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Global Electronic Package Metal Heat Sink Market Research Report 2025
Synopsis
The development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by Invar and Kovar alloys, and the thermal conductivity of the alloy is only 11-17W/(m•K). The second generation is a composite material represented by copper-tungsten (Cu-W) and Cu-molybdenum (Mo) materials, reaching about 200W / (m • K) and a thermal expansion coefficient of about 7.0×10-6/K. Good overall performance is the main material of choice for power chip packaging. The third generation is a lightweight, low-expansion composite material represented by aluminum (Al)/Sip and Al/SiCp. The thermal conductivity of Al/Sip material is only about 120~150W / (m•K), although the thermal conductivity is low , But the overall performance of workability, air tightness, weldability, etc. is good, and it is widely used in the production of RF power device packaging shells, and the thermal conductivity of Al/SiCp materials can reach 220 W / (m • K), and at the same time The density is controlled at about 3.0 g/cm3. Although the processing is difficult, the good thermal conductivity also makes it widely used as a shell material or chip heat sink material. The fourth generation is a high thermal conductivity, low expansion composite material represented by Dia/Cu, diamond/aluminum (Dia/Al), etc., which are designed to have a thermal expansion coefficient of 6×10-6~7×10-6/K, With a thermal conductivity of 550~650W / (m • K), it can be used on the 2nd and 3rd generation semiconductor chip devices and used for heat sink packaging of high-power devices to help the devices solve heat dissipation problems and achieve stable operation.
The global Electronic Package Metal Heat Sink market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Electronic Package Metal Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Electronic Package Metal Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Electronic Package Metal Heat Sink include Rogers Germany, Tecnisco, Heat Sinks Tungsten Molybdenum Science and Technology, Chengdu Eigen Material Technology, Luoyang Wochi, Citizen Electronics, HOSO Metal, AMETEK Metals Wallingford and Hermetic Solutions, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Electronic Package Metal Heat Sink, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Package Metal Heat Sink.
Report Scope
The Electronic Package Metal Heat Sink market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Electronic Package Metal Heat Sink market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Package Metal Heat Sink manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Rogers Germany
Tecnisco
Heat Sinks Tungsten Molybdenum Science and Technology
Chengdu Eigen Material Technology
Luoyang Wochi
Citizen Electronics
HOSO Metal
AMETEK Metals Wallingford
Hermetic Solutions
Element Six
Xinlong Metal Electrical
Segment by Type
Cu/Diamond
Al/SiCp
Al/Sip (Al30Si70)
Cu-Mo (Cu30Mo70)
Cu-W (Cu20W80)
Others
Segment by Application
Semiconductor Laser
Microwave Power Device
Semiconductor Lighting Device
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Package Metal Heat Sink manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Package Metal Heat Sink by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Package Metal Heat Sink in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by Invar and Kovar alloys, and the thermal conductivity of the alloy is only 11-17W/(m•K). The second generation is a composite material represented by copper-tungsten (Cu-W) and Cu-molybdenum (Mo) materials, reaching about 200W / (m • K) and a thermal expansion coefficient of about 7.0×10-6/K. Good overall performance is the main material of choice for power chip packaging. The third generation is a lightweight, low-expansion composite material represented by aluminum (Al)/Sip and Al/SiCp. The thermal conductivity of Al/Sip material is only about 120~150W / (m•K), although the thermal conductivity is low , But the overall performance of workability, air tightness, weldability, etc. is good, and it is widely used in the production of RF power device packaging shells, and the thermal conductivity of Al/SiCp materials can reach 220 W / (m • K), and at the same time The density is controlled at about 3.0 g/cm3. Although the processing is difficult, the good thermal conductivity also makes it widely used as a shell material or chip heat sink material. The fourth generation is a high thermal conductivity, low expansion composite material represented by Dia/Cu, diamond/aluminum (Dia/Al), etc., which are designed to have a thermal expansion coefficient of 6×10-6~7×10-6/K, With a thermal conductivity of 550~650W / (m • K), it can be used on the 2nd and 3rd generation semiconductor chip devices and used for heat sink packaging of high-power devices to help the devices solve heat dissipation problems and achieve stable operation.
