The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Global Molded Interconnect Devices (MID) Market Research Report 2025
Synopsis
The molded interconnect devices market is likely to exhibit growth over the forecast period owing to frequent technological advancements in telecommunication and consumer product applications. Rising proliferation of smartphones and surge in adoption of smart wearable devices are expected to offer stimulus to the industry growth. MID combines with various other internal parts such as connectors, circuit boards, and cables, among others, improving the circuit density and eliminating various combinations of components as in the case of PCB circuits.
The global Molded Interconnect Devices (MID) market was valued at US$ 642 million in 2023 and is anticipated to reach US$ 943.1 million by 2030, witnessing a CAGR of 6.4% during the forecast period 2024-2030.
North American market for Molded Interconnect Devices (MID) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Molded Interconnect Devices (MID) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Molded Interconnect Devices (MID) include MacDermid Enthone, Molex, LPKF Laser & Electronics, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies and RTP company, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Devices (MID), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Devices (MID).
Report Scope
The Molded Interconnect Devices (MID) market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Molded Interconnect Devices (MID) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Molded Interconnect Devices (MID) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
MacDermid Enthone
Molex
LPKF Laser & Electronics
TE Connectivity
Harting Mitronics AG
SelectConnect Technologies
RTP company
Segment by Type
Laser Direct Structuring (LDS)
Two-Shot Molding
Others
Segment by Application
Automotive
Consumer Products
Healthcare
Industrial
Military & Aerospace
Telecommunication & Computing
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Mexico
Europe
Germany
France
UK
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Molded Interconnect Devices (MID) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Molded Interconnect Devices (MID) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Molded Interconnect Devices (MID) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The molded interconnect devices market is likely to exhibit growth over the forecast period owing to frequent technological advancements in telecommunication and consumer product applications. Rising proliferation of smartphones and surge in adoption of smart wearable devices are expected to offer stimulus to the industry growth. MID combines with various other internal parts such as connectors, circuit boards, and cables, among others, improving the circuit density and eliminating various combinations of components as in the case of PCB circuits.
The global Molded Interconnect Devices (MID) market was valued at US$ 642 million in 2023 and is anticipated to reach US$ 943.1 million by 2030, witnessing a CAGR of 6.4% during the forecast period 2024-2030.
North American market for Molded Interconnect Devices (MID) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Molded Interconnect Devices (MID) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Molded Interconnect Devices (MID) include MacDermid Enthone, Molex, LPKF Laser & Electronics, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies and RTP company, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Devices (MID), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Devices (MID).
Report Scope
The Molded Interconnect Devices (MID) market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Molded Interconnect Devices (MID) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Molded Interconnect Devices (MID) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
MacDermid Enthone
Molex
LPKF Laser & Electronics
TE Connectivity
Harting Mitronics AG
SelectConnect Technologies
RTP company
Segment by Type
Laser Direct Structuring (LDS)
Two-Shot Molding
Others
Segment by Application
Automotive
Consumer Products
Healthcare
Industrial
Military & Aerospace
Telecommunication & Computing
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Mexico
Europe
Germany
France
UK
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Molded Interconnect Devices (MID) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Molded Interconnect Devices (MID) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Molded Interconnect Devices (MID) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Molded Interconnect Devices (MID) Market Overview
1.1 Product Definition
