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Global Flip-Chip Package Substrate Market Research Report 2025

Global Flip-Chip Package Substrate Market Research Report 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1949931

No of Pages : 98

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Synopsis
The global Flip-Chip Package Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Flip-Chip Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip-Chip Package Substrate.
Report Scope
The Flip-Chip Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Flip-Chip Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip-Chip Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron
Ibiden
Nan Ya PCB
Shiko Electric Industries
AT&S
Kinsus Interconnect Technology
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
ACCESS
Segment by Type
FCBGA
FCCSP
Segment by Application
High-end servers
GPU
CPU and MPU
ASIC
FPGA
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip-Chip Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip-Chip Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip-Chip Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index
1 Flip-Chip Package Substrate Market Overview
1.1 Product Definition
1.2 Flip-Chip Package Substrate Segment by Type
1.2.1 Global Flip-Chip Package Substrate Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 FCBGA
1.2.3 FCCSP
1.3 Flip-Chip Package Substrate Segment by Application
1.3.1 Global Flip-Chip Package Substrate Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 High-end servers
1.3.3 GPU
1.3.4 CPU and MPU
1.3.5 ASIC
1.3.6 FPGA
1.4 Global Market Growth Prospects
1.4.1 Global Flip-Chip Package Substrate Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Flip-Chip Package Substrate Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Flip-Chip Package Substrate Production Estimates and Forecasts (2019-2030)
1.4.4 Global Flip-Chip Package Substrate Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Flip-Chip Package Substrate Production Market Share by Manufacturers (2019-2024)
2.2 Global Flip-Chip Package Substrate Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Flip-Chip Package Substrate, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Flip-Chip Package Substrate Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Flip-Chip Package Substrate Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Flip-Chip Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Flip-Chip Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Flip-Chip Package Substrate, Date of Enter into This Industry
2.9 Flip-Chip Package Substrate Market Competitive Situation and Trends
2.9.1 Flip-Chip Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Flip-Chip Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Flip-Chip Package Substrate Production by Region
3.1 Global Flip-Chip Package Substrate Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Flip-Chip Package Substrate Production Value by Region (2019-2030)
3.2.1 Global Flip-Chip Package Substrate Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Flip-Chip Package Substrate by Region (2025-2030)
3.3 Global Flip-Chip Package Substrate Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Flip-Chip Package Substrate Production by Region (2019-2030)
3.4.1 Global Flip-Chip Package Substrate Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Flip-Chip Package Substrate by Region (2025-2030)
3.5 Global Flip-Chip Package Substrate Market Price Analysis by Region (2019-2024)
3.6 Global Flip-Chip Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Flip-Chip Package Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Flip-Chip Package Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Flip-Chip Package Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Flip-Chip Package Substrate Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Flip-Chip Package Substrate Production Value Estimates and Forecasts (2019-2030)
4 Flip-Chip Package Substrate Consumption by Region
4.1 Global Flip-Chip Package Substrate Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Flip-Chip Package Substrate Consumption by Region (2019-2030)
4.2.1 Global Flip-Chip Package Substrate Consumption by Region (2019-2024)
4.2.2 Global Flip-Chip Package Substrate Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Flip-Chip Package Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Flip-Chip Package Substrate Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Flip-Chip Package Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Flip-Chip Package Substrate Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Flip-Chip Package Substrate Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Flip-Chip Package Substrate Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Flip-Chip Package Substrate Production by Type (2019-2030)
5.1.1 Global Flip-Chip Package Substrate Production by Type (2019-2024)
5.1.2 Global Flip-Chip Package Substrate Production by Type (2025-2030)
5.1.3 Global Flip-Chip Package Substrate Production Market Share by Type (2019-2030)
5.2 Global Flip-Chip Package Substrate Production Value by Type (2019-2030)
5.2.1 Global Flip-Chip Package Substrate Production Value by Type (2019-2024)
