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Global Package Substrates in Mobile Devices Market Research Report 2025
Synopsis
Package substrate transmits electric signals between semiconductors and the main board, and it is mainly used for the core semiconductors of mobile devices and PCs.
The global Package Substrates in Mobile Devices market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Package Substrates in Mobile Devices is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Package Substrates in Mobile Devices is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Package Substrates in Mobile Devices include Ibiden, Shinko Electric Industries, Kyocera, Samsung Electro-Mechanics, Fujitsu, Hitachi, Eastern, LG Innotek and Simmtech, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Package Substrates in Mobile Devices, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package Substrates in Mobile Devices.
Report Scope
The Package Substrates in Mobile Devices market size, estimations, and forecasts are provided in terms of output/shipments (K sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Package Substrates in Mobile Devices market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Package Substrates in Mobile Devices manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ibiden
Shinko Electric Industries
Kyocera
Samsung Electro-Mechanics
Fujitsu
Hitachi
Eastern
LG Innotek
Simmtech
Daeduck
AT&S
Unimicron
Kinsus
Nan Ya PCB
ASE Group
TTM Technologies
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
Segment by Type
FCCSP
WBCSP
SiP
BOC
FCBGA
Segment by Application
Smartphones
Tablets
Notebook PCs
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Package Substrates in Mobile Devices manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Package Substrates in Mobile Devices by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Package Substrates in Mobile Devices in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Package substrate transmits electric signals between semiconductors and the main board, and it is mainly used for the core semiconductors of mobile devices and PCs.
The global Package Substrates in Mobile Devices market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Package Substrates in Mobile Devices is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Package Substrates in Mobile Devices is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Package Substrates in Mobile Devices include Ibiden, Shinko Electric Industries, Kyocera, Samsung Electro-Mechanics, Fujitsu, Hitachi, Eastern, LG Innotek and Simmtech, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Package Substrates in Mobile Devices, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package Substrates in Mobile Devices.
Report Scope
The Package Substrates in Mobile Devices market size, estimations, and forecasts are provided in terms of output/shipments (K sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Package Substrates in Mobile Devices market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Package Substrates in Mobile Devices manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ibiden
Shinko Electric Industries
Kyocera
Samsung Electro-Mechanics
Fujitsu
Hitachi
Eastern
LG Innotek
Simmtech
Daeduck
AT&S
Unimicron
Kinsus
Nan Ya PCB
ASE Group
TTM Technologies
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
Segment by Type
FCCSP
WBCSP
SiP
BOC
FCBGA
Segment by Application
Smartphones
Tablets
Notebook PCs
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Package Substrates in Mobile Devices manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Package Substrates in Mobile Devices by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Package Substrates in Mobile Devices in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Package Substrates in Mobile Devices Market Overview
1.1 Product Definition
1.2 Package Substrates in Mobile Devices Segment by Type
1.2.1 Global Package Substrates in Mobile Devices Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 FCCSP
1.2.3 WBCSP
1.2.4 SiP
1.2.5 BOC
1.2.6 FCBGA
1.3 Package Substrates in Mobile Devices Segment by Application
1.3.1 Global Package Substrates in Mobile Devices Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Smartphones
1.3.3 Tablets
1.3.4 Notebook PCs
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Package Substrates in Mobile Devices Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Package Substrates in Mobile Devices Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Package Substrates in Mobile Devices Production Estimates and Forecasts (2019-2030)
1.4.4 Global Package Substrates in Mobile Devices Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Package Substrates in Mobile Devices Production Market Share by Manufacturers (2019-2024)
