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Global Thick Copper Foil for Heat Sink and Current Board Market Research Report 2025
Synopsis
Generally, copper foil (surface treatment) with a thickness greater than 3oz (nominal thickness 105μm) and above is collectively called thick copper foil, and copper foil with a thickness of 300μm and above is called ultra-thick copper foil. After years of experience in surface treatment processes, this thick copper foil is suitable for manufacturing high-power circuit boards and high-frequency boards for automobiles, electric power, communications, military industry, and aerospace.
The global Thick Copper Foil for Heat Sink and Current Board market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Thick Copper Foil for Heat Sink and Current Board is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Thick Copper Foil for Heat Sink and Current Board is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Thick Copper Foil for Heat Sink and Current Board include Fukuda Metal Foil & Powder, Mitsui Mining & Smelting, The Furukawa Electric, JX Nippon Mining & Metals, HuiZhou United Copper Foil Electronic Material, Doosan Electronic(Luxembourg Circuit Copper Foil), Gould Electronics and Taiyo Kogyo Corporation, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Thick Copper Foil for Heat Sink and Current Board, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thick Copper Foil for Heat Sink and Current Board.
Report Scope
The Thick Copper Foil for Heat Sink and Current Board market size, estimations, and forecasts are provided in terms of output/shipments (MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thick Copper Foil for Heat Sink and Current Board market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thick Copper Foil for Heat Sink and Current Board manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Fukuda Metal Foil & Powder
Mitsui Mining & Smelting
The Furukawa Electric
JX Nippon Mining & Metals
HuiZhou United Copper Foil Electronic Material
Doosan Electronic(Luxembourg Circuit Copper Foil)
Gould Electronics
Taiyo Kogyo Corporation
Segment by Type
105 µm-200 µm
200 µm-300 µm
300 µm-400 µm
Above 400 µm
Segment by Application
Various Heat Sink
High Current Board
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Thick Copper Foil for Heat Sink and Current Board manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Thick Copper Foil for Heat Sink and Current Board by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Thick Copper Foil for Heat Sink and Current Board in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Generally, copper foil (surface treatment) with a thickness greater than 3oz (nominal thickness 105μm) and above is collectively called thick copper foil, and copper foil with a thickness of 300μm and above is called ultra-thick copper foil. After years of experience in surface treatment processes, this thick copper foil is suitable for manufacturing high-power circuit boards and high-frequency boards for automobiles, electric power, communications, military industry, and aerospace.
The global Thick Copper Foil for Heat Sink and Current Board market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Thick Copper Foil for Heat Sink and Current Board is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Thick Copper Foil for Heat Sink and Current Board is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Thick Copper Foil for Heat Sink and Current Board include Fukuda Metal Foil & Powder, Mitsui Mining & Smelting, The Furukawa Electric, JX Nippon Mining & Metals, HuiZhou United Copper Foil Electronic Material, Doosan Electronic(Luxembourg Circuit Copper Foil), Gould Electronics and Taiyo Kogyo Corporation, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Thick Copper Foil for Heat Sink and Current Board, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thick Copper Foil for Heat Sink and Current Board.
