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Global Semiconductor Epoxy Molding Compound Market Research Report 2025
Synopsis
Semiconductor epoxy molding compound (EMC) is a critical material used in the semiconductor packaging process. It is a thermosetting resin-based compound that encapsulates and protects semiconductor chips and wire bonds. The epoxy molding compound is applied in a process known as "transfer molding" to form the protective encapsulation around the semiconductor device.
Global Semiconductor Epoxy Molding Compound market is projected to reach US$ 3119.3 million in 2029, increasing from US$ 2248 million in 2022, with the CAGR of 4.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Epoxy Molding Compound market research.
The semiconductor epoxy molding compound (EMC) market plays a crucial role in the semiconductor packaging industry. EMC is widely used to encapsulate and protect semiconductor devices, providing mechanical, thermal, and electrical properties that enhance the reliability and performance of the chips. The demand for semiconductor devices across various industries, such as consumer electronics, automotive, industrial, and telecommunications, has been a significant driver for the growth of the EMC market. The demand for semiconductor epoxy molding compounds is spread across regions, with Asia-Pacific being a dominant market due to the presence of major semiconductor manufacturers in countries like China, Taiwan, South Korea, and Japan. North America and Europe also contribute significantly to the global market, owing to the strong presence of semiconductor and electronics industries in these regions. The semiconductor epoxy molding compound market is expected to witness continued growth in the coming years, driven by the expansion of semiconductor applications, advancements in packaging technologies, and the increasing need for reliable and efficient semiconductor devices in various industries.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Epoxy Molding Compound market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Hitachi Chemical
Sumitomo Bakelite Company
Panasonic
Kyocera
Samsung SDI
KCC Corporation
Chang Chun Group
Hysol Huawei Electronics
Nepes
PhiChem Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
CAPLINQ Corporation
Scienchem
Segment by Type
Bulk Molding Compounds
Sheet Molding Compounds
Segment by Application
Semiconductor Packaging
Electronic Component
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Semiconductor Epoxy Molding Compound report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Semiconductor epoxy molding compound (EMC) is a critical material used in the semiconductor packaging process. It is a thermosetting resin-based compound that encapsulates and protects semiconductor chips and wire bonds. The epoxy molding compound is applied in a process known as "transfer molding" to form the protective encapsulation around the semiconductor device.
Global Semiconductor Epoxy Molding Compound market is projected to reach US$ 3119.3 million in 2029, increasing from US$ 2248 million in 2022, with the CAGR of 4.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Epoxy Molding Compound market research.
The semiconductor epoxy molding compound (EMC) market plays a crucial role in the semiconductor packaging industry. EMC is widely used to encapsulate and protect semiconductor devices, providing mechanical, thermal, and electrical properties that enhance the reliability and performance of the chips. The demand for semiconductor devices across various industries, such as consumer electronics, automotive, industrial, and telecommunications, has been a significant driver for the growth of the EMC market. The demand for semiconductor epoxy molding compounds is spread across regions, with Asia-Pacific being a dominant market due to the presence of major semiconductor manufacturers in countries like China, Taiwan, South Korea, and Japan. North America and Europe also contribute significantly to the global market, owing to the strong presence of semiconductor and electronics industries in these regions. The semiconductor epoxy molding compound market is expected to witness continued growth in the coming years, driven by the expansion of semiconductor applications, advancements in packaging technologies, and the increasing need for reliable and efficient semiconductor devices in various industries.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Epoxy Molding Compound market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Hitachi Chemical
Sumitomo Bakelite Company
Panasonic
Kyocera
Samsung SDI
KCC Corporation
Chang Chun Group
Hysol Huawei Electronics
Nepes
PhiChem Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
CAPLINQ Corporation
Scienchem
Segment by Type
Bulk Molding Compounds
Sheet Molding Compounds
Segment by Application
Semiconductor Packaging
Electronic Component
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Semiconductor Epoxy Molding Compound report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Semiconductor Epoxy Molding Compound Market Overview
1.1 Product Definition
1.2 Semiconductor Epoxy Molding Compound Segment by Type
1.2.1 Global Semiconductor Epoxy Molding Compound Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Bulk Molding Compounds
1.2.3 Sheet Molding Compounds
1.3 Semiconductor Epoxy Molding Compound Segment by Application
