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Global Tape for Wafer Dicing Market Research Report 2025
Synopsis
The Dicing Tape is designed for Blade Dicing and Laser Dicing Process.
The global Tape for Wafer Dicing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Tape for Wafer Dicing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Tape for Wafer Dicing.
Report Scope
The Tape for Wafer Dicing market size, estimations, and forecasts are provided in terms of output/shipments (K Sq) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Tape for Wafer Dicing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Tape for Wafer Dicing manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Furukawa Electric
Nitto
Mitsui Chemicals
Lintec Corporation
Sumitomo Bakelite
Denka
Pantech Tape
Ultron Systems
AI Technology
Nippon Pulse Motor Taiwan
Minitron Electronic
Loadpoint
DaehyunST
Segment by Type
UV
Non-UV
Segment by Application
Thin Wafer
Bumped Wafer
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Tape for Wafer Dicing manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Tape for Wafer Dicing by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Tape for Wafer Dicing in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The Dicing Tape is designed for Blade Dicing and Laser Dicing Process.
The global Tape for Wafer Dicing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Tape for Wafer Dicing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Tape for Wafer Dicing.
Report Scope
The Tape for Wafer Dicing market size, estimations, and forecasts are provided in terms of output/shipments (K Sq) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Tape for Wafer Dicing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Tape for Wafer Dicing manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Furukawa Electric
Nitto
Mitsui Chemicals
Lintec Corporation
Sumitomo Bakelite
Denka
Pantech Tape
Ultron Systems
AI Technology
Nippon Pulse Motor Taiwan
Minitron Electronic
Loadpoint
DaehyunST
Segment by Type
UV
Non-UV
Segment by Application
Thin Wafer
Bumped Wafer
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Tape for Wafer Dicing manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Tape for Wafer Dicing by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Tape for Wafer Dicing in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Tape for Wafer Dicing Market Overview
1.1 Product Definition
1.2 Tape for Wafer Dicing Segment by Type
1.2.1 Global Tape for Wafer Dicing Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 UV
1.2.3 Non-UV
1.3 Tape for Wafer Dicing Segment by Application
1.3.1 Global Tape for Wafer Dicing Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Thin Wafer
1.3.3 Bumped Wafer
1.4 Global Market Growth Prospects
1.4.1 Global Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Tape for Wafer Dicing Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Tape for Wafer Dicing Production Estimates and Forecasts (2019-2030)
1.4.4 Global Tape for Wafer Dicing Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Tape for Wafer Dicing Production Market Share by Manufacturers (2019-2024)
2.2 Global Tape for Wafer Dicing Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Tape for Wafer Dicing, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Tape for Wafer Dicing Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Tape for Wafer Dicing Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Tape for Wafer Dicing, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Tape for Wafer Dicing, Product Offered and Application
2.8 Global Key Manufacturers of Tape for Wafer Dicing, Date of Enter into This Industry
2.9 Tape for Wafer Dicing Market Competitive Situation and Trends
2.9.1 Tape for Wafer Dicing Market Concentration Rate
2.9.2 Global 5 and 10 Largest Tape for Wafer Dicing Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Tape for Wafer Dicing Production by Region
3.1 Global Tape for Wafer Dicing Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Tape for Wafer Dicing Production Value by Region (2019-2030)
3.2.1 Global Tape for Wafer Dicing Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Tape for Wafer Dicing by Region (2025-2030)
3.3 Global Tape for Wafer Dicing Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Tape for Wafer Dicing Production by Region (2019-2030)
