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Global UV Curing PCB Encapsulating Materials Market Research Report 2025
Synopsis
UV curable PCB encapsulating materials refers to a type of material that is used to encapsulate or protect printed circuit boards (PCBs). These materials are designed to cure or harden when exposed to ultraviolet (UV) light, forming a durable and protective layer around the PCB components. This encapsulation process helps to safeguard the PCB from environmental factors such as moisture, dust, and mechanical stress, ensuring its long-term reliability and performance.
Global UV Curing PCB Encapsulating Materials market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole UV Curing PCB Encapsulating Materials market research.
Key manufacturers engaged in the UV Curing PCB Encapsulating Materials industry include Dymax, Advanced Packaging, Epoxyset, Panacol-Elosol GmbH, Mereco, Inseto, Masterbond, Bostik and 3M, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global UV Curing PCB Encapsulating Materials production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of UV Curing PCB Encapsulating Materials were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole UV Curing PCB Encapsulating Materials market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global UV Curing PCB Encapsulating Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Dymax
Advanced Packaging
Epoxyset
Panacol-Elosol GmbH
Mereco
Inseto
Masterbond
Bostik
3M
Adhesive Systems Inc
Permabond Engineering Adhesives
Tangent Industries
FUSION (Clear Innova)
Henkel
Segment by Type
Acrylic-based Materials
Epoxy-based Materials
Silicone-based Materials
Polyurethane-based Materials
Segment by Application
Consumer Electronics
Industrial
Aerospace
Medical
Automobile
Others
Production by Region
North America
Europe
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The UV Curing PCB Encapsulating Materials report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
UV curable PCB encapsulating materials refers to a type of material that is used to encapsulate or protect printed circuit boards (PCBs). These materials are designed to cure or harden when exposed to ultraviolet (UV) light, forming a durable and protective layer around the PCB components. This encapsulation process helps to safeguard the PCB from environmental factors such as moisture, dust, and mechanical stress, ensuring its long-term reliability and performance.
Global UV Curing PCB Encapsulating Materials market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole UV Curing PCB Encapsulating Materials market research.
Key manufacturers engaged in the UV Curing PCB Encapsulating Materials industry include Dymax, Advanced Packaging, Epoxyset, Panacol-Elosol GmbH, Mereco, Inseto, Masterbond, Bostik and 3M, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global UV Curing PCB Encapsulating Materials production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of UV Curing PCB Encapsulating Materials were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole UV Curing PCB Encapsulating Materials market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global UV Curing PCB Encapsulating Materials market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Dymax
Advanced Packaging
Epoxyset
Panacol-Elosol GmbH
Mereco
Inseto
Masterbond
Bostik
3M
Adhesive Systems Inc
Permabond Engineering Adhesives
Tangent Industries
FUSION (Clear Innova)
Henkel
Segment by Type
Acrylic-based Materials
Epoxy-based Materials
Silicone-based Materials
Polyurethane-based Materials
Segment by Application
Consumer Electronics
Industrial
Aerospace
Medical
Automobile
Others
Production by Region
North America
Europe
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The UV Curing PCB Encapsulating Materials report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 UV Curing PCB Encapsulating Materials Market Overview
1.1 Product Definition
1.2 UV Curing PCB Encapsulating Materials Segment by Type
1.2.1 Global UV Curing PCB Encapsulating Materials Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Acrylic-based Materials
1.2.3 Epoxy-based Materials
1.2.4 Silicone-based Materials
1.2.5 Polyurethane-based Materials
1.3 UV Curing PCB Encapsulating Materials Segment by Application
1.3.1 Global UV Curing PCB Encapsulating Materials Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Aerospace
1.3.5 Medical
1.3.6 Automobile
1.3.7 Others
1.4 Global Market Growth Prospects
1.4.1 Global UV Curing PCB Encapsulating Materials Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global UV Curing PCB Encapsulating Materials Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global UV Curing PCB Encapsulating Materials Production Estimates and Forecasts (2018-2029)
1.4.4 Global UV Curing PCB Encapsulating Materials Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global UV Curing PCB Encapsulating Materials Production Market Share by Manufacturers (2018-2023)
