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Global PCB Assembly Market Research Report 2024
Synopsis
The global PCB Assembly market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for PCB Assembly is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for PCB Assembly is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for PCB Assembly in Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of PCB Assembly include Wistron Corporation, Benchmark, Sanmina Corporation, SMTC Corporation, PARPRO, Sierra Circuits, Semecs, Zollner Elektronik and Mycronic, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for PCB Assembly, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding PCB Assembly.
Report Scope
The PCB Assembly market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global PCB Assembly market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the PCB Assembly companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Wistron Corporation
Benchmark
Sanmina Corporation
SMTC Corporation
PARPRO
Sierra Circuits
Semecs
Zollner Elektronik
Mycronic
Venture Electronics
Auspi
Seeed Technology
Euro Circuits
EC Electronics
Shin Puu Technology
FASTPCBA Technology
RауMing Tесhnоlоgу
PCBCart
Segment by Type
Surface Mount Technology
Through Hole Technique
Mixed PCBA Technology
Segment by Application
Electronics
Wireless
Medial
Automotive
Instrumentation
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of PCB Assembly companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
The global PCB Assembly market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for PCB Assembly is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for PCB Assembly is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for PCB Assembly in Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of PCB Assembly include Wistron Corporation, Benchmark, Sanmina Corporation, SMTC Corporation, PARPRO, Sierra Circuits, Semecs, Zollner Elektronik and Mycronic, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for PCB Assembly, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding PCB Assembly.
Report Scope
The PCB Assembly market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global PCB Assembly market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the PCB Assembly companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Wistron Corporation
Benchmark
Sanmina Corporation
SMTC Corporation
PARPRO
Sierra Circuits
Semecs
Zollner Elektronik
Mycronic
Venture Electronics
Auspi
Seeed Technology
Euro Circuits
EC Electronics
Shin Puu Technology
FASTPCBA Technology
RауMing Tесhnоlоgу
PCBCart
Segment by Type
Surface Mount Technology
Through Hole Technique
Mixed PCBA Technology
Segment by Application
Electronics
Wireless
Medial
Automotive
Instrumentation
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of PCB Assembly companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global PCB Assembly Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Surface Mount Technology
1.2.3 Through Hole Technique
1.2.4 Mixed PCBA Technology
1.3 Market by Application
1.3.1 Global PCB Assembly Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Electronics
1.3.3 Wireless
1.3.4 Medial
1.3.5 Automotive
1.3.6 Instrumentation
1.3.7 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global PCB Assembly Market Perspective (2019-2030)
2.2 PCB Assembly Growth Trends by Region
2.2.1 Global PCB Assembly Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 PCB Assembly Historic Market Size by Region (2019-2024)
2.2.3 PCB Assembly Forecasted Market Size by Region (2025-2030)
2.3 PCB Assembly Market Dynamics
2.3.1 PCB Assembly Industry Trends
2.3.2 PCB Assembly Market Drivers
2.3.3 PCB Assembly Market Challenges
2.3.4 PCB Assembly Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top PCB Assembly Players by Revenue
3.1.1 Global Top PCB Assembly Players by Revenue (2019-2024)
3.1.2 Global PCB Assembly Revenue Market Share by Players (2019-2024)
3.2 Global PCB Assembly Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by PCB Assembly Revenue
3.4 Global PCB Assembly Market Concentration Ratio
3.4.1 Global PCB Assembly Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by PCB Assembly Revenue in 2023
3.5 PCB Assembly Key Players Head office and Area Served
3.6 Key Players PCB Assembly Product Solution and Service
3.7 Date of Enter into PCB Assembly Market
3.8 Mergers & Acquisitions, Expansion Plans
4 PCB Assembly Breakdown Data by Type
4.1 Global PCB Assembly Historic Market Size by Type (2019-2024)
4.2 Global PCB Assembly Forecasted Market Size by Type (2025-2030)
5 PCB Assembly Breakdown Data by Application
5.1 Global PCB Assembly Historic Market Size by Application (2019-2024)
5.2 Global PCB Assembly Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America PCB Assembly Market Size (2019-2030)
6.2 North America PCB Assembly Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America PCB Assembly Market Size by Country (2019-2024)
6.4 North America PCB Assembly Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe PCB Assembly Market Size (2019-2030)
7.2 Europe PCB Assembly Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe PCB Assembly Market Size by Country (2019-2024)
7.4 Europe PCB Assembly Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific PCB Assembly Market Size (2019-2030)