3.4.1 Global Tape for Wafer Dicing Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Tape for Wafer Dicing by Region (2025-2030)
3.5 Global Tape for Wafer Dicing Market Price Analysis by Region (2019-2024)
3.6 Global Tape for Wafer Dicing Production and Value, Year-over-Year Growth
3.6.1 North America Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Tape for Wafer Dicing Production Value Estimates and Forecasts (2019-2030)
4 Tape for Wafer Dicing Consumption by Region
4.1 Global Tape for Wafer Dicing Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Tape for Wafer Dicing Consumption by Region (2019-2030)
4.2.1 Global Tape for Wafer Dicing Consumption by Region (2019-2024)
4.2.2 Global Tape for Wafer Dicing Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Tape for Wafer Dicing Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Tape for Wafer Dicing Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Tape for Wafer Dicing Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Tape for Wafer Dicing Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Tape for Wafer Dicing Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Tape for Wafer Dicing Production by Type (2019-2030)
5.1.1 Global Tape for Wafer Dicing Production by Type (2019-2024)
5.1.2 Global Tape for Wafer Dicing Production by Type (2025-2030)
5.1.3 Global Tape for Wafer Dicing Production Market Share by Type (2019-2030)
5.2 Global Tape for Wafer Dicing Production Value by Type (2019-2030)
5.2.1 Global Tape for Wafer Dicing Production Value by Type (2019-2024)
5.2.2 Global Tape for Wafer Dicing Production Value by Type (2025-2030)
5.2.3 Global Tape for Wafer Dicing Production Value Market Share by Type (2019-2030)
5.3 Global Tape for Wafer Dicing Price by Type (2019-2030)
6 Segment by Application
6.1 Global Tape for Wafer Dicing Production by Application (2019-2030)
6.1.1 Global Tape for Wafer Dicing Production by Application (2019-2024)
6.1.2 Global Tape for Wafer Dicing Production by Application (2025-2030)
6.1.3 Global Tape for Wafer Dicing Production Market Share by Application (2019-2030)
6.2 Global Tape for Wafer Dicing Production Value by Application (2019-2030)
6.2.1 Global Tape for Wafer Dicing Production Value by Application (2019-2024)
6.2.2 Global Tape for Wafer Dicing Production Value by Application (2025-2030)
6.2.3 Global Tape for Wafer Dicing Production Value Market Share by Application (2019-2030)
6.3 Global Tape for Wafer Dicing Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Furukawa Electric
7.1.1 Furukawa Electric Tape for Wafer Dicing Corporation Information
7.1.2 Furukawa Electric Tape for Wafer Dicing Product Portfolio
7.1.3 Furukawa Electric Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Furukawa Electric Main Business and Markets Served
7.1.5 Furukawa Electric Recent Developments/Updates
7.2 Nitto
7.2.1 Nitto Tape for Wafer Dicing Corporation Information
7.2.2 Nitto Tape for Wafer Dicing Product Portfolio
7.2.3 Nitto Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nitto Main Business and Markets Served
7.2.5 Nitto Recent Developments/Updates
7.3 Mitsui Chemicals
7.3.1 Mitsui Chemicals Tape for Wafer Dicing Corporation Information
7.3.2 Mitsui Chemicals Tape for Wafer Dicing Product Portfolio
7.3.3 Mitsui Chemicals Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Mitsui Chemicals Main Business and Markets Served
7.3.5 Mitsui Chemicals Recent Developments/Updates
7.4 Lintec Corporation
7.4.1 Lintec Corporation Tape for Wafer Dicing Corporation Information
7.4.2 Lintec Corporation Tape for Wafer Dicing Product Portfolio
7.4.3 Lintec Corporation Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Lintec Corporation Main Business and Markets Served
7.4.5 Lintec Corporation Recent Developments/Updates
7.5 Sumitomo Bakelite
7.5.1 Sumitomo Bakelite Tape for Wafer Dicing Corporation Information
7.5.2 Sumitomo Bakelite Tape for Wafer Dicing Product Portfolio
7.5.3 Sumitomo Bakelite Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Sumitomo Bakelite Main Business and Markets Served
7.5.5 Sumitomo Bakelite Recent Developments/Updates
7.6 Denka
7.6.1 Denka Tape for Wafer Dicing Corporation Information
7.6.2 Denka Tape for Wafer Dicing Product Portfolio
7.6.3 Denka Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Denka Main Business and Markets Served
