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Global Semiconductor Die Attach Materials Market Research Report 2025
Synopsis
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to investigators, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
The global Semiconductor Die Attach Materials market was valued at US$ 496.9 million in 2023 and is anticipated to reach US$ 681.5 million by 2030, witnessing a CAGR of 5.0% during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Die Attach Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Die Attach Materials.
Report Scope
The Semiconductor Die Attach Materials market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Die Attach Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Die Attach Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
DuPont
Segment by Type
Die Attach Paste
Die Attach Wire
Others
Segment by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Die Attach Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Die Attach Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Die Attach Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Typical die-attach materials are PbSn, PbSnAg or PbInAg alloys. These alloys wet conventional substrates and die metallizations due to the formation of intermetallic compounds, which build an adhesion layer between substrate or die metallization and bulk solder. To achieve the best wetting and lowest void rate, the solder material should contain the lowest possible oxide content. The die-attach layer has two main functions: mechanical fixation of the die on its substrate, and dissipation of heat generated in the die. Especially in power and high-power applications, generated heat density is high. Therefore, conventional die-attach adhesives or eutectic solder alloys are not suitable as die-attach materials. For these applications, high-melting solder alloys are used, which contain more than 85% lead by weight, and do not satisfy the requirements of RoHS. Since there is no established lead-free substitute on the market, high-lead alloys are included on the exemption list of RoHS for these applications. However, die-attach materials that satisfy the requirements of RoHS do exist.
Tip: It should be noted that the solder paste and tin wire used in the PCB of the electronics industry are not included in the statistical scope of the report because this part of the product is mainly used for the soldering of electronic components rather than the soldering of chips. According to investigators, with the increase of SMT equipment, die-attach wires used for die-attach materials are becoming less and less, and die-attach wires are mainly used in the electronics manufacturing industry instead of chip bonding.
The global Semiconductor Die Attach Materials market was valued at US$ 496.9 million in 2023 and is anticipated to reach US$ 681.5 million by 2030, witnessing a CAGR of 5.0% during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Die Attach Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Die Attach Materials.
Report Scope
The Semiconductor Die Attach Materials market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Die Attach Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Die Attach Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
DuPont
Segment by Type
Die Attach Paste
Die Attach Wire
Others
Segment by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Die Attach Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Die Attach Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Die Attach Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Semiconductor Die Attach Materials Market Overview
1.1 Product Definition
1.2 Semiconductor Die Attach Materials Segment by Type
1.2.1 Global Semiconductor Die Attach Materials Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Die Attach Paste
1.2.3 Die Attach Wire
1.2.4 Others
1.3 Semiconductor Die Attach Materials Segment by Application
1.3.1 Global Semiconductor Die Attach Materials Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Medical
1.3.5 Telecommunications
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Die Attach Materials Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Die Attach Materials Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Die Attach Materials Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Die Attach Materials Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Die Attach Materials Production Market Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Die Attach Materials Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Die Attach Materials, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Die Attach Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Die Attach Materials Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Die Attach Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Die Attach Materials, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Die Attach Materials, Date of Enter into This Industry
2.9 Semiconductor Die Attach Materials Market Competitive Situation and Trends
