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Global Semiconductor & IC Packaging Market Research Report 2025
Synopsis
Global Semiconductor & IC Packaging market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor & IC Packaging market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor & IC Packaging market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Semiconductor & IC Packaging report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
Global Semiconductor & IC Packaging market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor & IC Packaging market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor & IC Packaging market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
Kyocera
Unisem
NantongFujitsu Microelectronics
Hana Micron
Walton Advanced Engineering
Signetics
Intel Corp
LINGSEN
Segment by Type
DIP
SOP
QFP
QFN
BGA
CSP
Others
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Semiconductor & IC Packaging report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor & IC Packaging Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 DIP
1.2.3 SOP
1.2.4 QFP
1.2.5 QFN
1.2.6 BGA
1.2.7 CSP
1.2.8 Others
1.3 Market by Application
1.3.1 Global Semiconductor & IC Packaging Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Telecommunications
1.3.3 Automotive
1.3.4 Aerospace and Defense
1.3.5 Medical Devices
1.3.6 Consumer Electronics
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor & IC Packaging Market Perspective (2018-2029)
2.2 Semiconductor & IC Packaging Growth Trends by Region
2.2.1 Global Semiconductor & IC Packaging Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Semiconductor & IC Packaging Historic Market Size by Region (2018-2023)
2.2.3 Semiconductor & IC Packaging Forecasted Market Size by Region (2024-2029)
2.3 Semiconductor & IC Packaging Market Dynamics
2.3.1 Semiconductor & IC Packaging Industry Trends
2.3.2 Semiconductor & IC Packaging Market Drivers
2.3.3 Semiconductor & IC Packaging Market Challenges
2.3.4 Semiconductor & IC Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor & IC Packaging Players by Revenue
3.1.1 Global Top Semiconductor & IC Packaging Players by Revenue (2018-2023)
3.1.2 Global Semiconductor & IC Packaging Revenue Market Share by Players (2018-2023)
3.2 Global Semiconductor & IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Semiconductor & IC Packaging Revenue
3.4 Global Semiconductor & IC Packaging Market Concentration Ratio
3.4.1 Global Semiconductor & IC Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor & IC Packaging Revenue in 2022
3.5 Semiconductor & IC Packaging Key Players Head office and Area Served
3.6 Key Players Semiconductor & IC Packaging Product Solution and Service
3.7 Date of Enter into Semiconductor & IC Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor & IC Packaging Breakdown Data by Type
4.1 Global Semiconductor & IC Packaging Historic Market Size by Type (2018-2023)
4.2 Global Semiconductor & IC Packaging Forecasted Market Size by Type (2024-2029)
5 Semiconductor & IC Packaging Breakdown Data by Application
5.1 Global Semiconductor & IC Packaging Historic Market Size by Application (2018-2023)
5.2 Global Semiconductor & IC Packaging Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Semiconductor & IC Packaging Market Size (2018-2029)
6.2 North America Semiconductor & IC Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Semiconductor & IC Packaging Market Size by Country (2018-2023)
6.4 North America Semiconductor & IC Packaging Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor & IC Packaging Market Size (2018-2029)
7.2 Europe Semiconductor & IC Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Semiconductor & IC Packaging Market Size by Country (2018-2023)
7.4 Europe Semiconductor & IC Packaging Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor & IC Packaging Market Size (2018-2029)
8.2 Asia-Pacific Semiconductor & IC Packaging Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Semiconductor & IC Packaging Market Size by Region (2018-2023)
8.4 Asia-Pacific Semiconductor & IC Packaging Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor & IC Packaging Market Size (2018-2029)
9.2 Latin America Semiconductor & IC Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Semiconductor & IC Packaging Market Size by Country (2018-2023)
9.4 Latin America Semiconductor & IC Packaging Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor & IC Packaging Market Size (2018-2029)
10.2 Middle East & Africa Semiconductor & IC Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Semiconductor & IC Packaging Market Size by Country (2018-2023)
10.4 Middle East & Africa Semiconductor & IC Packaging Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Detail
11.1.2 ASE Business Overview
11.1.3 ASE Semiconductor & IC Packaging Introduction
11.1.4 ASE Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.1.5 ASE Recent Development
11.2 Amkor
11.2.1 Amkor Company Detail
11.2.2 Amkor Business Overview
11.2.3 Amkor Semiconductor & IC Packaging Introduction
11.2.4 Amkor Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.2.5 Amkor Recent Development
11.3 SPIL
11.3.1 SPIL Company Detail
11.3.2 SPIL Business Overview
11.3.3 SPIL Semiconductor & IC Packaging Introduction
11.3.4 SPIL Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.3.5 SPIL Recent Development
11.4 STATS ChipPac
11.4.1 STATS ChipPac Company Detail
11.4.2 STATS ChipPac Business Overview
11.4.3 STATS ChipPac Semiconductor & IC Packaging Introduction