The global Electronic Package Metal Heat Sink market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Electronic Package Metal Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Electronic Package Metal Heat Sink is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Electronic Package Metal Heat Sink include Rogers Germany, Tecnisco, Heat Sinks Tungsten Molybdenum Science and Technology, Chengdu Eigen Material Technology, Luoyang Wochi, Citizen Electronics, HOSO Metal, AMETEK Metals Wallingford and Hermetic Solutions, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Electronic Package Metal Heat Sink, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Package Metal Heat Sink.
Report Scope
The Electronic Package Metal Heat Sink market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Electronic Package Metal Heat Sink market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Package Metal Heat Sink manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Rogers Germany
Tecnisco
Heat Sinks Tungsten Molybdenum Science and Technology
Chengdu Eigen Material Technology
Luoyang Wochi
Citizen Electronics
HOSO Metal
AMETEK Metals Wallingford
Hermetic Solutions
Element Six
Xinlong Metal Electrical
Segment by Type
Cu/Diamond
Al/SiCp
Al/Sip (Al30Si70)
Cu-Mo (Cu30Mo70)
Cu-W (Cu20W80)
Others
Segment by Application
Semiconductor Laser
Microwave Power Device
Semiconductor Lighting Device
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Package Metal Heat Sink manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Package Metal Heat Sink by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Package Metal Heat Sink in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Electronic Package Metal Heat Sink Market Overview
1.1 Product Definition
1.2 Electronic Package Metal Heat Sink Segment by Type
1.2.1 Global Electronic Package Metal Heat Sink Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Cu/Diamond
1.2.3 Al/SiCp
1.2.4 Al/Sip (Al30Si70)
1.2.5 Cu-Mo (Cu30Mo70)
1.2.6 Cu-W (Cu20W80)
1.2.7 Others
1.3 Electronic Package Metal Heat Sink Segment by Application
1.3.1 Global Electronic Package Metal Heat Sink Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Semiconductor Laser
1.3.3 Microwave Power Device
1.3.4 Semiconductor Lighting Device
1.4 Global Market Growth Prospects
1.4.1 Global Electronic Package Metal Heat Sink Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Electronic Package Metal Heat Sink Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Electronic Package Metal Heat Sink Production Estimates and Forecasts (2019-2030)
1.4.4 Global Electronic Package Metal Heat Sink Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Electronic Package Metal Heat Sink Production Market Share by Manufacturers (2019-2024)
2.2 Global Electronic Package Metal Heat Sink Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Electronic Package Metal Heat Sink, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Electronic Package Metal Heat Sink Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Electronic Package Metal Heat Sink Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Electronic Package Metal Heat Sink, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electronic Package Metal Heat Sink, Product Offered and Application
2.8 Global Key Manufacturers of Electronic Package Metal Heat Sink, Date of Enter into This Industry
2.9 Electronic Package Metal Heat Sink Market Competitive Situation and Trends
2.9.1 Electronic Package Metal Heat Sink Market Concentration Rate
2.9.2 Global 5 and 10 Largest Electronic Package Metal Heat Sink Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electronic Package Metal Heat Sink Production by Region
3.1 Global Electronic Package Metal Heat Sink Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Electronic Package Metal Heat Sink Production Value by Region (2019-2030)
3.2.1 Global Electronic Package Metal Heat Sink Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Electronic Package Metal Heat Sink by Region (2025-2030)
3.3 Global Electronic Package Metal Heat Sink Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Electronic Package Metal Heat Sink Production by Region (2019-2030)
3.4.1 Global Electronic Package Metal Heat Sink Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Electronic Package Metal Heat Sink by Region (2025-2030)
3.5 Global Electronic Package Metal Heat Sink Market Price Analysis by Region (2019-2024)
3.6 Global Electronic Package Metal Heat Sink Production and Value, Year-over-Year Growth
3.6.1 North America Electronic Package Metal Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Electronic Package Metal Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Electronic Package Metal Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Electronic Package Metal Heat Sink Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Electronic Package Metal Heat Sink Production Value Estimates and Forecasts (2019-2030)