1.2 Molded Interconnect Devices (MID) Segment by Type
1.2.1 Global Molded Interconnect Devices (MID) Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Laser Direct Structuring (LDS)
1.2.3 Two-Shot Molding
1.2.4 Others
1.3 Molded Interconnect Devices (MID) Segment by Application
1.3.1 Global Molded Interconnect Devices (MID) Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Automotive
1.3.3 Consumer Products
1.3.4 Healthcare
1.3.5 Industrial
1.3.6 Military & Aerospace
1.3.7 Telecommunication & Computing
1.4 Global Market Growth Prospects
1.4.1 Global Molded Interconnect Devices (MID) Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Molded Interconnect Devices (MID) Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Molded Interconnect Devices (MID) Production Estimates and Forecasts (2019-2030)
1.4.4 Global Molded Interconnect Devices (MID) Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Molded Interconnect Devices (MID) Production Market Share by Manufacturers (2019-2024)
2.2 Global Molded Interconnect Devices (MID) Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Molded Interconnect Devices (MID), Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Molded Interconnect Devices (MID) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Molded Interconnect Devices (MID) Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Molded Interconnect Devices (MID), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Molded Interconnect Devices (MID), Product Offered and Application
2.8 Global Key Manufacturers of Molded Interconnect Devices (MID), Date of Enter into This Industry
2.9 Molded Interconnect Devices (MID) Market Competitive Situation and Trends
2.9.1 Molded Interconnect Devices (MID) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Molded Interconnect Devices (MID) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Molded Interconnect Devices (MID) Production by Region
3.1 Global Molded Interconnect Devices (MID) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Molded Interconnect Devices (MID) Production Value by Region (2019-2030)
3.2.1 Global Molded Interconnect Devices (MID) Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Molded Interconnect Devices (MID) by Region (2025-2030)
3.3 Global Molded Interconnect Devices (MID) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Molded Interconnect Devices (MID) Production by Region (2019-2030)
3.4.1 Global Molded Interconnect Devices (MID) Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Molded Interconnect Devices (MID) by Region (2025-2030)
3.5 Global Molded Interconnect Devices (MID) Market Price Analysis by Region (2019-2024)
3.6 Global Molded Interconnect Devices (MID) Production and Value, Year-over-Year Growth
3.6.1 North America Molded Interconnect Devices (MID) Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Molded Interconnect Devices (MID) Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Molded Interconnect Devices (MID) Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Molded Interconnect Devices (MID) Production Value Estimates and Forecasts (2019-2030)
4 Molded Interconnect Devices (MID) Consumption by Region
4.1 Global Molded Interconnect Devices (MID) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Molded Interconnect Devices (MID) Consumption by Region (2019-2030)
4.2.1 Global Molded Interconnect Devices (MID) Consumption by Region (2019-2024)
4.2.2 Global Molded Interconnect Devices (MID) Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Molded Interconnect Devices (MID) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Molded Interconnect Devices (MID) Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Molded Interconnect Devices (MID) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Molded Interconnect Devices (MID) Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 UK
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Molded Interconnect Devices (MID) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Molded Interconnect Devices (MID) Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Molded Interconnect Devices (MID) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Molded Interconnect Devices (MID) Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Molded Interconnect Devices (MID) Production by Type (2019-2030)
5.1.1 Global Molded Interconnect Devices (MID) Production by Type (2019-2024)
5.1.2 Global Molded Interconnect Devices (MID) Production by Type (2025-2030)
5.1.3 Global Molded Interconnect Devices (MID) Production Market Share by Type (2019-2030)
5.2 Global Molded Interconnect Devices (MID) Production Value by Type (2019-2030)
5.2.1 Global Molded Interconnect Devices (MID) Production Value by Type (2019-2024)