8.2 Asia-Pacific PCB Assembly Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific PCB Assembly Market Size by Region (2019-2024)
8.4 Asia-Pacific PCB Assembly Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America PCB Assembly Market Size (2019-2030)
9.2 Latin America PCB Assembly Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America PCB Assembly Market Size by Country (2019-2024)
9.4 Latin America PCB Assembly Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa PCB Assembly Market Size (2019-2030)
10.2 Middle East & Africa PCB Assembly Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa PCB Assembly Market Size by Country (2019-2024)
10.4 Middle East & Africa PCB Assembly Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Wistron Corporation
11.1.1 Wistron Corporation Company Detail
11.1.2 Wistron Corporation Business Overview
11.1.3 Wistron Corporation PCB Assembly Introduction
11.1.4 Wistron Corporation Revenue in PCB Assembly Business (2019-2024)
11.1.5 Wistron Corporation Recent Development
11.2 Benchmark
11.2.1 Benchmark Company Detail
11.2.2 Benchmark Business Overview
11.2.3 Benchmark PCB Assembly Introduction
11.2.4 Benchmark Revenue in PCB Assembly Business (2019-2024)
11.2.5 Benchmark Recent Development
11.3 Sanmina Corporation
11.3.1 Sanmina Corporation Company Detail
11.3.2 Sanmina Corporation Business Overview
11.3.3 Sanmina Corporation PCB Assembly Introduction
11.3.4 Sanmina Corporation Revenue in PCB Assembly Business (2019-2024)
11.3.5 Sanmina Corporation Recent Development
11.4 SMTC Corporation
11.4.1 SMTC Corporation Company Detail
11.4.2 SMTC Corporation Business Overview
11.4.3 SMTC Corporation PCB Assembly Introduction
11.4.4 SMTC Corporation Revenue in PCB Assembly Business (2019-2024)
11.4.5 SMTC Corporation Recent Development
11.5 PARPRO
11.5.1 PARPRO Company Detail
11.5.2 PARPRO Business Overview
11.5.3 PARPRO PCB Assembly Introduction
11.5.4 PARPRO Revenue in PCB Assembly Business (2019-2024)
11.5.5 PARPRO Recent Development
11.6 Sierra Circuits
11.6.1 Sierra Circuits Company Detail
11.6.2 Sierra Circuits Business Overview
11.6.3 Sierra Circuits PCB Assembly Introduction
11.6.4 Sierra Circuits Revenue in PCB Assembly Business (2019-2024)
11.6.5 Sierra Circuits Recent Development
11.7 Semecs
11.7.1 Semecs Company Detail
11.7.2 Semecs Business Overview
11.7.3 Semecs PCB Assembly Introduction
11.7.4 Semecs Revenue in PCB Assembly Business (2019-2024)
11.7.5 Semecs Recent Development
11.8 Zollner Elektronik
11.8.1 Zollner Elektronik Company Detail
11.8.2 Zollner Elektronik Business Overview
11.8.3 Zollner Elektronik PCB Assembly Introduction
11.8.4 Zollner Elektronik Revenue in PCB Assembly Business (2019-2024)
11.8.5 Zollner Elektronik Recent Development
11.9 Mycronic
11.9.1 Mycronic Company Detail
11.9.2 Mycronic Business Overview
11.9.3 Mycronic PCB Assembly Introduction
11.9.4 Mycronic Revenue in PCB Assembly Business (2019-2024)
11.9.5 Mycronic Recent Development
11.10 Venture Electronics
11.10.1 Venture Electronics Company Detail
11.10.2 Venture Electronics Business Overview
11.10.3 Venture Electronics PCB Assembly Introduction
11.10.4 Venture Electronics Revenue in PCB Assembly Business (2019-2024)
11.10.5 Venture Electronics Recent Development
11.11 Auspi
11.11.1 Auspi Company Detail
11.11.2 Auspi Business Overview
11.11.3 Auspi PCB Assembly Introduction
11.11.4 Auspi Revenue in PCB Assembly Business (2019-2024)
11.11.5 Auspi Recent Development
11.12 Seeed Technology
11.12.1 Seeed Technology Company Detail
11.12.2 Seeed Technology Business Overview
11.12.3 Seeed Technology PCB Assembly Introduction
11.12.4 Seeed Technology Revenue in PCB Assembly Business (2019-2024)
11.12.5 Seeed Technology Recent Development
11.13 Euro Circuits
11.13.1 Euro Circuits Company Detail
11.13.2 Euro Circuits Business Overview
11.13.3 Euro Circuits PCB Assembly Introduction
11.13.4 Euro Circuits Revenue in PCB Assembly Business (2019-2024)
11.13.5 Euro Circuits Recent Development
11.14 EC Electronics
11.14.1 EC Electronics Company Detail
11.14.2 EC Electronics Business Overview
11.14.3 EC Electronics PCB Assembly Introduction
11.14.4 EC Electronics Revenue in PCB Assembly Business (2019-2024)
11.14.5 EC Electronics Recent Development
11.15 Shin Puu Technology
11.15.1 Shin Puu Technology Company Detail
11.15.2 Shin Puu Technology Business Overview
11.15.3 Shin Puu Technology PCB Assembly Introduction
11.15.4 Shin Puu Technology Revenue in PCB Assembly Business (2019-2024)
11.15.5 Shin Puu Technology Recent Development
11.16 FASTPCBA Technology
11.16.1 FASTPCBA Technology Company Detail
11.16.2 FASTPCBA Technology Business Overview
11.16.3 FASTPCBA Technology PCB Assembly Introduction
11.16.4 FASTPCBA Technology Revenue in PCB Assembly Business (2019-2024)
11.16.5 FASTPCBA Technology Recent Development
11.17 RауMing Tесhnоlоgу
11.17.1 RауMing Tесhnоlоgу Company Detail
11.17.2 RауMing Tесhnоlоgу Business Overview
11.17.3 RауMing Tесhnоlоgу PCB Assembly Introduction
11.17.4 RауMing Tесhnоlоgу Revenue in PCB Assembly Business (2019-2024)
11.17.5 RауMing Tесhnоlоgу Recent Development
11.18 PCBCart
11.18.1 PCBCart Company Detail
11.18.2 PCBCart Business Overview
11.18.3 PCBCart PCB Assembly Introduction
11.18.4 PCBCart Revenue in PCB Assembly Business (2019-2024)
11.18.5 PCBCart Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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