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Synopsis
The global Semiconductor Dicing Blades market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for Semiconductor Dicing Blades is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Semiconductor Dicing Blades is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Semiconductor Dicing Blades include DISCO Corporation, YMB, Thermocarbon, TOKYO SEIMITSU, Advanced Dicing Technologies (ADT), Kulicke and Soffa Industries,, UKAM Industrial Superhard Tools, Ceiba Technologies. and KINIK COMPANY, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Dicing Blades, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Dicing Blades.
The Semiconductor Dicing Blades market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Semiconductor Dicing Blades market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Dicing Blades manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
- DISCO Corporation
- YMB
- Thermocarbon
- TOKYO SEIMITSU
- Advanced Dicing Technologies (ADT)
- Kulicke and Soffa Industries,
- UKAM Industrial Superhard Tools
- Ceiba Technologies.
- KINIK COMPANY
- ITI
- Taiwan Asahi Diamond Industrial
- Shanghai Sinyang
- Nanjing Sanchao Advanced Materials
- System Technology
- WSS Precision Tools
- Dongguan Wintime Semiconductor Technology
Segment by Type
- Hubless Dicing Blades
- Hub Dicing Blades
Segment by Application
- 300mm Wafer
- 200mm Wafer
- Others
Production by Region
- North America
- Europe
- China
- Japan
- South Korea
Consumption by Region
- North America (United States, Canada)
- Europe (Germany, France, U.K., Italy, Russia)
- Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
- Latin America (Mexico, Brazil)
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Dicing Blades manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Dicing Blades by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Dicing Blades in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index
1 Semiconductor Dicing Blades Market Overview
1.1 Product Definition
1.2 Semiconductor Dicing Blades Segment by Type
1.2.1 Global Semiconductor Dicing Blades Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Hubless Dicing Blades
1.2.3 Hub Dicing Blades
1.3 Semiconductor Dicing Blades Segment by Application
1.3.1 Global Semiconductor Dicing Blades Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 300mm Wafer
1.3.3 200mm Wafer
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Dicing Blades Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor Dicing Blades Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor Dicing Blades Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor Dicing Blades Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Dicing Blades Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor Dicing Blades Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor Dicing Blades, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor Dicing Blades Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Dicing Blades Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor Dicing Blades, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Dicing Blades, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Dicing Blades, Date of Enter into This Industry
2.9 Semiconductor Dicing Blades Market Competitive Situation and Trends
2.9.1 Semiconductor Dicing Blades Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Dicing Blades Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Dicing Blades Production by Region
3.1 Global Semiconductor Dicing Blades Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Dicing Blades Production Value by Region (2018-2029)
3.2.1 Global Semiconductor Dicing Blades Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor Dicing Blades by Region (2024-2029)
3.3 Global Semiconductor Dicing Blades Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor Dicing Blades Production by Region (2018-2029)
3.4.1 Global Semiconductor Dicing Blades Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor Dicing Blades by Region (2024-2029)
3.5 Global Semiconductor Dicing Blades Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor Dicing Blades Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Dicing Blades Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor Dicing Blades Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor Dicing Blades Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor Dicing Blades Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Semiconductor Dicing Blades Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor Dicing Blades Consumption by Region
