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Global Semiconductor Packaging and Assembly Equipment Market Outlook 2024

Global Semiconductor Packaging and Assembly Equipment Market Outlook 2024

Publishing Date : Dec, 2021

License Type :
 

Report Code : 1635371

No of Pages : 116

Synopsis
For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.
The die-level packaging and assembly equipment segment to be the major revenue contributing segment in this market during the forecasted period.

Market Analysis and Insights: Global Semiconductor Packaging and Assembly Equipment Market
The global Semiconductor Packaging and Assembly Equipment market was valued at US$ 2755.5 million in 2020 and it is expected to reach US$ 4224.9 million by the end of 2027, growing at a CAGR of 5.8% during 2021-2027.

Global Semiconductor Packaging and Assembly Equipment Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Semiconductor Packaging and Assembly Equipment Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.

Segment by Type

  • Die- Level Packaging and Assembly Equipment
  • Wafer-Level Packaging and Assembly Equipment

Segment by Application

  • IDM(Integrated Device Manufacturers)
  • OSAT(Outsourced Semiconductor Assembly and Test Companies)

By Company

  • Applied Materials
  • ASMPT
  • DISCO Corporation
  • EV Group
  • Kulicke and Soffa Industries
  • TEL
  • Tokyo Seimitsu
  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • Veeco/CNT
  • Ulvac Technologies

Consumption by Region

  • North America (United States, Canada, Mexico)
  • Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia, Other Regions)
  • Europe (Germany, U.K., France, Italy, Russia, Rest of Europe)
  • South America (Brazil, Argentina, Rest of South America)
  • Middle East & Africa (Turkey, Saudi Arabia, U.A.E., South Africa, Other Regions)

Scope of the Semiconductor Packaging and Assembly Equipment Market Report

Report Metric

Details

Report Name

Semiconductor Packaging and Assembly Equipment Market

Market size in 2021

US$ 2755.5 Million

The revenue forecast in 2027

US$ 4224.9 Million

Growth Rate

CAGR of 5.8% from 2021 to 2027

Market size available for years

2020-2027

Forecast units

Value (USD) & Volume (Units)

Segments covered

Types, End-User / Applications, Companies, and Region

Report coverage

Revenue & volume forecast, company share, competitive landscape, growth factors, and trends

Geographic regions covered

North America, Europe, Asia Pacific, Latin America, Middle East & Africa

 

Index

1 Semiconductor Packaging and Assembly Equipment Market Overview
1.1 Product Overview and Scope of Semiconductor Packaging and Assembly Equipment
1.2 Semiconductor Packaging and Assembly Equipment Segment by Type
1.2.1 Global Semiconductor Packaging and Assembly Equipment Market Size Growth Rate Analysis by Type 2021 VS 2027
1.2.2 Die- Level Packaging and Assembly Equipment
1.2.3 Wafer-Level Packaging and Assembly Equipment
1.3 Semiconductor Packaging and Assembly Equipment Segment by Application
1.3.1 Global Semiconductor Packaging and Assembly Equipment Consumption Comparison by Application: 2016 VS 2021 VS 2027
1.3.2 IDM(Integrated Device Manufacturers)
1.3.3 OSAT(Outsourced Semiconductor Assembly and Test Companies)
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Packaging and Assembly Equipment Revenue Estimates and Forecasts (2016-2027)
1.4.2 Global Semiconductor Packaging and Assembly Equipment Production Estimates and Forecasts (2016-2027)
1.5 Global Market Size by Region
1.5.1 Global Semiconductor Packaging and Assembly Equipment Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
1.5.2 North America Semiconductor Packaging and Assembly Equipment Estimates and Forecasts (2016-2027)
1.5.3 Europe Semiconductor Packaging and Assembly Equipment Estimates and Forecasts (2016-2027)
1.5.4 China Semiconductor Packaging and Assembly Equipment Estimates and Forecasts (2016-2027)
1.5.5 Japan Semiconductor Packaging and Assembly Equipment Estimates and Forecasts (2016-2027)

