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Global Epoxy Molding Compound for Power Device Market Research Report 2025
Synopsis
The global market for Epoxy Molding Compound for Power Device was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Epoxy Molding Compound (EMC) for power devices is a type of material used to encapsulate and protect power electronic devices. It is commonly used in the semiconductor industry for packaging high-power devices such as power transistors, diodes, and integrated circuits. The epoxy molding compound provides electrical insulation, mechanical support, and environmental protection to the power devices.
Here are some key features and advantages of epoxy molding compound for power devices:
Electrical Insulation: EMC has excellent electrical insulation properties, which help prevent electrical shorts and ensure proper functioning of the power devices.
Thermal Conductivity: Epoxy molding compounds can be formulated with additives to enhance their thermal conductivity. This helps dissipate heat generated by the power devices, ensuring their efficient operation and preventing overheating.
Mechanical Strength: EMC provides mechanical support to the delicate components inside the power devices, protecting them from physical stresses and mechanical shocks.
Chemical Resistance: Epoxy molding compounds exhibit good resistance to various chemicals and solvents, providing protection against corrosive substances that could potentially damage the power devices.
Moisture and Environmental Protection: EMC offers a high level of moisture and environmental protection, shielding the internal components of the power devices from moisture, dust, and other contaminants.
Adhesion and Bonding: Epoxy molding compounds have good adhesion properties, allowing them to bond well with different substrates and provide a secure encapsulation for the power devices.
Processability: EMC can be easily molded and processed into different shapes and sizes, making it suitable for mass production in the semiconductor industry.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound for Power Device, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound for Power Device.
The Epoxy Molding Compound for Power Device market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Epoxy Molding Compound for Power Device market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compound for Power Device manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Nagase ChemteX Corporation
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
by Type
SC
SOT
TO
Other
by Application
Automotive
Consumer Electronics
Industrial
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound for Power Device manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound for Power Device by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound for Power Device in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global market for Epoxy Molding Compound for Power Device was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Epoxy Molding Compound (EMC) for power devices is a type of material used to encapsulate and protect power electronic devices. It is commonly used in the semiconductor industry for packaging high-power devices such as power transistors, diodes, and integrated circuits. The epoxy molding compound provides electrical insulation, mechanical support, and environmental protection to the power devices.
Here are some key features and advantages of epoxy molding compound for power devices:
Electrical Insulation: EMC has excellent electrical insulation properties, which help prevent electrical shorts and ensure proper functioning of the power devices.
Thermal Conductivity: Epoxy molding compounds can be formulated with additives to enhance their thermal conductivity. This helps dissipate heat generated by the power devices, ensuring their efficient operation and preventing overheating.
Mechanical Strength: EMC provides mechanical support to the delicate components inside the power devices, protecting them from physical stresses and mechanical shocks.
Chemical Resistance: Epoxy molding compounds exhibit good resistance to various chemicals and solvents, providing protection against corrosive substances that could potentially damage the power devices.
Moisture and Environmental Protection: EMC offers a high level of moisture and environmental protection, shielding the internal components of the power devices from moisture, dust, and other contaminants.
Adhesion and Bonding: Epoxy molding compounds have good adhesion properties, allowing them to bond well with different substrates and provide a secure encapsulation for the power devices.
Processability: EMC can be easily molded and processed into different shapes and sizes, making it suitable for mass production in the semiconductor industry.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound for Power Device, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound for Power Device.