4 Electronic Package Metal Heat Sink Consumption by Region
4.1 Global Electronic Package Metal Heat Sink Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Electronic Package Metal Heat Sink Consumption by Region (2019-2030)
4.2.1 Global Electronic Package Metal Heat Sink Consumption by Region (2019-2024)
4.2.2 Global Electronic Package Metal Heat Sink Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Electronic Package Metal Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Electronic Package Metal Heat Sink Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electronic Package Metal Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Electronic Package Metal Heat Sink Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electronic Package Metal Heat Sink Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Electronic Package Metal Heat Sink Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electronic Package Metal Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Electronic Package Metal Heat Sink Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Electronic Package Metal Heat Sink Production by Type (2019-2030)
5.1.1 Global Electronic Package Metal Heat Sink Production by Type (2019-2024)
5.1.2 Global Electronic Package Metal Heat Sink Production by Type (2025-2030)
5.1.3 Global Electronic Package Metal Heat Sink Production Market Share by Type (2019-2030)
5.2 Global Electronic Package Metal Heat Sink Production Value by Type (2019-2030)
5.2.1 Global Electronic Package Metal Heat Sink Production Value by Type (2019-2024)
5.2.2 Global Electronic Package Metal Heat Sink Production Value by Type (2025-2030)
5.2.3 Global Electronic Package Metal Heat Sink Production Value Market Share by Type (2019-2030)
5.3 Global Electronic Package Metal Heat Sink Price by Type (2019-2030)
6 Segment by Application
6.1 Global Electronic Package Metal Heat Sink Production by Application (2019-2030)
6.1.1 Global Electronic Package Metal Heat Sink Production by Application (2019-2024)
6.1.2 Global Electronic Package Metal Heat Sink Production by Application (2025-2030)
6.1.3 Global Electronic Package Metal Heat Sink Production Market Share by Application (2019-2030)
6.2 Global Electronic Package Metal Heat Sink Production Value by Application (2019-2030)
6.2.1 Global Electronic Package Metal Heat Sink Production Value by Application (2019-2024)
6.2.2 Global Electronic Package Metal Heat Sink Production Value by Application (2025-2030)
6.2.3 Global Electronic Package Metal Heat Sink Production Value Market Share by Application (2019-2030)
6.3 Global Electronic Package Metal Heat Sink Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Rogers Germany
7.1.1 Rogers Germany Electronic Package Metal Heat Sink Corporation Information
7.1.2 Rogers Germany Electronic Package Metal Heat Sink Product Portfolio
7.1.3 Rogers Germany Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Rogers Germany Main Business and Markets Served
7.1.5 Rogers Germany Recent Developments/Updates
7.2 Tecnisco
7.2.1 Tecnisco Electronic Package Metal Heat Sink Corporation Information
7.2.2 Tecnisco Electronic Package Metal Heat Sink Product Portfolio
7.2.3 Tecnisco Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Tecnisco Main Business and Markets Served
7.2.5 Tecnisco Recent Developments/Updates
7.3 Heat Sinks Tungsten Molybdenum Science and Technology
7.3.1 Heat Sinks Tungsten Molybdenum Science and Technology Electronic Package Metal Heat Sink Corporation Information
7.3.2 Heat Sinks Tungsten Molybdenum Science and Technology Electronic Package Metal Heat Sink Product Portfolio
7.3.3 Heat Sinks Tungsten Molybdenum Science and Technology Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Heat Sinks Tungsten Molybdenum Science and Technology Main Business and Markets Served
7.3.5 Heat Sinks Tungsten Molybdenum Science and Technology Recent Developments/Updates
7.4 Chengdu Eigen Material Technology
7.4.1 Chengdu Eigen Material Technology Electronic Package Metal Heat Sink Corporation Information
7.4.2 Chengdu Eigen Material Technology Electronic Package Metal Heat Sink Product Portfolio
7.4.3 Chengdu Eigen Material Technology Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Chengdu Eigen Material Technology Main Business and Markets Served
7.4.5 Chengdu Eigen Material Technology Recent Developments/Updates
7.5 Luoyang Wochi
7.5.1 Luoyang Wochi Electronic Package Metal Heat Sink Corporation Information
7.5.2 Luoyang Wochi Electronic Package Metal Heat Sink Product Portfolio
7.5.3 Luoyang Wochi Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Luoyang Wochi Main Business and Markets Served