2 Market Competition by Manufacturers
2.1 Global Semiconductor Packaging and Assembly Equipment Production Market Share by Manufacturers (2016-2021)
2.2 Global Semiconductor Packaging and Assembly Equipment Revenue Market Share by Manufacturers (2016-2021)
2.3 Semiconductor Packaging and Assembly Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.4 Global Semiconductor Packaging and Assembly Equipment Average Price by Manufacturers (2016-2021)
2.5 Manufacturers Semiconductor Packaging and Assembly Equipment Production Sites, Area Served, Product Types
2.6 Semiconductor Packaging and Assembly Equipment Market Competitive Situation and Trends
2.6.1 Semiconductor Packaging and Assembly Equipment Market Concentration Rate
2.6.2 Global 5 and 10 Largest Semiconductor Packaging and Assembly Equipment Players Market Share by Revenue
2.6.3 Mergers & Acquisitions, Expansion

3 Production and Capacity by Region
3.1 Global Production of Semiconductor Packaging and Assembly Equipment Market Share by Region (2016-2021)
3.2 Global Semiconductor Packaging and Assembly Equipment Revenue Market Share by Region (2016-2021)
3.3 Global Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
3.4 North America Semiconductor Packaging and Assembly Equipment Production
3.4.1 North America Semiconductor Packaging and Assembly Equipment Production Growth Rate (2016-2021)
3.4.2 North America Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
3.5 Europe Semiconductor Packaging and Assembly Equipment Production
3.5.1 Europe Semiconductor Packaging and Assembly Equipment Production Growth Rate (2016-2021)
3.5.2 Europe Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
3.6 China Semiconductor Packaging and Assembly Equipment Production
3.6.1 China Semiconductor Packaging and Assembly Equipment Production Growth Rate (2016-2021)
3.6.2 China Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
3.7 Japan Semiconductor Packaging and Assembly Equipment Production
3.7.1 Japan Semiconductor Packaging and Assembly Equipment Production Growth Rate (2016-2021)
3.7.2 Japan Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)

4 Global Semiconductor Packaging and Assembly Equipment Consumption by Region
4.1 Global Semiconductor Packaging and Assembly Equipment Consumption by Region
4.1.1 Global Semiconductor Packaging and Assembly Equipment Consumption by Region
4.1.2 Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Region
4.2 North America
4.2.1 North America Semiconductor Packaging and Assembly Equipment Consumption by Country
4.2.2 U.S.
4.2.3 Canada
4.3 Europe
4.3.1 Europe Semiconductor Packaging and Assembly Equipment Consumption by Country
4.3.2 Germany
4.3.3 France
4.3.4 U.K.
4.3.5 Italy
4.3.6 Russia
4.4 Asia Pacific
4.4.1 Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption by Region
4.4.2 China
4.4.3 Japan
4.4.4 South Korea
4.4.5 Taiwan
4.4.6 Southeast Asia
4.4.7 India
4.4.8 Australia
4.5 Latin America
4.5.1 Latin America Semiconductor Packaging and Assembly Equipment Consumption by Country
4.5.2 Mexico
4.5.3 Brazil

5 Production, Revenue, Price Trend by Type
5.1 Global Semiconductor Packaging and Assembly Equipment Production Market Share by Type (2016-2021)
5.2 Global Semiconductor Packaging and Assembly Equipment Revenue Market Share by Type (2016-2021)
5.3 Global Semiconductor Packaging and Assembly Equipment Price by Type (2016-2021)

6 Consumption Analysis by Application
6.1 Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Application (2016-2021)
6.2 Global Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Application (2016-2021)