The Epoxy Molding Compound for Power Device market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Epoxy Molding Compound for Power Device market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compound for Power Device manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Nagase ChemteX Corporation
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
by Type
SC
SOT
TO
Other
by Application
Automotive
Consumer Electronics
Industrial
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound for Power Device manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound for Power Device by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound for Power Device in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Epoxy Molding Compound for Power Device Market Overview
1.1 Product Definition
1.2 Epoxy Molding Compound for Power Device by Type
1.2.1 Global Epoxy Molding Compound for Power Device Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 SC
1.2.3 SOT
1.2.4 TO
1.2.5 Other
1.3 Epoxy Molding Compound for Power Device by Application
1.3.1 Global Epoxy Molding Compound for Power Device Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Automotive
1.3.3 Consumer Electronics
1.3.4 Industrial
1.3.5 Other
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Epoxy Molding Compound for Power Device Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Epoxy Molding Compound for Power Device Production Estimates and Forecasts (2020-2031)
1.4.4 Global Epoxy Molding Compound for Power Device Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Epoxy Molding Compound for Power Device Production Market Share by Manufacturers (2020-2025)
2.2 Global Epoxy Molding Compound for Power Device Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Epoxy Molding Compound for Power Device, Industry Ranking, 2023 VS 2024
2.4 Global Epoxy Molding Compound for Power Device Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Epoxy Molding Compound for Power Device Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Epoxy Molding Compound for Power Device, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Epoxy Molding Compound for Power Device, Product Offered and Application
2.8 Global Key Manufacturers of Epoxy Molding Compound for Power Device, Date of Enter into This Industry
2.9 Epoxy Molding Compound for Power Device Market Competitive Situation and Trends
2.9.1 Epoxy Molding Compound for Power Device Market Concentration Rate
2.9.2 Global 5 and 10 Largest Epoxy Molding Compound for Power Device Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Epoxy Molding Compound for Power Device Production by Region
3.1 Global Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Epoxy Molding Compound for Power Device Production Value by Region (2020-2031)
3.2.1 Global Epoxy Molding Compound for Power Device Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Epoxy Molding Compound for Power Device by Region (2026-2031)
3.3 Global Epoxy Molding Compound for Power Device Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Epoxy Molding Compound for Power Device Production Volume by Region (2020-2031)
3.4.1 Global Epoxy Molding Compound for Power Device Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Epoxy Molding Compound for Power Device by Region (2026-2031)
3.5 Global Epoxy Molding Compound for Power Device Market Price Analysis by Region (2020-2025)
3.6 Global Epoxy Molding Compound for Power Device Production and Value, Year-over-Year Growth
3.6.1 North America Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2020-2031)
4 Epoxy Molding Compound for Power Device Consumption by Region
4.1 Global Epoxy Molding Compound for Power Device Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Epoxy Molding Compound for Power Device Consumption by Region (2020-2031)
4.2.1 Global Epoxy Molding Compound for Power Device Consumption by Region (2020-2025)
4.2.2 Global Epoxy Molding Compound for Power Device Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Epoxy Molding Compound for Power Device Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Epoxy Molding Compound for Power Device Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Epoxy Molding Compound for Power Device Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Epoxy Molding Compound for Power Device Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Epoxy Molding Compound for Power Device Production by Type (2020-2031)
5.1.1 Global Epoxy Molding Compound for Power Device Production by Type (2020-2025)
5.1.2 Global Epoxy Molding Compound for Power Device Production by Type (2026-2031)
5.1.3 Global Epoxy Molding Compound for Power Device Production Market Share by Type (2020-2031)
5.2 Global Epoxy Molding Compound for Power Device Production Value by Type (2020-2031)
5.2.1 Global Epoxy Molding Compound for Power Device Production Value by Type (2020-2025)
5.2.2 Global Epoxy Molding Compound for Power Device Production Value by Type (2026-2031)
5.2.3 Global Epoxy Molding Compound for Power Device Production Value Market Share by Type (2020-2031)