2.2 Global UV Curing PCB Encapsulating Materials Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of UV Curing PCB Encapsulating Materials, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global UV Curing PCB Encapsulating Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global UV Curing PCB Encapsulating Materials Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of UV Curing PCB Encapsulating Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of UV Curing PCB Encapsulating Materials, Product Offered and Application
2.8 Global Key Manufacturers of UV Curing PCB Encapsulating Materials, Date of Enter into This Industry
2.9 UV Curing PCB Encapsulating Materials Market Competitive Situation and Trends
2.9.1 UV Curing PCB Encapsulating Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest UV Curing PCB Encapsulating Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 UV Curing PCB Encapsulating Materials Production by Region
3.1 Global UV Curing PCB Encapsulating Materials Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global UV Curing PCB Encapsulating Materials Production Value by Region (2018-2029)
3.2.1 Global UV Curing PCB Encapsulating Materials Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of UV Curing PCB Encapsulating Materials by Region (2024-2029)
3.3 Global UV Curing PCB Encapsulating Materials Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global UV Curing PCB Encapsulating Materials Production by Region (2018-2029)
3.4.1 Global UV Curing PCB Encapsulating Materials Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of UV Curing PCB Encapsulating Materials by Region (2024-2029)
3.5 Global UV Curing PCB Encapsulating Materials Market Price Analysis by Region (2018-2023)
3.6 Global UV Curing PCB Encapsulating Materials Production and Value, Year-over-Year Growth
3.6.1 North America UV Curing PCB Encapsulating Materials Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe UV Curing PCB Encapsulating Materials Production Value Estimates and Forecasts (2018-2029)
4 UV Curing PCB Encapsulating Materials Consumption by Region
4.1 Global UV Curing PCB Encapsulating Materials Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global UV Curing PCB Encapsulating Materials Consumption by Region (2018-2029)
4.2.1 Global UV Curing PCB Encapsulating Materials Consumption by Region (2018-2023)
4.2.2 Global UV Curing PCB Encapsulating Materials Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America UV Curing PCB Encapsulating Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America UV Curing PCB Encapsulating Materials Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe UV Curing PCB Encapsulating Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe UV Curing PCB Encapsulating Materials Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific UV Curing PCB Encapsulating Materials Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific UV Curing PCB Encapsulating Materials Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa UV Curing PCB Encapsulating Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa UV Curing PCB Encapsulating Materials Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global UV Curing PCB Encapsulating Materials Production by Type (2018-2029)
5.1.1 Global UV Curing PCB Encapsulating Materials Production by Type (2018-2023)
5.1.2 Global UV Curing PCB Encapsulating Materials Production by Type (2024-2029)
5.1.3 Global UV Curing PCB Encapsulating Materials Production Market Share by Type (2018-2029)
5.2 Global UV Curing PCB Encapsulating Materials Production Value by Type (2018-2029)
5.2.1 Global UV Curing PCB Encapsulating Materials Production Value by Type (2018-2023)
5.2.2 Global UV Curing PCB Encapsulating Materials Production Value by Type (2024-2029)
5.2.3 Global UV Curing PCB Encapsulating Materials Production Value Market Share by Type (2018-2029)
5.3 Global UV Curing PCB Encapsulating Materials Price by Type (2018-2029)
6 Segment by Application
6.1 Global UV Curing PCB Encapsulating Materials Production by Application (2018-2029)
6.1.1 Global UV Curing PCB Encapsulating Materials Production by Application (2018-2023)
6.1.2 Global UV Curing PCB Encapsulating Materials Production by Application (2024-2029)
6.1.3 Global UV Curing PCB Encapsulating Materials Production Market Share by Application (2018-2029)
6.2 Global UV Curing PCB Encapsulating Materials Production Value by Application (2018-2029)
6.2.1 Global UV Curing PCB Encapsulating Materials Production Value by Application (2018-2023)
6.2.2 Global UV Curing PCB Encapsulating Materials Production Value by Application (2024-2029)
6.2.3 Global UV Curing PCB Encapsulating Materials Production Value Market Share by Application (2018-2029)
6.3 Global UV Curing PCB Encapsulating Materials Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Dymax
7.1.1 Dymax UV Curing PCB Encapsulating Materials Corporation Information
7.1.2 Dymax UV Curing PCB Encapsulating Materials Product Portfolio
7.1.3 Dymax UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Dymax Main Business and Markets Served
7.1.5 Dymax Recent Developments/Updates
7.2 Advanced Packaging
7.2.1 Advanced Packaging UV Curing PCB Encapsulating Materials Corporation Information
7.2.2 Advanced Packaging UV Curing PCB Encapsulating Materials Product Portfolio