7 Key Companies Profiled
7.1 Applied Materials
7.1.1 Applied Materials Semiconductor Packaging and Assembly Equipment Corporation Information
7.1.2 Applied Materials Semiconductor Packaging and Assembly Equipment Product Portfolio
7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.1.4 Applied Materials Main Business and Markets Served
7.1.5 Applied Materials Recent Developments/Updates
7.2 ASMPT
7.2.1 ASMPT Semiconductor Packaging and Assembly Equipment Corporation Information
7.2.2 ASMPT Semiconductor Packaging and Assembly Equipment Product Portfolio
7.2.3 ASMPT Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.2.4 ASMPT Main Business and Markets Served
7.2.5 ASMPT Recent Developments/Updates
7.3 DISCO Corporation
7.3.1 DISCO Corporation Semiconductor Packaging and Assembly Equipment Corporation Information
7.3.2 DISCO Corporation Semiconductor Packaging and Assembly Equipment Product Portfolio
7.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.3.4 DISCO Corporation Main Business and Markets Served
7.3.5 DISCO Corporation Recent Developments/Updates
7.4 EV Group
7.4.1 EV Group Semiconductor Packaging and Assembly Equipment Corporation Information
7.4.2 EV Group Semiconductor Packaging and Assembly Equipment Product Portfolio
7.4.3 EV Group Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.4.4 EV Group Main Business and Markets Served
7.4.5 EV Group Recent Developments/Updates
7.5 Kulicke and Soffa Industries
7.5.1 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Corporation Information
7.5.2 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Product Portfolio
7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.5.4 Kulicke and Soffa Industries Main Business and Markets Served
7.5.5 Kulicke and Soffa Industries Recent Developments/Updates
7.6 TEL
7.6.1 TEL Semiconductor Packaging and Assembly Equipment Corporation Information
7.6.2 TEL Semiconductor Packaging and Assembly Equipment Product Portfolio
7.6.3 TEL Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.6.4 TEL Main Business and Markets Served
7.6.5 TEL Recent Developments/Updates
7.7 Tokyo Seimitsu
7.7.1 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Corporation Information
7.7.2 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Product Portfolio
7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.7.4 Tokyo Seimitsu Main Business and Markets Served
7.7.5 Tokyo Seimitsu Recent Developments/Updates
7.8 Rudolph Technologies
7.8.1 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Corporation Information
7.8.2 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Product Portfolio
7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.8.4 Rudolph Technologies Main Business and Markets Served
7.7.5 Rudolph Technologies Recent Developments/Updates
7.9 SEMES
7.9.1 SEMES Semiconductor Packaging and Assembly Equipment Corporation Information
7.9.2 SEMES Semiconductor Packaging and Assembly Equipment Product Portfolio
7.9.3 SEMES Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.9.4 SEMES Main Business and Markets Served
7.9.5 SEMES Recent Developments/Updates
7.10 Suss Microtec
7.10.1 Suss Microtec Semiconductor Packaging and Assembly Equipment Corporation Information
7.10.2 Suss Microtec Semiconductor Packaging and Assembly Equipment Product Portfolio
7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.10.4 Suss Microtec Main Business and Markets Served
7.10.5 Suss Microtec Recent Developments/Updates
7.11 Veeco/CNT
7.11.1 Veeco/CNT Semiconductor Packaging and Assembly Equipment Corporation Information
7.11.2 Veeco/CNT Semiconductor Packaging and Assembly Equipment Product Portfolio
7.11.3 Veeco/CNT Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.11.4 Veeco/CNT Main Business and Markets Served
7.11.5 Veeco/CNT Recent Developments/Updates
7.12 Ulvac Technologies
7.12.1 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Corporation Information
7.12.2 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Product Portfolio
7.12.3 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Production, Revenue, Price and Gross Margin (2016-2021)
7.12.4 Ulvac Technologies Main Business and Markets Served
7.12.5 Ulvac Technologies Recent Developments/Updates

