Electronic Board Level Underfill and Encapsulation Material Production by Type (2019-2024)
5.1.2 Global Electronic Board Level Underfill and Encapsulation Material Production by Type (2025-2030)
5.1.3 Global Electronic Board Level Underfill and Encapsulation Material Production Market Share by Type (2019-2030)
5.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value by Type (2019-2030)
5.2.1 Global Electronic Board Level Underfill and Encapsulation Material Production Value by Type (2019-2024)
5.2.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value by Type (2025-2030)
5.2.3 Global Electronic Board Level Underfill and Encapsulation Material Production Value Market Share by Type (2019-2030)
5.3 Global Electronic Board Level Underfill and Encapsulation Material Price by Type (2019-2030)
6 Segment by Application
6.1 Global Electronic Board Level Underfill and Encapsulation Material Production by Application (2019-2030)
6.1.1 Global Electronic Board Level Underfill and Encapsulation Material Production by Application (2019-2024)
6.1.2 Global Electronic Board Level Underfill and Encapsulation Material Production by Application (2025-2030)
6.1.3 Global Electronic Board Level Underfill and Encapsulation Material Production Market Share by Application (2019-2030)
6.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value by Application (2019-2030)
6.2.1 Global Electronic Board Level Underfill and Encapsulation Material Production Value by Application (2019-2024)
6.2.2 Global Electronic Board Level Underfill and Encapsulation Material Production Value by Application (2025-2030)
6.2.3 Global Electronic Board Level Underfill and Encapsulation Material Production Value Market Share by Application (2019-2030)
6.3 Global Electronic Board Level Underfill and Encapsulation Material Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Fuller
7.1.1 Fuller Electronic Board Level Underfill and Encapsulation Material Corporation Information
7.1.2 Fuller Electronic Board Level Underfill and Encapsulation Material Product Portfolio
7.1.3 Fuller Electronic Board Level Underfill and Encapsulation Material Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Fuller Main Business and Markets Served
7.1.5 Fuller Recent Developments/Updates
7.2 Masterbond
7.2.1 Masterbond Electronic Board Level Underfill and Encapsulation Material Corporation Information
7.2.2 Masterbond Electronic Board Level Underfill and Encapsulation Material Product Portfolio
7.2.3 Masterbond Electronic Board Level Underfill and Encapsulation Material Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Masterbond Main Business and Markets Served
7.2.5 Masterbond Recent Developments/Updates
7.3 Zymet
7.3.1 Zymet Electronic Board Level Underfill and Encapsulation Material Corporation Information
7.3.2 Zymet Electronic Board Level Underfill and Encapsulation Material Product Portfolio
7.3.3 Zymet Electronic Board Level Underfill and Encapsulation Material Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Zymet Main Business and Markets Served
7.3.5 Zymet Recent Developments/Updates
7.4 Namics
7.4.1 Namics Electronic Board Level Underfill and Encapsulation Material Corporation Information
7.4.2 Namics Electronic Board Level Underfill and Encapsulation Material Product Portfolio
7.4.3 Namics Electronic Board Level Underfill and Encapsulation Material Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Namics Main Business and Markets Served
7.4.5 Namics Recent Developments/Updates
7.5 Epoxy Technology
7.5.1 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Corporation Information
7.5.2 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Product Portfolio
7.5.3 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Epoxy Technology Main Business and Markets Served
7.5.5 Epoxy Technology Recent Developments/Updates
7.6 Yincae Advanced Materials
7.6.1 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Corporation Information
7.6.2 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Product Portfolio
7.6.3 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Yincae Advanced Materials Main Business and Markets Served
7.6.5 Yincae Advanced Materials Recent Developments/Updates
7.7 Henkel
7.7.1 Henkel Electronic Board Level Underfill and Encapsulation Material Corporation Information
7.7.2 Henkel Electronic Board Level Underfill and Encapsulation Material Product Portfolio
7.7.3 Henkel Electronic Board Level Underfill and Encapsulation Material Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Henkel Main Business and Markets Served
7.7.5 Henkel Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electronic Board Level Underfill and Encapsulation Material Industry Chain Analysis
8.2 Electronic Board Level Underfill and Encapsulation Material Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electronic Board Level Underfill and Encapsulation Material Production Mode & Process
8.4 Electronic Board Level Underfill and Encapsulation Material Sales and Marketing
8.4.1 Electronic Board Level Underfill and Encapsulation Material Sales Channels
8.4.2 Electronic Board Level Underfill and Encapsulation Material Distributors
8.5 Electronic Board Level Underfill and Encapsulation Material Customers
9 Electronic Board Level Underfill and Encapsulation Material Market Dynamics
9.1 Electronic Board Level Underfill and Encapsulation Material Industry Trends
9.2 Electronic Board Level Underfill and Encapsulation Material Market Drivers
9.3 Electronic Board Level Underfill and Encapsulation Material Market Challenges
9.4 Electronic Board Level Underfill and Encapsulation Material Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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