7.5.5 Luoyang Wochi Recent Developments/Updates
7.6 Citizen Electronics
7.6.1 Citizen Electronics Electronic Package Metal Heat Sink Corporation Information
7.6.2 Citizen Electronics Electronic Package Metal Heat Sink Product Portfolio
7.6.3 Citizen Electronics Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Citizen Electronics Main Business and Markets Served
7.6.5 Citizen Electronics Recent Developments/Updates
7.7 HOSO Metal
7.7.1 HOSO Metal Electronic Package Metal Heat Sink Corporation Information
7.7.2 HOSO Metal Electronic Package Metal Heat Sink Product Portfolio
7.7.3 HOSO Metal Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.7.4 HOSO Metal Main Business and Markets Served
7.7.5 HOSO Metal Recent Developments/Updates
7.8 AMETEK Metals Wallingford
7.8.1 AMETEK Metals Wallingford Electronic Package Metal Heat Sink Corporation Information
7.8.2 AMETEK Metals Wallingford Electronic Package Metal Heat Sink Product Portfolio
7.8.3 AMETEK Metals Wallingford Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.8.4 AMETEK Metals Wallingford Main Business and Markets Served
7.7.5 AMETEK Metals Wallingford Recent Developments/Updates
7.9 Hermetic Solutions
7.9.1 Hermetic Solutions Electronic Package Metal Heat Sink Corporation Information
7.9.2 Hermetic Solutions Electronic Package Metal Heat Sink Product Portfolio
7.9.3 Hermetic Solutions Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Hermetic Solutions Main Business and Markets Served
7.9.5 Hermetic Solutions Recent Developments/Updates
7.10 Element Six
7.10.1 Element Six Electronic Package Metal Heat Sink Corporation Information
7.10.2 Element Six Electronic Package Metal Heat Sink Product Portfolio
7.10.3 Element Six Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Element Six Main Business and Markets Served
7.10.5 Element Six Recent Developments/Updates
7.11 Xinlong Metal Electrical
7.11.1 Xinlong Metal Electrical Electronic Package Metal Heat Sink Corporation Information
7.11.2 Xinlong Metal Electrical Electronic Package Metal Heat Sink Product Portfolio
7.11.3 Xinlong Metal Electrical Electronic Package Metal Heat Sink Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Xinlong Metal Electrical Main Business and Markets Served
7.11.5 Xinlong Metal Electrical Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electronic Package Metal Heat Sink Industry Chain Analysis
8.2 Electronic Package Metal Heat Sink Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electronic Package Metal Heat Sink Production Mode & Process
8.4 Electronic Package Metal Heat Sink Sales and Marketing
8.4.1 Electronic Package Metal Heat Sink Sales Channels
8.4.2 Electronic Package Metal Heat Sink Distributors
8.5 Electronic Package Metal Heat Sink Customers
9 Electronic Package Metal Heat Sink Market Dynamics
9.1 Electronic Package Metal Heat Sink Industry Trends
9.2 Electronic Package Metal Heat Sink Market Drivers
9.3 Electronic Package Metal Heat Sink Market Challenges
9.4 Electronic Package Metal Heat Sink Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Electronic Package Metal Heat Sink Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Electronic Package Metal Heat Sink Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Electronic Package Metal Heat Sink Production Capacity (K MT) by Manufacturers in 2023
Table 4. Global Electronic Package Metal Heat Sink Production by Manufacturers (2019-2024) & (K MT)
Table 5. Global Electronic Package Metal Heat Sink Production Market Share by Manufacturers (2019-2024)
Table 6. Global Electronic Package Metal Heat Sink Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Electronic Package Metal Heat Sink Production Value Share by Manufacturers (2019-2024)
Table 8. Global Electronic Package Metal Heat Sink Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Electronic Package Metal Heat Sink as of 2023)
Table 10. Global Market Electronic Package Metal Heat Sink Average Price by Manufacturers (USD/MT) & (2019-2024)
Table 11. Manufacturers Electronic Package Metal Heat Sink Production Sites and Area Served
Table 12. Manufacturers Electronic Package Metal Heat Sink Product Types
Table 13. Global Electronic Package Metal Heat Sink Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Electronic Package Metal Heat Sink Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Electronic Package Metal Heat Sink Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Electronic Package Metal Heat Sink Production Value Market Share by Region (2019-2024)
Table 18. Global Electronic Package Metal Heat Sink Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Electronic Package Metal Heat Sink Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Electronic Package Metal Heat Sink Production Comparison by Region: 2019 VS 2023 VS 2030 (K MT)