8 Semiconductor Packaging and Assembly Equipment Manufacturing Cost Analysis
8.1 Semiconductor Packaging and Assembly Equipment Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Raw Materials Price Trend
8.1.3 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of Semiconductor Packaging and Assembly Equipment
8.4 Semiconductor Packaging and Assembly Equipment Industrial Chain Analysis

9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 Semiconductor Packaging and Assembly Equipment Distributors List
9.3 Semiconductor Packaging and Assembly Equipment Customers

10 Market Dynamics
10.1 Semiconductor Packaging and Assembly Equipment Industry Trends
10.2 Semiconductor Packaging and Assembly Equipment Growth Drivers
10.3 Semiconductor Packaging and Assembly Equipment Market Challenges
10.4 Semiconductor Packaging and Assembly Equipment Market Restraints

11 Production and Supply Forecast
11.1 Global Forecasted Production of Semiconductor Packaging and Assembly Equipment by Region (2022-2027)
11.2 North America Semiconductor Packaging and Assembly Equipment Production, Revenue Forecast (2022-2027)
11.3 Europe Semiconductor Packaging and Assembly Equipment Production, Revenue Forecast (2022-2027)
11.4 China Semiconductor Packaging and Assembly Equipment Production, Revenue Forecast (2022-2027)
11.5 Japan Semiconductor Packaging and Assembly Equipment Production, Revenue Forecast (2022-2027)

12 Consumption and Demand Forecast
12.1 Global Forecasted Demand Analysis of Semiconductor Packaging and Assembly Equipment
12.2 North America Forecasted Consumption of Semiconductor Packaging and Assembly Equipment by Country
12.3 Europe Market Forecasted Consumption of Semiconductor Packaging and Assembly Equipment by Country
12.4 Asia Pacific Market Forecasted Consumption of Semiconductor Packaging and Assembly Equipment by Region
12.5 Latin America Forecasted Consumption of Semiconductor Packaging and Assembly Equipment by Country

13 Forecast by Type and by Application (2022-2027)
13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
13.1.1 Global Forecasted Production of Semiconductor Packaging and Assembly Equipment by Type (2022-2027)
13.1.2 Global Forecasted Revenue of Semiconductor Packaging and Assembly Equipment by Type (2022-2027)
13.1.3 Global Forecasted Price of Semiconductor Packaging and Assembly Equipment by Type (2022-2027)
13.2 Global Forecasted Consumption of Semiconductor Packaging and Assembly Equipment by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source
15.1 Methodology/Research Approach
15.1.1 Research Programs/Design
15.1.2 Market Size Estimation
15.1.3 Market Breakdown and Data Triangulation
15.2 Data Source
15.2.1 Secondary Sources
15.2.2 Primary Sources
15.3 Author List
15.4 Disclaimer

