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Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Research Report 2025
Synopsis
The global market for Epoxy Molding Compound (EMC) for Advanced Packaging was valued at US$ 654 million in the year 2024 and is projected to reach a revised size of US$ 1001 million by 2031, growing at a CAGR of 6.4% during the forecast period.
North American market for Epoxy Molding Compound (EMC) for Advanced Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Epoxy Molding Compound (EMC) for Advanced Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging include Resonac, Eternal Materials, Panasonic, Sumitomo Bakelite, Kyocera, Samsung SDI, Hysol Huawei Electronics, Jiangsu HHCK Advanced Materials, Shanghai Doitech, Beijing Sinotech Electronic Material, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound (EMC) for Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound (EMC) for Advanced Packaging.
The Epoxy Molding Compound (EMC) for Advanced Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Epoxy Molding Compound (EMC) for Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compound (EMC) for Advanced Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Resonac
Eternal Materials
Panasonic
Sumitomo Bakelite
Kyocera
Samsung SDI
Hysol Huawei Electronics
Jiangsu HHCK Advanced Materials
Shanghai Doitech
Beijing Sinotech Electronic Material
KCC
by Type
Soild EMC
Liquid EMC
by Application
BGA
QFN
FOWLP/FOPLP
SiP
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound (EMC) for Advanced Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound (EMC) for Advanced Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound (EMC) for Advanced Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global market for Epoxy Molding Compound (EMC) for Advanced Packaging was valued at US$ 654 million in the year 2024 and is projected to reach a revised size of US$ 1001 million by 2031, growing at a CAGR of 6.4% during the forecast period.
North American market for Epoxy Molding Compound (EMC) for Advanced Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Epoxy Molding Compound (EMC) for Advanced Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging include Resonac, Eternal Materials, Panasonic, Sumitomo Bakelite, Kyocera, Samsung SDI, Hysol Huawei Electronics, Jiangsu HHCK Advanced Materials, Shanghai Doitech, Beijing Sinotech Electronic Material, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound (EMC) for Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound (EMC) for Advanced Packaging.
The Epoxy Molding Compound (EMC) for Advanced Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Epoxy Molding Compound (EMC) for Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compound (EMC) for Advanced Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Resonac
Eternal Materials
Panasonic
Sumitomo Bakelite
Kyocera
Samsung SDI
Hysol Huawei Electronics
Jiangsu HHCK Advanced Materials
Shanghai Doitech
Beijing Sinotech Electronic Material
KCC
by Type
Soild EMC
Liquid EMC
by Application
BGA
QFN
FOWLP/FOPLP
SiP
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound (EMC) for Advanced Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound (EMC) for Advanced Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound (EMC) for Advanced Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Epoxy Molding Compound (EMC) for Advanced Packaging Market Overview
1.1 Product Definition
1.2 Epoxy Molding Compound (EMC) for Advanced Packaging by Type
1.2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Soild EMC
1.2.3 Liquid EMC
1.3 Epoxy Molding Compound (EMC) for Advanced Packaging by Application
1.3.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 BGA
1.3.3 QFN
1.3.4 FOWLP/FOPLP
1.3.5 SiP
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Estimates and Forecasts (2020-2031)
1.4.4 Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Manufacturers (2020-2025)
2.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Epoxy Molding Compound (EMC) for Advanced Packaging, Industry Ranking, 2023 VS 2024
2.4 Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Epoxy Molding Compound (EMC) for Advanced Packaging Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging, Date of Enter into This Industry
2.9 Epoxy Molding Compound (EMC) for Advanced Packaging Market Competitive Situation and Trends
2.9.1 Epoxy Molding Compound (EMC) for Advanced Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Epoxy Molding Compound (EMC) for Advanced Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Epoxy Molding Compound (EMC) for Advanced Packaging Production by Region
3.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Region (2020-2031)
3.2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Epoxy Molding Compound (EMC) for Advanced Packaging by Region (2026-2031)
3.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Volume by Region (2020-2031)
3.4.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Epoxy Molding Compound (EMC) for Advanced Packaging by Region (2026-2031)
3.5 Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Price Analysis by Region (2020-2025)
3.6 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Estimates and Forecasts (2020-2031)
4 Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region
4.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region (2020-2031)
4.2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region (2020-2025)
4.2.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Type (2020-2031)
5.1.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Type (2020-2025)
5.1.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Type (2026-2031)
5.1.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Type (2020-2031)
5.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Type (2020-2031)
5.2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Type (2020-2025)
5.2.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Type (2026-2031)
5.2.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Type (2020-2031)
5.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Price by Type (2020-2031)
6 Segment by Application
6.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Application (2020-2031)
6.1.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Application (2020-2025)
6.1.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Application (2026-2031)
6.1.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Application (2020-2031)
6.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Application (2020-2031)
6.2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Application (2020-2025)
