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Global Planar Die Bonder Market Research Report 2025
Synopsis
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Global Planar Die Bonder market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Planar Die Bonder market research.
Key manufacturers engaged in the Planar Die Bonder industry include ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, EV Group (EVG), SPTS Technologies Ltd., Besi (BE Semiconductor Industries N.V.) and Nordson Corporation, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Planar Die Bonder production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Planar Die Bonder were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Planar Die Bonder market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Planar Die Bonder market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
ASM Pacific Technology Ltd.
Kulicke & Soffa Industries, Inc.
Tokyo Electron Limited
Applied Materials, Inc.
Disco Corporation
EV Group (EVG)
SPTS Technologies Ltd.
Besi (BE Semiconductor Industries N.V.)
Nordson Corporation
Shibaura Mechatronics Corporation
Palomar Technologies, Inc.
Shinkawa Ltd.
Towa Corporation
F&K Delvotec Bondtechnik GmbH
West Bond, Inc.
Orthodyne Electronics Corporation
Segment by Type
Manual Plane Die Bonder
Semi-Automatic Planar Die Bonder
Fully Automatic Flat Die Bonder
Segment by Application
Semiconductor Manufacturing
Electronic Packaging
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Planar Die Bonder report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
Global Planar Die Bonder market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Planar Die Bonder market research.
Key manufacturers engaged in the Planar Die Bonder industry include ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, EV Group (EVG), SPTS Technologies Ltd., Besi (BE Semiconductor Industries N.V.) and Nordson Corporation, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Planar Die Bonder production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Planar Die Bonder were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Planar Die Bonder market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Planar Die Bonder market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
ASM Pacific Technology Ltd.
Kulicke & Soffa Industries, Inc.
Tokyo Electron Limited
Applied Materials, Inc.
Disco Corporation
EV Group (EVG)
SPTS Technologies Ltd.
Besi (BE Semiconductor Industries N.V.)
Nordson Corporation
Shibaura Mechatronics Corporation
Palomar Technologies, Inc.
Shinkawa Ltd.
Towa Corporation
F&K Delvotec Bondtechnik GmbH
West Bond, Inc.
Orthodyne Electronics Corporation
Segment by Type
Manual Plane Die Bonder
Semi-Automatic Planar Die Bonder
Fully Automatic Flat Die Bonder
Segment by Application
Semiconductor Manufacturing
Electronic Packaging
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Planar Die Bonder report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Planar Die Bonder Market Overview
1.1 Product Definition
1.2 Planar Die Bonder Segment by Type
1.2.1 Global Planar Die Bonder Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Manual Plane Die Bonder
1.2.3 Semi-Automatic Planar Die Bonder
1.2.4 Fully Automatic Flat Die Bonder
1.3 Planar Die Bonder Segment by Application
1.3.1 Global Planar Die Bonder Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor Manufacturing
1.3.3 Electronic Packaging
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Planar Die Bonder Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Planar Die Bonder Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Planar Die Bonder Production Estimates and Forecasts (2018-2029)
1.4.4 Global Planar Die Bonder Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Planar Die Bonder Production Market Share by Manufacturers (2018-2023)
2.2 Global Planar Die Bonder Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Planar Die Bonder, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Planar Die Bonder Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Planar Die Bonder Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Planar Die Bonder, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Planar Die Bonder, Product Offered and Application
2.8 Global Key Manufacturers of Planar Die Bonder, Date of Enter into This Industry
2.9 Planar Die Bonder Market Competitive Situation and Trends
2.9.1 Planar Die Bonder Market Concentration Rate
2.9.2 Global 5 and 10 Largest Planar Die Bonder Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Planar Die Bonder Production by Region
3.1 Global Planar Die Bonder Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Planar Die Bonder Production Value by Region (2018-2029)
3.2.1 Global Planar Die Bonder Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Planar Die Bonder by Region (2024-2029)