List of Tables

List of Tables
Table 1. Global Semiconductor Packaging and Assembly Equipment Market Size by Type (Units) & (US$ Million) (2021 VS 2027)
Table 2. Global Semiconductor Packaging and Assembly Equipment Consumption (Units) Comparison by Application: 2016 VS 2021 VS 2027
Table 3. Semiconductor Packaging and Assembly Equipment Market Size Comparison by Region: 2016 VS 2021 VS 2027
Table 4. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Manufacturers
Table 5. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Manufacturers (2016-2021)
Table 6. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Manufacturers (2016-2021)
Table 7. Global Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) by Manufacturers (2016-2021)
Table 8. Global Semiconductor Packaging and Assembly Equipment Revenue Share by Manufacturers (2016-2021)
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Packaging and Assembly Equipment as of 2020)
Table 10. Global Market Semiconductor Packaging and Assembly Equipment Average Price (K USD/Unit) of Key Manufacturers (2016-2021)
Table 11. Manufacturers Semiconductor Packaging and Assembly Equipment Production Sites and Area Served
Table 12. Manufacturers Semiconductor Packaging and Assembly Equipment Product Types
Table 13. Mergers & Acquisitions, Expansion
Table 14. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Region (2016-2021)
Table 15. Global Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) by Region (2016-2021)
Table 16. Global Semiconductor Packaging and Assembly Equipment Revenue Market Share by Region (2016-2021)
Table 17. Global Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 18. North America Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 19. Europe Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 20. China Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 21. Japan Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 22. Global Semiconductor Packaging and Assembly Equipment Consumption Market by Region (2016-2021) & (Units)
Table 23. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Region (2016-2021)
Table 24. North America Semiconductor Packaging and Assembly Equipment Consumption by Country (2016-2021) & (Units)
Table 25. Europe Semiconductor Packaging and Assembly Equipment Consumption by Country (2016-2021) & (Units)
Table 26. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption by Region (2016-2021) & (Units)
Table 27. Latin America Semiconductor Packaging and Assembly Equipment Consumption by Countries (2016-2021) & (Units)
Table 28. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Type (2016-2021)
Table 29. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Type (2016-2021)
Table 30. Global Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) by Type (2016-2021)
Table 31. Global Semiconductor Packaging and Assembly Equipment Revenue Share by Type (2016-2021)
Table 32. Global Semiconductor Packaging and Assembly Equipment Price (K USD/Unit) by Type (2016-2021)
Table 33. Global Semiconductor Packaging and Assembly Equipment Consumption by Application (2016-2021) & (Units)
Table 34. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Application (2016-2021)
Table 35. Global Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Application (2016-2021)
Table 36. Applied Materials Semiconductor Packaging and Assembly Equipment Corporation Information
Table 37. Applied Materials Specification and Application
Table 38. Applied Materials Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 39. Applied Materials Main Business and Markets Served
Table 40. Applied Materials Recent Developments/Updates
Table 41. ASMPT Semiconductor Packaging and Assembly Equipment Corporation Information
Table 42. ASMPT Specification and Application
Table 43. ASMPT Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 44. ASMPT Main Business and Markets Served
Table 45. ASMPT Recent Developments/Updates
Table 46. DISCO Corporation Semiconductor Packaging and Assembly Equipment Corporation Information
Table 47. DISCO Corporation Specification and Application
Table 48. DISCO Corporation Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 49. DISCO Corporation Main Business and Markets Served
Table 50. DISCO Corporation Recent Developments/Updates
Table 51. EV Group Semiconductor Packaging and Assembly Equipment Corporation Information
Table 52. EV Group Specification and Application
Table 53. EV Group Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 54. EV Group Main Business and Markets Served
Table 55. EV Group Recent Developments/Updates
Table 56. Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Corporation Information
Table 57. Kulicke and Soffa Industries Specification and Application
Table 58. Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 59. Kulicke and Soffa Industries Main Business and Markets Served
Table 60. Kulicke and Soffa Industries Recent Developments/Updates
Table 61. TEL Semiconductor Packaging and Assembly Equipment Corporation Information
Table 62. TEL Specification and Application
Table 63. TEL Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 64. TEL Main Business and Markets Served