2.2 Global Package Substrates in Mobile Devices Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Package Substrates in Mobile Devices, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Package Substrates in Mobile Devices Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Package Substrates in Mobile Devices Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Package Substrates in Mobile Devices, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Package Substrates in Mobile Devices, Product Offered and Application
2.8 Global Key Manufacturers of Package Substrates in Mobile Devices, Date of Enter into This Industry
2.9 Package Substrates in Mobile Devices Market Competitive Situation and Trends
2.9.1 Package Substrates in Mobile Devices Market Concentration Rate
2.9.2 Global 5 and 10 Largest Package Substrates in Mobile Devices Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Package Substrates in Mobile Devices Production by Region
3.1 Global Package Substrates in Mobile Devices Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Package Substrates in Mobile Devices Production Value by Region (2019-2030)
3.2.1 Global Package Substrates in Mobile Devices Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Package Substrates in Mobile Devices by Region (2025-2030)
3.3 Global Package Substrates in Mobile Devices Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Package Substrates in Mobile Devices Production by Region (2019-2030)
3.4.1 Global Package Substrates in Mobile Devices Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Package Substrates in Mobile Devices by Region (2025-2030)
3.5 Global Package Substrates in Mobile Devices Market Price Analysis by Region (2019-2024)
3.6 Global Package Substrates in Mobile Devices Production and Value, Year-over-Year Growth
3.6.1 North America Package Substrates in Mobile Devices Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Package Substrates in Mobile Devices Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Package Substrates in Mobile Devices Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Package Substrates in Mobile Devices Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Package Substrates in Mobile Devices Production Value Estimates and Forecasts (2019-2030)
4 Package Substrates in Mobile Devices Consumption by Region
4.1 Global Package Substrates in Mobile Devices Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Package Substrates in Mobile Devices Consumption by Region (2019-2030)
4.2.1 Global Package Substrates in Mobile Devices Consumption by Region (2019-2024)
4.2.2 Global Package Substrates in Mobile Devices Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Package Substrates in Mobile Devices Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Package Substrates in Mobile Devices Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Package Substrates in Mobile Devices Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Package Substrates in Mobile Devices Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Package Substrates in Mobile Devices Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Package Substrates in Mobile Devices Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Package Substrates in Mobile Devices Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Package Substrates in Mobile Devices Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Package Substrates in Mobile Devices Production by Type (2019-2030)
5.1.1 Global Package Substrates in Mobile Devices Production by Type (2019-2024)
5.1.2 Global Package Substrates in Mobile Devices Production by Type (2025-2030)
5.1.3 Global Package Substrates in Mobile Devices Production Market Share by Type (2019-2030)
5.2 Global Package Substrates in Mobile Devices Production Value by Type (2019-2030)
5.2.1 Global Package Substrates in Mobile Devices Production Value by Type (2019-2024)
5.2.2 Global Package Substrates in Mobile Devices Production Value by Type (2025-2030)
5.2.3 Global Package Substrates in Mobile Devices Production Value Market Share by Type (2019-2030)
5.3 Global Package Substrates in Mobile Devices Price by Type (2019-2030)
6 Segment by Application
6.1 Global Package Substrates in Mobile Devices Production by Application (2019-2030)
6.1.1 Global Package Substrates in Mobile Devices Production by Application (2019-2024)
6.1.2 Global Package Substrates in Mobile Devices Production by Application (2025-2030)
6.1.3 Global Package Substrates in Mobile Devices Production Market Share by Application (2019-2030)
6.2 Global Package Substrates in Mobile Devices Production Value by Application (2019-2030)
6.2.1 Global Package Substrates in Mobile Devices Production Value by Application (2019-2024)
6.2.2 Global Package Substrates in Mobile Devices Production Value by Application (2025-2030)
6.2.3 Global Package Substrates in Mobile Devices Production Value Market Share by Application (2019-2030)
6.3 Global Package Substrates in Mobile Devices Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Ibiden
7.1.1 Ibiden Package Substrates in Mobile Devices Corporation Information