Table 21. Global Electronic Package Metal Heat Sink Production (K MT) by Region (2019-2024)
Table 22. Global Electronic Package Metal Heat Sink Production Market Share by Region (2019-2024)
Table 23. Global Electronic Package Metal Heat Sink Production (K MT) Forecast by Region (2025-2030)
Table 24. Global Electronic Package Metal Heat Sink Production Market Share Forecast by Region (2025-2030)
Table 25. Global Electronic Package Metal Heat Sink Market Average Price (USD/MT) by Region (2019-2024)
Table 26. Global Electronic Package Metal Heat Sink Market Average Price (USD/MT) by Region (2025-2030)
Table 27. Global Electronic Package Metal Heat Sink Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K MT)
Table 28. Global Electronic Package Metal Heat Sink Consumption by Region (2019-2024) & (K MT)
Table 29. Global Electronic Package Metal Heat Sink Consumption Market Share by Region (2019-2024)
Table 30. Global Electronic Package Metal Heat Sink Forecasted Consumption by Region (2025-2030) & (K MT)
Table 31. Global Electronic Package Metal Heat Sink Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Electronic Package Metal Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K MT)
Table 33. North America Electronic Package Metal Heat Sink Consumption by Country (2019-2024) & (K MT)
Table 34. North America Electronic Package Metal Heat Sink Consumption by Country (2025-2030) & (K MT)
Table 35. Europe Electronic Package Metal Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K MT)
Table 36. Europe Electronic Package Metal Heat Sink Consumption by Country (2019-2024) & (K MT)
Table 37. Europe Electronic Package Metal Heat Sink Consumption by Country (2025-2030) & (K MT)
Table 38. Asia Pacific Electronic Package Metal Heat Sink Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K MT)
Table 39. Asia Pacific Electronic Package Metal Heat Sink Consumption by Region (2019-2024) & (K MT)
Table 40. Asia Pacific Electronic Package Metal Heat Sink Consumption by Region (2025-2030) & (K MT)
Table 41. Latin America, Middle East & Africa Electronic Package Metal Heat Sink Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K MT)
Table 42. Latin America, Middle East & Africa Electronic Package Metal Heat Sink Consumption by Country (2019-2024) & (K MT)
Table 43. Latin America, Middle East & Africa Electronic Package Metal Heat Sink Consumption by Country (2025-2030) & (K MT)
Table 44. Global Electronic Package Metal Heat Sink Production (K MT) by Type (2019-2024)
Table 45. Global Electronic Package Metal Heat Sink Production (K MT) by Type (2025-2030)
Table 46. Global Electronic Package Metal Heat Sink Production Market Share by Type (2019-2024)
Table 47. Global Electronic Package Metal Heat Sink Production Market Share by Type (2025-2030)
Table 48. Global Electronic Package Metal Heat Sink Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Electronic Package Metal Heat Sink Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Electronic Package Metal Heat Sink Production Value Share by Type (2019-2024)
Table 51. Global Electronic Package Metal Heat Sink Production Value Share by Type (2025-2030)
Table 52. Global Electronic Package Metal Heat Sink Price (USD/MT) by Type (2019-2024)
Table 53. Global Electronic Package Metal Heat Sink Price (USD/MT) by Type (2025-2030)
Table 54. Global Electronic Package Metal Heat Sink Production (K MT) by Application (2019-2024)
Table 55. Global Electronic Package Metal Heat Sink Production (K MT) by Application (2025-2030)
Table 56. Global Electronic Package Metal Heat Sink Production Market Share by Application (2019-2024)
Table 57. Global Electronic Package Metal Heat Sink Production Market Share by Application (2025-2030)
Table 58. Global Electronic Package Metal Heat Sink Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Electronic Package Metal Heat Sink Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Electronic Package Metal Heat Sink Production Value Share by Application (2019-2024)
Table 61. Global Electronic Package Metal Heat Sink Production Value Share by Application (2025-2030)
Table 62. Global Electronic Package Metal Heat Sink Price (USD/MT) by Application (2019-2024)
Table 63. Global Electronic Package Metal Heat Sink Price (USD/MT) by Application (2025-2030)
Table 64. Rogers Germany Electronic Package Metal Heat Sink Corporation Information
Table 65. Rogers Germany Specification and Application
Table 66. Rogers Germany Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 67. Rogers Germany Main Business and Markets Served
Table 68. Rogers Germany Recent Developments/Updates
Table 69. Tecnisco Electronic Package Metal Heat Sink Corporation Information
Table 70. Tecnisco Specification and Application