7.6.5 Denka Recent Developments/Updates
7.7 Pantech Tape
7.7.1 Pantech Tape Tape for Wafer Dicing Corporation Information
7.7.2 Pantech Tape Tape for Wafer Dicing Product Portfolio
7.7.3 Pantech Tape Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Pantech Tape Main Business and Markets Served
7.7.5 Pantech Tape Recent Developments/Updates
7.8 Ultron Systems
7.8.1 Ultron Systems Tape for Wafer Dicing Corporation Information
7.8.2 Ultron Systems Tape for Wafer Dicing Product Portfolio
7.8.3 Ultron Systems Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Ultron Systems Main Business and Markets Served
7.7.5 Ultron Systems Recent Developments/Updates
7.9 AI Technology
7.9.1 AI Technology Tape for Wafer Dicing Corporation Information
7.9.2 AI Technology Tape for Wafer Dicing Product Portfolio
7.9.3 AI Technology Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.9.4 AI Technology Main Business and Markets Served
7.9.5 AI Technology Recent Developments/Updates
7.10 Nippon Pulse Motor Taiwan
7.10.1 Nippon Pulse Motor Taiwan Tape for Wafer Dicing Corporation Information
7.10.2 Nippon Pulse Motor Taiwan Tape for Wafer Dicing Product Portfolio
7.10.3 Nippon Pulse Motor Taiwan Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Nippon Pulse Motor Taiwan Main Business and Markets Served
7.10.5 Nippon Pulse Motor Taiwan Recent Developments/Updates
7.11 Minitron Electronic
7.11.1 Minitron Electronic Tape for Wafer Dicing Corporation Information
7.11.2 Minitron Electronic Tape for Wafer Dicing Product Portfolio
7.11.3 Minitron Electronic Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Minitron Electronic Main Business and Markets Served
7.11.5 Minitron Electronic Recent Developments/Updates
7.12 Loadpoint
7.12.1 Loadpoint Tape for Wafer Dicing Corporation Information
7.12.2 Loadpoint Tape for Wafer Dicing Product Portfolio
7.12.3 Loadpoint Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Loadpoint Main Business and Markets Served
7.12.5 Loadpoint Recent Developments/Updates
7.13 DaehyunST
7.13.1 DaehyunST Tape for Wafer Dicing Corporation Information
7.13.2 DaehyunST Tape for Wafer Dicing Product Portfolio
7.13.3 DaehyunST Tape for Wafer Dicing Production, Value, Price and Gross Margin (2019-2024)
7.13.4 DaehyunST Main Business and Markets Served
7.13.5 DaehyunST Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Tape for Wafer Dicing Industry Chain Analysis
8.2 Tape for Wafer Dicing Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Tape for Wafer Dicing Production Mode & Process
8.4 Tape for Wafer Dicing Sales and Marketing
8.4.1 Tape for Wafer Dicing Sales Channels
8.4.2 Tape for Wafer Dicing Distributors
8.5 Tape for Wafer Dicing Customers
9 Tape for Wafer Dicing Market Dynamics
9.1 Tape for Wafer Dicing Industry Trends
9.2 Tape for Wafer Dicing Market Drivers
9.3 Tape for Wafer Dicing Market Challenges
9.4 Tape for Wafer Dicing Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Tape for Wafer Dicing Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Tape for Wafer Dicing Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Tape for Wafer Dicing Production Capacity (K Sq) by Manufacturers in 2023
Table 4. Global Tape for Wafer Dicing Production by Manufacturers (2019-2024) & (K Sq)
Table 5. Global Tape for Wafer Dicing Production Market Share by Manufacturers (2019-2024)
Table 6. Global Tape for Wafer Dicing Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Tape for Wafer Dicing Production Value Share by Manufacturers (2019-2024)
Table 8. Global Tape for Wafer Dicing Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Tape for Wafer Dicing as of 2023)
Table 10. Global Market Tape for Wafer Dicing Average Price by Manufacturers (US$/Sq) & (2019-2024)
Table 11. Manufacturers Tape for Wafer Dicing Production Sites and Area Served
Table 12. Manufacturers Tape for Wafer Dicing Product Types
Table 13. Global Tape for Wafer Dicing Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Tape for Wafer Dicing Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Tape for Wafer Dicing Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Tape for Wafer Dicing Production Value Market Share by Region (2019-2024)
Table 18. Global Tape for Wafer Dicing Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Tape for Wafer Dicing Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Tape for Wafer Dicing Production Comparison by Region: 2019 VS 2023 VS 2030 (K Sq)
