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Global Epoxy Molding Compound in Semiconductor Packaging Market Research Report 2025
Synopsis
The global Epoxy Molding Compound in Semiconductor Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound in Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound in Semiconductor Packaging.
Report Scope
The Epoxy Molding Compound in Semiconductor Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Epoxy Molding Compound in Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compound in Semiconductor Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung SDI
Sumitomo Bakelite
Showa Denko
Eternal Materials
Chang Chun Group
KCC
Duresco
Hysol Huawei Electronics
Jiangsu Huahai Chengkexin Material
Beijing Kehua New Materials
Segment by Type
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Segment by Application
IC
Diode
Transistor
Photocoupler
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound in Semiconductor Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound in Semiconductor Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound in Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global Epoxy Molding Compound in Semiconductor Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound in Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound in Semiconductor Packaging.
Report Scope
The Epoxy Molding Compound in Semiconductor Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Epoxy Molding Compound in Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Epoxy Molding Compound in Semiconductor Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung SDI
Sumitomo Bakelite
Showa Denko
Eternal Materials
Chang Chun Group
KCC
Duresco
Hysol Huawei Electronics
Jiangsu Huahai Chengkexin Material
Beijing Kehua New Materials
Segment by Type
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Segment by Application
IC
Diode
Transistor
Photocoupler
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound in Semiconductor Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound in Semiconductor Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound in Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Epoxy Molding Compound in Semiconductor Packaging Market Overview
1.1 Product Definition
1.2 Epoxy Molding Compound in Semiconductor Packaging Segment by Type
1.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Normal Epoxy Molding Compound
1.2.3 Green Epoxy Molding Compound
1.3 Epoxy Molding Compound in Semiconductor Packaging Segment by Application
1.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IC
1.3.3 Diode
1.3.4 Transistor
1.3.5 Photocoupler
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Epoxy Molding Compound in Semiconductor Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Epoxy Molding Compound in Semiconductor Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Epoxy Molding Compound in Semiconductor Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Date of Enter into This Industry
2.9 Epoxy Molding Compound in Semiconductor Packaging Market Competitive Situation and Trends
2.9.1 Epoxy Molding Compound in Semiconductor Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Epoxy Molding Compound in Semiconductor Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Epoxy Molding Compound in Semiconductor Packaging Production by Region
3.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region (2019-2030)
3.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Epoxy Molding Compound in Semiconductor Packaging by Region (2025-2030)
3.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Epoxy Molding Compound in Semiconductor Packaging Production by Region (2019-2030)
3.4.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Epoxy Molding Compound in Semiconductor Packaging by Region (2025-2030)
3.5 Global Epoxy Molding Compound in Semiconductor Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Epoxy Molding Compound in Semiconductor Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2019-2030)
4 Epoxy Molding Compound in Semiconductor Packaging Consumption by Region
4.1 Global Epoxy Molding Compound in Semiconductor Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2030)
4.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2024)
4.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2019-2030)
5.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2019-2024)
5.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2025-2030)
5.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Type (2019-2030)
5.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2019-2030)
5.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2019-2024)
5.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2025-2030)
5.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2019-2030)
6.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2019-2024)
6.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2025-2030)
6.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Application (2019-2030)
6.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2019-2030)
6.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2019-2024)
6.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2025-2030)
6.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Samsung SDI
7.1.1 Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.1.2 Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.1.3 Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Samsung SDI Main Business and Markets Served
7.1.5 Samsung SDI Recent Developments/Updates
7.2 Sumitomo Bakelite