Table 71. Tecnisco Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 72. Tecnisco Main Business and Markets Served
Table 73. Tecnisco Recent Developments/Updates
Table 74. Heat Sinks Tungsten Molybdenum Science and Technology Electronic Package Metal Heat Sink Corporation Information
Table 75. Heat Sinks Tungsten Molybdenum Science and Technology Specification and Application
Table 76. Heat Sinks Tungsten Molybdenum Science and Technology Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 77. Heat Sinks Tungsten Molybdenum Science and Technology Main Business and Markets Served
Table 78. Heat Sinks Tungsten Molybdenum Science and Technology Recent Developments/Updates
Table 79. Chengdu Eigen Material Technology Electronic Package Metal Heat Sink Corporation Information
Table 80. Chengdu Eigen Material Technology Specification and Application
Table 81. Chengdu Eigen Material Technology Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 82. Chengdu Eigen Material Technology Main Business and Markets Served
Table 83. Chengdu Eigen Material Technology Recent Developments/Updates
Table 84. Luoyang Wochi Electronic Package Metal Heat Sink Corporation Information
Table 85. Luoyang Wochi Specification and Application
Table 86. Luoyang Wochi Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 87. Luoyang Wochi Main Business and Markets Served
Table 88. Luoyang Wochi Recent Developments/Updates
Table 89. Citizen Electronics Electronic Package Metal Heat Sink Corporation Information
Table 90. Citizen Electronics Specification and Application
Table 91. Citizen Electronics Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 92. Citizen Electronics Main Business and Markets Served
Table 93. Citizen Electronics Recent Developments/Updates
Table 94. HOSO Metal Electronic Package Metal Heat Sink Corporation Information
Table 95. HOSO Metal Specification and Application
Table 96. HOSO Metal Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 97. HOSO Metal Main Business and Markets Served
Table 98. HOSO Metal Recent Developments/Updates
Table 99. AMETEK Metals Wallingford Electronic Package Metal Heat Sink Corporation Information
Table 100. AMETEK Metals Wallingford Specification and Application
Table 101. AMETEK Metals Wallingford Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 102. AMETEK Metals Wallingford Main Business and Markets Served
Table 103. AMETEK Metals Wallingford Recent Developments/Updates
Table 104. Hermetic Solutions Electronic Package Metal Heat Sink Corporation Information
Table 105. Hermetic Solutions Specification and Application
Table 106. Hermetic Solutions Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 107. Hermetic Solutions Main Business and Markets Served
Table 108. Hermetic Solutions Recent Developments/Updates
Table 109. Element Six Electronic Package Metal Heat Sink Corporation Information
Table 110. Element Six Specification and Application
Table 111. Element Six Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 112. Element Six Main Business and Markets Served
Table 113. Element Six Recent Developments/Updates
Table 114. Xinlong Metal Electrical Electronic Package Metal Heat Sink Corporation Information
Table 115. Xinlong Metal Electrical Specification and Application
Table 116. Xinlong Metal Electrical Electronic Package Metal Heat Sink Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 117. Xinlong Metal Electrical Main Business and Markets Served
Table 118. Xinlong Metal Electrical Recent Developments/Updates
Table 119. Key Raw Materials Lists
Table 120. Raw Materials Key Suppliers Lists
Table 121. Electronic Package Metal Heat Sink Distributors List
Table 122. Electronic Package Metal Heat Sink Customers List
Table 123. Electronic Package Metal Heat Sink Market Trends
Table 124. Electronic Package Metal Heat Sink Market Drivers
Table 125. Electronic Package Metal Heat Sink Market Challenges
Table 126. Electronic Package Metal Heat Sink Market Restraints
Table 127. Research Programs/Design for This Report
Table 128. Key Data Information from Secondary Sources
Table 129. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Electronic Package Metal Heat Sink
Figure 2. Global Electronic Package Metal Heat Sink Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Electronic Package Metal Heat Sink Market Share by Type: 2023 VS 2030
Figure 4. Cu/Diamond Product Picture
Figure 5. Al/SiCp Product Picture
Figure 6. Al/Sip (Al30Si70) Product Picture
Figure 7. Cu-Mo (Cu30Mo70) Product Picture
Figure 8. Cu-W (Cu20W80) Product Picture
Figure 9. Others Product Picture
Figure 10. Global Electronic Package Metal Heat Sink Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 11. Global Electronic Package Metal Heat Sink Market Share by Application: 2023 VS 2030
Figure 12. Semiconductor Laser