Report Scope
The Thick Copper Foil for Heat Sink and Current Board market size, estimations, and forecasts are provided in terms of output/shipments (MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thick Copper Foil for Heat Sink and Current Board market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thick Copper Foil for Heat Sink and Current Board manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Fukuda Metal Foil & Powder
Mitsui Mining & Smelting
The Furukawa Electric
JX Nippon Mining & Metals
HuiZhou United Copper Foil Electronic Material
Doosan Electronic(Luxembourg Circuit Copper Foil)
Gould Electronics
Taiyo Kogyo Corporation
Segment by Type
105 µm-200 µm
200 µm-300 µm
300 µm-400 µm
Above 400 µm
Segment by Application
Various Heat Sink
High Current Board
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Thick Copper Foil for Heat Sink and Current Board manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Thick Copper Foil for Heat Sink and Current Board by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Thick Copper Foil for Heat Sink and Current Board in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Thick Copper Foil for Heat Sink and Current Board Market Overview
1.1 Product Definition
1.2 Thick Copper Foil for Heat Sink and Current Board Segment by Type
1.2.1 Global Thick Copper Foil for Heat Sink and Current Board Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 105 µm-200 µm
1.2.3 200 µm-300 µm
1.2.4 300 µm-400 µm
1.2.5 Above 400 µm
1.3 Thick Copper Foil for Heat Sink and Current Board Segment by Application
1.3.1 Global Thick Copper Foil for Heat Sink and Current Board Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Various Heat Sink
1.3.3 High Current Board
1.4 Global Market Growth Prospects
1.4.1 Global Thick Copper Foil for Heat Sink and Current Board Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Thick Copper Foil for Heat Sink and Current Board Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Thick Copper Foil for Heat Sink and Current Board Production Estimates and Forecasts (2019-2030)
1.4.4 Global Thick Copper Foil for Heat Sink and Current Board Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Manufacturers (2019-2024)
2.2 Global Thick Copper Foil for Heat Sink and Current Board Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Thick Copper Foil for Heat Sink and Current Board, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Thick Copper Foil for Heat Sink and Current Board Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Thick Copper Foil for Heat Sink and Current Board Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Thick Copper Foil for Heat Sink and Current Board, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Thick Copper Foil for Heat Sink and Current Board, Product Offered and Application
2.8 Global Key Manufacturers of Thick Copper Foil for Heat Sink and Current Board, Date of Enter into This Industry
2.9 Thick Copper Foil for Heat Sink and Current Board Market Competitive Situation and Trends
2.9.1 Thick Copper Foil for Heat Sink and Current Board Market Concentration Rate
2.9.2 Global 5 and 10 Largest Thick Copper Foil for Heat Sink and Current Board Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Thick Copper Foil for Heat Sink and Current Board Production by Region
3.1 Global Thick Copper Foil for Heat Sink and Current Board Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Thick Copper Foil for Heat Sink and Current Board Production Value by Region (2019-2030)
3.2.1 Global Thick Copper Foil for Heat Sink and Current Board Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Thick Copper Foil for Heat Sink and Current Board by Region (2025-2030)
3.3 Global Thick Copper Foil for Heat Sink and Current Board Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Thick Copper Foil for Heat Sink and Current Board Production by Region (2019-2030)
3.4.1 Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Thick Copper Foil for Heat Sink and Current Board by Region (2025-2030)
3.5 Global Thick Copper Foil for Heat Sink and Current Board Market Price Analysis by Region (2019-2024)
3.6 Global Thick Copper Foil for Heat Sink and Current Board Production and Value, Year-over-Year Growth
3.6.1 North America Thick Copper Foil for Heat Sink and Current Board Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Thick Copper Foil for Heat Sink and Current Board Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Thick Copper Foil for Heat Sink and Current Board Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Thick Copper Foil for Heat Sink and Current Board Production Value Estimates and Forecasts (2019-2030)
4 Thick Copper Foil for Heat Sink and Current Board Consumption by Region
4.1 Global Thick Copper Foil for Heat Sink and Current Board Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Thick Copper Foil for Heat Sink and Current Board Consumption by Region (2019-2030)
4.2.1 Global Thick Copper Foil for Heat Sink and Current Board Consumption by Region (2019-2024)
4.2.2 Global Thick Copper Foil for Heat Sink and Current Board Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Thick Copper Foil for Heat Sink and Current Board Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Thick Copper Foil for Heat Sink and Current Board Production by Type (2019-2030)
5.1.1 Global Thick Copper Foil for Heat Sink and Current Board Production by Type (2019-2024)
