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Global Lead-free BGA Solder Ball Market Research Report 2025
Synopsis
BGA solder ball is a soldering material used for BGA packaging. The lead content in the lead-free BGA solder ball composition should be less than 0.1%.
Global Lead-free BGA Solder Ball market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Lead-free BGA Solder Ball market research.
Key manufacturers engaged in the Lead-free BGA Solder Ball industry include Senju Metal, DS HiMetal, MK Electron, NMC, Accurus, SMIC, Profound Material Technology, 昇貿科技 and Yunnan Tin Group, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Lead-free BGA Solder Ball production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Lead-free BGA Solder Ball were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Lead-free BGA Solder Ball market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Lead-free BGA Solder Ball market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Senju Metal
DS HiMetal
MK Electron
NMC
Accurus
SMIC
Profound Material Technology
昇貿科技
Yunnan Tin Group
Indium Corporation
King Shing
MBO-DOUBLINK SOLDERS
Hiking Group
Phichem Corporation
Ishikawa Metal
Fukuda Metal Foil & Powder
MATSUDA SANGYO
Segment by Type
Low Temperature Solder Ball (95°C-135°C)
Medium Temperature Solder Ball (138°C-186°C)
High Temperature Solder Ball (186°C-309°C)
Segment by Application
PBGA
FCBGA
CBGA
TBGA
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Lead-free BGA Solder Ball report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
BGA solder ball is a soldering material used for BGA packaging. The lead content in the lead-free BGA solder ball composition should be less than 0.1%.
Global Lead-free BGA Solder Ball market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Lead-free BGA Solder Ball market research.
Key manufacturers engaged in the Lead-free BGA Solder Ball industry include Senju Metal, DS HiMetal, MK Electron, NMC, Accurus, SMIC, Profound Material Technology, 昇貿科技 and Yunnan Tin Group, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Lead-free BGA Solder Ball production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Lead-free BGA Solder Ball were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Lead-free BGA Solder Ball market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Lead-free BGA Solder Ball market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Senju Metal
DS HiMetal
MK Electron
NMC
Accurus
SMIC
Profound Material Technology
昇貿科技
Yunnan Tin Group
Indium Corporation
King Shing
MBO-DOUBLINK SOLDERS
Hiking Group
Phichem Corporation
Ishikawa Metal
Fukuda Metal Foil & Powder
MATSUDA SANGYO
Segment by Type
Low Temperature Solder Ball (95°C-135°C)
Medium Temperature Solder Ball (138°C-186°C)
High Temperature Solder Ball (186°C-309°C)
Segment by Application
PBGA
FCBGA
CBGA
TBGA
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Lead-free BGA Solder Ball report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Lead-free BGA Solder Ball Market Overview
1.1 Product Definition
1.2 Lead-free BGA Solder Ball Segment by Type
1.2.1 Global Lead-free BGA Solder Ball Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Low Temperature Solder Ball (95°C-135°C)
1.2.3 Medium Temperature Solder Ball (138°C-186°C)
1.2.4 High Temperature Solder Ball (186°C-309°C)
1.3 Lead-free BGA Solder Ball Segment by Application
1.3.1 Global Lead-free BGA Solder Ball Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 PBGA
1.3.3 FCBGA
1.3.4 CBGA
1.3.5 TBGA
1.4 Global Market Growth Prospects
1.4.1 Global Lead-free BGA Solder Ball Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Lead-free BGA Solder Ball Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Lead-free BGA Solder Ball Production Estimates and Forecasts (2018-2029)
1.4.4 Global Lead-free BGA Solder Ball Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Lead-free BGA Solder Ball Production Market Share by Manufacturers (2018-2023)
2.2 Global Lead-free BGA Solder Ball Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Lead-free BGA Solder Ball, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Lead-free BGA Solder Ball Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Lead-free BGA Solder Ball Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Lead-free BGA Solder Ball, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Lead-free BGA Solder Ball, Product Offered and Application
2.8 Global Key Manufacturers of Lead-free BGA Solder Ball, Date of Enter into This Industry
2.9 Lead-free BGA Solder Ball Market Competitive Situation and Trends
2.9.1 Lead-free BGA Solder Ball Market Concentration Rate
2.9.2 Global 5 and 10 Largest Lead-free BGA Solder Ball Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Lead-free BGA Solder Ball Production by Region