5.2.2 Global Flip-Chip Package Substrate Production Value by Type (2025-2030)
5.2.3 Global Flip-Chip Package Substrate Production Value Market Share by Type (2019-2030)
5.3 Global Flip-Chip Package Substrate Price by Type (2019-2030)
6 Segment by Application
6.1 Global Flip-Chip Package Substrate Production by Application (2019-2030)
6.1.1 Global Flip-Chip Package Substrate Production by Application (2019-2024)
6.1.2 Global Flip-Chip Package Substrate Production by Application (2025-2030)
6.1.3 Global Flip-Chip Package Substrate Production Market Share by Application (2019-2030)
6.2 Global Flip-Chip Package Substrate Production Value by Application (2019-2030)
6.2.1 Global Flip-Chip Package Substrate Production Value by Application (2019-2024)
6.2.2 Global Flip-Chip Package Substrate Production Value by Application (2025-2030)
6.2.3 Global Flip-Chip Package Substrate Production Value Market Share by Application (2019-2030)
6.3 Global Flip-Chip Package Substrate Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron Flip-Chip Package Substrate Corporation Information
7.1.2 Unimicron Flip-Chip Package Substrate Product Portfolio
7.1.3 Unimicron Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden Flip-Chip Package Substrate Corporation Information
7.2.2 Ibiden Flip-Chip Package Substrate Product Portfolio
7.2.3 Ibiden Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Nan Ya PCB
7.3.1 Nan Ya PCB Flip-Chip Package Substrate Corporation Information
7.3.2 Nan Ya PCB Flip-Chip Package Substrate Product Portfolio
7.3.3 Nan Ya PCB Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Nan Ya PCB Main Business and Markets Served
7.3.5 Nan Ya PCB Recent Developments/Updates
7.4 Shiko Electric Industries
7.4.1 Shiko Electric Industries Flip-Chip Package Substrate Corporation Information
7.4.2 Shiko Electric Industries Flip-Chip Package Substrate Product Portfolio
7.4.3 Shiko Electric Industries Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Shiko Electric Industries Main Business and Markets Served
7.4.5 Shiko Electric Industries Recent Developments/Updates
7.5 AT&S
7.5.1 AT&S Flip-Chip Package Substrate Corporation Information
7.5.2 AT&S Flip-Chip Package Substrate Product Portfolio
7.5.3 AT&S Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.5.4 AT&S Main Business and Markets Served
7.5.5 AT&S Recent Developments/Updates
7.6 Kinsus Interconnect Technology
7.6.1 Kinsus Interconnect Technology Flip-Chip Package Substrate Corporation Information
7.6.2 Kinsus Interconnect Technology Flip-Chip Package Substrate Product Portfolio
7.6.3 Kinsus Interconnect Technology Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Kinsus Interconnect Technology Main Business and Markets Served
7.6.5 Kinsus Interconnect Technology Recent Developments/Updates
7.7 Semco
7.7.1 Semco Flip-Chip Package Substrate Corporation Information
7.7.2 Semco Flip-Chip Package Substrate Product Portfolio
7.7.3 Semco Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Semco Main Business and Markets Served
7.7.5 Semco Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera Flip-Chip Package Substrate Corporation Information
7.8.2 Kyocera Flip-Chip Package Substrate Product Portfolio
7.8.3 Kyocera Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Kyocera Main Business and Markets Served
7.7.5 Kyocera Recent Developments/Updates
7.9 TOPPAN
7.9.1 TOPPAN Flip-Chip Package Substrate Corporation Information
7.9.2 TOPPAN Flip-Chip Package Substrate Product Portfolio
7.9.3 TOPPAN Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.9.4 TOPPAN Main Business and Markets Served
7.9.5 TOPPAN Recent Developments/Updates
7.10 Zhen Ding Technology
7.10.1 Zhen Ding Technology Flip-Chip Package Substrate Corporation Information
7.10.2 Zhen Ding Technology Flip-Chip Package Substrate Product Portfolio
7.10.3 Zhen Ding Technology Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Zhen Ding Technology Main Business and Markets Served
7.10.5 Zhen Ding Technology Recent Developments/Updates
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics Flip-Chip Package Substrate Corporation Information
7.11.2 Daeduck Electronics Flip-Chip Package Substrate Product Portfolio
7.11.3 Daeduck Electronics Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Daeduck Electronics Main Business and Markets Served
7.11.5 Daeduck Electronics Recent Developments/Updates
7.12 ASE Material
7.12.1 ASE Material Flip-Chip Package Substrate Corporation Information
7.12.2 ASE Material Flip-Chip Package Substrate Product Portfolio
7.12.3 ASE Material Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.12.4 ASE Material Main Business and Markets Served
7.12.5 ASE Material Recent Developments/Updates
7.13 ACCESS
7.13.1 ACCESS Flip-Chip Package Substrate Corporation Information
7.13.2 ACCESS Flip-Chip Package Substrate Product Portfolio
7.13.3 ACCESS Flip-Chip Package Substrate Production, Value, Price and Gross Margin (2019-2024)
7.13.4 ACCESS Main Business and Markets Served
7.13.5 ACCESS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Flip-Chip Package Substrate Industry Chain Analysis
8.2 Flip-Chip Package Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Flip-Chip Package Substrate Production Mode & Process