Table 21. Global Tape for Wafer Dicing Production (K Sq) by Region (2019-2024)
Table 22. Global Tape for Wafer Dicing Production Market Share by Region (2019-2024)
Table 23. Global Tape for Wafer Dicing Production (K Sq) Forecast by Region (2025-2030)
Table 24. Global Tape for Wafer Dicing Production Market Share Forecast by Region (2025-2030)
Table 25. Global Tape for Wafer Dicing Market Average Price (US$/Sq) by Region (2019-2024)
Table 26. Global Tape for Wafer Dicing Market Average Price (US$/Sq) by Region (2025-2030)
Table 27. Global Tape for Wafer Dicing Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Sq)
Table 28. Global Tape for Wafer Dicing Consumption by Region (2019-2024) & (K Sq)
Table 29. Global Tape for Wafer Dicing Consumption Market Share by Region (2019-2024)
Table 30. Global Tape for Wafer Dicing Forecasted Consumption by Region (2025-2030) & (K Sq)
Table 31. Global Tape for Wafer Dicing Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sq)
Table 33. North America Tape for Wafer Dicing Consumption by Country (2019-2024) & (K Sq)
Table 34. North America Tape for Wafer Dicing Consumption by Country (2025-2030) & (K Sq)
Table 35. Europe Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sq)
Table 36. Europe Tape for Wafer Dicing Consumption by Country (2019-2024) & (K Sq)
Table 37. Europe Tape for Wafer Dicing Consumption by Country (2025-2030) & (K Sq)
Table 38. Asia Pacific Tape for Wafer Dicing Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Sq)
Table 39. Asia Pacific Tape for Wafer Dicing Consumption by Region (2019-2024) & (K Sq)
Table 40. Asia Pacific Tape for Wafer Dicing Consumption by Region (2025-2030) & (K Sq)
Table 41. Latin America, Middle East & Africa Tape for Wafer Dicing Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sq)
Table 42. Latin America, Middle East & Africa Tape for Wafer Dicing Consumption by Country (2019-2024) & (K Sq)
Table 43. Latin America, Middle East & Africa Tape for Wafer Dicing Consumption by Country (2025-2030) & (K Sq)
Table 44. Global Tape for Wafer Dicing Production (K Sq) by Type (2019-2024)
Table 45. Global Tape for Wafer Dicing Production (K Sq) by Type (2025-2030)
Table 46. Global Tape for Wafer Dicing Production Market Share by Type (2019-2024)
Table 47. Global Tape for Wafer Dicing Production Market Share by Type (2025-2030)
Table 48. Global Tape for Wafer Dicing Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Tape for Wafer Dicing Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Tape for Wafer Dicing Production Value Share by Type (2019-2024)
Table 51. Global Tape for Wafer Dicing Production Value Share by Type (2025-2030)
Table 52. Global Tape for Wafer Dicing Price (US$/Sq) by Type (2019-2024)
Table 53. Global Tape for Wafer Dicing Price (US$/Sq) by Type (2025-2030)
Table 54. Global Tape for Wafer Dicing Production (K Sq) by Application (2019-2024)
Table 55. Global Tape for Wafer Dicing Production (K Sq) by Application (2025-2030)
Table 56. Global Tape for Wafer Dicing Production Market Share by Application (2019-2024)
Table 57. Global Tape for Wafer Dicing Production Market Share by Application (2025-2030)
Table 58. Global Tape for Wafer Dicing Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Tape for Wafer Dicing Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Tape for Wafer Dicing Production Value Share by Application (2019-2024)
Table 61. Global Tape for Wafer Dicing Production Value Share by Application (2025-2030)
Table 62. Global Tape for Wafer Dicing Price (US$/Sq) by Application (2019-2024)
Table 63. Global Tape for Wafer Dicing Price (US$/Sq) by Application (2025-2030)
Table 64. Furukawa Electric Tape for Wafer Dicing Corporation Information
Table 65. Furukawa Electric Specification and Application
Table 66. Furukawa Electric Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 67. Furukawa Electric Main Business and Markets Served
Table 68. Furukawa Electric Recent Developments/Updates
Table 69. Nitto Tape for Wafer Dicing Corporation Information
Table 70. Nitto Specification and Application
Table 71. Nitto Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 72. Nitto Main Business and Markets Served
Table 73. Nitto Recent Developments/Updates
Table 74. Mitsui Chemicals Tape for Wafer Dicing Corporation Information