1.3.1 Global Semiconductor Epoxy Molding Compound Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor Packaging
1.3.3 Electronic Component
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Epoxy Molding Compound Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor Epoxy Molding Compound Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor Epoxy Molding Compound Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor Epoxy Molding Compound Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Epoxy Molding Compound Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor Epoxy Molding Compound Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor Epoxy Molding Compound, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor Epoxy Molding Compound Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Epoxy Molding Compound Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor Epoxy Molding Compound, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Epoxy Molding Compound, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Epoxy Molding Compound, Date of Enter into This Industry
2.9 Semiconductor Epoxy Molding Compound Market Competitive Situation and Trends
2.9.1 Semiconductor Epoxy Molding Compound Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Epoxy Molding Compound Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Epoxy Molding Compound Production by Region
3.1 Global Semiconductor Epoxy Molding Compound Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Epoxy Molding Compound Production Value by Region (2018-2029)
3.2.1 Global Semiconductor Epoxy Molding Compound Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor Epoxy Molding Compound by Region (2024-2029)
3.3 Global Semiconductor Epoxy Molding Compound Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor Epoxy Molding Compound Production by Region (2018-2029)
3.4.1 Global Semiconductor Epoxy Molding Compound Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor Epoxy Molding Compound by Region (2024-2029)
3.5 Global Semiconductor Epoxy Molding Compound Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor Epoxy Molding Compound Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Epoxy Molding Compound Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor Epoxy Molding Compound Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor Epoxy Molding Compound Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor Epoxy Molding Compound Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor Epoxy Molding Compound Consumption by Region
4.1 Global Semiconductor Epoxy Molding Compound Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor Epoxy Molding Compound Consumption by Region (2018-2029)
4.2.1 Global Semiconductor Epoxy Molding Compound Consumption by Region (2018-2023)
4.2.2 Global Semiconductor Epoxy Molding Compound Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor Epoxy Molding Compound Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor Epoxy Molding Compound Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Epoxy Molding Compound Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor Epoxy Molding Compound Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Epoxy Molding Compound Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor Epoxy Molding Compound Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Epoxy Molding Compound Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor Epoxy Molding Compound Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Epoxy Molding Compound Production by Type (2018-2029)
5.1.1 Global Semiconductor Epoxy Molding Compound Production by Type (2018-2023)
5.1.2 Global Semiconductor Epoxy Molding Compound Production by Type (2024-2029)
5.1.3 Global Semiconductor Epoxy Molding Compound Production Market Share by Type (2018-2029)
5.2 Global Semiconductor Epoxy Molding Compound Production Value by Type (2018-2029)
5.2.1 Global Semiconductor Epoxy Molding Compound Production Value by Type (2018-2023)
5.2.2 Global Semiconductor Epoxy Molding Compound Production Value by Type (2024-2029)
5.2.3 Global Semiconductor Epoxy Molding Compound Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor Epoxy Molding Compound Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor Epoxy Molding Compound Production by Application (2018-2029)
6.1.1 Global Semiconductor Epoxy Molding Compound Production by Application (2018-2023)
6.1.2 Global Semiconductor Epoxy Molding Compound Production by Application (2024-2029)
6.1.3 Global Semiconductor Epoxy Molding Compound Production Market Share by Application (2018-2029)
6.2 Global Semiconductor Epoxy Molding Compound Production Value by Application (2018-2029)
6.2.1 Global Semiconductor Epoxy Molding Compound Production Value by Application (2018-2023)
6.2.2 Global Semiconductor Epoxy Molding Compound Production Value by Application (2024-2029)
6.2.3 Global Semiconductor Epoxy Molding Compound Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor Epoxy Molding Compound Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Hitachi Chemical
7.1.1 Hitachi Chemical Semiconductor Epoxy Molding Compound Corporation Information
7.1.2 Hitachi Chemical Semiconductor Epoxy Molding Compound Product Portfolio
7.1.3 Hitachi Chemical Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Hitachi Chemical Main Business and Markets Served
7.1.5 Hitachi Chemical Recent Developments/Updates
7.2 Sumitomo Bakelite Company