5.1.2 Global Thick Copper Foil for Heat Sink and Current Board Production by Type (2025-2030)
5.1.3 Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Type (2019-2030)
5.2 Global Thick Copper Foil for Heat Sink and Current Board Production Value by Type (2019-2030)
5.2.1 Global Thick Copper Foil for Heat Sink and Current Board Production Value by Type (2019-2024)
5.2.2 Global Thick Copper Foil for Heat Sink and Current Board Production Value by Type (2025-2030)
5.2.3 Global Thick Copper Foil for Heat Sink and Current Board Production Value Market Share by Type (2019-2030)
5.3 Global Thick Copper Foil for Heat Sink and Current Board Price by Type (2019-2030)
6 Segment by Application
6.1 Global Thick Copper Foil for Heat Sink and Current Board Production by Application (2019-2030)
6.1.1 Global Thick Copper Foil for Heat Sink and Current Board Production by Application (2019-2024)
6.1.2 Global Thick Copper Foil for Heat Sink and Current Board Production by Application (2025-2030)
6.1.3 Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Application (2019-2030)
6.2 Global Thick Copper Foil for Heat Sink and Current Board Production Value by Application (2019-2030)
6.2.1 Global Thick Copper Foil for Heat Sink and Current Board Production Value by Application (2019-2024)
6.2.2 Global Thick Copper Foil for Heat Sink and Current Board Production Value by Application (2025-2030)
6.2.3 Global Thick Copper Foil for Heat Sink and Current Board Production Value Market Share by Application (2019-2030)
6.3 Global Thick Copper Foil for Heat Sink and Current Board Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Fukuda Metal Foil & Powder
7.1.1 Fukuda Metal Foil & Powder Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.1.2 Fukuda Metal Foil & Powder Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.1.3 Fukuda Metal Foil & Powder Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Fukuda Metal Foil & Powder Main Business and Markets Served
7.1.5 Fukuda Metal Foil & Powder Recent Developments/Updates
7.2 Mitsui Mining & Smelting
7.2.1 Mitsui Mining & Smelting Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.2.2 Mitsui Mining & Smelting Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.2.3 Mitsui Mining & Smelting Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Mitsui Mining & Smelting Main Business and Markets Served
7.2.5 Mitsui Mining & Smelting Recent Developments/Updates
7.3 The Furukawa Electric
7.3.1 The Furukawa Electric Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.3.2 The Furukawa Electric Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.3.3 The Furukawa Electric Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.3.4 The Furukawa Electric Main Business and Markets Served
7.3.5 The Furukawa Electric Recent Developments/Updates
7.4 JX Nippon Mining & Metals
7.4.1 JX Nippon Mining & Metals Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.4.2 JX Nippon Mining & Metals Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.4.3 JX Nippon Mining & Metals Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.4.4 JX Nippon Mining & Metals Main Business and Markets Served
7.4.5 JX Nippon Mining & Metals Recent Developments/Updates
7.5 HuiZhou United Copper Foil Electronic Material
7.5.1 HuiZhou United Copper Foil Electronic Material Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.5.2 HuiZhou United Copper Foil Electronic Material Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.5.3 HuiZhou United Copper Foil Electronic Material Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.5.4 HuiZhou United Copper Foil Electronic Material Main Business and Markets Served
7.5.5 HuiZhou United Copper Foil Electronic Material Recent Developments/Updates
7.6 Doosan Electronic(Luxembourg Circuit Copper Foil)
7.6.1 Doosan Electronic(Luxembourg Circuit Copper Foil) Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.6.2 Doosan Electronic(Luxembourg Circuit Copper Foil) Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.6.3 Doosan Electronic(Luxembourg Circuit Copper Foil) Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Doosan Electronic(Luxembourg Circuit Copper Foil) Main Business and Markets Served
7.6.5 Doosan Electronic(Luxembourg Circuit Copper Foil) Recent Developments/Updates
7.7 Gould Electronics
7.7.1 Gould Electronics Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.7.2 Gould Electronics Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.7.3 Gould Electronics Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Gould Electronics Main Business and Markets Served
7.7.5 Gould Electronics Recent Developments/Updates
7.8 Taiyo Kogyo Corporation
7.8.1 Taiyo Kogyo Corporation Thick Copper Foil for Heat Sink and Current Board Corporation Information
7.8.2 Taiyo Kogyo Corporation Thick Copper Foil for Heat Sink and Current Board Product Portfolio
7.8.3 Taiyo Kogyo Corporation Thick Copper Foil for Heat Sink and Current Board Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Taiyo Kogyo Corporation Main Business and Markets Served
7.7.5 Taiyo Kogyo Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Thick Copper Foil for Heat Sink and Current Board Industry Chain Analysis
8.2 Thick Copper Foil for Heat Sink and Current Board Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Thick Copper Foil for Heat Sink and Current Board Production Mode & Process
8.4 Thick Copper Foil for Heat Sink and Current Board Sales and Marketing