3.3 Global Planar Die Bonder Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Planar Die Bonder Production by Region (2018-2029)
3.4.1 Global Planar Die Bonder Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Planar Die Bonder by Region (2024-2029)
3.5 Global Planar Die Bonder Market Price Analysis by Region (2018-2023)
3.6 Global Planar Die Bonder Production and Value, Year-over-Year Growth
3.6.1 North America Planar Die Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Planar Die Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Planar Die Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Planar Die Bonder Production Value Estimates and Forecasts (2018-2029)
4 Planar Die Bonder Consumption by Region
4.1 Global Planar Die Bonder Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Planar Die Bonder Consumption by Region (2018-2029)
4.2.1 Global Planar Die Bonder Consumption by Region (2018-2023)
4.2.2 Global Planar Die Bonder Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Planar Die Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Planar Die Bonder Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Planar Die Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Planar Die Bonder Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Planar Die Bonder Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Planar Die Bonder Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Planar Die Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Planar Die Bonder Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Planar Die Bonder Production by Type (2018-2029)
5.1.1 Global Planar Die Bonder Production by Type (2018-2023)
5.1.2 Global Planar Die Bonder Production by Type (2024-2029)
5.1.3 Global Planar Die Bonder Production Market Share by Type (2018-2029)
5.2 Global Planar Die Bonder Production Value by Type (2018-2029)
5.2.1 Global Planar Die Bonder Production Value by Type (2018-2023)
5.2.2 Global Planar Die Bonder Production Value by Type (2024-2029)
5.2.3 Global Planar Die Bonder Production Value Market Share by Type (2018-2029)
5.3 Global Planar Die Bonder Price by Type (2018-2029)
6 Segment by Application
6.1 Global Planar Die Bonder Production by Application (2018-2029)
6.1.1 Global Planar Die Bonder Production by Application (2018-2023)
6.1.2 Global Planar Die Bonder Production by Application (2024-2029)
6.1.3 Global Planar Die Bonder Production Market Share by Application (2018-2029)
6.2 Global Planar Die Bonder Production Value by Application (2018-2029)
6.2.1 Global Planar Die Bonder Production Value by Application (2018-2023)
6.2.2 Global Planar Die Bonder Production Value by Application (2024-2029)
6.2.3 Global Planar Die Bonder Production Value Market Share by Application (2018-2029)
6.3 Global Planar Die Bonder Price by Application (2018-2029)
7 Key Companies Profiled
7.1 ASM Pacific Technology Ltd.
7.1.1 ASM Pacific Technology Ltd. Planar Die Bonder Corporation Information
7.1.2 ASM Pacific Technology Ltd. Planar Die Bonder Product Portfolio
7.1.3 ASM Pacific Technology Ltd. Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.1.4 ASM Pacific Technology Ltd. Main Business and Markets Served
7.1.5 ASM Pacific Technology Ltd. Recent Developments/Updates
7.2 Kulicke & Soffa Industries, Inc.
7.2.1 Kulicke & Soffa Industries, Inc. Planar Die Bonder Corporation Information
7.2.2 Kulicke & Soffa Industries, Inc. Planar Die Bonder Product Portfolio
7.2.3 Kulicke & Soffa Industries, Inc. Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Kulicke & Soffa Industries, Inc. Main Business and Markets Served
7.2.5 Kulicke & Soffa Industries, Inc. Recent Developments/Updates
7.3 Tokyo Electron Limited
7.3.1 Tokyo Electron Limited Planar Die Bonder Corporation Information
7.3.2 Tokyo Electron Limited Planar Die Bonder Product Portfolio
7.3.3 Tokyo Electron Limited Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Tokyo Electron Limited Main Business and Markets Served
7.3.5 Tokyo Electron Limited Recent Developments/Updates
7.4 Applied Materials, Inc.
7.4.1 Applied Materials, Inc. Planar Die Bonder Corporation Information
7.4.2 Applied Materials, Inc. Planar Die Bonder Product Portfolio
7.4.3 Applied Materials, Inc. Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Applied Materials, Inc. Main Business and Markets Served
7.4.5 Applied Materials, Inc. Recent Developments/Updates
7.5 Disco Corporation
7.5.1 Disco Corporation Planar Die Bonder Corporation Information
7.5.2 Disco Corporation Planar Die Bonder Product Portfolio
7.5.3 Disco Corporation Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Disco Corporation Main Business and Markets Served
7.5.5 Disco Corporation Recent Developments/Updates
7.6 EV Group (EVG)
7.6.1 EV Group (EVG) Planar Die Bonder Corporation Information
7.6.2 EV Group (EVG) Planar Die Bonder Product Portfolio
7.6.3 EV Group (EVG) Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.6.4 EV Group (EVG) Main Business and Markets Served
