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Global Semiconductor Molding Systems Market Research Report 2025
Synopsis
The so-called "Molding" refers to the molding process in which the semiconductor is electrically insulated from the outside by resin encapsulation. It protects the chip by injecting fluid resin from the gate around the semiconductor chip and curing it. Automatic molding machine refers to the fully automatic semiconductor packaging process equipment that automatically transports the lead frame from the feeding box for plastic sealing, and then removes the residual glue and then transports it to the discharging box.
The prices in this report are for individual machines and do not include molds.
The global Semiconductor Molding Systems market was valued at US$ 443.3 million in 2023 and is anticipated to reach US$ 712.6 million by 2030, witnessing a CAGR of 10.2% during the forecast period 2024-2030.
Global core semiconductor molding systems manufacturers include TOWA, ASMPT etc.The top 2 companies hold a share about 70%.Japan is the largest market, with a share about 75%, followed by China and Europe with the share about 15% and 10%.In terms of product, fully automatic is the largest segment, with a share over 60%. And in terms of application, the largest application is BGA packaging, followed by wafer level packaging.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Molding Systems, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Molding Systems.
Report Scope
The Semiconductor Molding Systems market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Molding Systems market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Molding Systems manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
Segment by Type
Fully Automatic
Semi-automatic
Manual
Segment by Application
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Production by Region
North America
Europe
China
Japan
Southeast Asia
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Molding Systems manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Molding Systems by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Molding Systems in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The so-called "Molding" refers to the molding process in which the semiconductor is electrically insulated from the outside by resin encapsulation. It protects the chip by injecting fluid resin from the gate around the semiconductor chip and curing it. Automatic molding machine refers to the fully automatic semiconductor packaging process equipment that automatically transports the lead frame from the feeding box for plastic sealing, and then removes the residual glue and then transports it to the discharging box.
The prices in this report are for individual machines and do not include molds.
The global Semiconductor Molding Systems market was valued at US$ 443.3 million in 2023 and is anticipated to reach US$ 712.6 million by 2030, witnessing a CAGR of 10.2% during the forecast period 2024-2030.
Global core semiconductor molding systems manufacturers include TOWA, ASMPT etc.The top 2 companies hold a share about 70%.Japan is the largest market, with a share about 75%, followed by China and Europe with the share about 15% and 10%.In terms of product, fully automatic is the largest segment, with a share over 60%. And in terms of application, the largest application is BGA packaging, followed by wafer level packaging.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Molding Systems, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Molding Systems.
Report Scope
The Semiconductor Molding Systems market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Molding Systems market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Molding Systems manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TOWA
ASMPT
Besi
I-PEX
Yamada
TAKARA TOOL & DIE
Asahi Engineering
Tongling Fushi Sanjia
Nextool Technology
DAHUA Technology
Segment by Type
Fully Automatic
Semi-automatic
Manual
Segment by Application
Wafer Level Packaging
BGA Packaging
Flat Panel Packaging
Others
Production by Region
North America
Europe
China
Japan
Southeast Asia
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Molding Systems manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Molding Systems by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Molding Systems in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Semiconductor Molding Systems Market Overview
1.1 Product Definition
1.2 Semiconductor Molding Systems Segment by Type
1.2.1 Global Semiconductor Molding Systems Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Fully Automatic
1.2.3 Semi-automatic
1.2.4 Manual
1.3 Semiconductor Molding Systems Segment by Application
1.3.1 Global Semiconductor Molding Systems Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Wafer Level Packaging
1.3.3 BGA Packaging
1.3.4 Flat Panel Packaging
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Molding Systems Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Molding Systems Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Molding Systems Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Molding Systems Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Molding Systems Production Market Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Molding Systems Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Molding Systems, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Molding Systems Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Molding Systems Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Molding Systems, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Molding Systems, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Molding Systems, Date of Enter into This Industry
2.9 Semiconductor Molding Systems Market Competitive Situation and Trends
2.9.1 Semiconductor Molding Systems Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Molding Systems Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Molding Systems Production by Region
3.1 Global Semiconductor Molding Systems Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Molding Systems Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Molding Systems Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Molding Systems by Region (2025-2030)
3.3 Global Semiconductor Molding Systems Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Molding Systems Production by Region (2019-2030)
3.4.1 Global Semiconductor Molding Systems Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Molding Systems by Region (2025-2030)