7.2.1 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.2.2 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.2.3 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Sumitomo Bakelite Main Business and Markets Served
7.2.5 Sumitomo Bakelite Recent Developments/Updates
7.3 Showa Denko
7.3.1 Showa Denko Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.3.2 Showa Denko Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.3.3 Showa Denko Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Showa Denko Main Business and Markets Served
7.3.5 Showa Denko Recent Developments/Updates
7.4 Eternal Materials
7.4.1 Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.4.2 Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.4.3 Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Eternal Materials Main Business and Markets Served
7.4.5 Eternal Materials Recent Developments/Updates
7.5 Chang Chun Group
7.5.1 Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.5.2 Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.5.3 Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Chang Chun Group Main Business and Markets Served
7.5.5 Chang Chun Group Recent Developments/Updates
7.6 KCC
7.6.1 KCC Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.6.2 KCC Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.6.3 KCC Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 KCC Main Business and Markets Served
7.6.5 KCC Recent Developments/Updates
7.7 Duresco
7.7.1 Duresco Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.7.2 Duresco Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.7.3 Duresco Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Duresco Main Business and Markets Served
7.7.5 Duresco Recent Developments/Updates
7.8 Hysol Huawei Electronics
7.8.1 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.8.2 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.8.3 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Hysol Huawei Electronics Main Business and Markets Served
7.7.5 Hysol Huawei Electronics Recent Developments/Updates
7.9 Jiangsu Huahai Chengkexin Material
7.9.1 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.9.2 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.9.3 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Jiangsu Huahai Chengkexin Material Main Business and Markets Served
7.9.5 Jiangsu Huahai Chengkexin Material Recent Developments/Updates
7.10 Beijing Kehua New Materials
7.10.1 Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Corporation Information
7.10.2 Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Product Portfolio
7.10.3 Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Beijing Kehua New Materials Main Business and Markets Served
7.10.5 Beijing Kehua New Materials Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Epoxy Molding Compound in Semiconductor Packaging Industry Chain Analysis
8.2 Epoxy Molding Compound in Semiconductor Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Epoxy Molding Compound in Semiconductor Packaging Production Mode & Process
8.4 Epoxy Molding Compound in Semiconductor Packaging Sales and Marketing
8.4.1 Epoxy Molding Compound in Semiconductor Packaging Sales Channels
8.4.2 Epoxy Molding Compound in Semiconductor Packaging Distributors
8.5 Epoxy Molding Compound in Semiconductor Packaging Customers
9 Epoxy Molding Compound in Semiconductor Packaging Market Dynamics
9.1 Epoxy Molding Compound in Semiconductor Packaging Industry Trends
9.2 Epoxy Molding Compound in Semiconductor Packaging Market Drivers
9.3 Epoxy Molding Compound in Semiconductor Packaging Market Challenges
9.4 Epoxy Molding Compound in Semiconductor Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity (Tons) by Manufacturers in 2023
Table 4. Global Epoxy Molding Compound in Semiconductor Packaging Production by Manufacturers (2019-2024) & (Tons)
Table 5. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Manufacturers (2019-2024)
Table 6. Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Share by Manufacturers (2019-2024)
Table 8. Global Epoxy Molding Compound in Semiconductor Packaging Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Epoxy Molding Compound in Semiconductor Packaging as of 2023)
Table 10. Global Market Epoxy Molding Compound in Semiconductor Packaging Average Price by Manufacturers (US$/Ton) & (2019-2024)
Table 11. Manufacturers Epoxy Molding Compound in Semiconductor Packaging Production Sites and Area Served
Table 12. Manufacturers Epoxy Molding Compound in Semiconductor Packaging Product Types
Table 13. Global Epoxy Molding Compound in Semiconductor Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Region (2019-2024)
Table 18. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Epoxy Molding Compound in Semiconductor Packaging Production Comparison by Region: 2019 VS 2023 VS 2030 (Tons)
Table 21. Global Epoxy Molding Compound in Semiconductor Packaging Production (Tons) by Region (2019-2024)
Table 22. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2019-2024)
Table 23. Global Epoxy Molding Compound in Semiconductor Packaging Production (Tons) Forecast by Region (2025-2030)
Table 24. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share Forecast by Region (2025-2030)
Table 25. Global Epoxy Molding Compound in Semiconductor Packaging Market Average Price (US$/Ton) by Region (2019-2024)
Table 26. Global Epoxy Molding Compound in Semiconductor Packaging Market Average Price (US$/Ton) by Region (2025-2030)
Table 27. Global Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Tons)
Table 28. Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2024) & (Tons)