8.4.1 Thick Copper Foil for Heat Sink and Current Board Sales Channels
8.4.2 Thick Copper Foil for Heat Sink and Current Board Distributors
8.5 Thick Copper Foil for Heat Sink and Current Board Customers
9 Thick Copper Foil for Heat Sink and Current Board Market Dynamics
9.1 Thick Copper Foil for Heat Sink and Current Board Industry Trends
9.2 Thick Copper Foil for Heat Sink and Current Board Market Drivers
9.3 Thick Copper Foil for Heat Sink and Current Board Market Challenges
9.4 Thick Copper Foil for Heat Sink and Current Board Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global Thick Copper Foil for Heat Sink and Current Board Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global Thick Copper Foil for Heat Sink and Current Board Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global Thick Copper Foil for Heat Sink and Current Board Production Capacity (MT) by Manufacturers in 2023
Table 4. Global Thick Copper Foil for Heat Sink and Current Board Production by Manufacturers (2019-2024) & (MT)
Table 5. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Manufacturers (2019-2024)
Table 6. Global Thick Copper Foil for Heat Sink and Current Board Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global Thick Copper Foil for Heat Sink and Current Board Production Value Share by Manufacturers (2019-2024)
Table 8. Global Thick Copper Foil for Heat Sink and Current Board Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Thick Copper Foil for Heat Sink and Current Board as of 2023)
Table 10. Global Market Thick Copper Foil for Heat Sink and Current Board Average Price by Manufacturers (US$/MT) & (2019-2024)
Table 11. Manufacturers Thick Copper Foil for Heat Sink and Current Board Production Sites and Area Served
Table 12. Manufacturers Thick Copper Foil for Heat Sink and Current Board Product Types
Table 13. Global Thick Copper Foil for Heat Sink and Current Board Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global Thick Copper Foil for Heat Sink and Current Board Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) by Region (2019-2024)
Table 17. Global Thick Copper Foil for Heat Sink and Current Board Production Value Market Share by Region (2019-2024)
Table 18. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global Thick Copper Foil for Heat Sink and Current Board Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global Thick Copper Foil for Heat Sink and Current Board Production Comparison by Region: 2019 VS 2023 VS 2030 (MT)
Table 21. Global Thick Copper Foil for Heat Sink and Current Board Production (MT) by Region (2019-2024)
Table 22. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Region (2019-2024)
Table 23. Global Thick Copper Foil for Heat Sink and Current Board Production (MT) Forecast by Region (2025-2030)
Table 24. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share Forecast by Region (2025-2030)
Table 25. Global Thick Copper Foil for Heat Sink and Current Board Market Average Price (US$/MT) by Region (2019-2024)
Table 26. Global Thick Copper Foil for Heat Sink and Current Board Market Average Price (US$/MT) by Region (2025-2030)
Table 27. Global Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (MT)
Table 28. Global Thick Copper Foil for Heat Sink and Current Board Consumption by Region (2019-2024) & (MT)
Table 29. Global Thick Copper Foil for Heat Sink and Current Board Consumption Market Share by Region (2019-2024)
Table 30. Global Thick Copper Foil for Heat Sink and Current Board Forecasted Consumption by Region (2025-2030) & (MT)
Table 31. Global Thick Copper Foil for Heat Sink and Current Board Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (MT)
Table 33. North America Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2019-2024) & (MT)
Table 34. North America Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2025-2030) & (MT)
Table 35. Europe Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (MT)
Table 36. Europe Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2019-2024) & (MT)
Table 37. Europe Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2025-2030) & (MT)
Table 38. Asia Pacific Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (MT)
Table 39. Asia Pacific Thick Copper Foil for Heat Sink and Current Board Consumption by Region (2019-2024) & (MT)
Table 40. Asia Pacific Thick Copper Foil for Heat Sink and Current Board Consumption by Region (2025-2030) & (MT)
Table 41. Latin America, Middle East & Africa Thick Copper Foil for Heat Sink and Current Board Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (MT)
Table 42. Latin America, Middle East & Africa Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2019-2024) & (MT)
Table 43. Latin America, Middle East & Africa Thick Copper Foil for Heat Sink and Current Board Consumption by Country (2025-2030) & (MT)
Table 44. Global Thick Copper Foil for Heat Sink and Current Board Production (MT) by Type (2019-2024)
Table 45. Global Thick Copper Foil for Heat Sink and Current Board Production (MT) by Type (2025-2030)
Table 46. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Type (2019-2024)
Table 47. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Type (2025-2030)
Table 48. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) by Type (2019-2024)
Table 49. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) by Type (2025-2030)
Table 50. Global Thick Copper Foil for Heat Sink and Current Board Production Value Share by Type (2019-2024)