6.2.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Application (2026-2031)
6.2.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Application (2020-2031)
6.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Resonac
7.1.1 Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.1.2 Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.1.3 Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Resonac Main Business and Markets Served
7.1.5 Resonac Recent Developments/Updates
7.2 Eternal Materials
7.2.1 Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.2.2 Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.2.3 Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Eternal Materials Main Business and Markets Served
7.2.5 Eternal Materials Recent Developments/Updates
7.3 Panasonic
7.3.1 Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.3.2 Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.3.3 Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Panasonic Main Business and Markets Served
7.3.5 Panasonic Recent Developments/Updates
7.4 Sumitomo Bakelite
7.4.1 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.4.2 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.4.3 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Sumitomo Bakelite Main Business and Markets Served
7.4.5 Sumitomo Bakelite Recent Developments/Updates
7.5 Kyocera
7.5.1 Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.5.2 Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.5.3 Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Kyocera Main Business and Markets Served
7.5.5 Kyocera Recent Developments/Updates
7.6 Samsung SDI
7.6.1 Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.6.2 Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.6.3 Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Samsung SDI Main Business and Markets Served
7.6.5 Samsung SDI Recent Developments/Updates
7.7 Hysol Huawei Electronics
7.7.1 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.7.2 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.7.3 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Hysol Huawei Electronics Main Business and Markets Served
7.7.5 Hysol Huawei Electronics Recent Developments/Updates
7.8 Jiangsu HHCK Advanced Materials
7.8.1 Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.8.2 Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.8.3 Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Jiangsu HHCK Advanced Materials Main Business and Markets Served
7.8.5 Jiangsu HHCK Advanced Materials Recent Developments/Updates
7.9 Shanghai Doitech
7.9.1 Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.9.2 Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.9.3 Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Shanghai Doitech Main Business and Markets Served
7.9.5 Shanghai Doitech Recent Developments/Updates
7.10 Beijing Sinotech Electronic Material
7.10.1 Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.10.2 Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.10.3 Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Beijing Sinotech Electronic Material Main Business and Markets Served
7.10.5 Beijing Sinotech Electronic Material Recent Developments/Updates
7.11 KCC
7.11.1 KCC Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
7.11.2 KCC Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolio
7.11.3 KCC Epoxy Molding Compound (EMC) for Advanced Packaging Production, Value, Price and Gross Margin (2020-2025)
7.11.4 KCC Main Business and Markets Served
7.11.5 KCC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Epoxy Molding Compound (EMC) for Advanced Packaging Industry Chain Analysis
8.2 Epoxy Molding Compound (EMC) for Advanced Packaging Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Epoxy Molding Compound (EMC) for Advanced Packaging Production Mode & Process Analysis
8.4 Epoxy Molding Compound (EMC) for Advanced Packaging Sales and Marketing
8.4.1 Epoxy Molding Compound (EMC) for Advanced Packaging Sales Channels
8.4.2 Epoxy Molding Compound (EMC) for Advanced Packaging Distributors
8.5 Epoxy Molding Compound (EMC) for Advanced Packaging Customer Analysis
9 Epoxy Molding Compound (EMC) for Advanced Packaging Market Dynamics
9.1 Epoxy Molding Compound (EMC) for Advanced Packaging Industry Trends
9.2 Epoxy Molding Compound (EMC) for Advanced Packaging Market Drivers
9.3 Epoxy Molding Compound (EMC) for Advanced Packaging Market Challenges
9.4 Epoxy Molding Compound (EMC) for Advanced Packaging Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Value by Type, (US$ Million) & (2024 VS 2031)
Table 2. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Value by Application, (US$ Million) & (2024 VS 2031)
Table 3. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Capacity (Tons) by Manufacturers in 2024
Table 4. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production by Manufacturers (2020-2025) & (Tons)
Table 5. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Manufacturers (2020-2025)
Table 6. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Manufacturers (2020-2025) & (US$ Million)
Table 7. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Share by Manufacturers (2020-2025)
Table 8. Global Key Players of Epoxy Molding Compound (EMC) for Advanced Packaging, Industry Ranking, 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Epoxy Molding Compound (EMC) for Advanced Packaging as of 2024)
Table 10. Global Market Epoxy Molding Compound (EMC) for Advanced Packaging Average Price by Manufacturers (US$/Ton) & (2020-2025)
Table 11. Global Key Manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging, Manufacturing Base Distribution and Headquarters
Table 12. Global Key Manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging, Product Offered and Application
Table 13. Global Key Manufacturers of Epoxy Molding Compound (EMC) for Advanced Packaging, Date of Enter into This Industry
Table 14. Global Epoxy Molding Compound (EMC) for Advanced Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Table 17. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) by Region (2020-2025)
Table 18. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Region (2020-2025)
Table 19. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) Forecast by Region (2026-2031)
Table 20. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share Forecast by Region (2026-2031)
Table 21. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
Table 22. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons) by Region (2020-2025)
Table 23. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Region (2020-2025)