8.4 Flip-Chip Package Substrate Sales and Marketing
8.4.1 Flip-Chip Package Substrate Sales Channels
8.4.2 Flip-Chip Package Substrate Distributors
8.5 Flip-Chip Package Substrate Customers
9 Flip-Chip Package Substrate Market Dynamics
9.1 Flip-Chip Package Substrate Industry Trends
9.2 Flip-Chip Package Substrate Market Drivers
9.3 Flip-Chip Package Substrate Market Challenges
9.4 Flip-Chip Package Substrate Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
List of Tables
Table 1. Global Flip-Chip Package Substrate Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Flip-Chip Package Substrate Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Flip-Chip Package Substrate Production Capacity (Sqm) by Manufacturers in 2023
Table 4. Global Flip-Chip Package Substrate Production by Manufacturers (2019-2024) & (Sqm)
Table 5. Global Flip-Chip Package Substrate Production Market Share by Manufacturers (2019-2024)
Table 6. Global Flip-Chip Package Substrate Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Flip-Chip Package Substrate Production Value Share by Manufacturers (2019-2024)
Table 8. Global Flip-Chip Package Substrate Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Flip-Chip Package Substrate as of 2023)
Table 10. Global Market Flip-Chip Package Substrate Average Price by Manufacturers (US$/Sqm) & (2019-2024)
Table 11. Manufacturers Flip-Chip Package Substrate Production Sites and Area Served
Table 12. Manufacturers Flip-Chip Package Substrate Product Types
Table 13. Global Flip-Chip Package Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Flip-Chip Package Substrate Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Flip-Chip Package Substrate Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Flip-Chip Package Substrate Production Value Market Share by Region (2019-2024)
Table 18. Global Flip-Chip Package Substrate Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Flip-Chip Package Substrate Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Flip-Chip Package Substrate Production Comparison by Region: 2019 VS 2023 VS 2030 (Sqm)
Table 21. Global Flip-Chip Package Substrate Production (Sqm) by Region (2019-2024)
Table 22. Global Flip-Chip Package Substrate Production Market Share by Region (2019-2024)
Table 23. Global Flip-Chip Package Substrate Production (Sqm) Forecast by Region (2025-2030)
Table 24. Global Flip-Chip Package Substrate Production Market Share Forecast by Region (2025-2030)
Table 25. Global Flip-Chip Package Substrate Market Average Price (US$/Sqm) by Region (2019-2024)
Table 26. Global Flip-Chip Package Substrate Market Average Price (US$/Sqm) by Region (2025-2030)
Table 27. Global Flip-Chip Package Substrate Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Sqm)
Table 28. Global Flip-Chip Package Substrate Consumption by Region (2019-2024) & (Sqm)
Table 29. Global Flip-Chip Package Substrate Consumption Market Share by Region (2019-2024)
Table 30. Global Flip-Chip Package Substrate Forecasted Consumption by Region (2025-2030) & (Sqm)
Table 31. Global Flip-Chip Package Substrate Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Flip-Chip Package Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Sqm)
Table 33. North America Flip-Chip Package Substrate Consumption by Country (2019-2024) & (Sqm)
Table 34. North America Flip-Chip Package Substrate Consumption by Country (2025-2030) & (Sqm)
Table 35. Europe Flip-Chip Package Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Sqm)
Table 36. Europe Flip-Chip Package Substrate Consumption by Country (2019-2024) & (Sqm)
Table 37. Europe Flip-Chip Package Substrate Consumption by Country (2025-2030) & (Sqm)
Table 38. Asia Pacific Flip-Chip Package Substrate Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Sqm)
Table 39. Asia Pacific Flip-Chip Package Substrate Consumption by Region (2019-2024) & (Sqm)
Table 40. Asia Pacific Flip-Chip Package Substrate Consumption by Region (2025-2030) & (Sqm)
Table 41. Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Sqm)
Table 42. Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption by Country (2019-2024) & (Sqm)
Table 43. Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption by Country (2025-2030) & (Sqm)
Table 44. Global Flip-Chip Package Substrate Production (Sqm) by Type (2019-2024)
Table 45. Global Flip-Chip Package Substrate Production (Sqm) by Type (2025-2030)
Table 46. Global Flip-Chip Package Substrate Production Market Share by Type (2019-2024)
Table 47. Global Flip-Chip Package Substrate Production Market Share by Type (2025-2030)
Table 48. Global Flip-Chip Package Substrate Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Flip-Chip Package Substrate Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Flip-Chip Package Substrate Production Value Share by Type (2019-2024)
Table 51. Global Flip-Chip Package Substrate Production Value Share by Type (2025-2030)
Table 52. Global Flip-Chip Package Substrate Price (US$/Sqm) by Type (2019-2024)
Table 53. Global Flip-Chip Package Substrate Price (US$/Sqm) by Type (2025-2030)
Table 54. Global Flip-Chip Package Substrate Production (Sqm) by Application (2019-2024)