5.3 Global Epoxy Molding Compound for Power Device Price by Type (2020-2031)
6 Segment by Application
6.1 Global Epoxy Molding Compound for Power Device Production by Application (2020-2031)
6.1.1 Global Epoxy Molding Compound for Power Device Production by Application (2020-2025)
6.1.2 Global Epoxy Molding Compound for Power Device Production by Application (2026-2031)
6.1.3 Global Epoxy Molding Compound for Power Device Production Market Share by Application (2020-2031)
6.2 Global Epoxy Molding Compound for Power Device Production Value by Application (2020-2031)
6.2.1 Global Epoxy Molding Compound for Power Device Production Value by Application (2020-2025)
6.2.2 Global Epoxy Molding Compound for Power Device Production Value by Application (2026-2031)
6.2.3 Global Epoxy Molding Compound for Power Device Production Value Market Share by Application (2020-2031)
6.3 Global Epoxy Molding Compound for Power Device Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Sumitomo Bakelite
7.1.1 Sumitomo Bakelite Epoxy Molding Compound for Power Device Company Information
7.1.2 Sumitomo Bakelite Epoxy Molding Compound for Power Device Product Portfolio
7.1.3 Sumitomo Bakelite Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Sumitomo Bakelite Main Business and Markets Served
7.1.5 Sumitomo Bakelite Recent Developments/Updates
7.2 Showa Denko
7.2.1 Showa Denko Epoxy Molding Compound for Power Device Company Information
7.2.2 Showa Denko Epoxy Molding Compound for Power Device Product Portfolio
7.2.3 Showa Denko Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Showa Denko Main Business and Markets Served
7.2.5 Showa Denko Recent Developments/Updates
7.3 Chang Chun Group
7.3.1 Chang Chun Group Epoxy Molding Compound for Power Device Company Information
7.3.2 Chang Chun Group Epoxy Molding Compound for Power Device Product Portfolio
7.3.3 Chang Chun Group Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Chang Chun Group Main Business and Markets Served
7.3.5 Chang Chun Group Recent Developments/Updates
7.4 Hysol Huawei Electronics
7.4.1 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Company Information
7.4.2 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Product Portfolio
7.4.3 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Hysol Huawei Electronics Main Business and Markets Served
7.4.5 Hysol Huawei Electronics Recent Developments/Updates
7.5 Panasonic
7.5.1 Panasonic Epoxy Molding Compound for Power Device Company Information
7.5.2 Panasonic Epoxy Molding Compound for Power Device Product Portfolio
7.5.3 Panasonic Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Panasonic Main Business and Markets Served
7.5.5 Panasonic Recent Developments/Updates
7.6 Kyocera
7.6.1 Kyocera Epoxy Molding Compound for Power Device Company Information
7.6.2 Kyocera Epoxy Molding Compound for Power Device Product Portfolio
7.6.3 Kyocera Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Kyocera Main Business and Markets Served
7.6.5 Kyocera Recent Developments/Updates
7.7 KCC
7.7.1 KCC Epoxy Molding Compound for Power Device Company Information
7.7.2 KCC Epoxy Molding Compound for Power Device Product Portfolio
7.7.3 KCC Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.7.4 KCC Main Business and Markets Served
7.7.5 KCC Recent Developments/Updates
7.8 Eternal Materials
7.8.1 Eternal Materials Epoxy Molding Compound for Power Device Company Information
7.8.2 Eternal Materials Epoxy Molding Compound for Power Device Product Portfolio
7.8.3 Eternal Materials Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Eternal Materials Main Business and Markets Served
7.8.5 Eternal Materials Recent Developments/Updates
7.9 Jiangsu zhongpeng new material
7.9.1 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Company Information
7.9.2 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Product Portfolio
7.9.3 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Jiangsu zhongpeng new material Main Business and Markets Served
7.9.5 Jiangsu zhongpeng new material Recent Developments/Updates
7.10 Shin-Etsu Chemical
7.10.1 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Company Information
7.10.2 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Product Portfolio
7.10.3 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Shin-Etsu Chemical Main Business and Markets Served
7.10.5 Shin-Etsu Chemical Recent Developments/Updates
7.11 Nagase ChemteX Corporation
7.11.1 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Company Information
7.11.2 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Product Portfolio
7.11.3 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Nagase ChemteX Corporation Main Business and Markets Served
7.11.5 Nagase ChemteX Corporation Recent Developments/Updates
7.12 Tianjin Kaihua Insulating Material
7.12.1 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Company Information
7.12.2 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Product Portfolio
7.12.3 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Tianjin Kaihua Insulating Material Main Business and Markets Served