Table 24. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons) Forecast by Region (2026-2031)
Table 25. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share Forecast by Region (2026-2031)
Table 26. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Average Price (US$/Ton) by Region (2020-2025)
Table 27. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Average Price (US$/Ton) by Region (2026-2031)
Table 28. Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
Table 29. Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region (2020-2025) & (Tons)
Table 30. Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Market Share by Region (2020-2025)
Table 31. Global Epoxy Molding Compound (EMC) for Advanced Packaging Forecasted Consumption by Region (2026-2031) & (Tons)
Table 32. Global Epoxy Molding Compound (EMC) for Advanced Packaging Forecasted Consumption Market Share by Region (2026-2031)
Table 33. North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 34. North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2020-2025) & (Tons)
Table 35. North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2026-2031) & (Tons)
Table 36. Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 37. Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2020-2025) & (Tons)
Table 38. Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2026-2031) & (Tons)
Table 39. Asia Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
Table 40. Asia Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region (2020-2025) & (Tons)
Table 41. Asia Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region (2026-2031) & (Tons)
Table 42. Latin America, Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 43. Latin America, Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2020-2025) & (Tons)
Table 44. Latin America, Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Country (2026-2031) & (Tons)
Table 45. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons) by Type (2020-2025)
Table 46. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons) by Type (2026-2031)
Table 47. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Type (2020-2025)
Table 48. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Type (2026-2031)
Table 49. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) by Type (2020-2025)
Table 50. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) by Type (2026-2031)
Table 51. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Type (2020-2025)
Table 52. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Type (2026-2031)
Table 53. Global Epoxy Molding Compound (EMC) for Advanced Packaging Price (US$/Ton) by Type (2020-2025)
Table 54. Global Epoxy Molding Compound (EMC) for Advanced Packaging Price (US$/Ton) by Type (2026-2031)
Table 55. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons) by Application (2020-2025)
Table 56. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons) by Application (2026-2031)
Table 57. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Application (2020-2025)
Table 58. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Application (2026-2031)
Table 59. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) by Application (2020-2025)
Table 60. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) by Application (2026-2031)
Table 61. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Application (2020-2025)
Table 62. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Application (2026-2031)
Table 63. Global Epoxy Molding Compound (EMC) for Advanced Packaging Price (US$/Ton) by Application (2020-2025)
Table 64. Global Epoxy Molding Compound (EMC) for Advanced Packaging Price (US$/Ton) by Application (2026-2031)
Table 65. Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 66. Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 67. Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 68. Resonac Main Business and Markets Served
Table 69. Resonac Recent Developments/Updates
Table 70. Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 71. Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 72. Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 73. Eternal Materials Main Business and Markets Served
Table 74. Eternal Materials Recent Developments/Updates
Table 75. Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 76. Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 77. Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 78. Panasonic Main Business and Markets Served
Table 79. Panasonic Recent Developments/Updates
Table 80. Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 81. Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 82. Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 83. Sumitomo Bakelite Main Business and Markets Served
Table 84. Sumitomo Bakelite Recent Developments/Updates
Table 85. Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 86. Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 87. Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 88. Kyocera Main Business and Markets Served
Table 89. Kyocera Recent Developments/Updates
Table 90. Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 91. Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 92. Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 93. Samsung SDI Main Business and Markets Served
Table 94. Samsung SDI Recent Developments/Updates
Table 95. Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 96. Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 97. Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 98. Hysol Huawei Electronics Main Business and Markets Served
Table 99. Hysol Huawei Electronics Recent Developments/Updates
Table 100. Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 101. Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 102. Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 103. Jiangsu HHCK Advanced Materials Main Business and Markets Served
Table 104. Jiangsu HHCK Advanced Materials Recent Developments/Updates
Table 105. Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 106. Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 107. Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 108. Shanghai Doitech Main Business and Markets Served
Table 109. Shanghai Doitech Recent Developments/Updates
Table 110. Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 111. Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 112. Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 113. Beijing Sinotech Electronic Material Main Business and Markets Served
Table 114. Beijing Sinotech Electronic Material Recent Developments/Updates