4.1 Global Semiconductor Dicing Blades Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor Dicing Blades Consumption by Region (2018-2029)
4.2.1 Global Semiconductor Dicing Blades Consumption by Region (2018-2023)
4.2.2 Global Semiconductor Dicing Blades Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor Dicing Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor Dicing Blades Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Dicing Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor Dicing Blades Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Dicing Blades Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor Dicing Blades Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Dicing Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor Dicing Blades Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Semiconductor Dicing Blades Production by Type (2018-2029)
5.1.1 Global Semiconductor Dicing Blades Production by Type (2018-2023)
5.1.2 Global Semiconductor Dicing Blades Production by Type (2024-2029)
5.1.3 Global Semiconductor Dicing Blades Production Market Share by Type (2018-2029)
5.2 Global Semiconductor Dicing Blades Production Value by Type (2018-2029)
5.2.1 Global Semiconductor Dicing Blades Production Value by Type (2018-2023)
5.2.2 Global Semiconductor Dicing Blades Production Value by Type (2024-2029)
5.2.3 Global Semiconductor Dicing Blades Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor Dicing Blades Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor Dicing Blades Production by Application (2018-2029)
6.1.1 Global Semiconductor Dicing Blades Production by Application (2018-2023)
6.1.2 Global Semiconductor Dicing Blades Production by Application (2024-2029)
6.1.3 Global Semiconductor Dicing Blades Production Market Share by Application (2018-2029)
6.2 Global Semiconductor Dicing Blades Production Value by Application (2018-2029)
6.2.1 Global Semiconductor Dicing Blades Production Value by Application (2018-2023)
6.2.2 Global Semiconductor Dicing Blades Production Value by Application (2024-2029)
6.2.3 Global Semiconductor Dicing Blades Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor Dicing Blades Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DISCO Corporation
7.1.1 DISCO Corporation Semiconductor Dicing Blades Corporation Information
7.1.2 DISCO Corporation Semiconductor Dicing Blades Product Portfolio
7.1.3 DISCO Corporation Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DISCO Corporation Main Business and Markets Served
7.1.5 DISCO Corporation Recent Developments/Updates
7.2 YMB
7.2.1 YMB Semiconductor Dicing Blades Corporation Information
7.2.2 YMB Semiconductor Dicing Blades Product Portfolio
7.2.3 YMB Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.2.4 YMB Main Business and Markets Served
7.2.5 YMB Recent Developments/Updates
7.3 Thermocarbon
7.3.1 Thermocarbon Semiconductor Dicing Blades Corporation Information
7.3.2 Thermocarbon Semiconductor Dicing Blades Product Portfolio
7.3.3 Thermocarbon Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Thermocarbon Main Business and Markets Served
7.3.5 Thermocarbon Recent Developments/Updates
7.4 TOKYO SEIMITSU
7.4.1 TOKYO SEIMITSU Semiconductor Dicing Blades Corporation Information
7.4.2 TOKYO SEIMITSU Semiconductor Dicing Blades Product Portfolio
7.4.3 TOKYO SEIMITSU Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.4.4 TOKYO SEIMITSU Main Business and Markets Served
7.4.5 TOKYO SEIMITSU Recent Developments/Updates
7.5 Advanced Dicing Technologies (ADT)
7.5.1 Advanced Dicing Technologies (ADT) Semiconductor Dicing Blades Corporation Information
7.5.2 Advanced Dicing Technologies (ADT) Semiconductor Dicing Blades Product Portfolio
7.5.3 Advanced Dicing Technologies (ADT) Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Advanced Dicing Technologies (ADT) Main Business and Markets Served
7.5.5 Advanced Dicing Technologies (ADT) Recent Developments/Updates
7.6 Kulicke and Soffa Industries,
7.6.1 Kulicke and Soffa Industries, Semiconductor Dicing Blades Corporation Information
7.6.2 Kulicke and Soffa Industries, Semiconductor Dicing Blades Product Portfolio
7.6.3 Kulicke and Soffa Industries, Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Kulicke and Soffa Industries, Main Business and Markets Served
7.6.5 Kulicke and Soffa Industries, Recent Developments/Updates
7.7 UKAM Industrial Superhard Tools
7.7.1 UKAM Industrial Superhard Tools Semiconductor Dicing Blades Corporation Information
7.7.2 UKAM Industrial Superhard Tools Semiconductor Dicing Blades Product Portfolio
7.7.3 UKAM Industrial Superhard Tools Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.7.4 UKAM Industrial Superhard Tools Main Business and Markets Served