Table 75. Mitsui Chemicals Specification and Application
Table 76. Mitsui Chemicals Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 77. Mitsui Chemicals Main Business and Markets Served
Table 78. Mitsui Chemicals Recent Developments/Updates
Table 79. Lintec Corporation Tape for Wafer Dicing Corporation Information
Table 80. Lintec Corporation Specification and Application
Table 81. Lintec Corporation Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 82. Lintec Corporation Main Business and Markets Served
Table 83. Lintec Corporation Recent Developments/Updates
Table 84. Sumitomo Bakelite Tape for Wafer Dicing Corporation Information
Table 85. Sumitomo Bakelite Specification and Application
Table 86. Sumitomo Bakelite Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 87. Sumitomo Bakelite Main Business and Markets Served
Table 88. Sumitomo Bakelite Recent Developments/Updates
Table 89. Denka Tape for Wafer Dicing Corporation Information
Table 90. Denka Specification and Application
Table 91. Denka Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 92. Denka Main Business and Markets Served
Table 93. Denka Recent Developments/Updates
Table 94. Pantech Tape Tape for Wafer Dicing Corporation Information
Table 95. Pantech Tape Specification and Application
Table 96. Pantech Tape Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 97. Pantech Tape Main Business and Markets Served
Table 98. Pantech Tape Recent Developments/Updates
Table 99. Ultron Systems Tape for Wafer Dicing Corporation Information
Table 100. Ultron Systems Specification and Application
Table 101. Ultron Systems Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 102. Ultron Systems Main Business and Markets Served
Table 103. Ultron Systems Recent Developments/Updates
Table 104. AI Technology Tape for Wafer Dicing Corporation Information
Table 105. AI Technology Specification and Application
Table 106. AI Technology Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 107. AI Technology Main Business and Markets Served
Table 108. AI Technology Recent Developments/Updates
Table 109. Nippon Pulse Motor Taiwan Tape for Wafer Dicing Corporation Information
Table 110. Nippon Pulse Motor Taiwan Specification and Application
Table 111. Nippon Pulse Motor Taiwan Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 112. Nippon Pulse Motor Taiwan Main Business and Markets Served
Table 113. Nippon Pulse Motor Taiwan Recent Developments/Updates
Table 114. Minitron Electronic Tape for Wafer Dicing Corporation Information
Table 115. Minitron Electronic Specification and Application
Table 116. Minitron Electronic Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 117. Minitron Electronic Main Business and Markets Served
Table 118. Minitron Electronic Recent Developments/Updates
Table 119. Loadpoint Tape for Wafer Dicing Corporation Information
Table 120. Loadpoint Specification and Application
Table 121. Loadpoint Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 122. Loadpoint Main Business and Markets Served
Table 123. Loadpoint Recent Developments/Updates
Table 124. DaehyunST Tape for Wafer Dicing Corporation Information
Table 125. DaehyunST Specification and Application
Table 126. DaehyunST Tape for Wafer Dicing Production (K Sq), Value (US$ Million), Price (US$/Sq) and Gross Margin (2019-2024)
Table 127. DaehyunST Main Business and Markets Served
Table 128. DaehyunST Recent Developments/Updates
Table 129. Key Raw Materials Lists
Table 130. Raw Materials Key Suppliers Lists
Table 131. Tape for Wafer Dicing Distributors List
Table 132. Tape for Wafer Dicing Customers List
Table 133. Tape for Wafer Dicing Market Trends
Table 134. Tape for Wafer Dicing Market Drivers
Table 135. Tape for Wafer Dicing Market Challenges
Table 136. Tape for Wafer Dicing Market Restraints
Table 137. Research Programs/Design for This Report
Table 138. Key Data Information from Secondary Sources
Table 139. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Tape for Wafer Dicing
Figure 2. Global Tape for Wafer Dicing Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Tape for Wafer Dicing Market Share by Type: 2023 VS 2030
Figure 4. UV Product Picture
Figure 5. Non-UV Product Picture
Figure 6. Global Tape for Wafer Dicing Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 7. Global Tape for Wafer Dicing Market Share by Application: 2023 VS 2030