3.1 Global Lead-free BGA Solder Ball Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Lead-free BGA Solder Ball Production Value by Region (2018-2029)
3.2.1 Global Lead-free BGA Solder Ball Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Lead-free BGA Solder Ball by Region (2024-2029)
3.3 Global Lead-free BGA Solder Ball Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Lead-free BGA Solder Ball Production by Region (2018-2029)
3.4.1 Global Lead-free BGA Solder Ball Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Lead-free BGA Solder Ball by Region (2024-2029)
3.5 Global Lead-free BGA Solder Ball Market Price Analysis by Region (2018-2023)
3.6 Global Lead-free BGA Solder Ball Production and Value, Year-over-Year Growth
3.6.1 North America Lead-free BGA Solder Ball Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Lead-free BGA Solder Ball Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Lead-free BGA Solder Ball Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Lead-free BGA Solder Ball Production Value Estimates and Forecasts (2018-2029)
4 Lead-free BGA Solder Ball Consumption by Region
4.1 Global Lead-free BGA Solder Ball Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Lead-free BGA Solder Ball Consumption by Region (2018-2029)
4.2.1 Global Lead-free BGA Solder Ball Consumption by Region (2018-2023)
4.2.2 Global Lead-free BGA Solder Ball Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Lead-free BGA Solder Ball Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Lead-free BGA Solder Ball Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Lead-free BGA Solder Ball Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Lead-free BGA Solder Ball Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Lead-free BGA Solder Ball Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Lead-free BGA Solder Ball Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Lead-free BGA Solder Ball Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Lead-free BGA Solder Ball Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Lead-free BGA Solder Ball Production by Type (2018-2029)
5.1.1 Global Lead-free BGA Solder Ball Production by Type (2018-2023)
5.1.2 Global Lead-free BGA Solder Ball Production by Type (2024-2029)
5.1.3 Global Lead-free BGA Solder Ball Production Market Share by Type (2018-2029)
5.2 Global Lead-free BGA Solder Ball Production Value by Type (2018-2029)
5.2.1 Global Lead-free BGA Solder Ball Production Value by Type (2018-2023)
5.2.2 Global Lead-free BGA Solder Ball Production Value by Type (2024-2029)
5.2.3 Global Lead-free BGA Solder Ball Production Value Market Share by Type (2018-2029)
5.3 Global Lead-free BGA Solder Ball Price by Type (2018-2029)
6 Segment by Application
6.1 Global Lead-free BGA Solder Ball Production by Application (2018-2029)
6.1.1 Global Lead-free BGA Solder Ball Production by Application (2018-2023)
6.1.2 Global Lead-free BGA Solder Ball Production by Application (2024-2029)
6.1.3 Global Lead-free BGA Solder Ball Production Market Share by Application (2018-2029)
6.2 Global Lead-free BGA Solder Ball Production Value by Application (2018-2029)
6.2.1 Global Lead-free BGA Solder Ball Production Value by Application (2018-2023)
6.2.2 Global Lead-free BGA Solder Ball Production Value by Application (2024-2029)
6.2.3 Global Lead-free BGA Solder Ball Production Value Market Share by Application (2018-2029)
6.3 Global Lead-free BGA Solder Ball Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Senju Metal
7.1.1 Senju Metal Lead-free BGA Solder Ball Corporation Information
7.1.2 Senju Metal Lead-free BGA Solder Ball Product Portfolio
7.1.3 Senju Metal Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Senju Metal Main Business and Markets Served
7.1.5 Senju Metal Recent Developments/Updates
7.2 DS HiMetal
7.2.1 DS HiMetal Lead-free BGA Solder Ball Corporation Information
7.2.2 DS HiMetal Lead-free BGA Solder Ball Product Portfolio
7.2.3 DS HiMetal Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.2.4 DS HiMetal Main Business and Markets Served
7.2.5 DS HiMetal Recent Developments/Updates
7.3 MK Electron
7.3.1 MK Electron Lead-free BGA Solder Ball Corporation Information
7.3.2 MK Electron Lead-free BGA Solder Ball Product Portfolio
7.3.3 MK Electron Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.3.4 MK Electron Main Business and Markets Served
7.3.5 MK Electron Recent Developments/Updates
7.4 NMC
7.4.1 NMC Lead-free BGA Solder Ball Corporation Information
7.4.2 NMC Lead-free BGA Solder Ball Product Portfolio
7.4.3 NMC Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.4.4 NMC Main Business and Markets Served
7.4.5 NMC Recent Developments/Updates
7.5 Accurus
7.5.1 Accurus Lead-free BGA Solder Ball Corporation Information
7.5.2 Accurus Lead-free BGA Solder Ball Product Portfolio
7.5.3 Accurus Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Accurus Main Business and Markets Served