7.12.5 Tianjin Kaihua Insulating Material Recent Developments/Updates
7.13 HHCK
7.13.1 HHCK Epoxy Molding Compound for Power Device Company Information
7.13.2 HHCK Epoxy Molding Compound for Power Device Product Portfolio
7.13.3 HHCK Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.13.4 HHCK Main Business and Markets Served
7.13.5 HHCK Recent Developments/Updates
7.14 Scienchem
7.14.1 Scienchem Epoxy Molding Compound for Power Device Company Information
7.14.2 Scienchem Epoxy Molding Compound for Power Device Product Portfolio
7.14.3 Scienchem Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Scienchem Main Business and Markets Served
7.14.5 Scienchem Recent Developments/Updates
7.15 Beijing Sino-tech Electronic Material
7.15.1 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Company Information
7.15.2 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Product Portfolio
7.15.3 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Beijing Sino-tech Electronic Material Main Business and Markets Served
7.15.5 Beijing Sino-tech Electronic Material Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Epoxy Molding Compound for Power Device Industry Chain Analysis
8.2 Epoxy Molding Compound for Power Device Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Epoxy Molding Compound for Power Device Production Mode & Process Analysis
8.4 Epoxy Molding Compound for Power Device Sales and Marketing
8.4.1 Epoxy Molding Compound for Power Device Sales Channels
8.4.2 Epoxy Molding Compound for Power Device Distributors
8.5 Epoxy Molding Compound for Power Device Customer Analysis
9 Epoxy Molding Compound for Power Device Market Dynamics
9.1 Epoxy Molding Compound for Power Device Industry Trends
9.2 Epoxy Molding Compound for Power Device Market Drivers
9.3 Epoxy Molding Compound for Power Device Market Challenges
9.4 Epoxy Molding Compound for Power Device Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Epoxy Molding Compound for Power Device Market Value by Type, (US$ Million) & (2024 VS 2031)
Table 2. Global Epoxy Molding Compound for Power Device Market Value by Application, (US$ Million) & (2024 VS 2031)
Table 3. Global Epoxy Molding Compound for Power Device Production Capacity (Tons) by Manufacturers in 2024
Table 4. Global Epoxy Molding Compound for Power Device Production by Manufacturers (2020-2025) & (Tons)
Table 5. Global Epoxy Molding Compound for Power Device Production Market Share by Manufacturers (2020-2025)
Table 6. Global Epoxy Molding Compound for Power Device Production Value by Manufacturers (2020-2025) & (US$ Million)
Table 7. Global Epoxy Molding Compound for Power Device Production Value Share by Manufacturers (2020-2025)
Table 8. Global Key Players of Epoxy Molding Compound for Power Device, Industry Ranking, 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Epoxy Molding Compound for Power Device as of 2024)
Table 10. Global Market Epoxy Molding Compound for Power Device Average Price by Manufacturers (US$/Ton) & (2020-2025)
Table 11. Global Key Manufacturers of Epoxy Molding Compound for Power Device, Manufacturing Base Distribution and Headquarters
Table 12. Global Key Manufacturers of Epoxy Molding Compound for Power Device, Product Offered and Application
Table 13. Global Key Manufacturers of Epoxy Molding Compound for Power Device, Date of Enter into This Industry
Table 14. Global Epoxy Molding Compound for Power Device Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global Epoxy Molding Compound for Power Device Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Table 17. Global Epoxy Molding Compound for Power Device Production Value (US$ Million) by Region (2020-2025)
Table 18. Global Epoxy Molding Compound for Power Device Production Value Market Share by Region (2020-2025)
Table 19. Global Epoxy Molding Compound for Power Device Production Value (US$ Million) Forecast by Region (2026-2031)
Table 20. Global Epoxy Molding Compound for Power Device Production Value Market Share Forecast by Region (2026-2031)
Table 21. Global Epoxy Molding Compound for Power Device Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
Table 22. Global Epoxy Molding Compound for Power Device Production (Tons) by Region (2020-2025)
Table 23. Global Epoxy Molding Compound for Power Device Production Market Share by Region (2020-2025)
Table 24. Global Epoxy Molding Compound for Power Device Production (Tons) Forecast by Region (2026-2031)
Table 25. Global Epoxy Molding Compound for Power Device Production Market Share Forecast by Region (2026-2031)
Table 26. Global Epoxy Molding Compound for Power Device Market Average Price (US$/Ton) by Region (2020-2025)
Table 27. Global Epoxy Molding Compound for Power Device Market Average Price (US$/Ton) by Region (2026-2031)
Table 28. Global Epoxy Molding Compound for Power Device Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
Table 29. Global Epoxy Molding Compound for Power Device Consumption by Region (2020-2025) & (Tons)
Table 30. Global Epoxy Molding Compound for Power Device Consumption Market Share by Region (2020-2025)