7.1.2 Ibiden Package Substrates in Mobile Devices Product Portfolio
7.1.3 Ibiden Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Ibiden Main Business and Markets Served
7.1.5 Ibiden Recent Developments/Updates
7.2 Shinko Electric Industries
7.2.1 Shinko Electric Industries Package Substrates in Mobile Devices Corporation Information
7.2.2 Shinko Electric Industries Package Substrates in Mobile Devices Product Portfolio
7.2.3 Shinko Electric Industries Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Shinko Electric Industries Main Business and Markets Served
7.2.5 Shinko Electric Industries Recent Developments/Updates
7.3 Kyocera
7.3.1 Kyocera Package Substrates in Mobile Devices Corporation Information
7.3.2 Kyocera Package Substrates in Mobile Devices Product Portfolio
7.3.3 Kyocera Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Kyocera Main Business and Markets Served
7.3.5 Kyocera Recent Developments/Updates
7.4 Samsung Electro-Mechanics
7.4.1 Samsung Electro-Mechanics Package Substrates in Mobile Devices Corporation Information
7.4.2 Samsung Electro-Mechanics Package Substrates in Mobile Devices Product Portfolio
7.4.3 Samsung Electro-Mechanics Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Samsung Electro-Mechanics Main Business and Markets Served
7.4.5 Samsung Electro-Mechanics Recent Developments/Updates
7.5 Fujitsu
7.5.1 Fujitsu Package Substrates in Mobile Devices Corporation Information
7.5.2 Fujitsu Package Substrates in Mobile Devices Product Portfolio
7.5.3 Fujitsu Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Fujitsu Main Business and Markets Served
7.5.5 Fujitsu Recent Developments/Updates
7.6 Hitachi
7.6.1 Hitachi Package Substrates in Mobile Devices Corporation Information
7.6.2 Hitachi Package Substrates in Mobile Devices Product Portfolio
7.6.3 Hitachi Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Hitachi Main Business and Markets Served
7.6.5 Hitachi Recent Developments/Updates
7.7 Eastern
7.7.1 Eastern Package Substrates in Mobile Devices Corporation Information
7.7.2 Eastern Package Substrates in Mobile Devices Product Portfolio
7.7.3 Eastern Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Eastern Main Business and Markets Served
7.7.5 Eastern Recent Developments/Updates
7.8 LG Innotek
7.8.1 LG Innotek Package Substrates in Mobile Devices Corporation Information
7.8.2 LG Innotek Package Substrates in Mobile Devices Product Portfolio
7.8.3 LG Innotek Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.8.4 LG Innotek Main Business and Markets Served
7.7.5 LG Innotek Recent Developments/Updates
7.9 Simmtech
7.9.1 Simmtech Package Substrates in Mobile Devices Corporation Information
7.9.2 Simmtech Package Substrates in Mobile Devices Product Portfolio
7.9.3 Simmtech Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Simmtech Main Business and Markets Served
7.9.5 Simmtech Recent Developments/Updates
7.10 Daeduck
7.10.1 Daeduck Package Substrates in Mobile Devices Corporation Information
7.10.2 Daeduck Package Substrates in Mobile Devices Product Portfolio
7.10.3 Daeduck Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Daeduck Main Business and Markets Served
7.10.5 Daeduck Recent Developments/Updates
7.11 AT&S
7.11.1 AT&S Package Substrates in Mobile Devices Corporation Information
7.11.2 AT&S Package Substrates in Mobile Devices Product Portfolio
7.11.3 AT&S Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.11.4 AT&S Main Business and Markets Served
7.11.5 AT&S Recent Developments/Updates
7.12 Unimicron
7.12.1 Unimicron Package Substrates in Mobile Devices Corporation Information
7.12.2 Unimicron Package Substrates in Mobile Devices Product Portfolio
7.12.3 Unimicron Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Unimicron Main Business and Markets Served
7.12.5 Unimicron Recent Developments/Updates
7.13 Kinsus
7.13.1 Kinsus Package Substrates in Mobile Devices Corporation Information
7.13.2 Kinsus Package Substrates in Mobile Devices Product Portfolio
7.13.3 Kinsus Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Kinsus Main Business and Markets Served
7.13.5 Kinsus Recent Developments/Updates
7.14 Nan Ya PCB
7.14.1 Nan Ya PCB Package Substrates in Mobile Devices Corporation Information
7.14.2 Nan Ya PCB Package Substrates in Mobile Devices Product Portfolio
7.14.3 Nan Ya PCB Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Nan Ya PCB Main Business and Markets Served
7.14.5 Nan Ya PCB Recent Developments/Updates
7.15 ASE Group
7.15.1 ASE Group Package Substrates in Mobile Devices Corporation Information
7.15.2 ASE Group Package Substrates in Mobile Devices Product Portfolio
7.15.3 ASE Group Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.15.4 ASE Group Main Business and Markets Served
7.15.5 ASE Group Recent Developments/Updates
7.16 TTM Technologies
7.16.1 TTM Technologies Package Substrates in Mobile Devices Corporation Information
7.16.2 TTM Technologies Package Substrates in Mobile Devices Product Portfolio
