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Global Electronic Packaging Heat Sink Material Market Research Report 2025
Synopsis
Since the heat sink material needs to be closely attached to the chip, two basic performance requirements need to be considered: high thermal conductivity (TC) and matching coefficient of thermal expansion (CTE). High thermal conductivity realizes rapid heat dissipation to ensure that the chip works normally at a suitable temperature; through the matching thermal expansion coefficient, it reduces the thermal stress between the heat sink, the chip and the packaging materials, and avoids cracking and detachment that may cause the chip to overburn occur. The essence of the upgrade and development of heat sink materials is the process of continuous optimization of thermal conductivity and thermal expansion coefficient. There are two main categories of electronic packaging heat sinks, ceramics and metals.
The global Electronic Packaging Heat Sink Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Electronic Packaging Heat Sink Material is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Electronic Packaging Heat Sink Material is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Electronic Packaging Heat Sink Material include Kyocera, Maruwa, Hitachi High-Technologies, Tecnisco, A.L.S. GmbH, Rogers Germany, ATTL, Ningbo CrysDiam Industrial Technology and Beijing Worldia Diamond Tools, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Electronic Packaging Heat Sink Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Packaging Heat Sink Material.
Report Scope
The Electronic Packaging Heat Sink Material market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Electronic Packaging Heat Sink Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Packaging Heat Sink Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Kyocera
Maruwa
Hitachi High-Technologies
Tecnisco
A.L.S. GmbH
Rogers Germany
ATTL
Ningbo CrysDiam Industrial Technology
Beijing Worldia Diamond Tools
Henan Baililai Superhard Materials
Advanced Composite Material
ICP Technology
Shengda Technology
Element Six
Segment by Type
Ceramic Heat Sink Material
Metal Heat Sink Material
Segment by Application
Semiconductor Laser
Microwave Power Device
Semiconductor Lighting Device
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Packaging Heat Sink Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Packaging Heat Sink Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Packaging Heat Sink Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Since the heat sink material needs to be closely attached to the chip, two basic performance requirements need to be considered: high thermal conductivity (TC) and matching coefficient of thermal expansion (CTE). High thermal conductivity realizes rapid heat dissipation to ensure that the chip works normally at a suitable temperature; through the matching thermal expansion coefficient, it reduces the thermal stress between the heat sink, the chip and the packaging materials, and avoids cracking and detachment that may cause the chip to overburn occur. The essence of the upgrade and development of heat sink materials is the process of continuous optimization of thermal conductivity and thermal expansion coefficient. There are two main categories of electronic packaging heat sinks, ceramics and metals.
The global Electronic Packaging Heat Sink Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Electronic Packaging Heat Sink Material is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Electronic Packaging Heat Sink Material is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Electronic Packaging Heat Sink Material include Kyocera, Maruwa, Hitachi High-Technologies, Tecnisco, A.L.S. GmbH, Rogers Germany, ATTL, Ningbo CrysDiam Industrial Technology and Beijing Worldia Diamond Tools, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Electronic Packaging Heat Sink Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Packaging Heat Sink Material.
