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Global Wafer Blade Dicers Market Research Report 2025

Global Wafer Blade Dicers Market Research Report 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1764831

No of Pages : 95

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Synopsis
Wafer blade dicers are cutting machines used in the semiconductor industry to separate wafers into individual chips or devices. Unlike wafer laser dicers that use lasers for cutting, blade dicers employ mechanical diamond blades to perform the slicing operation.

Global Wafer Blade Dicers market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Wafer Blade Dicers market research.

Key manufacturers engaged in the Wafer Blade Dicers industry include DISCO, Tokyo Seimitsu, Advanced Dicing Technologies (ADT), Loadpoint, GL Tech, CETC, Shenyang Heyan Technology, Jiangsu Jingchuang Advanced Electronic Technology and Shenzhen Hi-Test Semiconductor Equipment, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Wafer Blade Dicers production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Wafer Blade Dicers were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Wafer Blade Dicers market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Blade Dicers market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company

  • DISCO
  • Tokyo Seimitsu
  • Advanced Dicing Technologies (ADT)
  • Loadpoint
  • GL Tech
  • CETC
  • Shenyang Heyan Technology
  • Jiangsu Jingchuang Advanced Electronic Technology
  • Shenzhen Hi-Test Semiconductor Equipment
  • Shenzhen Tensun Precision Equipment
  • Zhengzhou Qisheng Precision Manufacturing

Segment by Type

  • Fully Automatic
  • Semi-Automatic

Segment by Application

  • Semiconductor
  • Led
  • Photovoltaic
  • Others

Production by Region

  • North America
  • Europe
  • China
  • Japan

Consumption by Region

  • North America (United States, Canada)
  • Europe (Germany, France, U.K., Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
  • Latin America (Mexico, Brazil,Turkey, GCC Countries)

The Wafer Blade Dicers report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Index