7.16.3 TTM Technologies Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.16.4 TTM Technologies Main Business and Markets Served
7.16.5 TTM Technologies Recent Developments/Updates
7.17 Zhen Ding Technology
7.17.1 Zhen Ding Technology Package Substrates in Mobile Devices Corporation Information
7.17.2 Zhen Ding Technology Package Substrates in Mobile Devices Product Portfolio
7.17.3 Zhen Ding Technology Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.17.4 Zhen Ding Technology Main Business and Markets Served
7.17.5 Zhen Ding Technology Recent Developments/Updates
7.18 Shenzhen Fastprint Circuit Tech
7.18.1 Shenzhen Fastprint Circuit Tech Package Substrates in Mobile Devices Corporation Information
7.18.2 Shenzhen Fastprint Circuit Tech Package Substrates in Mobile Devices Product Portfolio
7.18.3 Shenzhen Fastprint Circuit Tech Package Substrates in Mobile Devices Production, Value, Price and Gross Margin (2019-2024)
7.18.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
7.18.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Package Substrates in Mobile Devices Industry Chain Analysis
8.2 Package Substrates in Mobile Devices Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Package Substrates in Mobile Devices Production Mode & Process
8.4 Package Substrates in Mobile Devices Sales and Marketing
8.4.1 Package Substrates in Mobile Devices Sales Channels
8.4.2 Package Substrates in Mobile Devices Distributors
8.5 Package Substrates in Mobile Devices Customers
9 Package Substrates in Mobile Devices Market Dynamics
9.1 Package Substrates in Mobile Devices Industry Trends
9.2 Package Substrates in Mobile Devices Market Drivers
9.3 Package Substrates in Mobile Devices Market Challenges
9.4 Package Substrates in Mobile Devices Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Package Substrates in Mobile Devices Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Package Substrates in Mobile Devices Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Package Substrates in Mobile Devices Production Capacity (K sqm) by Manufacturers in 2023
Table 4. Global Package Substrates in Mobile Devices Production by Manufacturers (2019-2024) & (K sqm)
Table 5. Global Package Substrates in Mobile Devices Production Market Share by Manufacturers (2019-2024)
Table 6. Global Package Substrates in Mobile Devices Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Package Substrates in Mobile Devices Production Value Share by Manufacturers (2019-2024)
Table 8. Global Package Substrates in Mobile Devices Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Package Substrates in Mobile Devices as of 2023)
Table 10. Global Market Package Substrates in Mobile Devices Average Price by Manufacturers (USD/sqm) & (2019-2024)
Table 11. Manufacturers Package Substrates in Mobile Devices Production Sites and Area Served
Table 12. Manufacturers Package Substrates in Mobile Devices Product Types
Table 13. Global Package Substrates in Mobile Devices Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Package Substrates in Mobile Devices Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Package Substrates in Mobile Devices Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Package Substrates in Mobile Devices Production Value Market Share by Region (2019-2024)
Table 18. Global Package Substrates in Mobile Devices Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Package Substrates in Mobile Devices Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Package Substrates in Mobile Devices Production Comparison by Region: 2019 VS 2023 VS 2030 (K sqm)
Table 21. Global Package Substrates in Mobile Devices Production (K sqm) by Region (2019-2024)
Table 22. Global Package Substrates in Mobile Devices Production Market Share by Region (2019-2024)
Table 23. Global Package Substrates in Mobile Devices Production (K sqm) Forecast by Region (2025-2030)
Table 24. Global Package Substrates in Mobile Devices Production Market Share Forecast by Region (2025-2030)
Table 25. Global Package Substrates in Mobile Devices Market Average Price (USD/sqm) by Region (2019-2024)
Table 26. Global Package Substrates in Mobile Devices Market Average Price (USD/sqm) by Region (2025-2030)
Table 27. Global Package Substrates in Mobile Devices Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K sqm)
Table 28. Global Package Substrates in Mobile Devices Consumption by Region (2019-2024) & (K sqm)
Table 29. Global Package Substrates in Mobile Devices Consumption Market Share by Region (2019-2024)
Table 30. Global Package Substrates in Mobile Devices Forecasted Consumption by Region (2025-2030) & (K sqm)
Table 31. Global Package Substrates in Mobile Devices Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Package Substrates in Mobile Devices Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K sqm)
Table 33. North America Package Substrates in Mobile Devices Consumption by Country (2019-2024) & (K sqm)