Report Scope
The Electronic Packaging Heat Sink Material market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Electronic Packaging Heat Sink Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Packaging Heat Sink Material manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Kyocera
Maruwa
Hitachi High-Technologies
Tecnisco
A.L.S. GmbH
Rogers Germany
ATTL
Ningbo CrysDiam Industrial Technology
Beijing Worldia Diamond Tools
Henan Baililai Superhard Materials
Advanced Composite Material
ICP Technology
Shengda Technology
Element Six
Segment by Type
Ceramic Heat Sink Material
Metal Heat Sink Material
Segment by Application
Semiconductor Laser
Microwave Power Device
Semiconductor Lighting Device
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Packaging Heat Sink Material manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Packaging Heat Sink Material by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Packaging Heat Sink Material in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Electronic Packaging Heat Sink Material Market Overview
1.1 Product Definition
1.2 Electronic Packaging Heat Sink Material Segment by Type
1.2.1 Global Electronic Packaging Heat Sink Material Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Ceramic Heat Sink Material
1.2.3 Metal Heat Sink Material
1.3 Electronic Packaging Heat Sink Material Segment by Application
1.3.1 Global Electronic Packaging Heat Sink Material Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Semiconductor Laser
1.3.3 Microwave Power Device
1.3.4 Semiconductor Lighting Device
1.4 Global Market Growth Prospects
1.4.1 Global Electronic Packaging Heat Sink Material Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Electronic Packaging Heat Sink Material Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Electronic Packaging Heat Sink Material Production Estimates and Forecasts (2019-2030)
1.4.4 Global Electronic Packaging Heat Sink Material Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Electronic Packaging Heat Sink Material Production Market Share by Manufacturers (2019-2024)
2.2 Global Electronic Packaging Heat Sink Material Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Electronic Packaging Heat Sink Material, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Electronic Packaging Heat Sink Material Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Electronic Packaging Heat Sink Material Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Electronic Packaging Heat Sink Material, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electronic Packaging Heat Sink Material, Product Offered and Application
2.8 Global Key Manufacturers of Electronic Packaging Heat Sink Material, Date of Enter into This Industry
2.9 Electronic Packaging Heat Sink Material Market Competitive Situation and Trends
2.9.1 Electronic Packaging Heat Sink Material Market Concentration Rate
2.9.2 Global 5 and 10 Largest Electronic Packaging Heat Sink Material Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electronic Packaging Heat Sink Material Production by Region
3.1 Global Electronic Packaging Heat Sink Material Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Electronic Packaging Heat Sink Material Production Value by Region (2019-2030)
3.2.1 Global Electronic Packaging Heat Sink Material Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Electronic Packaging Heat Sink Material by Region (2025-2030)
3.3 Global Electronic Packaging Heat Sink Material Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Electronic Packaging Heat Sink Material Production by Region (2019-2030)
3.4.1 Global Electronic Packaging Heat Sink Material Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Electronic Packaging Heat Sink Material by Region (2025-2030)
3.5 Global Electronic Packaging Heat Sink Material Market Price Analysis by Region (2019-2024)
3.6 Global Electronic Packaging Heat Sink Material Production and Value, Year-over-Year Growth
3.6.1 North America Electronic Packaging Heat Sink Material Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Electronic Packaging Heat Sink Material Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Electronic Packaging Heat Sink Material Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Electronic Packaging Heat Sink Material Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Electronic Packaging Heat Sink Material Production Value Estimates and Forecasts (2019-2030)
4 Electronic Packaging Heat Sink Material Consumption by Region
4.1 Global Electronic Packaging Heat Sink Material Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Electronic Packaging Heat Sink Material Consumption by Region (2019-2030)
4.2.1 Global Electronic Packaging Heat Sink Material Consumption by Region (2019-2024)