Table 55. Global Flip-Chip Package Substrate Production (Sqm) by Application (2025-2030)
Table 56. Global Flip-Chip Package Substrate Production Market Share by Application (2019-2024)
Table 57. Global Flip-Chip Package Substrate Production Market Share by Application (2025-2030)
Table 58. Global Flip-Chip Package Substrate Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Flip-Chip Package Substrate Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Flip-Chip Package Substrate Production Value Share by Application (2019-2024)
Table 61. Global Flip-Chip Package Substrate Production Value Share by Application (2025-2030)
Table 62. Global Flip-Chip Package Substrate Price (US$/Sqm) by Application (2019-2024)
Table 63. Global Flip-Chip Package Substrate Price (US$/Sqm) by Application (2025-2030)
Table 64. Unimicron Flip-Chip Package Substrate Corporation Information
Table 65. Unimicron Specification and Application
Table 66. Unimicron Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 67. Unimicron Main Business and Markets Served
Table 68. Unimicron Recent Developments/Updates
Table 69. Ibiden Flip-Chip Package Substrate Corporation Information
Table 70. Ibiden Specification and Application
Table 71. Ibiden Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 72. Ibiden Main Business and Markets Served
Table 73. Ibiden Recent Developments/Updates
Table 74. Nan Ya PCB Flip-Chip Package Substrate Corporation Information
Table 75. Nan Ya PCB Specification and Application
Table 76. Nan Ya PCB Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 77. Nan Ya PCB Main Business and Markets Served
Table 78. Nan Ya PCB Recent Developments/Updates
Table 79. Shiko Electric Industries Flip-Chip Package Substrate Corporation Information
Table 80. Shiko Electric Industries Specification and Application
Table 81. Shiko Electric Industries Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 82. Shiko Electric Industries Main Business and Markets Served
Table 83. Shiko Electric Industries Recent Developments/Updates
Table 84. AT&S Flip-Chip Package Substrate Corporation Information
Table 85. AT&S Specification and Application
Table 86. AT&S Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 87. AT&S Main Business and Markets Served
Table 88. AT&S Recent Developments/Updates
Table 89. Kinsus Interconnect Technology Flip-Chip Package Substrate Corporation Information
Table 90. Kinsus Interconnect Technology Specification and Application
Table 91. Kinsus Interconnect Technology Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 92. Kinsus Interconnect Technology Main Business and Markets Served
Table 93. Kinsus Interconnect Technology Recent Developments/Updates
Table 94. Semco Flip-Chip Package Substrate Corporation Information
Table 95. Semco Specification and Application
Table 96. Semco Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 97. Semco Main Business and Markets Served
Table 98. Semco Recent Developments/Updates
Table 99. Kyocera Flip-Chip Package Substrate Corporation Information
Table 100. Kyocera Specification and Application
Table 101. Kyocera Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 102. Kyocera Main Business and Markets Served
Table 103. Kyocera Recent Developments/Updates
Table 104. TOPPAN Flip-Chip Package Substrate Corporation Information
Table 105. TOPPAN Specification and Application
Table 106. TOPPAN Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 107. TOPPAN Main Business and Markets Served
Table 108. TOPPAN Recent Developments/Updates
Table 109. Zhen Ding Technology Flip-Chip Package Substrate Corporation Information
Table 110. Zhen Ding Technology Specification and Application
Table 111. Zhen Ding Technology Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 112. Zhen Ding Technology Main Business and Markets Served
Table 113. Zhen Ding Technology Recent Developments/Updates
Table 114. Daeduck Electronics Flip-Chip Package Substrate Corporation Information
Table 115. Daeduck Electronics Specification and Application
Table 116. Daeduck Electronics Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 117. Daeduck Electronics Main Business and Markets Served
Table 118. Daeduck Electronics Recent Developments/Updates
Table 119. ASE Material Flip-Chip Package Substrate Corporation Information
Table 120. ASE Material Specification and Application
Table 121. ASE Material Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 122. ASE Material Main Business and Markets Served
Table 123. ASE Material Recent Developments/Updates
Table 124. ACCESS Flip-Chip Package Substrate Corporation Information
Table 125. ACCESS Specification and Application
Table 126. ACCESS Flip-Chip Package Substrate Production (Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)
Table 127. ACCESS Main Business and Markets Served
Table 128. ACCESS Recent Developments/Updates
Table 129. Key Raw Materials Lists
Table 130. Raw Materials Key Suppliers Lists
Table 131. Flip-Chip Package Substrate Distributors List
Table 132. Flip-Chip Package Substrate Customers List
Table 133. Flip-Chip Package Substrate Market Trends
Table 134. Flip-Chip Package Substrate Market Drivers
Table 135. Flip-Chip Package Substrate Market Challenges
