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Global Semiconductor Die Encapsulants Market Research Report 2025

Global Semiconductor Die Encapsulants Market Research Report 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1898076

No of Pages : 96

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Synopsis
The global Semiconductor Die Encapsulants market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Semiconductor Die Encapsulants is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Semiconductor Die Encapsulants is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Semiconductor Die Encapsulants include Ajinomoto Fine-Techno, DuPont, Shin-Etsu MicroSi, Henkel Adhesives, Inabata, LG Chem, Panasonic, Parker Hannifin and Sanyu Rec, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Die Encapsulants, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Die Encapsulants.
Report Scope
The Semiconductor Die Encapsulants market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Die Encapsulants market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Die Encapsulants manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Ajinomoto Fine-Techno
DuPont
Shin-Etsu MicroSi
Henkel Adhesives
Inabata
LG Chem
Panasonic
Parker Hannifin
Sanyu Rec
DELO
Segment by Type
Epoxy Resin Encapsulants
Polyimide Encapsulants
Silicone Encapsulants
Others
Segment by Application
Wafer Grade Packaging
Consumer Electronics
Automotive Electronics
LED Chips
Communication Devices
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Die Encapsulants manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Die Encapsulants by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Die Encapsulants in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index
1 Semiconductor Die Encapsulants Market Overview
1.1 Product Definition
1.2 Semiconductor Die Encapsulants Segment by Type
1.2.1 Global Semiconductor Die Encapsulants Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Epoxy Resin Encapsulants
1.2.3 Polyimide Encapsulants
1.2.4 Silicone Encapsulants
1.2.5 Others
1.3 Semiconductor Die Encapsulants Segment by Application
1.3.1 Global Semiconductor Die Encapsulants Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Wafer Grade Packaging
1.3.3 Consumer Electronics
1.3.4 Automotive Electronics
1.3.5 LED Chips
1.3.6 Communication Devices
1.3.7 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Die Encapsulants Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Die Encapsulants Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Die Encapsulants Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Die Encapsulants Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Die Encapsulants Production Market Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Die Encapsulants Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Die Encapsulants, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Die Encapsulants Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Die Encapsulants Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Die Encapsulants, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Die Encapsulants, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Die Encapsulants, Date of Enter into This Industry
2.9 Semiconductor Die Encapsulants Market Competitive Situation and Trends
2.9.1 Semiconductor Die Encapsulants Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Die Encapsulants Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Die Encapsulants Production by Region
3.1 Global Semiconductor Die Encapsulants Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Die Encapsulants Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Die Encapsulants Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Die Encapsulants by Region (2025-2030)
3.3 Global Semiconductor Die Encapsulants Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Die Encapsulants Production by Region (2019-2030)
3.4.1 Global Semiconductor Die Encapsulants Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Die Encapsulants by Region (2025-2030)
3.5 Global Semiconductor Die Encapsulants Market Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Die Encapsulants Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Die Encapsulants Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Die Encapsulants Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Die Encapsulants Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Die Encapsulants Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Die Encapsulants Consumption by Region
4.1 Global Semiconductor Die Encapsulants Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Die Encapsulants Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Die Encapsulants Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Die Encapsulants Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Die Encapsulants Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Die Encapsulants Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Die Encapsulants Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Die Encapsulants Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Die Encapsulants Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Die Encapsulants Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Die Encapsulants Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Die Encapsulants Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Die Encapsulants Production by Type (2019-2030)