Figure 8. Thin Wafer
Figure 9. Bumped Wafer
Figure 10. Global Tape for Wafer Dicing Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 11. Global Tape for Wafer Dicing Production Value (US$ Million) & (2019-2030)
Figure 12. Global Tape for Wafer Dicing Production Capacity (K Sq) & (2019-2030)
Figure 13. Global Tape for Wafer Dicing Production (K Sq) & (2019-2030)
Figure 14. Global Tape for Wafer Dicing Average Price (US$/Sq) & (2019-2030)
Figure 15. Tape for Wafer Dicing Report Years Considered
Figure 16. Tape for Wafer Dicing Production Share by Manufacturers in 2023
Figure 17. Tape for Wafer Dicing Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 18. The Global 5 and 10 Largest Players: Market Share by Tape for Wafer Dicing Revenue in 2023
Figure 19. Global Tape for Wafer Dicing Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 20. Global Tape for Wafer Dicing Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 21. Global Tape for Wafer Dicing Production Comparison by Region: 2019 VS 2023 VS 2030 (K Sq)
Figure 22. Global Tape for Wafer Dicing Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. North America Tape for Wafer Dicing Production Value (US$ Million) Growth Rate (2019-2030)
Figure 24. Europe Tape for Wafer Dicing Production Value (US$ Million) Growth Rate (2019-2030)
Figure 25. China Tape for Wafer Dicing Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Japan Tape for Wafer Dicing Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. Global Tape for Wafer Dicing Consumption by Region: 2019 VS 2023 VS 2030 (K Sq)
Figure 28. Global Tape for Wafer Dicing Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 29. North America Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 30. North America Tape for Wafer Dicing Consumption Market Share by Country (2019-2030)
Figure 31. Canada Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 32. U.S. Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 33. Europe Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 34. Europe Tape for Wafer Dicing Consumption Market Share by Country (2019-2030)
Figure 35. Germany Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 36. France Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 37. U.K. Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 38. Italy Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 39. Russia Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 40. Asia Pacific Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 41. Asia Pacific Tape for Wafer Dicing Consumption Market Share by Regions (2019-2030)
Figure 42. China Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 43. Japan Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 44. South Korea Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 45. China Taiwan Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 46. Southeast Asia Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 47. India Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 48. Latin America, Middle East & Africa Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 49. Latin America, Middle East & Africa Tape for Wafer Dicing Consumption Market Share by Country (2019-2030)
Figure 50. Mexico Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 51. Brazil Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 52. Turkey Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 53. GCC Countries Tape for Wafer Dicing Consumption and Growth Rate (2019-2024) & (K Sq)
Figure 54. Global Production Market Share of Tape for Wafer Dicing by Type (2019-2030)
Figure 55. Global Production Value Market Share of Tape for Wafer Dicing by Type (2019-2030)
Figure 56. Global Tape for Wafer Dicing Price (US$/Sq) by Type (2019-2030)
Figure 57. Global Production Market Share of Tape for Wafer Dicing by Application (2019-2030)
Figure 58. Global Production Value Market Share of Tape for Wafer Dicing by Application (2019-2030)
Figure 59. Global Tape for Wafer Dicing Price (US$/Sq) by Application (2019-2030)
Figure 60. Tape for Wafer Dicing Value Chain
Figure 61. Tape for Wafer Dicing Production Process
Figure 62. Channels of Distribution (Direct Vs Distribution)
Figure 63. Distributors Profiles
Figure 64. Bottom-up and Top-down Approaches for This Report
Figure 65. Data Triangulation
Published By : QY Research
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