Table 65. TEL Recent Developments/Updates
Table 66. Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Corporation Information
Table 67. Tokyo Seimitsu Specification and Application
Table 68. Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 69. Tokyo Seimitsu Main Business and Markets Served
Table 70. Tokyo Seimitsu Recent Developments/Updates
Table 71. Rudolph Technologies Semiconductor Packaging and Assembly Equipment Corporation Information
Table 72. Rudolph Technologies Specification and Application
Table 73. Rudolph Technologies Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 74. Rudolph Technologies Main Business and Markets Served
Table 75. Rudolph Technologies Recent Developments/Updates
Table 76. SEMES Semiconductor Packaging and Assembly Equipment Corporation Information
Table 77. SEMES Specification and Application
Table 78. SEMES Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 79. SEMES Main Business and Markets Served
Table 80. SEMES Recent Developments/Updates
Table 81. Suss Microtec Semiconductor Packaging and Assembly Equipment Corporation Information
Table 82. Suss Microtec Specification and Application
Table 83. Suss Microtec Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 84. Suss Microtec Main Business and Markets Served
Table 85. Suss Microtec Recent Developments/Updates
Table 86. Veeco/CNT Semiconductor Packaging and Assembly Equipment Corporation Information
Table 87. Veeco/CNT Specification and Application
Table 88. Veeco/CNT Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 89. Veeco/CNT Main Business and Markets Served
Table 90. Veeco/CNT Recent Developments/Updates
Table 91. Ulvac Technologies Semiconductor Packaging and Assembly Equipment Corporation Information
Table 92. Ulvac Technologies Specification and Application
Table 93. Ulvac Technologies Semiconductor Packaging and Assembly Equipment Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 94. Ulvac Technologies Main Business and Markets Served
Table 95. Ulvac Technologies Recent Developments/Updates
Table 96. Production Base and Market Concentration Rate of Raw Material
Table 97. Key Suppliers of Raw Materials
Table 98. Semiconductor Packaging and Assembly Equipment Distributors List
Table 99. Semiconductor Packaging and Assembly Equipment Customers List
Table 100. Semiconductor Packaging and Assembly Equipment Market Trends
Table 101. Semiconductor Packaging and Assembly Equipment Growth Drivers
Table 102. Semiconductor Packaging and Assembly Equipment Market Challenges
Table 103. Semiconductor Packaging and Assembly Equipment Market Restraints
Table 104. Global Semiconductor Packaging and Assembly Equipment Production (Units) Forecast by Region (2022-2027)
Table 105. North America Semiconductor Packaging and Assembly Equipment Consumption Forecast by Country (2022-2027) & (Units)
Table 106. Europe Semiconductor Packaging and Assembly Equipment Consumption Forecast by Country (2022-2027) & (Units)
Table 107. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption Forecast by Region (2022-2027) & (Units)
Table 108. Latin America Semiconductor Packaging and Assembly Equipment Consumption Forecast by Country (2022-2027) & (Units)
Table 109. Global Semiconductor Packaging and Assembly Equipment Production Forecast by Type (2022-2027) & (Units)
Table 110. Global Semiconductor Packaging and Assembly Equipment Revenue Forecast by Type (2022-2027) & (US$ Million)
Table 111. Global Semiconductor Packaging and Assembly Equipment Price Forecast by Type (2022-2027) & (K USD/Unit)
Table 112. Global Semiconductor Packaging and Assembly Equipment Consumption (Units) Forecast by Application (2022-2027)
Table 113. Research Programs/Design for This Report
Table 114. Key Data Information from Secondary Sources
Table 115. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Semiconductor Packaging and Assembly Equipment
Figure 2. Global Semiconductor Packaging and Assembly Equipment Market Share by Type: 2020 VS 2027
Figure 3. Die- Level Packaging and Assembly Equipment Product Picture
Figure 4. Wafer-Level Packaging and Assembly Equipment Product Picture
Figure 5. Global Semiconductor Packaging and Assembly Equipment Market Share by Application: 2020 VS 2027
Figure 6. IDM(Integrated Device Manufacturers)
Figure 7. OSAT(Outsourced Semiconductor Assembly and Test Companies)
Figure 8. Global Semiconductor Packaging and Assembly Equipment Revenue (US$ Million), 2016 VS 2021 VS 2027
Figure 9. Global Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) (2016-2027)
Figure 10. Global Semiconductor Packaging and Assembly Equipment Production (Units) & (2016-2027)
Figure 11. North America Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 12. Europe Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 13. China Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 14. Japan Semiconductor Packaging and Assembly Equipment Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 15. Semiconductor Packaging and Assembly Equipment Production Share by Manufacturers in 2020