5.1.1 Global Semiconductor Die Encapsulants Production by Type (2019-2024)
5.1.2 Global Semiconductor Die Encapsulants Production by Type (2025-2030)
5.1.3 Global Semiconductor Die Encapsulants Production Market Share by Type (2019-2030)
5.2 Global Semiconductor Die Encapsulants Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Die Encapsulants Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Die Encapsulants Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Die Encapsulants Production Value Market Share by Type (2019-2030)
5.3 Global Semiconductor Die Encapsulants Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Die Encapsulants Production by Application (2019-2030)
6.1.1 Global Semiconductor Die Encapsulants Production by Application (2019-2024)
6.1.2 Global Semiconductor Die Encapsulants Production by Application (2025-2030)
6.1.3 Global Semiconductor Die Encapsulants Production Market Share by Application (2019-2030)
6.2 Global Semiconductor Die Encapsulants Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Die Encapsulants Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Die Encapsulants Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Die Encapsulants Production Value Market Share by Application (2019-2030)
6.3 Global Semiconductor Die Encapsulants Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Ajinomoto Fine-Techno
7.1.1 Ajinomoto Fine-Techno Semiconductor Die Encapsulants Corporation Information
7.1.2 Ajinomoto Fine-Techno Semiconductor Die Encapsulants Product Portfolio
7.1.3 Ajinomoto Fine-Techno Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Ajinomoto Fine-Techno Main Business and Markets Served
7.1.5 Ajinomoto Fine-Techno Recent Developments/Updates
7.2 DuPont
7.2.1 DuPont Semiconductor Die Encapsulants Corporation Information
7.2.2 DuPont Semiconductor Die Encapsulants Product Portfolio
7.2.3 DuPont Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.2.4 DuPont Main Business and Markets Served
7.2.5 DuPont Recent Developments/Updates
7.3 Shin-Etsu MicroSi
7.3.1 Shin-Etsu MicroSi Semiconductor Die Encapsulants Corporation Information
7.3.2 Shin-Etsu MicroSi Semiconductor Die Encapsulants Product Portfolio
7.3.3 Shin-Etsu MicroSi Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Shin-Etsu MicroSi Main Business and Markets Served
7.3.5 Shin-Etsu MicroSi Recent Developments/Updates
7.4 Henkel Adhesives
7.4.1 Henkel Adhesives Semiconductor Die Encapsulants Corporation Information
7.4.2 Henkel Adhesives Semiconductor Die Encapsulants Product Portfolio
7.4.3 Henkel Adhesives Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Henkel Adhesives Main Business and Markets Served
7.4.5 Henkel Adhesives Recent Developments/Updates
7.5 Inabata
7.5.1 Inabata Semiconductor Die Encapsulants Corporation Information
7.5.2 Inabata Semiconductor Die Encapsulants Product Portfolio
7.5.3 Inabata Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Inabata Main Business and Markets Served
7.5.5 Inabata Recent Developments/Updates
7.6 LG Chem
7.6.1 LG Chem Semiconductor Die Encapsulants Corporation Information
7.6.2 LG Chem Semiconductor Die Encapsulants Product Portfolio
7.6.3 LG Chem Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.6.4 LG Chem Main Business and Markets Served
7.6.5 LG Chem Recent Developments/Updates
7.7 Panasonic
7.7.1 Panasonic Semiconductor Die Encapsulants Corporation Information
7.7.2 Panasonic Semiconductor Die Encapsulants Product Portfolio
7.7.3 Panasonic Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Panasonic Main Business and Markets Served
7.7.5 Panasonic Recent Developments/Updates
7.8 Parker Hannifin
7.8.1 Parker Hannifin Semiconductor Die Encapsulants Corporation Information
7.8.2 Parker Hannifin Semiconductor Die Encapsulants Product Portfolio
7.8.3 Parker Hannifin Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Parker Hannifin Main Business and Markets Served
7.7.5 Parker Hannifin Recent Developments/Updates
7.9 Sanyu Rec
7.9.1 Sanyu Rec Semiconductor Die Encapsulants Corporation Information
7.9.2 Sanyu Rec Semiconductor Die Encapsulants Product Portfolio
7.9.3 Sanyu Rec Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Sanyu Rec Main Business and Markets Served
7.9.5 Sanyu Rec Recent Developments/Updates
7.10 DELO
7.10.1 DELO Semiconductor Die Encapsulants Corporation Information
7.10.2 DELO Semiconductor Die Encapsulants Product Portfolio
7.10.3 DELO Semiconductor Die Encapsulants Production, Value, Price and Gross Margin (2019-2024)
7.10.4 DELO Main Business and Markets Served
7.10.5 DELO Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Die Encapsulants Industry Chain Analysis
8.2 Semiconductor Die Encapsulants Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Die Encapsulants Production Mode & Process
8.4 Semiconductor Die Encapsulants Sales and Marketing
8.4.1 Semiconductor Die Encapsulants Sales Channels
8.4.2 Semiconductor Die Encapsulants Distributors
8.5 Semiconductor Die Encapsulants Customers
9 Semiconductor Die Encapsulants Market Dynamics
9.1 Semiconductor Die Encapsulants Industry Trends
9.2 Semiconductor Die Encapsulants Market Drivers
9.3 Semiconductor Die Encapsulants Market Challenges
9.4 Semiconductor Die Encapsulants Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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