7.5.5 Accurus Recent Developments/Updates
7.6 SMIC
7.6.1 SMIC Lead-free BGA Solder Ball Corporation Information
7.6.2 SMIC Lead-free BGA Solder Ball Product Portfolio
7.6.3 SMIC Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.6.4 SMIC Main Business and Markets Served
7.6.5 SMIC Recent Developments/Updates
7.7 Profound Material Technology
7.7.1 Profound Material Technology Lead-free BGA Solder Ball Corporation Information
7.7.2 Profound Material Technology Lead-free BGA Solder Ball Product Portfolio
7.7.3 Profound Material Technology Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Profound Material Technology Main Business and Markets Served
7.7.5 Profound Material Technology Recent Developments/Updates
7.8 昇貿科技
7.8.1 昇貿科技 Lead-free BGA Solder Ball Corporation Information
7.8.2 昇貿科技 Lead-free BGA Solder Ball Product Portfolio
7.8.3 昇貿科技 Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.8.4 昇貿科技 Main Business and Markets Served
7.7.5 昇貿科技 Recent Developments/Updates
7.9 Yunnan Tin Group
7.9.1 Yunnan Tin Group Lead-free BGA Solder Ball Corporation Information
7.9.2 Yunnan Tin Group Lead-free BGA Solder Ball Product Portfolio
7.9.3 Yunnan Tin Group Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Yunnan Tin Group Main Business and Markets Served
7.9.5 Yunnan Tin Group Recent Developments/Updates
7.10 Indium Corporation
7.10.1 Indium Corporation Lead-free BGA Solder Ball Corporation Information
7.10.2 Indium Corporation Lead-free BGA Solder Ball Product Portfolio
7.10.3 Indium Corporation Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Indium Corporation Main Business and Markets Served
7.10.5 Indium Corporation Recent Developments/Updates
7.11 King Shing
7.11.1 King Shing Lead-free BGA Solder Ball Corporation Information
7.11.2 King Shing Lead-free BGA Solder Ball Product Portfolio
7.11.3 King Shing Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.11.4 King Shing Main Business and Markets Served
7.11.5 King Shing Recent Developments/Updates
7.12 MBO-DOUBLINK SOLDERS
7.12.1 MBO-DOUBLINK SOLDERS Lead-free BGA Solder Ball Corporation Information
7.12.2 MBO-DOUBLINK SOLDERS Lead-free BGA Solder Ball Product Portfolio
7.12.3 MBO-DOUBLINK SOLDERS Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.12.4 MBO-DOUBLINK SOLDERS Main Business and Markets Served
7.12.5 MBO-DOUBLINK SOLDERS Recent Developments/Updates
7.13 Hiking Group
7.13.1 Hiking Group Lead-free BGA Solder Ball Corporation Information
7.13.2 Hiking Group Lead-free BGA Solder Ball Product Portfolio
7.13.3 Hiking Group Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Hiking Group Main Business and Markets Served
7.13.5 Hiking Group Recent Developments/Updates
7.14 Phichem Corporation
7.14.1 Phichem Corporation Lead-free BGA Solder Ball Corporation Information
7.14.2 Phichem Corporation Lead-free BGA Solder Ball Product Portfolio
7.14.3 Phichem Corporation Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Phichem Corporation Main Business and Markets Served
7.14.5 Phichem Corporation Recent Developments/Updates
7.15 Ishikawa Metal
7.15.1 Ishikawa Metal Lead-free BGA Solder Ball Corporation Information
7.15.2 Ishikawa Metal Lead-free BGA Solder Ball Product Portfolio
7.15.3 Ishikawa Metal Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Ishikawa Metal Main Business and Markets Served
7.15.5 Ishikawa Metal Recent Developments/Updates
7.16 Fukuda Metal Foil & Powder
7.16.1 Fukuda Metal Foil & Powder Lead-free BGA Solder Ball Corporation Information
7.16.2 Fukuda Metal Foil & Powder Lead-free BGA Solder Ball Product Portfolio
7.16.3 Fukuda Metal Foil & Powder Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Fukuda Metal Foil & Powder Main Business and Markets Served
7.16.5 Fukuda Metal Foil & Powder Recent Developments/Updates
7.17 MATSUDA SANGYO
7.17.1 MATSUDA SANGYO Lead-free BGA Solder Ball Corporation Information
7.17.2 MATSUDA SANGYO Lead-free BGA Solder Ball Product Portfolio
7.17.3 MATSUDA SANGYO Lead-free BGA Solder Ball Production, Value, Price and Gross Margin (2018-2023)
7.17.4 MATSUDA SANGYO Main Business and Markets Served
7.17.5 MATSUDA SANGYO Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Lead-free BGA Solder Ball Industry Chain Analysis
8.2 Lead-free BGA Solder Ball Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Lead-free BGA Solder Ball Production Mode & Process
8.4 Lead-free BGA Solder Ball Sales and Marketing
8.4.1 Lead-free BGA Solder Ball Sales Channels
8.4.2 Lead-free BGA Solder Ball Distributors
8.5 Lead-free BGA Solder Ball Customers
9 Lead-free BGA Solder Ball Market Dynamics
9.1 Lead-free BGA Solder Ball Industry Trends
9.2 Lead-free BGA Solder Ball Market Drivers
9.3 Lead-free BGA Solder Ball Market Challenges
9.4 Lead-free BGA Solder Ball Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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