4.2.2 Global Electronic Packaging Heat Sink Material Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Electronic Packaging Heat Sink Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Electronic Packaging Heat Sink Material Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electronic Packaging Heat Sink Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Electronic Packaging Heat Sink Material Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electronic Packaging Heat Sink Material Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Electronic Packaging Heat Sink Material Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electronic Packaging Heat Sink Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Electronic Packaging Heat Sink Material Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Electronic Packaging Heat Sink Material Production by Type (2019-2030)
5.1.1 Global Electronic Packaging Heat Sink Material Production by Type (2019-2024)
5.1.2 Global Electronic Packaging Heat Sink Material Production by Type (2025-2030)
5.1.3 Global Electronic Packaging Heat Sink Material Production Market Share by Type (2019-2030)
5.2 Global Electronic Packaging Heat Sink Material Production Value by Type (2019-2030)
5.2.1 Global Electronic Packaging Heat Sink Material Production Value by Type (2019-2024)
5.2.2 Global Electronic Packaging Heat Sink Material Production Value by Type (2025-2030)
5.2.3 Global Electronic Packaging Heat Sink Material Production Value Market Share by Type (2019-2030)
5.3 Global Electronic Packaging Heat Sink Material Price by Type (2019-2030)
6 Segment by Application
6.1 Global Electronic Packaging Heat Sink Material Production by Application (2019-2030)
6.1.1 Global Electronic Packaging Heat Sink Material Production by Application (2019-2024)
6.1.2 Global Electronic Packaging Heat Sink Material Production by Application (2025-2030)
6.1.3 Global Electronic Packaging Heat Sink Material Production Market Share by Application (2019-2030)
6.2 Global Electronic Packaging Heat Sink Material Production Value by Application (2019-2030)
6.2.1 Global Electronic Packaging Heat Sink Material Production Value by Application (2019-2024)
6.2.2 Global Electronic Packaging Heat Sink Material Production Value by Application (2025-2030)
6.2.3 Global Electronic Packaging Heat Sink Material Production Value Market Share by Application (2019-2030)
6.3 Global Electronic Packaging Heat Sink Material Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Kyocera
7.1.1 Kyocera Electronic Packaging Heat Sink Material Corporation Information
7.1.2 Kyocera Electronic Packaging Heat Sink Material Product Portfolio
7.1.3 Kyocera Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Kyocera Main Business and Markets Served
7.1.5 Kyocera Recent Developments/Updates
7.2 Maruwa
7.2.1 Maruwa Electronic Packaging Heat Sink Material Corporation Information
7.2.2 Maruwa Electronic Packaging Heat Sink Material Product Portfolio
7.2.3 Maruwa Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Maruwa Main Business and Markets Served
7.2.5 Maruwa Recent Developments/Updates
7.3 Hitachi High-Technologies
7.3.1 Hitachi High-Technologies Electronic Packaging Heat Sink Material Corporation Information
7.3.2 Hitachi High-Technologies Electronic Packaging Heat Sink Material Product Portfolio
7.3.3 Hitachi High-Technologies Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Hitachi High-Technologies Main Business and Markets Served
7.3.5 Hitachi High-Technologies Recent Developments/Updates
7.4 Tecnisco
7.4.1 Tecnisco Electronic Packaging Heat Sink Material Corporation Information
7.4.2 Tecnisco Electronic Packaging Heat Sink Material Product Portfolio
7.4.3 Tecnisco Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Tecnisco Main Business and Markets Served
7.4.5 Tecnisco Recent Developments/Updates
7.5 A.L.S. GmbH
7.5.1 A.L.S. GmbH Electronic Packaging Heat Sink Material Corporation Information
7.5.2 A.L.S. GmbH Electronic Packaging Heat Sink Material Product Portfolio
7.5.3 A.L.S. GmbH Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.5.4 A.L.S. GmbH Main Business and Markets Served
7.5.5 A.L.S. GmbH Recent Developments/Updates
7.6 Rogers Germany
7.6.1 Rogers Germany Electronic Packaging Heat Sink Material Corporation Information
7.6.2 Rogers Germany Electronic Packaging Heat Sink Material Product Portfolio
7.6.3 Rogers Germany Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Rogers Germany Main Business and Markets Served
7.6.5 Rogers Germany Recent Developments/Updates
7.7 ATTL
7.7.1 ATTL Electronic Packaging Heat Sink Material Corporation Information
7.7.2 ATTL Electronic Packaging Heat Sink Material Product Portfolio
7.7.3 ATTL Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.7.4 ATTL Main Business and Markets Served
7.7.5 ATTL Recent Developments/Updates
7.8 Ningbo CrysDiam Industrial Technology
7.8.1 Ningbo CrysDiam Industrial Technology Electronic Packaging Heat Sink Material Corporation Information
7.8.2 Ningbo CrysDiam Industrial Technology Electronic Packaging Heat Sink Material Product Portfolio
7.8.3 Ningbo CrysDiam Industrial Technology Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Ningbo CrysDiam Industrial Technology Main Business and Markets Served
7.7.5 Ningbo CrysDiam Industrial Technology Recent Developments/Updates
7.9 Beijing Worldia Diamond Tools
7.9.1 Beijing Worldia Diamond Tools Electronic Packaging Heat Sink Material Corporation Information
7.9.2 Beijing Worldia Diamond Tools Electronic Packaging Heat Sink Material Product Portfolio