Table 34. North America Package Substrates in Mobile Devices Consumption by Country (2025-2030) & (K sqm)
Table 35. Europe Package Substrates in Mobile Devices Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K sqm)
Table 36. Europe Package Substrates in Mobile Devices Consumption by Country (2019-2024) & (K sqm)
Table 37. Europe Package Substrates in Mobile Devices Consumption by Country (2025-2030) & (K sqm)
Table 38. Asia Pacific Package Substrates in Mobile Devices Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K sqm)
Table 39. Asia Pacific Package Substrates in Mobile Devices Consumption by Region (2019-2024) & (K sqm)
Table 40. Asia Pacific Package Substrates in Mobile Devices Consumption by Region (2025-2030) & (K sqm)
Table 41. Latin America, Middle East & Africa Package Substrates in Mobile Devices Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K sqm)
Table 42. Latin America, Middle East & Africa Package Substrates in Mobile Devices Consumption by Country (2019-2024) & (K sqm)
Table 43. Latin America, Middle East & Africa Package Substrates in Mobile Devices Consumption by Country (2025-2030) & (K sqm)
Table 44. Global Package Substrates in Mobile Devices Production (K sqm) by Type (2019-2024)
Table 45. Global Package Substrates in Mobile Devices Production (K sqm) by Type (2025-2030)
Table 46. Global Package Substrates in Mobile Devices Production Market Share by Type (2019-2024)
Table 47. Global Package Substrates in Mobile Devices Production Market Share by Type (2025-2030)
Table 48. Global Package Substrates in Mobile Devices Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Package Substrates in Mobile Devices Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Package Substrates in Mobile Devices Production Value Share by Type (2019-2024)
Table 51. Global Package Substrates in Mobile Devices Production Value Share by Type (2025-2030)
Table 52. Global Package Substrates in Mobile Devices Price (USD/sqm) by Type (2019-2024)
Table 53. Global Package Substrates in Mobile Devices Price (USD/sqm) by Type (2025-2030)
Table 54. Global Package Substrates in Mobile Devices Production (K sqm) by Application (2019-2024)
Table 55. Global Package Substrates in Mobile Devices Production (K sqm) by Application (2025-2030)
Table 56. Global Package Substrates in Mobile Devices Production Market Share by Application (2019-2024)
Table 57. Global Package Substrates in Mobile Devices Production Market Share by Application (2025-2030)
Table 58. Global Package Substrates in Mobile Devices Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Package Substrates in Mobile Devices Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Package Substrates in Mobile Devices Production Value Share by Application (2019-2024)
Table 61. Global Package Substrates in Mobile Devices Production Value Share by Application (2025-2030)
Table 62. Global Package Substrates in Mobile Devices Price (USD/sqm) by Application (2019-2024)
Table 63. Global Package Substrates in Mobile Devices Price (USD/sqm) by Application (2025-2030)
Table 64. Ibiden Package Substrates in Mobile Devices Corporation Information
Table 65. Ibiden Specification and Application
Table 66. Ibiden Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 67. Ibiden Main Business and Markets Served
Table 68. Ibiden Recent Developments/Updates
Table 69. Shinko Electric Industries Package Substrates in Mobile Devices Corporation Information
Table 70. Shinko Electric Industries Specification and Application
Table 71. Shinko Electric Industries Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 72. Shinko Electric Industries Main Business and Markets Served
Table 73. Shinko Electric Industries Recent Developments/Updates
Table 74. Kyocera Package Substrates in Mobile Devices Corporation Information
Table 75. Kyocera Specification and Application
Table 76. Kyocera Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 77. Kyocera Main Business and Markets Served
Table 78. Kyocera Recent Developments/Updates
Table 79. Samsung Electro-Mechanics Package Substrates in Mobile Devices Corporation Information
Table 80. Samsung Electro-Mechanics Specification and Application
Table 81. Samsung Electro-Mechanics Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 82. Samsung Electro-Mechanics Main Business and Markets Served
Table 83. Samsung Electro-Mechanics Recent Developments/Updates
Table 84. Fujitsu Package Substrates in Mobile Devices Corporation Information
Table 85. Fujitsu Specification and Application
Table 86. Fujitsu Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 87. Fujitsu Main Business and Markets Served
Table 88. Fujitsu Recent Developments/Updates
Table 89. Hitachi Package Substrates in Mobile Devices Corporation Information
Table 90. Hitachi Specification and Application
Table 91. Hitachi Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 92. Hitachi Main Business and Markets Served
