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Synopsis
Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.
The global Semiconductor Packaging Equipment market was valued at US$ 6258.6 million in 2023 and is anticipated to reach US$ 9357.4 million by 2030, witnessing a CAGR of 6.0% during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging Equipment.
Report Scope
The Semiconductor Packaging Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Packaging Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
- Applied Materials
- ASM Pacific Technology
- Kulicke and Soffa Industries
- Tokyo Electron Limited
- Tokyo Seimitsu
- ChipMos
- Greatek
- Hua Hong
- Jiangsu Changjiang Electronics Technology
- Lingsen Precision
- Nepes
- Tianshui Huatian
- Unisem
- Veeco/CNT
Segment by Type
- Chip Bonding Equipment
- Inspection and Cutting Equipment
- Packaging equipment
- Wire bonding equipment
- Electroplating equipment
- Other
Segment by Application
- Manufacturer of Integrated Devices
- Packaged Semiconductor Assembly
Production by Region
- North America
- Europe
- China
- Japan
Consumption by Region
- North America (United States, Canada)
- Europe (Germany, France, U.K., Italy, Netherlands)
- Asia-Pacific (China, Japan, South Korea, China Taiwan, Southeast Asia, India)
- Latin America, Middle East & Africa (Latin America, Mexico, Brazil, Turkey)
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Packaging Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Packaging Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Packaging Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index
1 Semiconductor Packaging Equipment Market Overview
1.1 Product Definition
1.2 Semiconductor Packaging Equipment Segment by Type
1.2.1 Global Semiconductor Packaging Equipment Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Chip Bonding Equipment
1.2.3 Inspection and Cutting Equipment
1.2.4 Packaging equipment
1.2.5 Wire bonding equipment
1.2.6 Electroplating equipment
1.2.7 Other
1.3 Semiconductor Packaging Equipment Segment by Application
1.3.1 Global Semiconductor Packaging Equipment Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Manufacturer of Integrated Devices
1.3.3 Packaged Semiconductor Assembly
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Semiconductor Packaging Equipment Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Semiconductor Packaging Equipment Production Estimates and Forecasts (2019-2030)
1.4.4 Global Semiconductor Packaging Equipment Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Packaging Equipment Production Market Share by Manufacturers (2019-2024)
2.2 Global Semiconductor Packaging Equipment Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Semiconductor Packaging Equipment, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Semiconductor Packaging Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Packaging Equipment Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Semiconductor Packaging Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Packaging Equipment, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Packaging Equipment, Date of Enter into This Industry
2.9 Semiconductor Packaging Equipment Market Competitive Situation and Trends
2.9.1 Semiconductor Packaging Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Packaging Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Packaging Equipment Production by Region
3.1 Global Semiconductor Packaging Equipment Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Semiconductor Packaging Equipment Production Value by Region (2019-2030)
3.2.1 Global Semiconductor Packaging Equipment Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Semiconductor Packaging Equipment by Region (2025-2030)
3.3 Global Semiconductor Packaging Equipment Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Semiconductor Packaging Equipment Production by Region (2019-2030)
3.4.1 Global Semiconductor Packaging Equipment Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Semiconductor Packaging Equipment by Region (2025-2030)
3.5 Global Semiconductor Packaging Equipment Market Price Analysis by Region (2019-2024)
3.6 Global Semiconductor Packaging Equipment Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Semiconductor Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Semiconductor Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Semiconductor Packaging Equipment Production Value Estimates and Forecasts (2019-2030)
4 Semiconductor Packaging Equipment Consumption by Region
4.1 Global Semiconductor Packaging Equipment Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Semiconductor Packaging Equipment Consumption by Region (2019-2030)
4.2.1 Global Semiconductor Packaging Equipment Consumption by Region (2019-2024)
4.2.2 Global Semiconductor Packaging Equipment Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Semiconductor Packaging Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Semiconductor Packaging Equipment Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Packaging Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Semiconductor Packaging Equipment Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Packaging Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Semiconductor Packaging Equipment Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Packaging Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Semiconductor Packaging Equipment Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Packaging Equipment Production by Type (2019-2030)
5.1.1 Global Semiconductor Packaging Equipment Production by Type (2019-2024)
5.1.2 Global Semiconductor Packaging Equipment Production by Type (2025-2030)
5.1.3 Global Semiconductor Packaging Equipment Production Market Share by Type (2019-2030)
5.2 Global Semiconductor Packaging Equipment Production Value by Type (2019-2030)
5.2.1 Global Semiconductor Packaging Equipment Production Value by Type (2019-2024)
5.2.2 Global Semiconductor Packaging Equipment Production Value by Type (2025-2030)
5.2.3 Global Semiconductor Packaging Equipment Production Value Market Share by Type (2019-2030)
5.3 Global Semiconductor Packaging Equipment Price by Type (2019-2030)
6 Segment by Application
6.1 Global Semiconductor Packaging Equipment Production by Application (2019-2030)
6.1.1 Global Semiconductor Packaging Equipment Production by Application (2019-2024)