5.2.2 Global Molded Interconnect Devices (MID) Production Value by Type (2025-2030)
5.2.3 Global Molded Interconnect Devices (MID) Production Value Market Share by Type (2019-2030)
5.3 Global Molded Interconnect Devices (MID) Price by Type (2019-2030)
6 Segment by Application
6.1 Global Molded Interconnect Devices (MID) Production by Application (2019-2030)
6.1.1 Global Molded Interconnect Devices (MID) Production by Application (2019-2024)
6.1.2 Global Molded Interconnect Devices (MID) Production by Application (2025-2030)
6.1.3 Global Molded Interconnect Devices (MID) Production Market Share by Application (2019-2030)
6.2 Global Molded Interconnect Devices (MID) Production Value by Application (2019-2030)
6.2.1 Global Molded Interconnect Devices (MID) Production Value by Application (2019-2024)
6.2.2 Global Molded Interconnect Devices (MID) Production Value by Application (2025-2030)
6.2.3 Global Molded Interconnect Devices (MID) Production Value Market Share by Application (2019-2030)
6.3 Global Molded Interconnect Devices (MID) Price by Application (2019-2030)
7 Key Companies Profiled
7.1 MacDermid Enthone
7.1.1 MacDermid Enthone Molded Interconnect Devices (MID) Corporation Information
7.1.2 MacDermid Enthone Molded Interconnect Devices (MID) Product Portfolio
7.1.3 MacDermid Enthone Molded Interconnect Devices (MID) Production, Value, Price and Gross Margin (2019-2024)
7.1.4 MacDermid Enthone Main Business and Markets Served
7.1.5 MacDermid Enthone Recent Developments/Updates
7.2 Molex
7.2.1 Molex Molded Interconnect Devices (MID) Corporation Information
7.2.2 Molex Molded Interconnect Devices (MID) Product Portfolio
7.2.3 Molex Molded Interconnect Devices (MID) Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Molex Main Business and Markets Served
7.2.5 Molex Recent Developments/Updates
7.3 LPKF Laser & Electronics
7.3.1 LPKF Laser & Electronics Molded Interconnect Devices (MID) Corporation Information
7.3.2 LPKF Laser & Electronics Molded Interconnect Devices (MID) Product Portfolio
7.3.3 LPKF Laser & Electronics Molded Interconnect Devices (MID) Production, Value, Price and Gross Margin (2019-2024)
7.3.4 LPKF Laser & Electronics Main Business and Markets Served
7.3.5 LPKF Laser & Electronics Recent Developments/Updates
7.4 TE Connectivity
7.4.1 TE Connectivity Molded Interconnect Devices (MID) Corporation Information
7.4.2 TE Connectivity Molded Interconnect Devices (MID) Product Portfolio
7.4.3 TE Connectivity Molded Interconnect Devices (MID) Production, Value, Price and Gross Margin (2019-2024)
7.4.4 TE Connectivity Main Business and Markets Served
7.4.5 TE Connectivity Recent Developments/Updates
7.5 Harting Mitronics AG
7.5.1 Harting Mitronics AG Molded Interconnect Devices (MID) Corporation Information
7.5.2 Harting Mitronics AG Molded Interconnect Devices (MID) Product Portfolio
7.5.3 Harting Mitronics AG Molded Interconnect Devices (MID) Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Harting Mitronics AG Main Business and Markets Served
7.5.5 Harting Mitronics AG Recent Developments/Updates
7.6 SelectConnect Technologies
7.6.1 SelectConnect Technologies Molded Interconnect Devices (MID) Corporation Information
7.6.2 SelectConnect Technologies Molded Interconnect Devices (MID) Product Portfolio
7.6.3 SelectConnect Technologies Molded Interconnect Devices (MID) Production, Value, Price and Gross Margin (2019-2024)
7.6.4 SelectConnect Technologies Main Business and Markets Served
7.6.5 SelectConnect Technologies Recent Developments/Updates
7.7 RTP company
7.7.1 RTP company Molded Interconnect Devices (MID) Corporation Information
7.7.2 RTP company Molded Interconnect Devices (MID) Product Portfolio
7.7.3 RTP company Molded Interconnect Devices (MID) Production, Value, Price and Gross Margin (2019-2024)
7.7.4 RTP company Main Business and Markets Served
7.7.5 RTP company Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Molded Interconnect Devices (MID) Industry Chain Analysis
8.2 Molded Interconnect Devices (MID) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Molded Interconnect Devices (MID) Production Mode & Process
8.4 Molded Interconnect Devices (MID) Sales and Marketing
8.4.1 Molded Interconnect Devices (MID) Sales Channels
8.4.2 Molded Interconnect Devices (MID) Distributors
8.5 Molded Interconnect Devices (MID) Customers
9 Molded Interconnect Devices (MID) Market Dynamics
9.1 Molded Interconnect Devices (MID) Industry Trends
9.2 Molded Interconnect Devices (MID) Market Drivers
9.3 Molded Interconnect Devices (MID) Market Challenges
9.4 Molded Interconnect Devices (MID) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest Industrial Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