2.9.1 Semiconductor Die Attach Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Die Attach Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Die Attach Materials Production by Region
3.1 Global Semiconductor Die Attach Materials Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Die Attach Materials Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Die Attach Materials Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Die Attach Materials by Region (2025-2030)
3.3 Global Semiconductor Die Attach Materials Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Die Attach Materials Production by Region (2019-2030)
3.4.1 Global Semiconductor Die Attach Materials Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Die Attach Materials by Region (2025-2030)
3.5 Global Semiconductor Die Attach Materials Market Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Die Attach Materials Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Die Attach Materials Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Die Attach Materials Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Die Attach Materials Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Die Attach Materials Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Die Attach Materials Consumption by Region
4.1 Global Semiconductor Die Attach Materials Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Die Attach Materials Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Die Attach Materials Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Die Attach Materials Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Die Attach Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Die Attach Materials Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Die Attach Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Die Attach Materials Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Die Attach Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Die Attach Materials Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Die Attach Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Die Attach Materials Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Die Attach Materials Production by Type (2019-2030)
5.1.1 Global Semiconductor Die Attach Materials Production by Type (2019-2024)
5.1.2 Global Semiconductor Die Attach Materials Production by Type (2025-2030)
5.1.3 Global Semiconductor Die Attach Materials Production Market Share by Type (2019-2030)
5.2 Global Semiconductor Die Attach Materials Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Die Attach Materials Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Die Attach Materials Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Die Attach Materials Production Value Market Share by Type (2019-2030)
5.3 Global Semiconductor Die Attach Materials Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Die Attach Materials Production by Application (2019-2030)
6.1.1 Global Semiconductor Die Attach Materials Production by Application (2019-2024)
6.1.2 Global Semiconductor Die Attach Materials Production by Application (2025-2030)
6.1.3 Global Semiconductor Die Attach Materials Production Market Share by Application (2019-2030)
6.2 Global Semiconductor Die Attach Materials Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Die Attach Materials Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Die Attach Materials Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Die Attach Materials Production Value Market Share by Application (2019-2030)
6.3 Global Semiconductor Die Attach Materials Price by Application (2019-2030)
7 Key Companies Profiled
7.1 SMIC
7.1.1 SMIC Semiconductor Die Attach Materials Corporation Information
7.1.2 SMIC Semiconductor Die Attach Materials Product Portfolio
7.1.3 SMIC Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.1.4 SMIC Main Business and Markets Served
7.1.5 SMIC Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Semiconductor Die Attach Materials Corporation Information
7.2.2 Henkel Semiconductor Die Attach Materials Product Portfolio
7.2.3 Henkel Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Henkel Main Business and Markets Served
7.2.5 Henkel Recent Developments/Updates
7.3 Shenzhen Vital New Material
7.3.1 Shenzhen Vital New Material Semiconductor Die Attach Materials Corporation Information
7.3.2 Shenzhen Vital New Material Semiconductor Die Attach Materials Product Portfolio
7.3.3 Shenzhen Vital New Material Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Shenzhen Vital New Material Main Business and Markets Served
7.3.5 Shenzhen Vital New Material Recent Developments/Updates
7.4 Indium
7.4.1 Indium Semiconductor Die Attach Materials Corporation Information
7.4.2 Indium Semiconductor Die Attach Materials Product Portfolio
7.4.3 Indium Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Indium Main Business and Markets Served
7.4.5 Indium Recent Developments/Updates
7.5 Alpha Assembly Solutions
7.5.1 Alpha Assembly Solutions Semiconductor Die Attach Materials Corporation Information
7.5.2 Alpha Assembly Solutions Semiconductor Die Attach Materials Product Portfolio
7.5.3 Alpha Assembly Solutions Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Alpha Assembly Solutions Main Business and Markets Served