Table 31. Global Epoxy Molding Compound for Power Device Forecasted Consumption by Region (2026-2031) & (Tons)
Table 32. Global Epoxy Molding Compound for Power Device Forecasted Consumption Market Share by Region (2026-2031)
Table 33. North America Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 34. North America Epoxy Molding Compound for Power Device Consumption by Country (2020-2025) & (Tons)
Table 35. North America Epoxy Molding Compound for Power Device Consumption by Country (2026-2031) & (Tons)
Table 36. Europe Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 37. Europe Epoxy Molding Compound for Power Device Consumption by Country (2020-2025) & (Tons)
Table 38. Europe Epoxy Molding Compound for Power Device Consumption by Country (2026-2031) & (Tons)
Table 39. Asia Pacific Epoxy Molding Compound for Power Device Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
Table 40. Asia Pacific Epoxy Molding Compound for Power Device Consumption by Region (2020-2025) & (Tons)
Table 41. Asia Pacific Epoxy Molding Compound for Power Device Consumption by Region (2026-2031) & (Tons)
Table 42. Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
Table 43. Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption by Country (2020-2025) & (Tons)
Table 44. Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption by Country (2026-2031) & (Tons)
Table 45. Global Epoxy Molding Compound for Power Device Production (Tons) by Type (2020-2025)
Table 46. Global Epoxy Molding Compound for Power Device Production (Tons) by Type (2026-2031)
Table 47. Global Epoxy Molding Compound for Power Device Production Market Share by Type (2020-2025)
Table 48. Global Epoxy Molding Compound for Power Device Production Market Share by Type (2026-2031)
Table 49. Global Epoxy Molding Compound for Power Device Production Value (US$ Million) by Type (2020-2025)
Table 50. Global Epoxy Molding Compound for Power Device Production Value (US$ Million) by Type (2026-2031)
Table 51. Global Epoxy Molding Compound for Power Device Production Value Market Share by Type (2020-2025)
Table 52. Global Epoxy Molding Compound for Power Device Production Value Market Share by Type (2026-2031)
Table 53. Global Epoxy Molding Compound for Power Device Price (US$/Ton) by Type (2020-2025)
Table 54. Global Epoxy Molding Compound for Power Device Price (US$/Ton) by Type (2026-2031)
Table 55. Global Epoxy Molding Compound for Power Device Production (Tons) by Application (2020-2025)
Table 56. Global Epoxy Molding Compound for Power Device Production (Tons) by Application (2026-2031)
Table 57. Global Epoxy Molding Compound for Power Device Production Market Share by Application (2020-2025)
Table 58. Global Epoxy Molding Compound for Power Device Production Market Share by Application (2026-2031)
Table 59. Global Epoxy Molding Compound for Power Device Production Value (US$ Million) by Application (2020-2025)
Table 60. Global Epoxy Molding Compound for Power Device Production Value (US$ Million) by Application (2026-2031)
Table 61. Global Epoxy Molding Compound for Power Device Production Value Market Share by Application (2020-2025)
Table 62. Global Epoxy Molding Compound for Power Device Production Value Market Share by Application (2026-2031)
Table 63. Global Epoxy Molding Compound for Power Device Price (US$/Ton) by Application (2020-2025)
Table 64. Global Epoxy Molding Compound for Power Device Price (US$/Ton) by Application (2026-2031)
Table 65. Sumitomo Bakelite Epoxy Molding Compound for Power Device Company Information
Table 66. Sumitomo Bakelite Epoxy Molding Compound for Power Device Specification and Application
Table 67. Sumitomo Bakelite Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 68. Sumitomo Bakelite Main Business and Markets Served
Table 69. Sumitomo Bakelite Recent Developments/Updates
Table 70. Showa Denko Epoxy Molding Compound for Power Device Company Information
Table 71. Showa Denko Epoxy Molding Compound for Power Device Specification and Application
Table 72. Showa Denko Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 73. Showa Denko Main Business and Markets Served
Table 74. Showa Denko Recent Developments/Updates
Table 75. Chang Chun Group Epoxy Molding Compound for Power Device Company Information
Table 76. Chang Chun Group Epoxy Molding Compound for Power Device Specification and Application
Table 77. Chang Chun Group Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 78. Chang Chun Group Main Business and Markets Served
Table 79. Chang Chun Group Recent Developments/Updates
Table 80. Hysol Huawei Electronics Epoxy Molding Compound for Power Device Company Information
Table 81. Hysol Huawei Electronics Epoxy Molding Compound for Power Device Specification and Application
Table 82. Hysol Huawei Electronics Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 83. Hysol Huawei Electronics Main Business and Markets Served
Table 84. Hysol Huawei Electronics Recent Developments/Updates
Table 85. Panasonic Epoxy Molding Compound for Power Device Company Information