7.2.3 Advanced Packaging UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Advanced Packaging Main Business and Markets Served
7.2.5 Advanced Packaging Recent Developments/Updates
7.3 Epoxyset
7.3.1 Epoxyset UV Curing PCB Encapsulating Materials Corporation Information
7.3.2 Epoxyset UV Curing PCB Encapsulating Materials Product Portfolio
7.3.3 Epoxyset UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Epoxyset Main Business and Markets Served
7.3.5 Epoxyset Recent Developments/Updates
7.4 Panacol-Elosol GmbH
7.4.1 Panacol-Elosol GmbH UV Curing PCB Encapsulating Materials Corporation Information
7.4.2 Panacol-Elosol GmbH UV Curing PCB Encapsulating Materials Product Portfolio
7.4.3 Panacol-Elosol GmbH UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Panacol-Elosol GmbH Main Business and Markets Served
7.4.5 Panacol-Elosol GmbH Recent Developments/Updates
7.5 Mereco
7.5.1 Mereco UV Curing PCB Encapsulating Materials Corporation Information
7.5.2 Mereco UV Curing PCB Encapsulating Materials Product Portfolio
7.5.3 Mereco UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Mereco Main Business and Markets Served
7.5.5 Mereco Recent Developments/Updates
7.6 Inseto
7.6.1 Inseto UV Curing PCB Encapsulating Materials Corporation Information
7.6.2 Inseto UV Curing PCB Encapsulating Materials Product Portfolio
7.6.3 Inseto UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Inseto Main Business and Markets Served
7.6.5 Inseto Recent Developments/Updates
7.7 Masterbond
7.7.1 Masterbond UV Curing PCB Encapsulating Materials Corporation Information
7.7.2 Masterbond UV Curing PCB Encapsulating Materials Product Portfolio
7.7.3 Masterbond UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Masterbond Main Business and Markets Served
7.7.5 Masterbond Recent Developments/Updates
7.8 Bostik
7.8.1 Bostik UV Curing PCB Encapsulating Materials Corporation Information
7.8.2 Bostik UV Curing PCB Encapsulating Materials Product Portfolio
7.8.3 Bostik UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Bostik Main Business and Markets Served
7.7.5 Bostik Recent Developments/Updates
7.9 3M
7.9.1 3M UV Curing PCB Encapsulating Materials Corporation Information
7.9.2 3M UV Curing PCB Encapsulating Materials Product Portfolio
7.9.3 3M UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.9.4 3M Main Business and Markets Served
7.9.5 3M Recent Developments/Updates
7.10 Adhesive Systems Inc
7.10.1 Adhesive Systems Inc UV Curing PCB Encapsulating Materials Corporation Information
7.10.2 Adhesive Systems Inc UV Curing PCB Encapsulating Materials Product Portfolio
7.10.3 Adhesive Systems Inc UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Adhesive Systems Inc Main Business and Markets Served
7.10.5 Adhesive Systems Inc Recent Developments/Updates
7.11 Permabond Engineering Adhesives
7.11.1 Permabond Engineering Adhesives UV Curing PCB Encapsulating Materials Corporation Information
7.11.2 Permabond Engineering Adhesives UV Curing PCB Encapsulating Materials Product Portfolio
7.11.3 Permabond Engineering Adhesives UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Permabond Engineering Adhesives Main Business and Markets Served
7.11.5 Permabond Engineering Adhesives Recent Developments/Updates
7.12 Tangent Industries
7.12.1 Tangent Industries UV Curing PCB Encapsulating Materials Corporation Information
7.12.2 Tangent Industries UV Curing PCB Encapsulating Materials Product Portfolio
7.12.3 Tangent Industries UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Tangent Industries Main Business and Markets Served
7.12.5 Tangent Industries Recent Developments/Updates
7.13 FUSION (Clear Innova)
7.13.1 FUSION (Clear Innova) UV Curing PCB Encapsulating Materials Corporation Information
7.13.2 FUSION (Clear Innova) UV Curing PCB Encapsulating Materials Product Portfolio
7.13.3 FUSION (Clear Innova) UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.13.4 FUSION (Clear Innova) Main Business and Markets Served
7.13.5 FUSION (Clear Innova) Recent Developments/Updates
7.14 Henkel
7.14.1 Henkel UV Curing PCB Encapsulating Materials Corporation Information
7.14.2 Henkel UV Curing PCB Encapsulating Materials Product Portfolio
7.14.3 Henkel UV Curing PCB Encapsulating Materials Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Henkel Main Business and Markets Served
7.14.5 Henkel Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 UV Curing PCB Encapsulating Materials Industry Chain Analysis
8.2 UV Curing PCB Encapsulating Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 UV Curing PCB Encapsulating Materials Production Mode & Process
8.4 UV Curing PCB Encapsulating Materials Sales and Marketing
8.4.1 UV Curing PCB Encapsulating Materials Sales Channels
8.4.2 UV Curing PCB Encapsulating Materials Distributors
8.5 UV Curing PCB Encapsulating Materials Customers
9 UV Curing PCB Encapsulating Materials Market Dynamics
9.1 UV Curing PCB Encapsulating Materials Industry Trends
9.2 UV Curing PCB Encapsulating Materials Market Drivers
9.3 UV Curing PCB Encapsulating Materials Market Challenges
9.4 UV Curing PCB Encapsulating Materials Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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