6.1.2 Global Semiconductor Packaging Equipment Production by Application (2025-2030)
6.1.3 Global Semiconductor Packaging Equipment Production Market Share by Application (2019-2030)
6.2 Global Semiconductor Packaging Equipment Production Value by Application (2019-2030)
6.2.1 Global Semiconductor Packaging Equipment Production Value by Application (2019-2024)
6.2.2 Global Semiconductor Packaging Equipment Production Value by Application (2025-2030)
6.2.3 Global Semiconductor Packaging Equipment Production Value Market Share by Application (2019-2030)
6.3 Global Semiconductor Packaging Equipment Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Applied Materials
7.1.1 Applied Materials Semiconductor Packaging Equipment Corporation Information
7.1.2 Applied Materials Semiconductor Packaging Equipment Product Portfolio
7.1.3 Applied Materials Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Applied Materials Main Business and Markets Served
7.1.5 Applied Materials Recent Developments/Updates
7.2 ASM Pacific Technology
7.2.1 ASM Pacific Technology Semiconductor Packaging Equipment Corporation Information
7.2.2 ASM Pacific Technology Semiconductor Packaging Equipment Product Portfolio
7.2.3 ASM Pacific Technology Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.2.4 ASM Pacific Technology Main Business and Markets Served
7.2.5 ASM Pacific Technology Recent Developments/Updates
7.3 Kulicke and Soffa Industries
7.3.1 Kulicke and Soffa Industries Semiconductor Packaging Equipment Corporation Information
7.3.2 Kulicke and Soffa Industries Semiconductor Packaging Equipment Product Portfolio
7.3.3 Kulicke and Soffa Industries Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Kulicke and Soffa Industries Main Business and Markets Served
7.3.5 Kulicke and Soffa Industries Recent Developments/Updates
7.4 Tokyo Electron Limited
7.4.1 Tokyo Electron Limited Semiconductor Packaging Equipment Corporation Information
7.4.2 Tokyo Electron Limited Semiconductor Packaging Equipment Product Portfolio
7.4.3 Tokyo Electron Limited Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Tokyo Electron Limited Main Business and Markets Served
7.4.5 Tokyo Electron Limited Recent Developments/Updates
7.5 Tokyo Seimitsu
7.5.1 Tokyo Seimitsu Semiconductor Packaging Equipment Corporation Information
7.5.2 Tokyo Seimitsu Semiconductor Packaging Equipment Product Portfolio
7.5.3 Tokyo Seimitsu Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Tokyo Seimitsu Main Business and Markets Served
7.5.5 Tokyo Seimitsu Recent Developments/Updates
7.6 ChipMos
7.6.1 ChipMos Semiconductor Packaging Equipment Corporation Information
7.6.2 ChipMos Semiconductor Packaging Equipment Product Portfolio
7.6.3 ChipMos Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.6.4 ChipMos Main Business and Markets Served
7.6.5 ChipMos Recent Developments/Updates
7.7 Greatek
7.7.1 Greatek Semiconductor Packaging Equipment Corporation Information
7.7.2 Greatek Semiconductor Packaging Equipment Product Portfolio
7.7.3 Greatek Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Greatek Main Business and Markets Served
7.7.5 Greatek Recent Developments/Updates
7.8 Hua Hong
7.8.1 Hua Hong Semiconductor Packaging Equipment Corporation Information
7.8.2 Hua Hong Semiconductor Packaging Equipment Product Portfolio
7.8.3 Hua Hong Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Hua Hong Main Business and Markets Served
7.7.5 Hua Hong Recent Developments/Updates
7.9 Jiangsu Changjiang Electronics Technology
7.9.1 Jiangsu Changjiang Electronics Technology Semiconductor Packaging Equipment Corporation Information
7.9.2 Jiangsu Changjiang Electronics Technology Semiconductor Packaging Equipment Product Portfolio
7.9.3 Jiangsu Changjiang Electronics Technology Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Jiangsu Changjiang Electronics Technology Main Business and Markets Served
7.9.5 Jiangsu Changjiang Electronics Technology Recent Developments/Updates
7.10 Lingsen Precision
7.10.1 Lingsen Precision Semiconductor Packaging Equipment Corporation Information
7.10.2 Lingsen Precision Semiconductor Packaging Equipment Product Portfolio
7.10.3 Lingsen Precision Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Lingsen Precision Main Business and Markets Served
7.10.5 Lingsen Precision Recent Developments/Updates
7.11 Nepes
7.11.1 Nepes Semiconductor Packaging Equipment Corporation Information
7.11.2 Nepes Semiconductor Packaging Equipment Product Portfolio
7.11.3 Nepes Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Nepes Main Business and Markets Served
7.11.5 Nepes Recent Developments/Updates
7.12 Tianshui Huatian
7.12.1 Tianshui Huatian Semiconductor Packaging Equipment Corporation Information
7.12.2 Tianshui Huatian Semiconductor Packaging Equipment Product Portfolio
7.12.3 Tianshui Huatian Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Tianshui Huatian Main Business and Markets Served
7.12.5 Tianshui Huatian Recent Developments/Updates
7.13 Unisem
7.13.1 Unisem Semiconductor Packaging Equipment Corporation Information
7.13.2 Unisem Semiconductor Packaging Equipment Product Portfolio
7.13.3 Unisem Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Unisem Main Business and Markets Served
7.13.5 Unisem Recent Developments/Updates
7.14 Veeco/CNT
7.14.1 Veeco/CNT Semiconductor Packaging Equipment Corporation Information
7.14.2 Veeco/CNT Semiconductor Packaging Equipment Product Portfolio
7.14.3 Veeco/CNT Semiconductor Packaging Equipment Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Veeco/CNT Main Business and Markets Served
7.14.5 Veeco/CNT Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Packaging Equipment Industry Chain Analysis
8.2 Semiconductor Packaging Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Packaging Equipment Production Mode & Process
8.4 Semiconductor Packaging Equipment Sales and Marketing
8.4.1 Semiconductor Packaging Equipment Sales Channels
8.4.2 Semiconductor Packaging Equipment Distributors
8.5 Semiconductor Packaging Equipment Customers
9 Semiconductor Packaging Equipment Market Dynamics
9.1 Semiconductor Packaging Equipment Industry Trends
9.2 Semiconductor Packaging Equipment Market Drivers
9.3 Semiconductor Packaging Equipment Market Challenges
9.4 Semiconductor Packaging Equipment Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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