Table 86. Panasonic Epoxy Molding Compound for Power Device Specification and Application
Table 87. Panasonic Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 88. Panasonic Main Business and Markets Served
Table 89. Panasonic Recent Developments/Updates
Table 90. Kyocera Epoxy Molding Compound for Power Device Company Information
Table 91. Kyocera Epoxy Molding Compound for Power Device Specification and Application
Table 92. Kyocera Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 93. Kyocera Main Business and Markets Served
Table 94. Kyocera Recent Developments/Updates
Table 95. KCC Epoxy Molding Compound for Power Device Company Information
Table 96. KCC Epoxy Molding Compound for Power Device Specification and Application
Table 97. KCC Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 98. KCC Main Business and Markets Served
Table 99. KCC Recent Developments/Updates
Table 100. Eternal Materials Epoxy Molding Compound for Power Device Company Information
Table 101. Eternal Materials Epoxy Molding Compound for Power Device Specification and Application
Table 102. Eternal Materials Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 103. Eternal Materials Main Business and Markets Served
Table 104. Eternal Materials Recent Developments/Updates
Table 105. Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Company Information
Table 106. Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Specification and Application
Table 107. Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 108. Jiangsu zhongpeng new material Main Business and Markets Served
Table 109. Jiangsu zhongpeng new material Recent Developments/Updates
Table 110. Shin-Etsu Chemical Epoxy Molding Compound for Power Device Company Information
Table 111. Shin-Etsu Chemical Epoxy Molding Compound for Power Device Specification and Application
Table 112. Shin-Etsu Chemical Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 113. Shin-Etsu Chemical Main Business and Markets Served
Table 114. Shin-Etsu Chemical Recent Developments/Updates
Table 115. Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Company Information
Table 116. Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Specification and Application
Table 117. Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 118. Nagase ChemteX Corporation Main Business and Markets Served
Table 119. Nagase ChemteX Corporation Recent Developments/Updates
Table 120. Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Company Information
Table 121. Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Specification and Application
Table 122. Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 123. Tianjin Kaihua Insulating Material Main Business and Markets Served
Table 124. Tianjin Kaihua Insulating Material Recent Developments/Updates
Table 125. HHCK Epoxy Molding Compound for Power Device Company Information
Table 126. HHCK Epoxy Molding Compound for Power Device Specification and Application
Table 127. HHCK Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 128. HHCK Main Business and Markets Served
Table 129. HHCK Recent Developments/Updates
Table 130. Scienchem Epoxy Molding Compound for Power Device Company Information
Table 131. Scienchem Epoxy Molding Compound for Power Device Specification and Application
Table 132. Scienchem Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 133. Scienchem Main Business and Markets Served
Table 134. Scienchem Recent Developments/Updates
Table 135. Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Company Information
Table 136. Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Specification and Application
Table 137. Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
Table 138. Beijing Sino-tech Electronic Material Main Business and Markets Served
Table 139. Beijing Sino-tech Electronic Material Recent Developments/Updates
Table 140. Key Raw Materials Lists
Table 141. Raw Materials Key Suppliers Lists
Table 142. Epoxy Molding Compound for Power Device Distributors List
Table 143. Epoxy Molding Compound for Power Device Customers List
Table 144. Epoxy Molding Compound for Power Device Market Trends
Table 145. Epoxy Molding Compound for Power Device Market Drivers
Table 146. Epoxy Molding Compound for Power Device Market Challenges
Table 147. Epoxy Molding Compound for Power Device Market Restraints
Table 148. Research Programs/Design for This Report
Table 149. Key Data Information from Secondary Sources
Table 150. Key Data Information from Primary Sources
Table 151. Authors List of This Report
List of Figures
Figure 1. Product Picture of Epoxy Molding Compound for Power Device
Figure 2. Global Epoxy Molding Compound for Power Device Market Value by Type, (US$ Million) & (2020-2031)
Figure 3. Global Epoxy Molding Compound for Power Device Market Share by Type: 2024 VS 2031
Figure 4. SC Product Picture
Figure 5. SOT Product Picture
Figure 6. TO Product Picture
Figure 7. Other Product Picture
Figure 8. Global Epoxy Molding Compound for Power Device Market Value by Application, (US$ Million) & (2020-2031)