7.7.5 UKAM Industrial Superhard Tools Recent Developments/Updates
7.8 Ceiba Technologies.
7.8.1 Ceiba Technologies. Semiconductor Dicing Blades Corporation Information
7.8.2 Ceiba Technologies. Semiconductor Dicing Blades Product Portfolio
7.8.3 Ceiba Technologies. Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Ceiba Technologies. Main Business and Markets Served
7.7.5 Ceiba Technologies. Recent Developments/Updates
7.9 KINIK COMPANY
7.9.1 KINIK COMPANY Semiconductor Dicing Blades Corporation Information
7.9.2 KINIK COMPANY Semiconductor Dicing Blades Product Portfolio
7.9.3 KINIK COMPANY Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.9.4 KINIK COMPANY Main Business and Markets Served
7.9.5 KINIK COMPANY Recent Developments/Updates
7.10 ITI
7.10.1 ITI Semiconductor Dicing Blades Corporation Information
7.10.2 ITI Semiconductor Dicing Blades Product Portfolio
7.10.3 ITI Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.10.4 ITI Main Business and Markets Served
7.10.5 ITI Recent Developments/Updates
7.11 Taiwan Asahi Diamond Industrial
7.11.1 Taiwan Asahi Diamond Industrial Semiconductor Dicing Blades Corporation Information
7.11.2 Taiwan Asahi Diamond Industrial Semiconductor Dicing Blades Product Portfolio
7.11.3 Taiwan Asahi Diamond Industrial Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Taiwan Asahi Diamond Industrial Main Business and Markets Served
7.11.5 Taiwan Asahi Diamond Industrial Recent Developments/Updates
7.12 Shanghai Sinyang
7.12.1 Shanghai Sinyang Semiconductor Dicing Blades Corporation Information
7.12.2 Shanghai Sinyang Semiconductor Dicing Blades Product Portfolio
7.12.3 Shanghai Sinyang Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Shanghai Sinyang Main Business and Markets Served
7.12.5 Shanghai Sinyang Recent Developments/Updates
7.13 Nanjing Sanchao Advanced Materials
7.13.1 Nanjing Sanchao Advanced Materials Semiconductor Dicing Blades Corporation Information
7.13.2 Nanjing Sanchao Advanced Materials Semiconductor Dicing Blades Product Portfolio
7.13.3 Nanjing Sanchao Advanced Materials Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Nanjing Sanchao Advanced Materials Main Business and Markets Served
7.13.5 Nanjing Sanchao Advanced Materials Recent Developments/Updates
7.14 System Technology
7.14.1 System Technology Semiconductor Dicing Blades Corporation Information
7.14.2 System Technology Semiconductor Dicing Blades Product Portfolio
7.14.3 System Technology Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.14.4 System Technology Main Business and Markets Served
7.14.5 System Technology Recent Developments/Updates
7.15 WSS Precision Tools
7.15.1 WSS Precision Tools Semiconductor Dicing Blades Corporation Information
7.15.2 WSS Precision Tools Semiconductor Dicing Blades Product Portfolio
7.15.3 WSS Precision Tools Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.15.4 WSS Precision Tools Main Business and Markets Served
7.15.5 WSS Precision Tools Recent Developments/Updates
7.16 Dongguan Wintime Semiconductor Technology
7.16.1 Dongguan Wintime Semiconductor Technology Semiconductor Dicing Blades Corporation Information
7.16.2 Dongguan Wintime Semiconductor Technology Semiconductor Dicing Blades Product Portfolio
7.16.3 Dongguan Wintime Semiconductor Technology Semiconductor Dicing Blades Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Dongguan Wintime Semiconductor Technology Main Business and Markets Served
7.16.5 Dongguan Wintime Semiconductor Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Dicing Blades Industry Chain Analysis
8.2 Semiconductor Dicing Blades Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Dicing Blades Production Mode & Process
8.4 Semiconductor Dicing Blades Sales and Marketing
8.4.1 Semiconductor Dicing Blades Sales Channels
8.4.2 Semiconductor Dicing Blades Distributors
8.5 Semiconductor Dicing Blades Customers
9 Semiconductor Dicing Blades Market Dynamics
9.1 Semiconductor Dicing Blades Industry Trends
9.2 Semiconductor Dicing Blades Market Drivers
9.3 Semiconductor Dicing Blades Market Challenges
9.4 Semiconductor Dicing Blades Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
List of Tables
Table 1. Global Semiconductor Dicing Blades Market Value by Type, (US$ Million) & (2022 VS 2029)