7.9.3 Beijing Worldia Diamond Tools Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Beijing Worldia Diamond Tools Main Business and Markets Served
7.9.5 Beijing Worldia Diamond Tools Recent Developments/Updates
7.10 Henan Baililai Superhard Materials
7.10.1 Henan Baililai Superhard Materials Electronic Packaging Heat Sink Material Corporation Information
7.10.2 Henan Baililai Superhard Materials Electronic Packaging Heat Sink Material Product Portfolio
7.10.3 Henan Baililai Superhard Materials Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Henan Baililai Superhard Materials Main Business and Markets Served
7.10.5 Henan Baililai Superhard Materials Recent Developments/Updates
7.11 Advanced Composite Material
7.11.1 Advanced Composite Material Electronic Packaging Heat Sink Material Corporation Information
7.11.2 Advanced Composite Material Electronic Packaging Heat Sink Material Product Portfolio
7.11.3 Advanced Composite Material Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Advanced Composite Material Main Business and Markets Served
7.11.5 Advanced Composite Material Recent Developments/Updates
7.12 ICP Technology
7.12.1 ICP Technology Electronic Packaging Heat Sink Material Corporation Information
7.12.2 ICP Technology Electronic Packaging Heat Sink Material Product Portfolio
7.12.3 ICP Technology Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.12.4 ICP Technology Main Business and Markets Served
7.12.5 ICP Technology Recent Developments/Updates
7.13 Shengda Technology
7.13.1 Shengda Technology Electronic Packaging Heat Sink Material Corporation Information
7.13.2 Shengda Technology Electronic Packaging Heat Sink Material Product Portfolio
7.13.3 Shengda Technology Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Shengda Technology Main Business and Markets Served
7.13.5 Shengda Technology Recent Developments/Updates
7.14 Element Six
7.14.1 Element Six Electronic Packaging Heat Sink Material Corporation Information
7.14.2 Element Six Electronic Packaging Heat Sink Material Product Portfolio
7.14.3 Element Six Electronic Packaging Heat Sink Material Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Element Six Main Business and Markets Served
7.14.5 Element Six Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electronic Packaging Heat Sink Material Industry Chain Analysis
8.2 Electronic Packaging Heat Sink Material Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electronic Packaging Heat Sink Material Production Mode & Process
8.4 Electronic Packaging Heat Sink Material Sales and Marketing
8.4.1 Electronic Packaging Heat Sink Material Sales Channels
8.4.2 Electronic Packaging Heat Sink Material Distributors
8.5 Electronic Packaging Heat Sink Material Customers
9 Electronic Packaging Heat Sink Material Market Dynamics
9.1 Electronic Packaging Heat Sink Material Industry Trends
9.2 Electronic Packaging Heat Sink Material Market Drivers
9.3 Electronic Packaging Heat Sink Material Market Challenges
9.4 Electronic Packaging Heat Sink Material Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Electronic Packaging Heat Sink Material Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Electronic Packaging Heat Sink Material Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Electronic Packaging Heat Sink Material Production Capacity (K MT) by Manufacturers in 2023
Table 4. Global Electronic Packaging Heat Sink Material Production by Manufacturers (2019-2024) & (K MT)
Table 5. Global Electronic Packaging Heat Sink Material Production Market Share by Manufacturers (2019-2024)
Table 6. Global Electronic Packaging Heat Sink Material Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Electronic Packaging Heat Sink Material Production Value Share by Manufacturers (2019-2024)
Table 8. Global Electronic Packaging Heat Sink Material Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Electronic Packaging Heat Sink Material as of 2023)
Table 10. Global Market Electronic Packaging Heat Sink Material Average Price by Manufacturers (USD/MT) & (2019-2024)
Table 11. Manufacturers Electronic Packaging Heat Sink Material Production Sites and Area Served
Table 12. Manufacturers Electronic Packaging Heat Sink Material Product Types
Table 13. Global Electronic Packaging Heat Sink Material Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Electronic Packaging Heat Sink Material Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Electronic Packaging Heat Sink Material Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Electronic Packaging Heat Sink Material Production Value Market Share by Region (2019-2024)
Table 18. Global Electronic Packaging Heat Sink Material Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Electronic Packaging Heat Sink Material Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Electronic Packaging Heat Sink Material Production Comparison by Region: 2019 VS 2023 VS 2030 (K MT)
Table 21. Global Electronic Packaging Heat Sink Material Production (K MT) by Region (2019-2024)
Table 22. Global Electronic Packaging Heat Sink Material Production Market Share by Region (2019-2024)