7.5.5 Alpha Assembly Solutions Recent Developments/Updates
7.6 TONGFANG TECH
7.6.1 TONGFANG TECH Semiconductor Die Attach Materials Corporation Information
7.6.2 TONGFANG TECH Semiconductor Die Attach Materials Product Portfolio
7.6.3 TONGFANG TECH Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.6.4 TONGFANG TECH Main Business and Markets Served
7.6.5 TONGFANG TECH Recent Developments/Updates
7.7 Umicore
7.7.1 Umicore Semiconductor Die Attach Materials Corporation Information
7.7.2 Umicore Semiconductor Die Attach Materials Product Portfolio
7.7.3 Umicore Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Umicore Main Business and Markets Served
7.7.5 Umicore Recent Developments/Updates
7.8 Heraeu
7.8.1 Heraeu Semiconductor Die Attach Materials Corporation Information
7.8.2 Heraeu Semiconductor Die Attach Materials Product Portfolio
7.8.3 Heraeu Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Heraeu Main Business and Markets Served
7.7.5 Heraeu Recent Developments/Updates
7.9 AIM
7.9.1 AIM Semiconductor Die Attach Materials Corporation Information
7.9.2 AIM Semiconductor Die Attach Materials Product Portfolio
7.9.3 AIM Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.9.4 AIM Main Business and Markets Served
7.9.5 AIM Recent Developments/Updates
7.10 TAMURA RADIO
7.10.1 TAMURA RADIO Semiconductor Die Attach Materials Corporation Information
7.10.2 TAMURA RADIO Semiconductor Die Attach Materials Product Portfolio
7.10.3 TAMURA RADIO Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.10.4 TAMURA RADIO Main Business and Markets Served
7.10.5 TAMURA RADIO Recent Developments/Updates
7.11 Kyocera
7.11.1 Kyocera Semiconductor Die Attach Materials Corporation Information
7.11.2 Kyocera Semiconductor Die Attach Materials Product Portfolio
7.11.3 Kyocera Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Kyocera Main Business and Markets Served
7.11.5 Kyocera Recent Developments/Updates
7.12 Shanghai Jinji
7.12.1 Shanghai Jinji Semiconductor Die Attach Materials Corporation Information
7.12.2 Shanghai Jinji Semiconductor Die Attach Materials Product Portfolio
7.12.3 Shanghai Jinji Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Shanghai Jinji Main Business and Markets Served
7.12.5 Shanghai Jinji Recent Developments/Updates
7.13 Palomar Technologies
7.13.1 Palomar Technologies Semiconductor Die Attach Materials Corporation Information
7.13.2 Palomar Technologies Semiconductor Die Attach Materials Product Portfolio
7.13.3 Palomar Technologies Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Palomar Technologies Main Business and Markets Served
7.13.5 Palomar Technologies Recent Developments/Updates
7.14 Nordson EFD
7.14.1 Nordson EFD Semiconductor Die Attach Materials Corporation Information
7.14.2 Nordson EFD Semiconductor Die Attach Materials Product Portfolio
7.14.3 Nordson EFD Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Nordson EFD Main Business and Markets Served
7.14.5 Nordson EFD Recent Developments/Updates
7.15 DuPont
7.15.1 DuPont Semiconductor Die Attach Materials Corporation Information
7.15.2 DuPont Semiconductor Die Attach Materials Product Portfolio
7.15.3 DuPont Semiconductor Die Attach Materials Production, Value, Price and Gross Margin (2019-2024)
7.15.4 DuPont Main Business and Markets Served
7.15.5 DuPont Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Die Attach Materials Industry Chain Analysis
8.2 Semiconductor Die Attach Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Die Attach Materials Production Mode & Process
8.4 Semiconductor Die Attach Materials Sales and Marketing
8.4.1 Semiconductor Die Attach Materials Sales Channels
8.4.2 Semiconductor Die Attach Materials Distributors
8.5 Semiconductor Die Attach Materials Customers
9 Semiconductor Die Attach Materials Market Dynamics
9.1 Semiconductor Die Attach Materials Industry Trends
9.2 Semiconductor Die Attach Materials Market Drivers
9.3 Semiconductor Die Attach Materials Market Challenges
9.4 Semiconductor Die Attach Materials Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Semiconductor Die Attach Materials Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Semiconductor Die Attach Materials Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Semiconductor Die Attach Materials Production Capacity (Tons) by Manufacturers in 2023
Table 4. Global Semiconductor Die Attach Materials Production by Manufacturers (2019-2024) & (Tons)
Table 5. Global Semiconductor Die Attach Materials Production Market Share by Manufacturers (2019-2024)
Table 6. Global Semiconductor Die Attach Materials Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Semiconductor Die Attach Materials Production Value Share by Manufacturers (2019-2024)
Table 8. Global Semiconductor Die Attach Materials Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Die Attach Materials as of 2023)
Table 10. Global Market Semiconductor Die Attach Materials Average Price by Manufacturers (US$/Ton) & (2019-2024)
Table 11. Manufacturers Semiconductor Die Attach Materials Production Sites and Area Served
Table 12. Manufacturers Semiconductor Die Attach Materials Product Types