Table 2. Global Semiconductor Dicing Blades Market Value by Application, (US$ Million) & (2022 VS 2029)
Table 3. Global Semiconductor Dicing Blades Production Capacity (K Units) by Manufacturers in 2022
Table 4. Global Semiconductor Dicing Blades Production by Manufacturers (2018-2023) & (K Units)
Table 5. Global Semiconductor Dicing Blades Production Market Share by Manufacturers (2018-2023)
Table 6. Global Semiconductor Dicing Blades Production Value by Manufacturers (2018-2023) & (US$ Million)
Table 7. Global Semiconductor Dicing Blades Production Value Share by Manufacturers (2018-2023)
Table 8. Global Semiconductor Dicing Blades Industry Ranking 2021 VS 2022 VS 2023
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Dicing Blades as of 2022)
Table 10. Global Market Semiconductor Dicing Blades Average Price by Manufacturers (US$/Unit) & (2018-2023)
Table 11. Manufacturers Semiconductor Dicing Blades Production Sites and Area Served
Table 12. Manufacturers Semiconductor Dicing Blades Product Types
Table 13. Global Semiconductor Dicing Blades Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Semiconductor Dicing Blades Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
Table 16. Global Semiconductor Dicing Blades Production Value (US$ Million) by Region (2018-2023)
Table 17. Global Semiconductor Dicing Blades Production Value Market Share by Region (2018-2023)
Table 18. Global Semiconductor Dicing Blades Production Value (US$ Million) Forecast by Region (2024-2029)
Table 19. Global Semiconductor Dicing Blades Production Value Market Share Forecast by Region (2024-2029)
Table 20. Global Semiconductor Dicing Blades Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
Table 21. Global Semiconductor Dicing Blades Production (K Units) by Region (2018-2023)
Table 22. Global Semiconductor Dicing Blades Production Market Share by Region (2018-2023)
Table 23. Global Semiconductor Dicing Blades Production (K Units) Forecast by Region (2024-2029)
Table 24. Global Semiconductor Dicing Blades Production Market Share Forecast by Region (2024-2029)
Table 25. Global Semiconductor Dicing Blades Market Average Price (US$/Unit) by Region (2018-2023)
Table 26. Global Semiconductor Dicing Blades Market Average Price (US$/Unit) by Region (2024-2029)
Table 27. Global Semiconductor Dicing Blades Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
Table 28. Global Semiconductor Dicing Blades Consumption by Region (2018-2023) & (K Units)
Table 29. Global Semiconductor Dicing Blades Consumption Market Share by Region (2018-2023)
Table 30. Global Semiconductor Dicing Blades Forecasted Consumption by Region (2024-2029) & (K Units)
Table 31. Global Semiconductor Dicing Blades Forecasted Consumption Market Share by Region (2018-2023)
Table 32. North America Semiconductor Dicing Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 33. North America Semiconductor Dicing Blades Consumption by Country (2018-2023) & (K Units)
Table 34. North America Semiconductor Dicing Blades Consumption by Country (2024-2029) & (K Units)
Table 35. Europe Semiconductor Dicing Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 36. Europe Semiconductor Dicing Blades Consumption by Country (2018-2023) & (K Units)
Table 37. Europe Semiconductor Dicing Blades Consumption by Country (2024-2029) & (K Units)
Table 38. Asia Pacific Semiconductor Dicing Blades Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
Table 39. Asia Pacific Semiconductor Dicing Blades Consumption by Region (2018-2023) & (K Units)
Table 40. Asia Pacific Semiconductor Dicing Blades Consumption by Region (2024-2029) & (K Units)
Table 41. Latin America, Middle East & Africa Semiconductor Dicing Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
Table 42. Latin America, Middle East & Africa Semiconductor Dicing Blades Consumption by Country (2018-2023) & (K Units)
Table 43. Latin America, Middle East & Africa Semiconductor Dicing Blades Consumption by Country (2024-2029) & (K Units)
Table 44. Global Semiconductor Dicing Blades Production (K Units) by Type (2018-2023)
Table 45. Global Semiconductor Dicing Blades Production (K Units) by Type (2024-2029)
Table 46. Global Semiconductor Dicing Blades Production Market Share by Type (2018-2023)
Table 47. Global Semiconductor Dicing Blades Production Market Share by Type (2024-2029)