7.2.1 Sumitomo Bakelite Company Semiconductor Epoxy Molding Compound Corporation Information
7.2.2 Sumitomo Bakelite Company Semiconductor Epoxy Molding Compound Product Portfolio
7.2.3 Sumitomo Bakelite Company Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Sumitomo Bakelite Company Main Business and Markets Served
7.2.5 Sumitomo Bakelite Company Recent Developments/Updates
7.3 Panasonic
7.3.1 Panasonic Semiconductor Epoxy Molding Compound Corporation Information
7.3.2 Panasonic Semiconductor Epoxy Molding Compound Product Portfolio
7.3.3 Panasonic Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Panasonic Main Business and Markets Served
7.3.5 Panasonic Recent Developments/Updates
7.4 Kyocera
7.4.1 Kyocera Semiconductor Epoxy Molding Compound Corporation Information
7.4.2 Kyocera Semiconductor Epoxy Molding Compound Product Portfolio
7.4.3 Kyocera Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Kyocera Main Business and Markets Served
7.4.5 Kyocera Recent Developments/Updates
7.5 Samsung SDI
7.5.1 Samsung SDI Semiconductor Epoxy Molding Compound Corporation Information
7.5.2 Samsung SDI Semiconductor Epoxy Molding Compound Product Portfolio
7.5.3 Samsung SDI Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Samsung SDI Main Business and Markets Served
7.5.5 Samsung SDI Recent Developments/Updates
7.6 KCC Corporation
7.6.1 KCC Corporation Semiconductor Epoxy Molding Compound Corporation Information
7.6.2 KCC Corporation Semiconductor Epoxy Molding Compound Product Portfolio
7.6.3 KCC Corporation Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.6.4 KCC Corporation Main Business and Markets Served
7.6.5 KCC Corporation Recent Developments/Updates
7.7 Chang Chun Group
7.7.1 Chang Chun Group Semiconductor Epoxy Molding Compound Corporation Information
7.7.2 Chang Chun Group Semiconductor Epoxy Molding Compound Product Portfolio
7.7.3 Chang Chun Group Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Chang Chun Group Main Business and Markets Served
7.7.5 Chang Chun Group Recent Developments/Updates
7.8 Hysol Huawei Electronics
7.8.1 Hysol Huawei Electronics Semiconductor Epoxy Molding Compound Corporation Information
7.8.2 Hysol Huawei Electronics Semiconductor Epoxy Molding Compound Product Portfolio
7.8.3 Hysol Huawei Electronics Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Hysol Huawei Electronics Main Business and Markets Served
7.7.5 Hysol Huawei Electronics Recent Developments/Updates
7.9 Nepes
7.9.1 Nepes Semiconductor Epoxy Molding Compound Corporation Information
7.9.2 Nepes Semiconductor Epoxy Molding Compound Product Portfolio
7.9.3 Nepes Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Nepes Main Business and Markets Served
7.9.5 Nepes Recent Developments/Updates
7.10 PhiChem Materials
7.10.1 PhiChem Materials Semiconductor Epoxy Molding Compound Corporation Information
7.10.2 PhiChem Materials Semiconductor Epoxy Molding Compound Product Portfolio
7.10.3 PhiChem Materials Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.10.4 PhiChem Materials Main Business and Markets Served
7.10.5 PhiChem Materials Recent Developments/Updates
7.11 Jiangsu Zhongpeng New Material
7.11.1 Jiangsu Zhongpeng New Material Semiconductor Epoxy Molding Compound Corporation Information
7.11.2 Jiangsu Zhongpeng New Material Semiconductor Epoxy Molding Compound Product Portfolio
7.11.3 Jiangsu Zhongpeng New Material Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Jiangsu Zhongpeng New Material Main Business and Markets Served
7.11.5 Jiangsu Zhongpeng New Material Recent Developments/Updates
7.12 Shin-Etsu Chemical
7.12.1 Shin-Etsu Chemical Semiconductor Epoxy Molding Compound Corporation Information
7.12.2 Shin-Etsu Chemical Semiconductor Epoxy Molding Compound Product Portfolio
7.12.3 Shin-Etsu Chemical Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Shin-Etsu Chemical Main Business and Markets Served
7.12.5 Shin-Etsu Chemical Recent Developments/Updates
7.13 CAPLINQ Corporation
7.13.1 CAPLINQ Corporation Semiconductor Epoxy Molding Compound Corporation Information
7.13.2 CAPLINQ Corporation Semiconductor Epoxy Molding Compound Product Portfolio
7.13.3 CAPLINQ Corporation Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.13.4 CAPLINQ Corporation Main Business and Markets Served
7.13.5 CAPLINQ Corporation Recent Developments/Updates
7.14 Scienchem
7.14.1 Scienchem Semiconductor Epoxy Molding Compound Corporation Information
7.14.2 Scienchem Semiconductor Epoxy Molding Compound Product Portfolio
7.14.3 Scienchem Semiconductor Epoxy Molding Compound Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Scienchem Main Business and Markets Served
7.14.5 Scienchem Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Epoxy Molding Compound Industry Chain Analysis
8.2 Semiconductor Epoxy Molding Compound Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Epoxy Molding Compound Production Mode & Process
8.4 Semiconductor Epoxy Molding Compound Sales and Marketing
8.4.1 Semiconductor Epoxy Molding Compound Sales Channels
8.4.2 Semiconductor Epoxy Molding Compound Distributors
8.5 Semiconductor Epoxy Molding Compound Customers
9 Semiconductor Epoxy Molding Compound Market Dynamics
9.1 Semiconductor Epoxy Molding Compound Industry Trends
9.2 Semiconductor Epoxy Molding Compound Market Drivers
9.3 Semiconductor Epoxy Molding Compound Market Challenges
9.4 Semiconductor Epoxy Molding Compound Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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