Table 23. Global Electronic Packaging Heat Sink Material Production (K MT) Forecast by Region (2025-2030)
Table 24. Global Electronic Packaging Heat Sink Material Production Market Share Forecast by Region (2025-2030)
Table 25. Global Electronic Packaging Heat Sink Material Market Average Price (USD/MT) by Region (2019-2024)
Table 26. Global Electronic Packaging Heat Sink Material Market Average Price (USD/MT) by Region (2025-2030)
Table 27. Global Electronic Packaging Heat Sink Material Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K MT)
Table 28. Global Electronic Packaging Heat Sink Material Consumption by Region (2019-2024) & (K MT)
Table 29. Global Electronic Packaging Heat Sink Material Consumption Market Share by Region (2019-2024)
Table 30. Global Electronic Packaging Heat Sink Material Forecasted Consumption by Region (2025-2030) & (K MT)
Table 31. Global Electronic Packaging Heat Sink Material Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Electronic Packaging Heat Sink Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K MT)
Table 33. North America Electronic Packaging Heat Sink Material Consumption by Country (2019-2024) & (K MT)
Table 34. North America Electronic Packaging Heat Sink Material Consumption by Country (2025-2030) & (K MT)
Table 35. Europe Electronic Packaging Heat Sink Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K MT)
Table 36. Europe Electronic Packaging Heat Sink Material Consumption by Country (2019-2024) & (K MT)
Table 37. Europe Electronic Packaging Heat Sink Material Consumption by Country (2025-2030) & (K MT)
Table 38. Asia Pacific Electronic Packaging Heat Sink Material Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K MT)
Table 39. Asia Pacific Electronic Packaging Heat Sink Material Consumption by Region (2019-2024) & (K MT)
Table 40. Asia Pacific Electronic Packaging Heat Sink Material Consumption by Region (2025-2030) & (K MT)
Table 41. Latin America, Middle East & Africa Electronic Packaging Heat Sink Material Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K MT)
Table 42. Latin America, Middle East & Africa Electronic Packaging Heat Sink Material Consumption by Country (2019-2024) & (K MT)
Table 43. Latin America, Middle East & Africa Electronic Packaging Heat Sink Material Consumption by Country (2025-2030) & (K MT)
Table 44. Global Electronic Packaging Heat Sink Material Production (K MT) by Type (2019-2024)
Table 45. Global Electronic Packaging Heat Sink Material Production (K MT) by Type (2025-2030)
Table 46. Global Electronic Packaging Heat Sink Material Production Market Share by Type (2019-2024)
Table 47. Global Electronic Packaging Heat Sink Material Production Market Share by Type (2025-2030)
Table 48. Global Electronic Packaging Heat Sink Material Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Electronic Packaging Heat Sink Material Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Electronic Packaging Heat Sink Material Production Value Share by Type (2019-2024)
Table 51. Global Electronic Packaging Heat Sink Material Production Value Share by Type (2025-2030)
Table 52. Global Electronic Packaging Heat Sink Material Price (USD/MT) by Type (2019-2024)
Table 53. Global Electronic Packaging Heat Sink Material Price (USD/MT) by Type (2025-2030)
Table 54. Global Electronic Packaging Heat Sink Material Production (K MT) by Application (2019-2024)
Table 55. Global Electronic Packaging Heat Sink Material Production (K MT) by Application (2025-2030)
Table 56. Global Electronic Packaging Heat Sink Material Production Market Share by Application (2019-2024)
Table 57. Global Electronic Packaging Heat Sink Material Production Market Share by Application (2025-2030)
Table 58. Global Electronic Packaging Heat Sink Material Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Electronic Packaging Heat Sink Material Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Electronic Packaging Heat Sink Material Production Value Share by Application (2019-2024)
Table 61. Global Electronic Packaging Heat Sink Material Production Value Share by Application (2025-2030)
Table 62. Global Electronic Packaging Heat Sink Material Price (USD/MT) by Application (2019-2024)
Table 63. Global Electronic Packaging Heat Sink Material Price (USD/MT) by Application (2025-2030)
Table 64. Kyocera Electronic Packaging Heat Sink Material Corporation Information
Table 65. Kyocera Specification and Application
Table 66. Kyocera Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 67. Kyocera Main Business and Markets Served
Table 68. Kyocera Recent Developments/Updates
Table 69. Maruwa Electronic Packaging Heat Sink Material Corporation Information
Table 70. Maruwa Specification and Application
Table 71. Maruwa Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 72. Maruwa Main Business and Markets Served
Table 73. Maruwa Recent Developments/Updates
Table 74. Hitachi High-Technologies Electronic Packaging Heat Sink Material Corporation Information
Table 75. Hitachi High-Technologies Specification and Application
Table 76. Hitachi High-Technologies Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 77. Hitachi High-Technologies Main Business and Markets Served