11.4.4 STATS ChipPac Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.4.5 STATS ChipPac Recent Development
11.5 Powertech Technology
11.5.1 Powertech Technology Company Detail
11.5.2 Powertech Technology Business Overview
11.5.3 Powertech Technology Semiconductor & IC Packaging Introduction
11.5.4 Powertech Technology Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.5.5 Powertech Technology Recent Development
11.6 J-devices
11.6.1 J-devices Company Detail
11.6.2 J-devices Business Overview
11.6.3 J-devices Semiconductor & IC Packaging Introduction
11.6.4 J-devices Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.6.5 J-devices Recent Development
11.7 UTAC
11.7.1 UTAC Company Detail
11.7.2 UTAC Business Overview
11.7.3 UTAC Semiconductor & IC Packaging Introduction
11.7.4 UTAC Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.7.5 UTAC Recent Development
11.8 JECT
11.8.1 JECT Company Detail
11.8.2 JECT Business Overview
11.8.3 JECT Semiconductor & IC Packaging Introduction
11.8.4 JECT Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.8.5 JECT Recent Development
11.9 ChipMOS
11.9.1 ChipMOS Company Detail
11.9.2 ChipMOS Business Overview
11.9.3 ChipMOS Semiconductor & IC Packaging Introduction
11.9.4 ChipMOS Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.9.5 ChipMOS Recent Development
11.10 Chipbond
11.10.1 Chipbond Company Detail
11.10.2 Chipbond Business Overview
11.10.3 Chipbond Semiconductor & IC Packaging Introduction
11.10.4 Chipbond Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.10.5 Chipbond Recent Development
11.11 KYEC
11.11.1 KYEC Company Detail
11.11.2 KYEC Business Overview
11.11.3 KYEC Semiconductor & IC Packaging Introduction
11.11.4 KYEC Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.11.5 KYEC Recent Development
11.12 STS Semiconductor
11.12.1 STS Semiconductor Company Detail
11.12.2 STS Semiconductor Business Overview
11.12.3 STS Semiconductor Semiconductor & IC Packaging Introduction
11.12.4 STS Semiconductor Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.12.5 STS Semiconductor Recent Development
11.13 Huatian
11.13.1 Huatian Company Detail
11.13.2 Huatian Business Overview
11.13.3 Huatian Semiconductor & IC Packaging Introduction
11.13.4 Huatian Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.13.5 Huatian Recent Development
11.14 MPl(Carsem)
11.14.1 MPl(Carsem) Company Detail
11.14.2 MPl(Carsem) Business Overview
11.14.3 MPl(Carsem) Semiconductor & IC Packaging Introduction
11.14.4 MPl(Carsem) Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.14.5 MPl(Carsem) Recent Development
11.15 Nepes
11.15.1 Nepes Company Detail
11.15.2 Nepes Business Overview
11.15.3 Nepes Semiconductor & IC Packaging Introduction
11.15.4 Nepes Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.15.5 Nepes Recent Development
11.16 FATC
11.16.1 FATC Company Detail
11.16.2 FATC Business Overview
11.16.3 FATC Semiconductor & IC Packaging Introduction
11.16.4 FATC Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.16.5 FATC Recent Development
11.17 Walton
11.17.1 Walton Company Detail
11.17.2 Walton Business Overview
11.17.3 Walton Semiconductor & IC Packaging Introduction
11.17.4 Walton Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.17.5 Walton Recent Development
11.18 Kyocera
11.18.1 Kyocera Company Detail
11.18.2 Kyocera Business Overview
11.18.3 Kyocera Semiconductor & IC Packaging Introduction
11.18.4 Kyocera Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.18.5 Kyocera Recent Development
11.19 Unisem
11.19.1 Unisem Company Detail
11.19.2 Unisem Business Overview
11.19.3 Unisem Semiconductor & IC Packaging Introduction
11.19.4 Unisem Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.19.5 Unisem Recent Development
11.20 NantongFujitsu Microelectronics
11.20.1 NantongFujitsu Microelectronics Company Detail
11.20.2 NantongFujitsu Microelectronics Business Overview
11.20.3 NantongFujitsu Microelectronics Semiconductor & IC Packaging Introduction
11.20.4 NantongFujitsu Microelectronics Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.20.5 NantongFujitsu Microelectronics Recent Development
11.21 Hana Micron
11.21.1 Hana Micron Company Detail
11.21.2 Hana Micron Business Overview
11.21.3 Hana Micron Semiconductor & IC Packaging Introduction
11.21.4 Hana Micron Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.21.5 Hana Micron Recent Development
11.22 Walton Advanced Engineering
11.22.1 Walton Advanced Engineering Company Detail
11.22.2 Walton Advanced Engineering Business Overview
11.22.3 Walton Advanced Engineering Semiconductor & IC Packaging Introduction
11.22.4 Walton Advanced Engineering Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.22.5 Walton Advanced Engineering Recent Development
11.23 Signetics
11.23.1 Signetics Company Detail
11.23.2 Signetics Business Overview
11.23.3 Signetics Semiconductor & IC Packaging Introduction
11.23.4 Signetics Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.23.5 Signetics Recent Development
11.24 Intel Corp
11.24.1 Intel Corp Company Detail
11.24.2 Intel Corp Business Overview
11.24.3 Intel Corp Semiconductor & IC Packaging Introduction
11.24.4 Intel Corp Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.24.5 Intel Corp Recent Development
11.25 LINGSEN
11.25.1 LINGSEN Company Detail
11.25.2 LINGSEN Business Overview
11.25.3 LINGSEN Semiconductor & IC Packaging Introduction
11.25.4 LINGSEN Revenue in Semiconductor & IC Packaging Business (2018-2023)
11.25.5 LINGSEN Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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