Table 48. Global Semiconductor Dicing Blades Production Value (US$ Million) by Type (2018-2023)
Table 49. Global Semiconductor Dicing Blades Production Value (US$ Million) by Type (2024-2029)
Table 50. Global Semiconductor Dicing Blades Production Value Share by Type (2018-2023)
Table 51. Global Semiconductor Dicing Blades Production Value Share by Type (2024-2029)
Table 52. Global Semiconductor Dicing Blades Price (US$/Unit) by Type (2018-2023)
Table 53. Global Semiconductor Dicing Blades Price (US$/Unit) by Type (2024-2029)
Table 54. Global Semiconductor Dicing Blades Production (K Units) by Application (2018-2023)
Table 55. Global Semiconductor Dicing Blades Production (K Units) by Application (2024-2029)
Table 56. Global Semiconductor Dicing Blades Production Market Share by Application (2018-2023)
Table 57. Global Semiconductor Dicing Blades Production Market Share by Application (2024-2029)
Table 58. Global Semiconductor Dicing Blades Production Value (US$ Million) by Application (2018-2023)
Table 59. Global Semiconductor Dicing Blades Production Value (US$ Million) by Application (2024-2029)
Table 60. Global Semiconductor Dicing Blades Production Value Share by Application (2018-2023)
Table 61. Global Semiconductor Dicing Blades Production Value Share by Application (2024-2029)
Table 62. Global Semiconductor Dicing Blades Price (US$/Unit) by Application (2018-2023)
Table 63. Global Semiconductor Dicing Blades Price (US$/Unit) by Application (2024-2029)
Table 64. DISCO Corporation Semiconductor Dicing Blades Corporation Information
Table 65. DISCO Corporation Specification and Application
Table 66. DISCO Corporation Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 67. DISCO Corporation Main Business and Markets Served
Table 68. DISCO Corporation Recent Developments/Updates
Table 69. YMB Semiconductor Dicing Blades Corporation Information
Table 70. YMB Specification and Application
Table 71. YMB Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 72. YMB Main Business and Markets Served
Table 73. YMB Recent Developments/Updates
Table 74. Thermocarbon Semiconductor Dicing Blades Corporation Information
Table 75. Thermocarbon Specification and Application
Table 76. Thermocarbon Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 77. Thermocarbon Main Business and Markets Served
Table 78. Thermocarbon Recent Developments/Updates
Table 79. TOKYO SEIMITSU Semiconductor Dicing Blades Corporation Information
Table 80. TOKYO SEIMITSU Specification and Application
Table 81. TOKYO SEIMITSU Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 82. TOKYO SEIMITSU Main Business and Markets Served
Table 83. TOKYO SEIMITSU Recent Developments/Updates
Table 84. Advanced Dicing Technologies (ADT) Semiconductor Dicing Blades Corporation Information
Table 85. Advanced Dicing Technologies (ADT) Specification and Application
Table 86. Advanced Dicing Technologies (ADT) Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 87. Advanced Dicing Technologies (ADT) Main Business and Markets Served
Table 88. Advanced Dicing Technologies (ADT) Recent Developments/Updates
Table 89. Kulicke and Soffa Industries, Semiconductor Dicing Blades Corporation Information
Table 90. Kulicke and Soffa Industries, Specification and Application
Table 91. Kulicke and Soffa Industries, Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 92. Kulicke and Soffa Industries, Main Business and Markets Served
Table 93. Kulicke and Soffa Industries, Recent Developments/Updates
Table 94. UKAM Industrial Superhard Tools Semiconductor Dicing Blades Corporation Information
Table 95. UKAM Industrial Superhard Tools Specification and Application
Table 96. UKAM Industrial Superhard Tools Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 97. UKAM Industrial Superhard Tools Main Business and Markets Served
Table 98. UKAM Industrial Superhard Tools Recent Developments/Updates
Table 99. Ceiba Technologies. Semiconductor Dicing Blades Corporation Information
Table 100. Ceiba Technologies. Specification and Application
Table 101. Ceiba Technologies. Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 102. Ceiba Technologies. Main Business and Markets Served
Table 103. Ceiba Technologies. Recent Developments/Updates