Table 13. Global Semiconductor Die Attach Materials Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Semiconductor Die Attach Materials Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Semiconductor Die Attach Materials Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Semiconductor Die Attach Materials Production Value Market Share by Region (2019-2024)
Table 18. Global Semiconductor Die Attach Materials Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Semiconductor Die Attach Materials Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Semiconductor Die Attach Materials Production Comparison by Region: 2019 VS 2023 VS 2030 (Tons)
Table 21. Global Semiconductor Die Attach Materials Production (Tons) by Region (2019-2024)
Table 22. Global Semiconductor Die Attach Materials Production Market Share by Region (2019-2024)
Table 23. Global Semiconductor Die Attach Materials Production (Tons) Forecast by Region (2025-2030)
Table 24. Global Semiconductor Die Attach Materials Production Market Share Forecast by Region (2025-2030)
Table 25. Global Semiconductor Die Attach Materials Market Average Price (US$/Ton) by Region (2019-2024)
Table 26. Global Semiconductor Die Attach Materials Market Average Price (US$/Ton) by Region (2025-2030)
Table 27. Global Semiconductor Die Attach Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Tons)
Table 28. Global Semiconductor Die Attach Materials Consumption by Region (2019-2024) & (Tons)
Table 29. Global Semiconductor Die Attach Materials Consumption Market Share by Region (2019-2024)
Table 30. Global Semiconductor Die Attach Materials Forecasted Consumption by Region (2025-2030) & (Tons)
Table 31. Global Semiconductor Die Attach Materials Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Semiconductor Die Attach Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Tons)
Table 33. North America Semiconductor Die Attach Materials Consumption by Country (2019-2024) & (Tons)
Table 34. North America Semiconductor Die Attach Materials Consumption by Country (2025-2030) & (Tons)
Table 35. Europe Semiconductor Die Attach Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Tons)
Table 36. Europe Semiconductor Die Attach Materials Consumption by Country (2019-2024) & (Tons)
Table 37. Europe Semiconductor Die Attach Materials Consumption by Country (2025-2030) & (Tons)
Table 38. Asia Pacific Semiconductor Die Attach Materials Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Tons)
Table 39. Asia Pacific Semiconductor Die Attach Materials Consumption by Region (2019-2024) & (Tons)
Table 40. Asia Pacific Semiconductor Die Attach Materials Consumption by Region (2025-2030) & (Tons)
Table 41. Latin America, Middle East & Africa Semiconductor Die Attach Materials Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Tons)
Table 42. Latin America, Middle East & Africa Semiconductor Die Attach Materials Consumption by Country (2019-2024) & (Tons)
Table 43. Latin America, Middle East & Africa Semiconductor Die Attach Materials Consumption by Country (2025-2030) & (Tons)
Table 44. Global Semiconductor Die Attach Materials Production (Tons) by Type (2019-2024)
Table 45. Global Semiconductor Die Attach Materials Production (Tons) by Type (2025-2030)
Table 46. Global Semiconductor Die Attach Materials Production Market Share by Type (2019-2024)
Table 47. Global Semiconductor Die Attach Materials Production Market Share by Type (2025-2030)
Table 48. Global Semiconductor Die Attach Materials Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Semiconductor Die Attach Materials Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Semiconductor Die Attach Materials Production Value Share by Type (2019-2024)
Table 51. Global Semiconductor Die Attach Materials Production Value Share by Type (2025-2030)
Table 52. Global Semiconductor Die Attach Materials Price (US$/Ton) by Type (2019-2024)
Table 53. Global Semiconductor Die Attach Materials Price (US$/Ton) by Type (2025-2030)
Table 54. Global Semiconductor Die Attach Materials Production (Tons) by Application (2019-2024)
Table 55. Global Semiconductor Die Attach Materials Production (Tons) by Application (2025-2030)
Table 56. Global Semiconductor Die Attach Materials Production Market Share by Application (2019-2024)
Table 57. Global Semiconductor Die Attach Materials Production Market Share by Application (2025-2030)
Table 58. Global Semiconductor Die Attach Materials Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Semiconductor Die Attach Materials Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Semiconductor Die Attach Materials Production Value Share by Application (2019-2024)
Table 61. Global Semiconductor Die Attach Materials Production Value Share by Application (2025-2030)
Table 62. Global Semiconductor Die Attach Materials Price (US$/Ton) by Application (2019-2024)
Table 63. Global Semiconductor Die Attach Materials Price (US$/Ton) by Application (2025-2030)
Table 64. SMIC Semiconductor Die Attach Materials Corporation Information
Table 65. SMIC Specification and Application
Table 66. SMIC Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 67. SMIC Main Business and Markets Served
Table 68. SMIC Recent Developments/Updates