Table 51. Global Thick Copper Foil for Heat Sink and Current Board Production Value Share by Type (2025-2030)
Table 52. Global Thick Copper Foil for Heat Sink and Current Board Price (US$/MT) by Type (2019-2024)
Table 53. Global Thick Copper Foil for Heat Sink and Current Board Price (US$/MT) by Type (2025-2030)
Table 54. Global Thick Copper Foil for Heat Sink and Current Board Production (MT) by Application (2019-2024)
Table 55. Global Thick Copper Foil for Heat Sink and Current Board Production (MT) by Application (2025-2030)
Table 56. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Application (2019-2024)
Table 57. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Application (2025-2030)
Table 58. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) by Application (2019-2024)
Table 59. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) by Application (2025-2030)
Table 60. Global Thick Copper Foil for Heat Sink and Current Board Production Value Share by Application (2019-2024)
Table 61. Global Thick Copper Foil for Heat Sink and Current Board Production Value Share by Application (2025-2030)
Table 62. Global Thick Copper Foil for Heat Sink and Current Board Price (US$/MT) by Application (2019-2024)
Table 63. Global Thick Copper Foil for Heat Sink and Current Board Price (US$/MT) by Application (2025-2030)
Table 64. Fukuda Metal Foil & Powder Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 65. Fukuda Metal Foil & Powder Specification and Application
Table 66. Fukuda Metal Foil & Powder Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 67. Fukuda Metal Foil & Powder Main Business and Markets Served
Table 68. Fukuda Metal Foil & Powder Recent Developments/Updates
Table 69. Mitsui Mining & Smelting Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 70. Mitsui Mining & Smelting Specification and Application
Table 71. Mitsui Mining & Smelting Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 72. Mitsui Mining & Smelting Main Business and Markets Served
Table 73. Mitsui Mining & Smelting Recent Developments/Updates
Table 74. The Furukawa Electric Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 75. The Furukawa Electric Specification and Application
Table 76. The Furukawa Electric Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 77. The Furukawa Electric Main Business and Markets Served
Table 78. The Furukawa Electric Recent Developments/Updates
Table 79. JX Nippon Mining & Metals Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 80. JX Nippon Mining & Metals Specification and Application
Table 81. JX Nippon Mining & Metals Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 82. JX Nippon Mining & Metals Main Business and Markets Served
Table 83. JX Nippon Mining & Metals Recent Developments/Updates
Table 84. HuiZhou United Copper Foil Electronic Material Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 85. HuiZhou United Copper Foil Electronic Material Specification and Application
Table 86. HuiZhou United Copper Foil Electronic Material Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 87. HuiZhou United Copper Foil Electronic Material Main Business and Markets Served
Table 88. HuiZhou United Copper Foil Electronic Material Recent Developments/Updates
Table 89. Doosan Electronic(Luxembourg Circuit Copper Foil) Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 90. Doosan Electronic(Luxembourg Circuit Copper Foil) Specification and Application
Table 91. Doosan Electronic(Luxembourg Circuit Copper Foil) Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 92. Doosan Electronic(Luxembourg Circuit Copper Foil) Main Business and Markets Served
Table 93. Doosan Electronic(Luxembourg Circuit Copper Foil) Recent Developments/Updates
Table 94. Gould Electronics Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 95. Gould Electronics Specification and Application
Table 96. Gould Electronics Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 97. Gould Electronics Main Business and Markets Served
Table 98. Gould Electronics Recent Developments/Updates
Table 99. Taiyo Kogyo Corporation Thick Copper Foil for Heat Sink and Current Board Corporation Information
Table 100. Taiyo Kogyo Corporation Specification and Application
Table 101. Taiyo Kogyo Corporation Thick Copper Foil for Heat Sink and Current Board Production (MT), Value (US$ Million), Price (US$/MT) and Gross Margin (2019-2024)
Table 102. Taiyo Kogyo Corporation Main Business and Markets Served
Table 103. Taiyo Kogyo Corporation Recent Developments/Updates
Table 104. Key Raw Materials Lists
Table 105. Raw Materials Key Suppliers Lists
Table 106. Thick Copper Foil for Heat Sink and Current Board Distributors List
Table 107. Thick Copper Foil for Heat Sink and Current Board Customers List
Table 108. Thick Copper Foil for Heat Sink and Current Board Market Trends
Table 109. Thick Copper Foil for Heat Sink and Current Board Market Drivers
Table 110. Thick Copper Foil for Heat Sink and Current Board Market Challenges
Table 111. Thick Copper Foil for Heat Sink and Current Board Market Restraints
Table 112. Research Programs/Design for This Report
Table 113. Key Data Information from Secondary Sources
Table 114. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Thick Copper Foil for Heat Sink and Current Board
Figure 2. Global Thick Copper Foil for Heat Sink and Current Board Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global Thick Copper Foil for Heat Sink and Current Board Market Share by Type: 2023 VS 2030
