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Global Fan-out Panel-level Packaging Market Research Report 2025

Global Fan-out Panel-level Packaging Market Research Report 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1806614

No of Pages : 71

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Synopsis

The global Fan-out Panel-level Packaging market was valued at US$ 1369.8 million in 2023 and is anticipated to reach US$ 4907.9 million by 2030, witnessing a CAGR of 19.7% during the forecast period 2024-2030.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report aims to provide a comprehensive presentation of the global market for Fan-out Panel-level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-out Panel-level Packaging.

Report Scope

The Fan-out Panel-level Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Fan-out Panel-level Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Fan-out Panel-level Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

  • Amkor Technology
  • Deca Technologies
  • Lam Research Corporation
  • Qualcomm Technologies
  • Siliconware Precision Industries
  • SPTS Technologies
  • STATS ChipPAC
  • Samsung
  • TSMC

Segment by Type

  • System-in-package (SiP)
  • Heterogeneous Integration

Segment by Application

  • Wireless Devices
  • Power Management Units
  • Radar Devices
  • Processing Units
  • Others

Consumption by Region

  • North America (United States, Canada)
  • Europe (Germany, France, U.K., Italy, Netherlands)
  • Asia-Pacific (China, Japan, South Korea, China Taiwan, Southeast Asia, India)
  • Latin America, Middle East & Africa (Latin America, Mexico, Brazil, Turkey)

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Fan-out Panel-level Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Index

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Fan-out Panel-level Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 System-in-package (SiP)
1.2.3 Heterogeneous Integration
1.3 Market by Application
1.3.1 Global Fan-out Panel-level Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Wireless Devices
1.3.3 Power Management Units
1.3.4 Radar Devices
1.3.5 Processing Units
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Fan-out Panel-level Packaging Market Perspective (2019-2030)
2.2 Fan-out Panel-level Packaging Growth Trends by Region
2.2.1 Global Fan-out Panel-level Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Fan-out Panel-level Packaging Historic Market Size by Region (2019-2024)
2.2.3 Fan-out Panel-level Packaging Forecasted Market Size by Region (2025-2030)
2.3 Fan-out Panel-level Packaging Market Dynamics
2.3.1 Fan-out Panel-level Packaging Industry Trends
2.3.2 Fan-out Panel-level Packaging Market Drivers
2.3.3 Fan-out Panel-level Packaging Market Challenges
2.3.4 Fan-out Panel-level Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Fan-out Panel-level Packaging Players by Revenue
3.1.1 Global Top Fan-out Panel-level Packaging Players by Revenue (2019-2024)
3.1.2 Global Fan-out Panel-level Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Fan-out Panel-level Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Fan-out Panel-level Packaging Revenue
3.4 Global Fan-out Panel-level Packaging Market Concentration Ratio
3.4.1 Global Fan-out Panel-level Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Fan-out Panel-level Packaging Revenue in 2023
3.5 Fan-out Panel-level Packaging Key Players Head office and Area Served
3.6 Key Players Fan-out Panel-level Packaging Product Solution and Service
3.7 Date of Enter into Fan-out Panel-level Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Fan-out Panel-level Packaging Breakdown Data by Type
4.1 Global Fan-out Panel-level Packaging Historic Market Size by Type (2019-2024)
4.2 Global Fan-out Panel-level Packaging Forecasted Market Size by Type (2025-2030)
5 Fan-out Panel-level Packaging Breakdown Data by Application
5.1 Global Fan-out Panel-level Packaging Historic Market Size by Application (2019-2024)
5.2 Global Fan-out Panel-level Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Fan-out Panel-level Packaging Market Size (2019-2030)
6.2 North America Fan-out Panel-level Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Fan-out Panel-level Packaging Market Size by Country (2019-2024)
6.4 North America Fan-out Panel-level Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Fan-out Panel-level Packaging Market Size (2019-2030)
7.2 Europe Fan-out Panel-level Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Fan-out Panel-level Packaging Market Size by Country (2019-2024)
7.4 Europe Fan-out Panel-level Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Fan-out Panel-level Packaging Market Size (2019-2030)
8.2 Asia-Pacific Fan-out Panel-level Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Fan-out Panel-level Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific Fan-out Panel-level Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Fan-out Panel-level Packaging Market Size (2019-2030)
9.2 Latin America Fan-out Panel-level Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Fan-out Panel-level Packaging Market Size by Country (2019-2024)
9.4 Latin America Fan-out Panel-level Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Fan-out Panel-level Packaging Market Size (2019-2030)
10.2 Middle East & Africa Fan-out Panel-level Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Fan-out Panel-level Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa Fan-out Panel-level Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor Technology
11.1.1 Amkor Technology Company Detail
11.1.2 Amkor Technology Business Overview
11.1.3 Amkor Technology Fan-out Panel-level Packaging Introduction
11.1.4 Amkor Technology Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.1.5 Amkor Technology Recent Development
11.2 Deca Technologies
11.2.1 Deca Technologies Company Detail
11.2.2 Deca Technologies Business Overview
11.2.3 Deca Technologies Fan-out Panel-level Packaging Introduction
11.2.4 Deca Technologies Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.2.5 Deca Technologies Recent Development
11.3 Lam Research Corporation
11.3.1 Lam Research Corporation Company Detail
11.3.2 Lam Research Corporation Business Overview
11.3.3 Lam Research Corporation Fan-out Panel-level Packaging Introduction
11.3.4 Lam Research Corporation Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.3.5 Lam Research Corporation Recent Development
11.4 Qualcomm Technologies
11.4.1 Qualcomm Technologies Company Detail
11.4.2 Qualcomm Technologies Business Overview
11.4.3 Qualcomm Technologies Fan-out Panel-level Packaging Introduction
11.4.4 Qualcomm Technologies Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.4.5 Qualcomm Technologies Recent Development
11.5 Siliconware Precision Industries
11.5.1 Siliconware Precision Industries Company Detail
11.5.2 Siliconware Precision Industries Business Overview
11.5.3 Siliconware Precision Industries Fan-out Panel-level Packaging Introduction
11.5.4 Siliconware Precision Industries Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.5.5 Siliconware Precision Industries Recent Development
11.6 SPTS Technologies
11.6.1 SPTS Technologies Company Detail
11.6.2 SPTS Technologies Business Overview
11.6.3 SPTS Technologies Fan-out Panel-level Packaging Introduction
11.6.4 SPTS Technologies Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.6.5 SPTS Technologies Recent Development
11.7 STATS ChipPAC
11.7.1 STATS ChipPAC Company Detail
11.7.2 STATS ChipPAC Business Overview
11.7.3 STATS ChipPAC Fan-out Panel-level Packaging Introduction
11.7.4 STATS ChipPAC Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.7.5 STATS ChipPAC Recent Development
11.8 Samsung
11.8.1 Samsung Company Detail
11.8.2 Samsung Business Overview
11.8.3 Samsung Fan-out Panel-level Packaging Introduction
11.8.4 Samsung Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.8.5 Samsung Recent Development
11.9 TSMC
11.9.1 TSMC Company Detail
11.9.2 TSMC Business Overview
11.9.3 TSMC Fan-out Panel-level Packaging Introduction
11.9.4 TSMC Revenue in Fan-out Panel-level Packaging Business (2019-2024)
11.9.5 TSMC Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Published By : QY Research

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