Table 115. KCC Epoxy Molding Compound (EMC) for Advanced Packaging Company Information
Table 116. KCC Epoxy Molding Compound (EMC) for Advanced Packaging Specification and Application
Table 117. KCC Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 118. KCC Main Business and Markets Served
Table 119. KCC Recent Developments/Updates
Table 120. Key Raw Materials Lists
Table 121. Raw Materials Key Suppliers Lists
Table 122. Epoxy Molding Compound (EMC) for Advanced Packaging Distributors List
Table 123. Epoxy Molding Compound (EMC) for Advanced Packaging Customers List
Table 124. Epoxy Molding Compound (EMC) for Advanced Packaging Market Trends
Table 125. Epoxy Molding Compound (EMC) for Advanced Packaging Market Drivers
Table 126. Epoxy Molding Compound (EMC) for Advanced Packaging Market Challenges
Table 127. Epoxy Molding Compound (EMC) for Advanced Packaging Market Restraints
Table 128. Research Programs/Design for This Report
Table 129. Key Data Information from Secondary Sources
Table 130. Key Data Information from Primary Sources
Table 131. Authors List of This Report
List of Figures
Figure 1. Product Picture of Epoxy Molding Compound (EMC) for Advanced Packaging
Figure 2. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Value by Type, (US$ Million) & (2020-2031)
Figure 3. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Share by Type: 2024 VS 2031
Figure 4. Soild EMC Product Picture
Figure 5. Liquid EMC Product Picture
Figure 6. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Value by Application, (US$ Million) & (2020-2031)
Figure 7. Global Epoxy Molding Compound (EMC) for Advanced Packaging Market Share by Application: 2024 VS 2031
Figure 8. BGA
Figure 9. QFN
Figure 10. FOWLP/FOPLP
Figure 11. SiP
Figure 12. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million), 2020 VS 2024 VS 2031
Figure 13. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) & (2020-2031)
Figure 14. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Capacity (Tons) & (2020-2031)
Figure 15. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production (Tons) & (2020-2031)
Figure 16. Global Epoxy Molding Compound (EMC) for Advanced Packaging Average Price (US$/Ton) & (2020-2031)
Figure 17. Epoxy Molding Compound (EMC) for Advanced Packaging Report Years Considered
Figure 18. Epoxy Molding Compound (EMC) for Advanced Packaging Production Share by Manufacturers in 2024
Figure 19. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Share by Manufacturers (2024)
Figure 20. Epoxy Molding Compound (EMC) for Advanced Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
Figure 21. The Global 5 and 10 Largest Players: Market Share by Epoxy Molding Compound (EMC) for Advanced Packaging Revenue in 2024
Figure 22. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Figure 23. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Value Market Share by Region: 2020 VS 2024 VS 2031
Figure 24. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
Figure 25. Global Epoxy Molding Compound (EMC) for Advanced Packaging Production Market Share by Region: 2020 VS 2024 VS 2031
Figure 26. North America Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) Growth Rate (2020-2031)
Figure 27. Europe Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) Growth Rate (2020-2031)
Figure 28. China Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) Growth Rate (2020-2031)
Figure 29. Japan Epoxy Molding Compound (EMC) for Advanced Packaging Production Value (US$ Million) Growth Rate (2020-2031)
Figure 30. Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption by Region: 2020 VS 2024 VS 2031 (Tons)
Figure 31. Global Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Market Share by Region: 2020 VS 2024 VS 2031
Figure 32. North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 33. North America Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Market Share by Country (2020-2031)
Figure 34. U.S. Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 35. Canada Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 36. Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 37. Europe Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Market Share by Country (2020-2031)
Figure 38. Germany Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 39. France Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 40. U.K. Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 41. Italy Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 42. Russia Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 43. Asia Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 44. Asia Pacific Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Market Share by Region (2020-2031)
Figure 45. China Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 46. Japan Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 47. South Korea Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 48. China Taiwan Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 49. Southeast Asia Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 50. India Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 51. Latin America, Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 52. Latin America, Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Consumption Market Share by Country (2020-2031)
Figure 53. Mexico Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 54. Brazil Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 55. Turkey Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 56. GCC Countries Epoxy Molding Compound (EMC) for Advanced Packaging Consumption and Growth Rate (2020-2031) & (Tons)
Figure 57. Global Production Market Share of Epoxy Molding Compound (EMC) for Advanced Packaging by Type (2020-2031)
Figure 58. Global Production Value Market Share of Epoxy Molding Compound (EMC) for Advanced Packaging by Type (2020-2031)
Figure 59. Global Epoxy Molding Compound (EMC) for Advanced Packaging Price (US$/Ton) by Type (2020-2031)
Figure 60. Global Production Market Share of Epoxy Molding Compound (EMC) for Advanced Packaging by Application (2020-2031)
Figure 61. Global Production Value Market Share of Epoxy Molding Compound (EMC) for Advanced Packaging by Application (2020-2031)
Figure 62. Global Epoxy Molding Compound (EMC) for Advanced Packaging Price (US$/Ton) by Application (2020-2031)
Figure 63. Epoxy Molding Compound (EMC) for Advanced Packaging Value Chain
Figure 64. Channels of Distribution (Direct Vs Distribution)
Figure 65. Bottom-up and Top-down Approaches for This Report
Figure 66. Data Triangulation
Published By : QY Research
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