Table 29. Global Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Region (2019-2024)
Table 30. Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Consumption by Region (2025-2030) & (Tons)
Table 31. Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Tons)
Table 33. North America Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2024) & (Tons)
Table 34. North America Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2025-2030) & (Tons)
Table 35. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Tons)
Table 36. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2024) & (Tons)
Table 37. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2025-2030) & (Tons)
Table 38. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Tons)
Table 39. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2019-2024) & (Tons)
Table 40. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2025-2030) & (Tons)
Table 41. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Tons)
Table 42. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2019-2024) & (Tons)
Table 43. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2025-2030) & (Tons)
Table 44. Global Epoxy Molding Compound in Semiconductor Packaging Production (Tons) by Type (2019-2024)
Table 45. Global Epoxy Molding Compound in Semiconductor Packaging Production (Tons) by Type (2025-2030)
Table 46. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Type (2019-2024)
Table 47. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Type (2025-2030)
Table 48. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Share by Type (2019-2024)
Table 51. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Share by Type (2025-2030)
Table 52. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Type (2019-2024)
Table 53. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Type (2025-2030)
Table 54. Global Epoxy Molding Compound in Semiconductor Packaging Production (Tons) by Application (2019-2024)
Table 55. Global Epoxy Molding Compound in Semiconductor Packaging Production (Tons) by Application (2025-2030)
Table 56. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Application (2019-2024)
Table 57. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Application (2025-2030)
Table 58. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Share by Application (2019-2024)
Table 61. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Share by Application (2025-2030)
Table 62. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Application (2019-2024)
Table 63. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Application (2025-2030)
Table 64. Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 65. Samsung SDI Specification and Application
Table 66. Samsung SDI Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 67. Samsung SDI Main Business and Markets Served
Table 68. Samsung SDI Recent Developments/Updates
Table 69. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 70. Sumitomo Bakelite Specification and Application
Table 71. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 72. Sumitomo Bakelite Main Business and Markets Served
Table 73. Sumitomo Bakelite Recent Developments/Updates
Table 74. Showa Denko Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 75. Showa Denko Specification and Application
Table 76. Showa Denko Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 77. Showa Denko Main Business and Markets Served
Table 78. Showa Denko Recent Developments/Updates
Table 79. Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 80. Eternal Materials Specification and Application
Table 81. Eternal Materials Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 82. Eternal Materials Main Business and Markets Served
Table 83. Eternal Materials Recent Developments/Updates
Table 84. Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 85. Chang Chun Group Specification and Application
Table 86. Chang Chun Group Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 87. Chang Chun Group Main Business and Markets Served
Table 88. Chang Chun Group Recent Developments/Updates
Table 89. KCC Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 90. KCC Specification and Application
Table 91. KCC Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 92. KCC Main Business and Markets Served
Table 93. KCC Recent Developments/Updates
Table 94. Duresco Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 95. Duresco Specification and Application
Table 96. Duresco Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 97. Duresco Main Business and Markets Served
Table 98. Duresco Recent Developments/Updates
Table 99. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 100. Hysol Huawei Electronics Specification and Application
Table 101. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 102. Hysol Huawei Electronics Main Business and Markets Served
Table 103. Hysol Huawei Electronics Recent Developments/Updates
Table 104. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 105. Jiangsu Huahai Chengkexin Material Specification and Application
Table 106. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 107. Jiangsu Huahai Chengkexin Material Main Business and Markets Served
Table 108. Jiangsu Huahai Chengkexin Material Recent Developments/Updates
Table 109. Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Corporation Information
Table 110. Beijing Kehua New Materials Specification and Application
Table 111. Beijing Kehua New Materials Epoxy Molding Compound in Semiconductor Packaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 112. Beijing Kehua New Materials Main Business and Markets Served