Table 78. Hitachi High-Technologies Recent Developments/Updates
Table 79. Tecnisco Electronic Packaging Heat Sink Material Corporation Information
Table 80. Tecnisco Specification and Application
Table 81. Tecnisco Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 82. Tecnisco Main Business and Markets Served
Table 83. Tecnisco Recent Developments/Updates
Table 84. A.L.S. GmbH Electronic Packaging Heat Sink Material Corporation Information
Table 85. A.L.S. GmbH Specification and Application
Table 86. A.L.S. GmbH Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 87. A.L.S. GmbH Main Business and Markets Served
Table 88. A.L.S. GmbH Recent Developments/Updates
Table 89. Rogers Germany Electronic Packaging Heat Sink Material Corporation Information
Table 90. Rogers Germany Specification and Application
Table 91. Rogers Germany Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 92. Rogers Germany Main Business and Markets Served
Table 93. Rogers Germany Recent Developments/Updates
Table 94. ATTL Electronic Packaging Heat Sink Material Corporation Information
Table 95. ATTL Specification and Application
Table 96. ATTL Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 97. ATTL Main Business and Markets Served
Table 98. ATTL Recent Developments/Updates
Table 99. Ningbo CrysDiam Industrial Technology Electronic Packaging Heat Sink Material Corporation Information
Table 100. Ningbo CrysDiam Industrial Technology Specification and Application
Table 101. Ningbo CrysDiam Industrial Technology Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 102. Ningbo CrysDiam Industrial Technology Main Business and Markets Served
Table 103. Ningbo CrysDiam Industrial Technology Recent Developments/Updates
Table 104. Beijing Worldia Diamond Tools Electronic Packaging Heat Sink Material Corporation Information
Table 105. Beijing Worldia Diamond Tools Specification and Application
Table 106. Beijing Worldia Diamond Tools Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 107. Beijing Worldia Diamond Tools Main Business and Markets Served
Table 108. Beijing Worldia Diamond Tools Recent Developments/Updates
Table 109. Henan Baililai Superhard Materials Electronic Packaging Heat Sink Material Corporation Information
Table 110. Henan Baililai Superhard Materials Specification and Application
Table 111. Henan Baililai Superhard Materials Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 112. Henan Baililai Superhard Materials Main Business and Markets Served
Table 113. Henan Baililai Superhard Materials Recent Developments/Updates
Table 114. Advanced Composite Material Electronic Packaging Heat Sink Material Corporation Information
Table 115. Advanced Composite Material Specification and Application
Table 116. Advanced Composite Material Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 117. Advanced Composite Material Main Business and Markets Served
Table 118. Advanced Composite Material Recent Developments/Updates
Table 119. ICP Technology Electronic Packaging Heat Sink Material Corporation Information
Table 120. ICP Technology Specification and Application
Table 121. ICP Technology Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 122. ICP Technology Main Business and Markets Served
Table 123. ICP Technology Recent Developments/Updates
Table 124. Shengda Technology Electronic Packaging Heat Sink Material Corporation Information
Table 125. Shengda Technology Specification and Application
Table 126. Shengda Technology Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 127. Shengda Technology Main Business and Markets Served
Table 128. Shengda Technology Recent Developments/Updates
Table 129. Element Six Electronic Packaging Heat Sink Material Corporation Information
Table 130. Element Six Specification and Application
Table 131. Element Six Electronic Packaging Heat Sink Material Production (K MT), Value (US$ Million), Price (USD/MT) and Gross Margin (2019-2024)
Table 132. Element Six Main Business and Markets Served
Table 133. Element Six Recent Developments/Updates
Table 134. Key Raw Materials Lists
Table 135. Raw Materials Key Suppliers Lists
Table 136. Electronic Packaging Heat Sink Material Distributors List
Table 137. Electronic Packaging Heat Sink Material Customers List
Table 138. Electronic Packaging Heat Sink Material Market Trends
Table 139. Electronic Packaging Heat Sink Material Market Drivers
Table 140. Electronic Packaging Heat Sink Material Market Challenges
Table 141. Electronic Packaging Heat Sink Material Market Restraints
Table 142. Research Programs/Design for This Report
Table 143. Key Data Information from Secondary Sources
Table 144. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Electronic Packaging Heat Sink Material
Figure 2. Global Electronic Packaging Heat Sink Material Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Electronic Packaging Heat Sink Material Market Share by Type: 2023 VS 2030
Figure 4. Ceramic Heat Sink Material Product Picture
Figure 5. Metal Heat Sink Material Product Picture