Figure 16. Global Semiconductor Packaging and Assembly Equipment Revenue Share by Manufacturers in 2020
Figure 17. Semiconductor Packaging and Assembly Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3): 2016 VS 2020
Figure 18. Global Market Semiconductor Packaging and Assembly Equipment Average Price (K USD/Unit) of Key Manufacturers in 2020
Figure 19. The Global 5 and 10 Largest Players: Market Share by Semiconductor Packaging and Assembly Equipment Revenue in 2020
Figure 20. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Region (2016-2021)
Figure 21. North America Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate (2016-2021)
Figure 22. Europe Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate (2016-2021)
Figure 23. China Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate (2016-2021)
Figure 24. Japan Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate (2016-2021)
Figure 25. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Region (2016-2021)
Figure 26. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Region in 2020
Figure 27. North America Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 28. North America Semiconductor Packaging and Assembly Equipment Consumption Market Share by Country in 2020
Figure 29. Canada Semiconductor Packaging and Assembly Equipment Consumption Growth Rate (2016-2021) & (Units)
Figure 30. U.S. Semiconductor Packaging and Assembly Equipment Consumption Growth Rate (2016-2021) & (Units)
Figure 31. Europe Semiconductor Packaging and Assembly Equipment Consumption Growth Rate (2016-2021) & (Units)
Figure 32. Europe Semiconductor Packaging and Assembly Equipment Consumption Market Share by Country in 2020
Figure 33. Germany America Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 34. France Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 35. U.K. Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 36. Italy Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 37. Russia Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 38. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 39. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption Market Share by Regions in 2020
Figure 40. China Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 41. Japan Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 42. South Korea Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 43. Taiwan Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 44. Southeast Asia Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 45. India Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 46. Australia Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 47. Latin America Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 48. Latin America Semiconductor Packaging and Assembly Equipment Consumption Market Share by Country in 2020
Figure 49. Mexico Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 50. Brazil Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2016-2021) & (Units)
Figure 51. Production Market Share of Semiconductor Packaging and Assembly Equipment by Type (2016-2021)
Figure 52. Production Market Share of Semiconductor Packaging and Assembly Equipment by Type in 2020
Figure 53. Revenue Share of Semiconductor Packaging and Assembly Equipment by Type (2016-2021)
Figure 54. Revenue Market Share of Semiconductor Packaging and Assembly Equipment by Type in 2020
Figure 55. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Application (2016-2021)
Figure 56. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Application in 2020
Figure 57. Global Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Application (2016-2021)
Figure 58. Key Raw Materials Price Trend
Figure 59. Manufacturing Cost Structure of Semiconductor Packaging and Assembly Equipment
Figure 60. Manufacturing Process Analysis of Semiconductor Packaging and Assembly Equipment
Figure 61. Semiconductor Packaging and Assembly Equipment Industrial Chain Analysis
Figure 62. Channels of Distribution
Figure 63. Distributors Profiles
Figure 64. Global Semiconductor Packaging and Assembly Equipment Production Market Share Forecast by Region (2022-2027)
Figure 65. North America Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate Forecast (2022-2027)
Figure 66. Europe Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate Forecast (2022-2027)
Figure 67. China Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate Forecast (2022-2027)
Figure 68. Japan Semiconductor Packaging and Assembly Equipment Production (Units) Growth Rate Forecast (2022-2027)
Figure 69. Global Forecasted Demand Analysis of Semiconductor Packaging and Assembly Equipment (2015-2027) & (Units)
Figure 70. Global Semiconductor Packaging and Assembly Equipment Production Market Share Forecast by Type (2022-2027)
Figure 71. Global Semiconductor Packaging and Assembly Equipment Revenue Market Share Forecast by Type (2022-2027)
Figure 72. Global Semiconductor Packaging and Assembly Equipment Consumption Forecast by Application (2022-2027)
Figure 73. Bottom-up and Top-down Approaches for This Report
Figure 74. Data Triangulation

Published By : QY Research

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