Table 113. Beijing Kehua New Materials Recent Developments/Updates
Table 114. Key Raw Materials Lists
Table 115. Raw Materials Key Suppliers Lists
Table 116. Epoxy Molding Compound in Semiconductor Packaging Distributors List
Table 117. Epoxy Molding Compound in Semiconductor Packaging Customers List
Table 118. Epoxy Molding Compound in Semiconductor Packaging Market Trends
Table 119. Epoxy Molding Compound in Semiconductor Packaging Market Drivers
Table 120. Epoxy Molding Compound in Semiconductor Packaging Market Challenges
Table 121. Epoxy Molding Compound in Semiconductor Packaging Market Restraints
Table 122. Research Programs/Design for This Report
Table 123. Key Data Information from Secondary Sources
Table 124. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Epoxy Molding Compound in Semiconductor Packaging
Figure 2. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Type: 2023 VS 2030
Figure 4. Normal Epoxy Molding Compound Product Picture
Figure 5. Green Epoxy Molding Compound Product Picture
Figure 6. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 7. Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Application: 2023 VS 2030
Figure 8. IC
Figure 9. Diode
Figure 10. Transistor
Figure 11. Photocoupler
Figure 12. Others
Figure 13. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 14. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) & (2019-2030)
Figure 15. Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity (Tons) & (2019-2030)
Figure 16. Global Epoxy Molding Compound in Semiconductor Packaging Production (Tons) & (2019-2030)
Figure 17. Global Epoxy Molding Compound in Semiconductor Packaging Average Price (US$/Ton) & (2019-2030)
Figure 18. Epoxy Molding Compound in Semiconductor Packaging Report Years Considered
Figure 19. Epoxy Molding Compound in Semiconductor Packaging Production Share by Manufacturers in 2023
Figure 20. Epoxy Molding Compound in Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 21. The Global 5 and 10 Largest Players: Market Share by Epoxy Molding Compound in Semiconductor Packaging Revenue in 2023
Figure 22. Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 23. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 24. Global Epoxy Molding Compound in Semiconductor Packaging Production Comparison by Region: 2019 VS 2023 VS 2030 (Tons)
Figure 25. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 26. North America Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. Europe Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. China Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. Japan Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region: 2019 VS 2023 VS 2030 (Tons)
Figure 31. Global Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 32. North America Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 33. North America Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Country (2019-2030)
Figure 34. Canada Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 35. U.S. Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 36. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 37. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Country (2019-2030)
Figure 38. Germany Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 39. France Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 40. U.K. Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 41. Italy Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 42. Russia Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 43. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 44. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Regions (2019-2030)
Figure 45. China Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 46. Japan Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 47. South Korea Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 48. China Taiwan Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 49. Southeast Asia Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 50. India Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 51. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 52. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Country (2019-2030)
Figure 53. Mexico Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 54. Brazil Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 55. Turkey Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 56. GCC Countries Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2019-2024) & (Tons)
Figure 57. Global Production Market Share of Epoxy Molding Compound in Semiconductor Packaging by Type (2019-2030)
Figure 58. Global Production Value Market Share of Epoxy Molding Compound in Semiconductor Packaging by Type (2019-2030)
Figure 59. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Type (2019-2030)
Figure 60. Global Production Market Share of Epoxy Molding Compound in Semiconductor Packaging by Application (2019-2030)
Figure 61. Global Production Value Market Share of Epoxy Molding Compound in Semiconductor Packaging by Application (2019-2030)
Figure 62. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Application (2019-2030)
Figure 63. Epoxy Molding Compound in Semiconductor Packaging Value Chain
Figure 64. Epoxy Molding Compound in Semiconductor Packaging Production Process
Figure 65. Channels of Distribution (Direct Vs Distribution)
Figure 66. Distributors Profiles
Figure 67. Bottom-up and Top-down Approaches for This Report
Figure 68. Data Triangulation
Published By : QY Research
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