Figure 6. Global Electronic Packaging Heat Sink Material Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 7. Global Electronic Packaging Heat Sink Material Market Share by Application: 2023 VS 2030
Figure 8. Semiconductor Laser
Figure 9. Microwave Power Device
Figure 10. Semiconductor Lighting Device
Figure 11. Global Electronic Packaging Heat Sink Material Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 12. Global Electronic Packaging Heat Sink Material Production Value (US$ Million) & (2019-2030)
Figure 13. Global Electronic Packaging Heat Sink Material Production (K MT) & (2019-2030)
Figure 14. Global Electronic Packaging Heat Sink Material Average Price (USD/MT) & (2019-2030)
Figure 15. Electronic Packaging Heat Sink Material Report Years Considered
Figure 16. Electronic Packaging Heat Sink Material Production Share by Manufacturers in 2023
Figure 17. Electronic Packaging Heat Sink Material Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 18. The Global 5 and 10 Largest Players: Market Share by Electronic Packaging Heat Sink Material Revenue in 2023
Figure 19. Global Electronic Packaging Heat Sink Material Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 20. Global Electronic Packaging Heat Sink Material Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 21. Global Electronic Packaging Heat Sink Material Production Comparison by Region: 2019 VS 2023 VS 2030 (K MT)
Figure 22. Global Electronic Packaging Heat Sink Material Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. North America Electronic Packaging Heat Sink Material Production Value (US$ Million) Growth Rate (2019-2030)
Figure 24. Europe Electronic Packaging Heat Sink Material Production Value (US$ Million) Growth Rate (2019-2030)
Figure 25. China Electronic Packaging Heat Sink Material Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Japan Electronic Packaging Heat Sink Material Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. South Korea Electronic Packaging Heat Sink Material Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Global Electronic Packaging Heat Sink Material Consumption by Region: 2019 VS 2023 VS 2030 (K MT)
Figure 29. Global Electronic Packaging Heat Sink Material Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 30. North America Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 31. North America Electronic Packaging Heat Sink Material Consumption Market Share by Country (2019-2030)
Figure 32. Canada Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 33. U.S. Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 34. Europe Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 35. Europe Electronic Packaging Heat Sink Material Consumption Market Share by Country (2019-2030)
Figure 36. Germany Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 37. France Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 38. U.K. Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 39. Italy Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 40. Russia Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 41. Asia Pacific Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 42. Asia Pacific Electronic Packaging Heat Sink Material Consumption Market Share by Regions (2019-2030)
Figure 43. China Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 44. Japan Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 45. South Korea Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 46. China Taiwan Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 47. Southeast Asia Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 48. India Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 49. Latin America, Middle East & Africa Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 50. Latin America, Middle East & Africa Electronic Packaging Heat Sink Material Consumption Market Share by Country (2019-2030)
Figure 51. Mexico Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 52. Brazil Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 53. Turkey Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 54. GCC Countries Electronic Packaging Heat Sink Material Consumption and Growth Rate (2019-2024) & (K MT)
Figure 55. Global Production Market Share of Electronic Packaging Heat Sink Material by Type (2019-2030)
Figure 56. Global Production Value Market Share of Electronic Packaging Heat Sink Material by Type (2019-2030)
Figure 57. Global Electronic Packaging Heat Sink Material Price (USD/MT) by Type (2019-2030)
Figure 58. Global Production Market Share of Electronic Packaging Heat Sink Material by Application (2019-2030)
Figure 59. Global Production Value Market Share of Electronic Packaging Heat Sink Material by Application (2019-2030)
Figure 60. Global Electronic Packaging Heat Sink Material Price (USD/MT) by Application (2019-2030)
Figure 61. Electronic Packaging Heat Sink Material Value Chain
Figure 62. Electronic Packaging Heat Sink Material Production Process
Figure 63. Channels of Distribution (Direct Vs Distribution)
Figure 64. Distributors Profiles
Figure 65. Bottom-up and Top-down Approaches for This Report
Figure 66. Data Triangulation
Published By : QY Research
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