Figure 4. 105 µm-200 µm Product Picture
Figure 5. 200 µm-300 µm Product Picture
Figure 6. 300 µm-400 µm Product Picture
Figure 7. Above 400 µm Product Picture
Figure 8. Global Thick Copper Foil for Heat Sink and Current Board Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 9. Global Thick Copper Foil for Heat Sink and Current Board Market Share by Application: 2023 VS 2030
Figure 10. Various Heat Sink
Figure 11. High Current Board
Figure 12. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 13. Global Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) & (2019-2030)
Figure 14. Global Thick Copper Foil for Heat Sink and Current Board Production Capacity (MT) & (2019-2030)
Figure 15. Global Thick Copper Foil for Heat Sink and Current Board Production (MT) & (2019-2030)
Figure 16. Global Thick Copper Foil for Heat Sink and Current Board Average Price (US$/MT) & (2019-2030)
Figure 17. Thick Copper Foil for Heat Sink and Current Board Report Years Considered
Figure 18. Thick Copper Foil for Heat Sink and Current Board Production Share by Manufacturers in 2023
Figure 19. Thick Copper Foil for Heat Sink and Current Board Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 20. The Global 5 and 10 Largest Players: Market Share by Thick Copper Foil for Heat Sink and Current Board Revenue in 2023
Figure 21. Global Thick Copper Foil for Heat Sink and Current Board Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 22. Global Thick Copper Foil for Heat Sink and Current Board Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. Global Thick Copper Foil for Heat Sink and Current Board Production Comparison by Region: 2019 VS 2023 VS 2030 (MT)
Figure 24. Global Thick Copper Foil for Heat Sink and Current Board Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. North America Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Europe Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. China Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Japan Thick Copper Foil for Heat Sink and Current Board Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. Global Thick Copper Foil for Heat Sink and Current Board Consumption by Region: 2019 VS 2023 VS 2030 (MT)
Figure 30. Global Thick Copper Foil for Heat Sink and Current Board Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 31. North America Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 32. North America Thick Copper Foil for Heat Sink and Current Board Consumption Market Share by Country (2019-2030)
Figure 33. Canada Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 34. U.S. Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 35. Europe Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 36. Europe Thick Copper Foil for Heat Sink and Current Board Consumption Market Share by Country (2019-2030)
Figure 37. Germany Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 38. France Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 39. U.K. Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 40. Italy Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 41. Russia Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 42. Asia Pacific Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 43. Asia Pacific Thick Copper Foil for Heat Sink and Current Board Consumption Market Share by Regions (2019-2030)
Figure 44. China Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 45. Japan Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 46. South Korea Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 47. China Taiwan Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 48. Southeast Asia Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 49. India Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 50. Latin America, Middle East & Africa Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 51. Latin America, Middle East & Africa Thick Copper Foil for Heat Sink and Current Board Consumption Market Share by Country (2019-2030)
Figure 52. Mexico Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 53. Brazil Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 54. Turkey Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 55. GCC Countries Thick Copper Foil for Heat Sink and Current Board Consumption and Growth Rate (2019-2024) & (MT)
Figure 56. Global Production Market Share of Thick Copper Foil for Heat Sink and Current Board by Type (2019-2030)
Figure 57. Global Production Value Market Share of Thick Copper Foil for Heat Sink and Current Board by Type (2019-2030)
Figure 58. Global Thick Copper Foil for Heat Sink and Current Board Price (US$/MT) by Type (2019-2030)
Figure 59. Global Production Market Share of Thick Copper Foil for Heat Sink and Current Board by Application (2019-2030)
Figure 60. Global Production Value Market Share of Thick Copper Foil for Heat Sink and Current Board by Application (2019-2030)
Figure 61. Global Thick Copper Foil for Heat Sink and Current Board Price (US$/MT) by Application (2019-2030)
Figure 62. Thick Copper Foil for Heat Sink and Current Board Value Chain
Figure 63. Thick Copper Foil for Heat Sink and Current Board Production Process
Figure 64. Channels of Distribution (Direct Vs Distribution)
Figure 65. Distributors Profiles
Figure 66. Bottom-up and Top-down Approaches for This Report
Figure 67. Data Triangulation
Published By : QY Research
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