Figure 13. Microwave Power Device
Figure 14. Semiconductor Lighting Device
Figure 15. Global Electronic Package Metal Heat Sink Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 16. Global Electronic Package Metal Heat Sink Production Value (US$ Million) & (2019-2030)
Figure 17. Global Electronic Package Metal Heat Sink Production (K MT) & (2019-2030)
Figure 18. Global Electronic Package Metal Heat Sink Average Price (USD/MT) & (2019-2030)
Figure 19. Electronic Package Metal Heat Sink Report Years Considered
Figure 20. Electronic Package Metal Heat Sink Production Share by Manufacturers in 2023
Figure 21. Electronic Package Metal Heat Sink Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 22. The Global 5 and 10 Largest Players: Market Share by Electronic Package Metal Heat Sink Revenue in 2023
Figure 23. Global Electronic Package Metal Heat Sink Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 24. Global Electronic Package Metal Heat Sink Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. Global Electronic Package Metal Heat Sink Production Comparison by Region: 2019 VS 2023 VS 2030 (K MT)
Figure 26. Global Electronic Package Metal Heat Sink Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 27. North America Electronic Package Metal Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Europe Electronic Package Metal Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. China Electronic Package Metal Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Japan Electronic Package Metal Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 31. South Korea Electronic Package Metal Heat Sink Production Value (US$ Million) Growth Rate (2019-2030)
Figure 32. Global Electronic Package Metal Heat Sink Consumption by Region: 2019 VS 2023 VS 2030 (K MT)
Figure 33. Global Electronic Package Metal Heat Sink Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 34. North America Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 35. North America Electronic Package Metal Heat Sink Consumption Market Share by Country (2019-2030)
Figure 36. Canada Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 37. U.S. Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 38. Europe Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 39. Europe Electronic Package Metal Heat Sink Consumption Market Share by Country (2019-2030)
Figure 40. Germany Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 41. France Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 42. U.K. Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 43. Italy Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 44. Russia Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 45. Asia Pacific Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 46. Asia Pacific Electronic Package Metal Heat Sink Consumption Market Share by Regions (2019-2030)
Figure 47. China Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 48. Japan Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 49. South Korea Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 50. China Taiwan Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 51. Southeast Asia Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 52. India Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 53. Latin America, Middle East & Africa Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 54. Latin America, Middle East & Africa Electronic Package Metal Heat Sink Consumption Market Share by Country (2019-2030)
Figure 55. Mexico Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 56. Brazil Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 57. Turkey Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 58. GCC Countries Electronic Package Metal Heat Sink Consumption and Growth Rate (2019-2024) & (K MT)
Figure 59. Global Production Market Share of Electronic Package Metal Heat Sink by Type (2019-2030)
Figure 60. Global Production Value Market Share of Electronic Package Metal Heat Sink by Type (2019-2030)
Figure 61. Global Electronic Package Metal Heat Sink Price (USD/MT) by Type (2019-2030)
Figure 62. Global Production Market Share of Electronic Package Metal Heat Sink by Application (2019-2030)
Figure 63. Global Production Value Market Share of Electronic Package Metal Heat Sink by Application (2019-2030)
Figure 64. Global Electronic Package Metal Heat Sink Price (USD/MT) by Application (2019-2030)
Figure 65. Electronic Package Metal Heat Sink Value Chain
Figure 66. Electronic Package Metal Heat Sink Production Process
Figure 67. Channels of Distribution (Direct Vs Distribution)
Figure 68. Distributors Profiles
Figure 69. Bottom-up and Top-down Approaches for This Report
Figure 70. Data Triangulation
Published By : QY Research
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