Table 93. Hitachi Recent Developments/Updates
Table 94. Eastern Package Substrates in Mobile Devices Corporation Information
Table 95. Eastern Specification and Application
Table 96. Eastern Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 97. Eastern Main Business and Markets Served
Table 98. Eastern Recent Developments/Updates
Table 99. LG Innotek Package Substrates in Mobile Devices Corporation Information
Table 100. LG Innotek Specification and Application
Table 101. LG Innotek Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 102. LG Innotek Main Business and Markets Served
Table 103. LG Innotek Recent Developments/Updates
Table 104. Simmtech Package Substrates in Mobile Devices Corporation Information
Table 105. Simmtech Specification and Application
Table 106. Simmtech Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 107. Simmtech Main Business and Markets Served
Table 108. Simmtech Recent Developments/Updates
Table 109. Daeduck Package Substrates in Mobile Devices Corporation Information
Table 110. Daeduck Specification and Application
Table 111. Daeduck Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 112. Daeduck Main Business and Markets Served
Table 113. Daeduck Recent Developments/Updates
Table 114. AT&S Package Substrates in Mobile Devices Corporation Information
Table 115. AT&S Specification and Application
Table 116. AT&S Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 117. AT&S Main Business and Markets Served
Table 118. AT&S Recent Developments/Updates
Table 119. Unimicron Package Substrates in Mobile Devices Corporation Information
Table 120. Unimicron Specification and Application
Table 121. Unimicron Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 122. Unimicron Main Business and Markets Served
Table 123. Unimicron Recent Developments/Updates
Table 124. Kinsus Package Substrates in Mobile Devices Corporation Information
Table 125. Kinsus Specification and Application
Table 126. Kinsus Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 127. Kinsus Main Business and Markets Served
Table 128. Kinsus Recent Developments/Updates
Table 129. Nan Ya PCB Package Substrates in Mobile Devices Corporation Information
Table 130. Nan Ya PCB Specification and Application
Table 131. Nan Ya PCB Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 132. Nan Ya PCB Main Business and Markets Served
Table 133. Nan Ya PCB Recent Developments/Updates
Table 134. Nan Ya PCB Package Substrates in Mobile Devices Corporation Information
Table 135. ASE Group Specification and Application
Table 136. ASE Group Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 137. ASE Group Main Business and Markets Served
Table 138. ASE Group Recent Developments/Updates
Table 139. TTM Technologies Package Substrates in Mobile Devices Corporation Information
Table 140. TTM Technologies Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 141. TTM Technologies Main Business and Markets Served
Table 142. TTM Technologies Recent Developments/Updates
Table 143. Zhen Ding Technology Package Substrates in Mobile Devices Corporation Information
Table 144. Zhen Ding Technology Specification and Application
Table 145. Zhen Ding Technology Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 146. Zhen Ding Technology Main Business and Markets Served
Table 147. Zhen Ding Technology Recent Developments/Updates
Table 148. Shenzhen Fastprint Circuit Tech Package Substrates in Mobile Devices Corporation Information
Table 149. Shenzhen Fastprint Circuit Tech Specification and Application
Table 150. Shenzhen Fastprint Circuit Tech Package Substrates in Mobile Devices Production (K sqm), Value (US$ Million), Price (USD/sqm) and Gross Margin (2019-2024)
Table 151. Shenzhen Fastprint Circuit Tech Main Business and Markets Served
Table 152. Shenzhen Fastprint Circuit Tech Recent Developments/Updates
Table 153. Key Raw Materials Lists
Table 154. Raw Materials Key Suppliers Lists
Table 155. Package Substrates in Mobile Devices Distributors List
Table 156. Package Substrates in Mobile Devices Customers List
Table 157. Package Substrates in Mobile Devices Market Trends
Table 158. Package Substrates in Mobile Devices Market Drivers
Table 159. Package Substrates in Mobile Devices Market Challenges
Table 160. Package Substrates in Mobile Devices Market Restraints
Table 161. Research Programs/Design for This Report
Table 162. Key Data Information from Secondary Sources
Table 163. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Package Substrates in Mobile Devices
Figure 2. Global Package Substrates in Mobile Devices Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Package Substrates in Mobile Devices Market Share by Type: 2023 VS 2030
Figure 4. FCCSP Product Picture
Figure 5. WBCSP Product Picture
Figure 6. SiP Product Picture
Figure 7. BOC Product Picture
Figure 8. FCBGA Product Picture
Figure 9. Global Package Substrates in Mobile Devices Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 10. Global Package Substrates in Mobile Devices Market Share by Application: 2023 VS 2030