7.6.5 EV Group (EVG) Recent Developments/Updates
7.7 SPTS Technologies Ltd.
7.7.1 SPTS Technologies Ltd. Planar Die Bonder Corporation Information
7.7.2 SPTS Technologies Ltd. Planar Die Bonder Product Portfolio
7.7.3 SPTS Technologies Ltd. Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.7.4 SPTS Technologies Ltd. Main Business and Markets Served
7.7.5 SPTS Technologies Ltd. Recent Developments/Updates
7.8 Besi (BE Semiconductor Industries N.V.)
7.8.1 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Corporation Information
7.8.2 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Product Portfolio
7.8.3 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Besi (BE Semiconductor Industries N.V.) Main Business and Markets Served
7.7.5 Besi (BE Semiconductor Industries N.V.) Recent Developments/Updates
7.9 Nordson Corporation
7.9.1 Nordson Corporation Planar Die Bonder Corporation Information
7.9.2 Nordson Corporation Planar Die Bonder Product Portfolio
7.9.3 Nordson Corporation Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Nordson Corporation Main Business and Markets Served
7.9.5 Nordson Corporation Recent Developments/Updates
7.10 Shibaura Mechatronics Corporation
7.10.1 Shibaura Mechatronics Corporation Planar Die Bonder Corporation Information
7.10.2 Shibaura Mechatronics Corporation Planar Die Bonder Product Portfolio
7.10.3 Shibaura Mechatronics Corporation Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Shibaura Mechatronics Corporation Main Business and Markets Served
7.10.5 Shibaura Mechatronics Corporation Recent Developments/Updates
7.11 Palomar Technologies, Inc.
7.11.1 Palomar Technologies, Inc. Planar Die Bonder Corporation Information
7.11.2 Palomar Technologies, Inc. Planar Die Bonder Product Portfolio
7.11.3 Palomar Technologies, Inc. Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Palomar Technologies, Inc. Main Business and Markets Served
7.11.5 Palomar Technologies, Inc. Recent Developments/Updates
7.12 Shinkawa Ltd.
7.12.1 Shinkawa Ltd. Planar Die Bonder Corporation Information
7.12.2 Shinkawa Ltd. Planar Die Bonder Product Portfolio
7.12.3 Shinkawa Ltd. Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Shinkawa Ltd. Main Business and Markets Served
7.12.5 Shinkawa Ltd. Recent Developments/Updates
7.13 Towa Corporation
7.13.1 Towa Corporation Planar Die Bonder Corporation Information
7.13.2 Towa Corporation Planar Die Bonder Product Portfolio
7.13.3 Towa Corporation Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Towa Corporation Main Business and Markets Served
7.13.5 Towa Corporation Recent Developments/Updates
7.14 F&K Delvotec Bondtechnik GmbH
7.14.1 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Corporation Information
7.14.2 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Product Portfolio
7.14.3 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.14.4 F&K Delvotec Bondtechnik GmbH Main Business and Markets Served
7.14.5 F&K Delvotec Bondtechnik GmbH Recent Developments/Updates
7.15 West Bond, Inc.
7.15.1 West Bond, Inc. Planar Die Bonder Corporation Information
7.15.2 West Bond, Inc. Planar Die Bonder Product Portfolio
7.15.3 West Bond, Inc. Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.15.4 West Bond, Inc. Main Business and Markets Served
7.15.5 West Bond, Inc. Recent Developments/Updates
7.16 Orthodyne Electronics Corporation
7.16.1 Orthodyne Electronics Corporation Planar Die Bonder Corporation Information
7.16.2 Orthodyne Electronics Corporation Planar Die Bonder Product Portfolio
7.16.3 Orthodyne Electronics Corporation Planar Die Bonder Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Orthodyne Electronics Corporation Main Business and Markets Served
7.16.5 Orthodyne Electronics Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Planar Die Bonder Industry Chain Analysis
8.2 Planar Die Bonder Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Planar Die Bonder Production Mode & Process
8.4 Planar Die Bonder Sales and Marketing
8.4.1 Planar Die Bonder Sales Channels
8.4.2 Planar Die Bonder Distributors
8.5 Planar Die Bonder Customers
9 Planar Die Bonder Market Dynamics
9.1 Planar Die Bonder Industry Trends
9.2 Planar Die Bonder Market Drivers
9.3 Planar Die Bonder Market Challenges
9.4 Planar Die Bonder Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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