Figure 9. Global Epoxy Molding Compound for Power Device Market Share by Application: 2024 VS 2031
Figure 10. Automotive
Figure 11. Consumer Electronics
Figure 12. Industrial
Figure 13. Other
Figure 14. Global Epoxy Molding Compound for Power Device Production Value (US$ Million), 2020 VS 2024 VS 2031
Figure 15. Global Epoxy Molding Compound for Power Device Production Value (US$ Million) & (2020-2031)
Figure 16. Global Epoxy Molding Compound for Power Device Production Capacity (Tons) & (2020-2031)
Figure 17. Global Epoxy Molding Compound for Power Device Production (Tons) & (2020-2031)
Figure 18. Global Epoxy Molding Compound for Power Device Average Price (US$/Ton) & (2020-2031)
Figure 19. Epoxy Molding Compound for Power Device Report Years Considered
Figure 20. Epoxy Molding Compound for Power Device Production Share by Manufacturers in 2024
Figure 21. Global Epoxy Molding Compound for Power Device Production Value Share by Manufacturers (2024)
Figure 22. Epoxy Molding Compound for Power Device Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
Figure 23. The Global 5 and 10 Largest Players: Market Share by Epoxy Molding Compound for Power Device Revenue in 2024
Figure 24. Global Epoxy Molding Compound for Power Device Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Figure 25. Global Epoxy Molding Compound for Power Device Production Value Market Share by Region: 2020 VS 2024 VS 2031
Figure 26. Global Epoxy Molding Compound for Power Device Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
Figure 27. Global Epoxy Molding Compound for Power Device Production Market Share by Region: 2020 VS 2024 VS 2031
Figure 28. North America Epoxy Molding Compound for Power Device Production Value (US$ Million) Growth Rate (2020-2031)
Figure 29. Europe Epoxy Molding Compound for Power Device Production Value (US$ Million) Growth Rate (2020-2031)
Figure 30. China Epoxy Molding Compound for Power Device Production Value (US$ Million) Growth Rate (2020-2031)
Figure 31. Japan Epoxy Molding Compound for Power Device Production Value (US$ Million) Growth Rate (2020-2031)
Figure 32. Global Epoxy Molding Compound for Power Device Consumption by Region: 2020 VS 2024 VS 2031 (Tons)
Figure 33. Global Epoxy Molding Compound for Power Device Consumption Market Share by Region: 2020 VS 2024 VS 2031
Figure 34. North America Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 35. North America Epoxy Molding Compound for Power Device Consumption Market Share by Country (2020-2031)
Figure 36. U.S. Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 37. Canada Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 38. Europe Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 39. Europe Epoxy Molding Compound for Power Device Consumption Market Share by Country (2020-2031)
Figure 40. Germany Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 41. France Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 42. U.K. Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 43. Italy Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 44. Russia Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 45. Asia Pacific Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 46. Asia Pacific Epoxy Molding Compound for Power Device Consumption Market Share by Region (2020-2031)
Figure 47. China Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 48. Japan Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 49. South Korea Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 50. China Taiwan Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 51. Southeast Asia Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 52. India Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 53. Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 54. Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption Market Share by Country (2020-2031)
Figure 55. Mexico Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 56. Brazil Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 57. Turkey Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 58. GCC Countries Epoxy Molding Compound for Power Device Consumption and Growth Rate (2020-2031) & (Tons)
Figure 59. Global Production Market Share of Epoxy Molding Compound for Power Device by Type (2020-2031)
Figure 60. Global Production Value Market Share of Epoxy Molding Compound for Power Device by Type (2020-2031)
Figure 61. Global Epoxy Molding Compound for Power Device Price (US$/Ton) by Type (2020-2031)
Figure 62. Global Production Market Share of Epoxy Molding Compound for Power Device by Application (2020-2031)
Figure 63. Global Production Value Market Share of Epoxy Molding Compound for Power Device by Application (2020-2031)
Figure 64. Global Epoxy Molding Compound for Power Device Price (US$/Ton) by Application (2020-2031)
Figure 65. Epoxy Molding Compound for Power Device Value Chain
Figure 66. Channels of Distribution (Direct Vs Distribution)
Figure 67. Bottom-up and Top-down Approaches for This Report
Figure 68. Data Triangulation
Published By : QY Research
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