Table 136. Flip-Chip Package Substrate Market Restraints
Table 137. Research Programs/Design for This Report
Table 138. Key Data Information from Secondary Sources
Table 139. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Flip-Chip Package Substrate
Figure 2. Global Flip-Chip Package Substrate Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Flip-Chip Package Substrate Market Share by Type: 2023 VS 2030
Figure 4. FCBGA Product Picture
Figure 5. FCCSP Product Picture
Figure 6. Global Flip-Chip Package Substrate Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 7. Global Flip-Chip Package Substrate Market Share by Application: 2023 VS 2030
Figure 8. High-end servers
Figure 9. GPU
Figure 10. CPU and MPU
Figure 11. ASIC
Figure 12. FPGA
Figure 13. Global Flip-Chip Package Substrate Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 14. Global Flip-Chip Package Substrate Production Value (US$ Million) & (2019-2030)
Figure 15. Global Flip-Chip Package Substrate Production (Sqm) & (2019-2030)
Figure 16. Global Flip-Chip Package Substrate Average Price (US$/Sqm) & (2019-2030)
Figure 17. Flip-Chip Package Substrate Report Years Considered
Figure 18. Flip-Chip Package Substrate Production Share by Manufacturers in 2023
Figure 19. Flip-Chip Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 20. The Global 5 and 10 Largest Players: Market Share by Flip-Chip Package Substrate Revenue in 2023
Figure 21. Global Flip-Chip Package Substrate Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 22. Global Flip-Chip Package Substrate Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. Global Flip-Chip Package Substrate Production Comparison by Region: 2019 VS 2023 VS 2030 (Sqm)
Figure 24. Global Flip-Chip Package Substrate Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. North America Flip-Chip Package Substrate Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Europe Flip-Chip Package Substrate Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. China Flip-Chip Package Substrate Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Japan Flip-Chip Package Substrate Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. South Korea Flip-Chip Package Substrate Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Global Flip-Chip Package Substrate Consumption by Region: 2019 VS 2023 VS 2030 (Sqm)
Figure 31. Global Flip-Chip Package Substrate Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 32. North America Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 33. North America Flip-Chip Package Substrate Consumption Market Share by Country (2019-2030)
Figure 34. Canada Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 35. U.S. Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 36. Europe Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 37. Europe Flip-Chip Package Substrate Consumption Market Share by Country (2019-2030)
Figure 38. Germany Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 39. France Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 40. U.K. Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 41. Italy Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 42. Russia Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 43. Asia Pacific Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 44. Asia Pacific Flip-Chip Package Substrate Consumption Market Share by Regions (2019-2030)
Figure 45. China Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 46. Japan Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 47. South Korea Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 48. China Taiwan Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 49. Southeast Asia Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 50. India Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 51. Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 52. Latin America, Middle East & Africa Flip-Chip Package Substrate Consumption Market Share by Country (2019-2030)
Figure 53. Mexico Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 54. Brazil Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 55. Turkey Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 56. GCC Countries Flip-Chip Package Substrate Consumption and Growth Rate (2019-2024) & (Sqm)
Figure 57. Global Production Market Share of Flip-Chip Package Substrate by Type (2019-2030)
Figure 58. Global Production Value Market Share of Flip-Chip Package Substrate by Type (2019-2030)
Figure 59. Global Flip-Chip Package Substrate Price (US$/Sqm) by Type (2019-2030)
Figure 60. Global Production Market Share of Flip-Chip Package Substrate by Application (2019-2030)
Figure 61. Global Production Value Market Share of Flip-Chip Package Substrate by Application (2019-2030)
Figure 62. Global Flip-Chip Package Substrate Price (US$/Sqm) by Application (2019-2030)
Figure 63. Flip-Chip Package Substrate Value Chain
Figure 64. Flip-Chip Package Substrate Production Process
Figure 65. Channels of Distribution (Direct Vs Distribution)
Figure 66. Distributors Profiles
Figure 67. Bottom-up and Top-down Approaches for This Report
Figure 68. Data Triangulation

Published By : QY Research

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