Figure 11. Smartphones
Figure 12. Tablets
Figure 13. Notebook PCs
Figure 14. Others
Figure 15. Global Package Substrates in Mobile Devices Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 16. Global Package Substrates in Mobile Devices Production Value (US$ Million) & (2019-2030)
Figure 17. Global Package Substrates in Mobile Devices Production (K sqm) & (2019-2030)
Figure 18. Global Package Substrates in Mobile Devices Average Price (USD/sqm) & (2019-2030)
Figure 19. Package Substrates in Mobile Devices Report Years Considered
Figure 20. Package Substrates in Mobile Devices Production Share by Manufacturers in 2023
Figure 21. Package Substrates in Mobile Devices Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 22. The Global 5 and 10 Largest Players: Market Share by Package Substrates in Mobile Devices Revenue in 2023
Figure 23. Global Package Substrates in Mobile Devices Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 24. Global Package Substrates in Mobile Devices Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. Global Package Substrates in Mobile Devices Production Comparison by Region: 2019 VS 2023 VS 2030 (K sqm)
Figure 26. Global Package Substrates in Mobile Devices Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 27. North America Package Substrates in Mobile Devices Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Europe Package Substrates in Mobile Devices Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. China Package Substrates in Mobile Devices Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Japan Package Substrates in Mobile Devices Production Value (US$ Million) Growth Rate (2019-2030)
Figure 31. South Korea Package Substrates in Mobile Devices Production Value (US$ Million) Growth Rate (2019-2030)
Figure 32. Global Package Substrates in Mobile Devices Consumption by Region: 2019 VS 2023 VS 2030 (K sqm)
Figure 33. Global Package Substrates in Mobile Devices Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 34. North America Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 35. North America Package Substrates in Mobile Devices Consumption Market Share by Country (2019-2030)
Figure 36. Canada Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 37. U.S. Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 38. Europe Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 39. Europe Package Substrates in Mobile Devices Consumption Market Share by Country (2019-2030)
Figure 40. Germany Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 41. France Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 42. U.K. Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 43. Italy Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 44. Russia Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 45. Asia Pacific Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 46. Asia Pacific Package Substrates in Mobile Devices Consumption Market Share by Regions (2019-2030)
Figure 47. China Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 48. Japan Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 49. South Korea Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 50. China Taiwan Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 51. Southeast Asia Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 52. India Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 53. Latin America, Middle East & Africa Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 54. Latin America, Middle East & Africa Package Substrates in Mobile Devices Consumption Market Share by Country (2019-2030)
Figure 55. Mexico Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 56. Brazil Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 57. Turkey Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 58. GCC Countries Package Substrates in Mobile Devices Consumption and Growth Rate (2019-2024) & (K sqm)
Figure 59. Global Production Market Share of Package Substrates in Mobile Devices by Type (2019-2030)
Figure 60. Global Production Value Market Share of Package Substrates in Mobile Devices by Type (2019-2030)
Figure 61. Global Package Substrates in Mobile Devices Price (USD/sqm) by Type (2019-2030)
Figure 62. Global Production Market Share of Package Substrates in Mobile Devices by Application (2019-2030)
Figure 63. Global Production Value Market Share of Package Substrates in Mobile Devices by Application (2019-2030)
Figure 64. Global Package Substrates in Mobile Devices Price (USD/sqm) by Application (2019-2030)
Figure 65. Package Substrates in Mobile Devices Value Chain
Figure 66. Package Substrates in Mobile Devices Production Process
Figure 67. Channels of Distribution (Direct Vs Distribution)
Figure 68. Distributors Profiles
Figure 69. Bottom-up and Top-down Approaches for This Report
Figure 70. Data Triangulation
Published By : QY Research
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