Table 69. Henkel Semiconductor Die Attach Materials Corporation Information
Table 70. Henkel Specification and Application
Table 71. Henkel Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 72. Henkel Main Business and Markets Served
Table 73. Henkel Recent Developments/Updates
Table 74. Shenzhen Vital New Material Semiconductor Die Attach Materials Corporation Information
Table 75. Shenzhen Vital New Material Specification and Application
Table 76. Shenzhen Vital New Material Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 77. Shenzhen Vital New Material Main Business and Markets Served
Table 78. Shenzhen Vital New Material Recent Developments/Updates
Table 79. Indium Semiconductor Die Attach Materials Corporation Information
Table 80. Indium Specification and Application
Table 81. Indium Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 82. Indium Main Business and Markets Served
Table 83. Indium Recent Developments/Updates
Table 84. Alpha Assembly Solutions Semiconductor Die Attach Materials Corporation Information
Table 85. Alpha Assembly Solutions Specification and Application
Table 86. Alpha Assembly Solutions Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 87. Alpha Assembly Solutions Main Business and Markets Served
Table 88. Alpha Assembly Solutions Recent Developments/Updates
Table 89. TONGFANG TECH Semiconductor Die Attach Materials Corporation Information
Table 90. TONGFANG TECH Specification and Application
Table 91. TONGFANG TECH Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 92. TONGFANG TECH Main Business and Markets Served
Table 93. TONGFANG TECH Recent Developments/Updates
Table 94. Umicore Semiconductor Die Attach Materials Corporation Information
Table 95. Umicore Specification and Application
Table 96. Umicore Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 97. Umicore Main Business and Markets Served
Table 98. Umicore Recent Developments/Updates
Table 99. Heraeu Semiconductor Die Attach Materials Corporation Information
Table 100. Heraeu Specification and Application
Table 101. Heraeu Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 102. Heraeu Main Business and Markets Served
Table 103. Heraeu Recent Developments/Updates
Table 104. AIM Semiconductor Die Attach Materials Corporation Information
Table 105. AIM Specification and Application
Table 106. AIM Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 107. AIM Main Business and Markets Served
Table 108. AIM Recent Developments/Updates
Table 109. TAMURA RADIO Semiconductor Die Attach Materials Corporation Information
Table 110. TAMURA RADIO Specification and Application
Table 111. TAMURA RADIO Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 112. TAMURA RADIO Main Business and Markets Served
Table 113. TAMURA RADIO Recent Developments/Updates
Table 114. Kyocera Semiconductor Die Attach Materials Corporation Information
Table 115. Kyocera Specification and Application
Table 116. Kyocera Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 117. Kyocera Main Business and Markets Served
Table 118. Kyocera Recent Developments/Updates
Table 119. Shanghai Jinji Semiconductor Die Attach Materials Corporation Information
Table 120. Shanghai Jinji Specification and Application
Table 121. Shanghai Jinji Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 122. Shanghai Jinji Main Business and Markets Served
Table 123. Shanghai Jinji Recent Developments/Updates
Table 124. Palomar Technologies Semiconductor Die Attach Materials Corporation Information
Table 125. Palomar Technologies Specification and Application
Table 126. Palomar Technologies Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 127. Palomar Technologies Main Business and Markets Served
Table 128. Palomar Technologies Recent Developments/Updates
Table 129. Nordson EFD Semiconductor Die Attach Materials Corporation Information
Table 130. Nordson EFD Specification and Application
Table 131. Nordson EFD Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 132. Nordson EFD Main Business and Markets Served
Table 133. Nordson EFD Recent Developments/Updates
Table 134. Nordson EFD Semiconductor Die Attach Materials Corporation Information
Table 135. DuPont Specification and Application
Table 136. DuPont Semiconductor Die Attach Materials Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2019-2024)
Table 137. DuPont Main Business and Markets Served
Table 138. DuPont Recent Developments/Updates
Table 139. Key Raw Materials Lists
Table 140. Raw Materials Key Suppliers Lists
Table 141. Semiconductor Die Attach Materials Distributors List
Table 142. Semiconductor Die Attach Materials Customers List
Table 143. Semiconductor Die Attach Materials Market Trends
Table 144. Semiconductor Die Attach Materials Market Drivers
Table 145. Semiconductor Die Attach Materials Market Challenges
Table 146. Semiconductor Die Attach Materials Market Restraints
Table 147. Research Programs/Design for This Report
Table 148. Key Data Information from Secondary Sources
Table 149. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Semiconductor Die Attach Materials
Figure 2. Global Semiconductor Die Attach Materials Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Semiconductor Die Attach Materials Market Share by Type: 2023 VS 2030