Table 104. KINIK COMPANY Semiconductor Dicing Blades Corporation Information
Table 105. KINIK COMPANY Specification and Application
Table 106. KINIK COMPANY Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 107. KINIK COMPANY Main Business and Markets Served
Table 108. KINIK COMPANY Recent Developments/Updates
Table 109. ITI Semiconductor Dicing Blades Corporation Information
Table 110. ITI Specification and Application
Table 111. ITI Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 112. ITI Main Business and Markets Served
Table 113. ITI Recent Developments/Updates
Table 114. Taiwan Asahi Diamond Industrial Semiconductor Dicing Blades Corporation Information
Table 115. Taiwan Asahi Diamond Industrial Specification and Application
Table 116. Taiwan Asahi Diamond Industrial Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 117. Taiwan Asahi Diamond Industrial Main Business and Markets Served
Table 118. Taiwan Asahi Diamond Industrial Recent Developments/Updates
Table 119. Shanghai Sinyang Semiconductor Dicing Blades Corporation Information
Table 120. Shanghai Sinyang Specification and Application
Table 121. Shanghai Sinyang Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 122. Shanghai Sinyang Main Business and Markets Served
Table 123. Shanghai Sinyang Recent Developments/Updates
Table 124. Nanjing Sanchao Advanced Materials Semiconductor Dicing Blades Corporation Information
Table 125. Nanjing Sanchao Advanced Materials Specification and Application
Table 126. Nanjing Sanchao Advanced Materials Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 127. Nanjing Sanchao Advanced Materials Main Business and Markets Served
Table 128. Nanjing Sanchao Advanced Materials Recent Developments/Updates
Table 129. System Technology Semiconductor Dicing Blades Corporation Information
Table 130. System Technology Specification and Application
Table 131. System Technology Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 132. System Technology Main Business and Markets Served
Table 133. System Technology Recent Developments/Updates
Table 134. System Technology Semiconductor Dicing Blades Corporation Information
Table 135. WSS Precision Tools Specification and Application
Table 136. WSS Precision Tools Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 137. WSS Precision Tools Main Business and Markets Served
Table 138. WSS Precision Tools Recent Developments/Updates
Table 139. Dongguan Wintime Semiconductor Technology Semiconductor Dicing Blades Corporation Information
Table 140. Dongguan Wintime Semiconductor Technology Semiconductor Dicing Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
Table 141. Dongguan Wintime Semiconductor Technology Main Business and Markets Served
Table 142. Dongguan Wintime Semiconductor Technology Recent Developments/Updates
Table 143. Key Raw Materials Lists
Table 144. Raw Materials Key Suppliers Lists
Table 145. Semiconductor Dicing Blades Distributors List
Table 146. Semiconductor Dicing Blades Customers List
Table 147. Semiconductor Dicing Blades Market Trends
Table 148. Semiconductor Dicing Blades Market Drivers
Table 149. Semiconductor Dicing Blades Market Challenges
Table 150. Semiconductor Dicing Blades Market Restraints
Table 151. Research Programs/Design for This Report
Table 152. Key Data Information from Secondary Sources
Table 153. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Semiconductor Dicing Blades
Figure 2. Global Semiconductor Dicing Blades Market Value by Type, (US$ Million) & (2022 VS 2029)
Figure 3. Global Semiconductor Dicing Blades Market Share by Type: 2022 VS 2029
Figure 4. Hubless Dicing Blades Product Picture
Figure 5. Hub Dicing Blades Product Picture
Figure 6. Global Semiconductor Dicing Blades Market Value by Application, (US$ Million) & (2022 VS 2029)
Figure 7. Global Semiconductor Dicing Blades Market Share by Application: 2022 VS 2029
Figure 8. 300mm Wafer
Figure 9. 200mm Wafer
Figure 10. Others
Figure 11. Global Semiconductor Dicing Blades Production Value (US$ Million), 2018 VS 2022 VS 2029
Figure 12. Global Semiconductor Dicing Blades Production Value (US$ Million) & (2018-2029)
Figure 13. Global Semiconductor Dicing Blades Production (K Units) & (2018-2029)
Figure 14. Global Semiconductor Dicing Blades Average Price (US$/Unit) & (2018-2029)