3.5 Global Semiconductor Molding Systems Market Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Molding Systems Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Molding Systems Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Molding Systems Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Molding Systems Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Molding Systems Production Value Estimates and Forecasts (2019-2030)
3.6.5 Southeast Asia Semiconductor Molding Systems Production Value Estimates and Forecasts (2019-2030)
3.6.6 South Korea Semiconductor Molding Systems Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Molding Systems Consumption by Region
4.1 Global Semiconductor Molding Systems Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Molding Systems Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Molding Systems Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Molding Systems Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Molding Systems Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Molding Systems Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Molding Systems Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Molding Systems Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Molding Systems Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Molding Systems Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Molding Systems Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Molding Systems Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Molding Systems Production by Type (2019-2030)
5.1.1 Global Semiconductor Molding Systems Production by Type (2019-2024)
5.1.2 Global Semiconductor Molding Systems Production by Type (2025-2030)
5.1.3 Global Semiconductor Molding Systems Production Market Share by Type (2019-2030)
5.2 Global Semiconductor Molding Systems Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Molding Systems Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Molding Systems Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Molding Systems Production Value Market Share by Type (2019-2030)
5.3 Global Semiconductor Molding Systems Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Molding Systems Production by Application (2019-2030)
6.1.1 Global Semiconductor Molding Systems Production by Application (2019-2024)
6.1.2 Global Semiconductor Molding Systems Production by Application (2025-2030)
6.1.3 Global Semiconductor Molding Systems Production Market Share by Application (2019-2030)
6.2 Global Semiconductor Molding Systems Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Molding Systems Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Molding Systems Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Molding Systems Production Value Market Share by Application (2019-2030)
6.3 Global Semiconductor Molding Systems Price by Application (2019-2030)
7 Key Companies Profiled
7.1 TOWA
7.1.1 TOWA Semiconductor Molding Systems Corporation Information
7.1.2 TOWA Semiconductor Molding Systems Product Portfolio
7.1.3 TOWA Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.1.4 TOWA Main Business and Markets Served
7.1.5 TOWA Recent Developments/Updates
7.2 ASMPT
7.2.1 ASMPT Semiconductor Molding Systems Corporation Information
7.2.2 ASMPT Semiconductor Molding Systems Product Portfolio
7.2.3 ASMPT Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.2.4 ASMPT Main Business and Markets Served
7.2.5 ASMPT Recent Developments/Updates
7.3 Besi
7.3.1 Besi Semiconductor Molding Systems Corporation Information
7.3.2 Besi Semiconductor Molding Systems Product Portfolio
7.3.3 Besi Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Besi Main Business and Markets Served
7.3.5 Besi Recent Developments/Updates
7.4 I-PEX
7.4.1 I-PEX Semiconductor Molding Systems Corporation Information
7.4.2 I-PEX Semiconductor Molding Systems Product Portfolio
7.4.3 I-PEX Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.4.4 I-PEX Main Business and Markets Served
7.4.5 I-PEX Recent Developments/Updates
7.5 Yamada
7.5.1 Yamada Semiconductor Molding Systems Corporation Information
7.5.2 Yamada Semiconductor Molding Systems Product Portfolio
7.5.3 Yamada Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Yamada Main Business and Markets Served
7.5.5 Yamada Recent Developments/Updates
7.6 TAKARA TOOL & DIE
7.6.1 TAKARA TOOL & DIE Semiconductor Molding Systems Corporation Information
7.6.2 TAKARA TOOL & DIE Semiconductor Molding Systems Product Portfolio
7.6.3 TAKARA TOOL & DIE Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.6.4 TAKARA TOOL & DIE Main Business and Markets Served
7.6.5 TAKARA TOOL & DIE Recent Developments/Updates
7.7 Asahi Engineering
7.7.1 Asahi Engineering Semiconductor Molding Systems Corporation Information
7.7.2 Asahi Engineering Semiconductor Molding Systems Product Portfolio
7.7.3 Asahi Engineering Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Asahi Engineering Main Business and Markets Served
7.7.5 Asahi Engineering Recent Developments/Updates
7.8 Tongling Fushi Sanjia
7.8.1 Tongling Fushi Sanjia Semiconductor Molding Systems Corporation Information
7.8.2 Tongling Fushi Sanjia Semiconductor Molding Systems Product Portfolio
7.8.3 Tongling Fushi Sanjia Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Tongling Fushi Sanjia Main Business and Markets Served
7.7.5 Tongling Fushi Sanjia Recent Developments/Updates
7.9 Nextool Technology
7.9.1 Nextool Technology Semiconductor Molding Systems Corporation Information
7.9.2 Nextool Technology Semiconductor Molding Systems Product Portfolio
7.9.3 Nextool Technology Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Nextool Technology Main Business and Markets Served
7.9.5 Nextool Technology Recent Developments/Updates
7.10 DAHUA Technology
7.10.1 DAHUA Technology Semiconductor Molding Systems Corporation Information
7.10.2 DAHUA Technology Semiconductor Molding Systems Product Portfolio
7.10.3 DAHUA Technology Semiconductor Molding Systems Production, Value, Price and Gross Margin (2019-2024)
7.10.4 DAHUA Technology Main Business and Markets Served
7.10.5 DAHUA Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Molding Systems Industry Chain Analysis
8.2 Semiconductor Molding Systems Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Molding Systems Production Mode & Process
8.4 Semiconductor Molding Systems Sales and Marketing
8.4.1 Semiconductor Molding Systems Sales Channels
8.4.2 Semiconductor Molding Systems Distributors
8.5 Semiconductor Molding Systems Customers
9 Semiconductor Molding Systems Market Dynamics
9.1 Semiconductor Molding Systems Industry Trends
9.2 Semiconductor Molding Systems Market Drivers
9.3 Semiconductor Molding Systems Market Challenges
9.4 Semiconductor Molding Systems Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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