Figure 4. Die Attach Paste Product Picture
Figure 5. Die Attach Wire Product Picture
Figure 6. Others Product Picture
Figure 7. Global Semiconductor Die Attach Materials Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 8. Global Semiconductor Die Attach Materials Market Share by Application: 2023 VS 2030
Figure 9. Consumer Electronics
Figure 10. Automotive
Figure 11. Medical
Figure 12. Telecommunications
Figure 13. Others
Figure 14. Global Semiconductor Die Attach Materials Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 15. Global Semiconductor Die Attach Materials Production Value (US$ Million) & (2019-2030)
Figure 16. Global Semiconductor Die Attach Materials Production Capacity (Tons) & (2019-2030)
Figure 17. Global Semiconductor Die Attach Materials Production (Tons) & (2019-2030)
Figure 18. Global Semiconductor Die Attach Materials Average Price (US$/Ton) & (2019-2030)
Figure 19. Semiconductor Die Attach Materials Report Years Considered
Figure 20. Semiconductor Die Attach Materials Production Share by Manufacturers in 2023
Figure 21. Semiconductor Die Attach Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 22. The Global 5 and 10 Largest Players: Market Share by Semiconductor Die Attach Materials Revenue in 2023
Figure 23. Global Semiconductor Die Attach Materials Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 24. Global Semiconductor Die Attach Materials Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. Global Semiconductor Die Attach Materials Production Comparison by Region: 2019 VS 2023 VS 2030 (Tons)
Figure 26. Global Semiconductor Die Attach Materials Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 27. North America Semiconductor Die Attach Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Europe Semiconductor Die Attach Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. China Semiconductor Die Attach Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Japan Semiconductor Die Attach Materials Production Value (US$ Million) Growth Rate (2019-2030)
Figure 31. Global Semiconductor Die Attach Materials Consumption by Region: 2019 VS 2023 VS 2030 (Tons)
Figure 32. Global Semiconductor Die Attach Materials Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 33. North America Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 34. North America Semiconductor Die Attach Materials Consumption Market Share by Country (2019-2030)
Figure 35. Canada Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 36. U.S. Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 37. Europe Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 38. Europe Semiconductor Die Attach Materials Consumption Market Share by Country (2019-2030)
Figure 39. Germany Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 40. France Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 41. U.K. Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 42. Italy Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 43. Russia Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 44. Asia Pacific Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 45. Asia Pacific Semiconductor Die Attach Materials Consumption Market Share by Regions (2019-2030)
Figure 46. China Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 47. Japan Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 48. South Korea Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 49. China Taiwan Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 50. Southeast Asia Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 51. India Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 52. Latin America, Middle East & Africa Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 53. Latin America, Middle East & Africa Semiconductor Die Attach Materials Consumption Market Share by Country (2019-2030)
Figure 54. Mexico Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 55. Brazil Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 56. Turkey Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 57. GCC Countries Semiconductor Die Attach Materials Consumption and Growth Rate (2019-2024) & (Tons)
Figure 58. Global Production Market Share of Semiconductor Die Attach Materials by Type (2019-2030)
Figure 59. Global Production Value Market Share of Semiconductor Die Attach Materials by Type (2019-2030)
Figure 60. Global Semiconductor Die Attach Materials Price (US$/Ton) by Type (2019-2030)
Figure 61. Global Production Market Share of Semiconductor Die Attach Materials by Application (2019-2030)
Figure 62. Global Production Value Market Share of Semiconductor Die Attach Materials by Application (2019-2030)
Figure 63. Global Semiconductor Die Attach Materials Price (US$/Ton) by Application (2019-2030)
Figure 64. Semiconductor Die Attach Materials Value Chain
Figure 65. Semiconductor Die Attach Materials Production Process
Figure 66. Channels of Distribution (Direct Vs Distribution)
Figure 67. Distributors Profiles
Figure 68. Bottom-up and Top-down Approaches for This Report
Figure 69. Data Triangulation
Published By : QY Research
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