Figure 15. Semiconductor Dicing Blades Report Years Considered
Figure 16. Semiconductor Dicing Blades Production Share by Manufacturers in 2022
Figure 17. Semiconductor Dicing Blades Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
Figure 18. The Global 5 and 10 Largest Players: Market Share by Semiconductor Dicing Blades Revenue in 2022
Figure 19. Global Semiconductor Dicing Blades Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
Figure 20. Global Semiconductor Dicing Blades Production Value Market Share by Region: 2018 VS 2022 VS 2029
Figure 21. Global Semiconductor Dicing Blades Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
Figure 22. Global Semiconductor Dicing Blades Production Market Share by Region: 2018 VS 2022 VS 2029
Figure 23. North America Semiconductor Dicing Blades Production Value (US$ Million) Growth Rate (2018-2029)
Figure 24. Europe Semiconductor Dicing Blades Production Value (US$ Million) Growth Rate (2018-2029)
Figure 25. China Semiconductor Dicing Blades Production Value (US$ Million) Growth Rate (2018-2029)
Figure 26. Japan Semiconductor Dicing Blades Production Value (US$ Million) Growth Rate (2018-2029)
Figure 27. South Korea Semiconductor Dicing Blades Production Value (US$ Million) Growth Rate (2018-2029)
Figure 28. Global Semiconductor Dicing Blades Consumption by Region: 2018 VS 2022 VS 2029 (K Units)
Figure 29. Global Semiconductor Dicing Blades Consumption Market Share by Region: 2018 VS 2022 VS 2029
Figure 30. North America Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 31. North America Semiconductor Dicing Blades Consumption Market Share by Country (2018-2029)
Figure 32. Canada Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 33. U.S. Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 34. Europe Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 35. Europe Semiconductor Dicing Blades Consumption Market Share by Country (2018-2029)
Figure 36. Germany Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 37. France Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 38. U.K. Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 39. Italy Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 40. Russia Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 41. Asia Pacific Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 42. Asia Pacific Semiconductor Dicing Blades Consumption Market Share by Regions (2018-2029)
Figure 43. China Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 44. Japan Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 45. South Korea Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 46. China Taiwan Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 47. Southeast Asia Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 48. India Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 49. Latin America, Middle East & Africa Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 50. Latin America, Middle East & Africa Semiconductor Dicing Blades Consumption Market Share by Country (2018-2029)
Figure 51. Mexico Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 52. Brazil Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 53. Turkey Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 54. GCC Countries Semiconductor Dicing Blades Consumption and Growth Rate (2018-2023) & (K Units)
Figure 55. Global Production Market Share of Semiconductor Dicing Blades by Type (2018-2029)
Figure 56. Global Production Value Market Share of Semiconductor Dicing Blades by Type (2018-2029)
Figure 57. Global Semiconductor Dicing Blades Price (US$/Unit) by Type (2018-2029)
Figure 58. Global Production Market Share of Semiconductor Dicing Blades by Application (2018-2029)
Figure 59. Global Production Value Market Share of Semiconductor Dicing Blades by Application (2018-2029)
Figure 60. Global Semiconductor Dicing Blades Price (US$/Unit) by Application (2018-2029)
Figure 61. Semiconductor Dicing Blades Value Chain
Figure 62. Semiconductor Dicing Blades Production Process
Figure 63. Channels of Distribution (Direct Vs Distribution)
Figure 64. Distributors Profiles
Figure 65. Bottom-up and Top-down Approaches for This Report
Figure 66. Data Triangulation
Published By : QY Research
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