1 Wafer Blade Dicers Market Overview
1.1 Product Definition
1.2 Wafer Blade Dicers Segment by Type
1.2.1 Global Wafer Blade Dicers Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 Wafer Blade Dicers Segment by Application
1.3.1 Global Wafer Blade Dicers Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor
1.3.3 Led
1.3.4 Photovoltaic
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Blade Dicers Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Blade Dicers Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Blade Dicers Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Blade Dicers Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Blade Dicers Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Blade Dicers Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Blade Dicers, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Blade Dicers Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Blade Dicers Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Blade Dicers, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Blade Dicers, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Blade Dicers, Date of Enter into This Industry
2.9 Wafer Blade Dicers Market Competitive Situation and Trends
2.9.1 Wafer Blade Dicers Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Blade Dicers Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Blade Dicers Production by Region
3.1 Global Wafer Blade Dicers Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Blade Dicers Production Value by Region (2018-2029)
3.2.1 Global Wafer Blade Dicers Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Blade Dicers by Region (2024-2029)
3.3 Global Wafer Blade Dicers Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Blade Dicers Production by Region (2018-2029)
3.4.1 Global Wafer Blade Dicers Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Blade Dicers by Region (2024-2029)
3.5 Global Wafer Blade Dicers Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Blade Dicers Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Blade Dicers Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Blade Dicers Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Blade Dicers Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Blade Dicers Production Value Estimates and Forecasts (2018-2029)
4 Wafer Blade Dicers Consumption by Region
4.1 Global Wafer Blade Dicers Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Blade Dicers Consumption by Region (2018-2029)
4.2.1 Global Wafer Blade Dicers Consumption by Region (2018-2023)
4.2.2 Global Wafer Blade Dicers Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Blade Dicers Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Blade Dicers Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Blade Dicers Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Blade Dicers Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Blade Dicers Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Blade Dicers Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Blade Dicers Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Blade Dicers Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Wafer Blade Dicers Production by Type (2018-2029)
5.1.1 Global Wafer Blade Dicers Production by Type (2018-2023)
5.1.2 Global Wafer Blade Dicers Production by Type (2024-2029)
5.1.3 Global Wafer Blade Dicers Production Market Share by Type (2018-2029)
5.2 Global Wafer Blade Dicers Production Value by Type (2018-2029)
5.2.1 Global Wafer Blade Dicers Production Value by Type (2018-2023)
5.2.2 Global Wafer Blade Dicers Production Value by Type (2024-2029)
5.2.3 Global Wafer Blade Dicers Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Blade Dicers Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Blade Dicers Production by Application (2018-2029)
6.1.1 Global Wafer Blade Dicers Production by Application (2018-2023)
6.1.2 Global Wafer Blade Dicers Production by Application (2024-2029)
6.1.3 Global Wafer Blade Dicers Production Market Share by Application (2018-2029)
6.2 Global Wafer Blade Dicers Production Value by Application (2018-2029)
6.2.1 Global Wafer Blade Dicers Production Value by Application (2018-2023)
6.2.2 Global Wafer Blade Dicers Production Value by Application (2024-2029)
6.2.3 Global Wafer Blade Dicers Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Blade Dicers Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DISCO
7.1.1 DISCO Wafer Blade Dicers Corporation Information
7.1.2 DISCO Wafer Blade Dicers Product Portfolio
7.1.3 DISCO Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DISCO Main Business and Markets Served
7.1.5 DISCO Recent Developments/Updates
7.2 Tokyo Seimitsu
7.2.1 Tokyo Seimitsu Wafer Blade Dicers Corporation Information
7.2.2 Tokyo Seimitsu Wafer Blade Dicers Product Portfolio
7.2.3 Tokyo Seimitsu Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Tokyo Seimitsu Main Business and Markets Served
7.2.5 Tokyo Seimitsu Recent Developments/Updates
7.3 Advanced Dicing Technologies (ADT)
7.3.1 Advanced Dicing Technologies (ADT) Wafer Blade Dicers Corporation Information
7.3.2 Advanced Dicing Technologies (ADT) Wafer Blade Dicers Product Portfolio
7.3.3 Advanced Dicing Technologies (ADT) Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Advanced Dicing Technologies (ADT) Main Business and Markets Served
7.3.5 Advanced Dicing Technologies (ADT) Recent Developments/Updates
7.4 Loadpoint
7.4.1 Loadpoint Wafer Blade Dicers Corporation Information
7.4.2 Loadpoint Wafer Blade Dicers Product Portfolio
7.4.3 Loadpoint Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Loadpoint Main Business and Markets Served
7.4.5 Loadpoint Recent Developments/Updates
7.5 GL Tech
7.5.1 GL Tech Wafer Blade Dicers Corporation Information
7.5.2 GL Tech Wafer Blade Dicers Product Portfolio
7.5.3 GL Tech Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.5.4 GL Tech Main Business and Markets Served
7.5.5 GL Tech Recent Developments/Updates
7.6 CETC
7.6.1 CETC Wafer Blade Dicers Corporation Information
7.6.2 CETC Wafer Blade Dicers Product Portfolio
7.6.3 CETC Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.6.4 CETC Main Business and Markets Served
7.6.5 CETC Recent Developments/Updates
7.7 Shenyang Heyan Technology
7.7.1 Shenyang Heyan Technology Wafer Blade Dicers Corporation Information
7.7.2 Shenyang Heyan Technology Wafer Blade Dicers Product Portfolio
7.7.3 Shenyang Heyan Technology Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Shenyang Heyan Technology Main Business and Markets Served
7.7.5 Shenyang Heyan Technology Recent Developments/Updates
7.8 Jiangsu Jingchuang Advanced Electronic Technology
7.8.1 Jiangsu Jingchuang Advanced Electronic Technology Wafer Blade Dicers Corporation Information
7.8.2 Jiangsu Jingchuang Advanced Electronic Technology Wafer Blade Dicers Product Portfolio
7.8.3 Jiangsu Jingchuang Advanced Electronic Technology Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Jiangsu Jingchuang Advanced Electronic Technology Main Business and Markets Served
7.7.5 Jiangsu Jingchuang Advanced Electronic Technology Recent Developments/Updates
7.9 Shenzhen Hi-Test Semiconductor Equipment
7.9.1 Shenzhen Hi-Test Semiconductor Equipment Wafer Blade Dicers Corporation Information
7.9.2 Shenzhen Hi-Test Semiconductor Equipment Wafer Blade Dicers Product Portfolio
7.9.3 Shenzhen Hi-Test Semiconductor Equipment Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Shenzhen Hi-Test Semiconductor Equipment Main Business and Markets Served
7.9.5 Shenzhen Hi-Test Semiconductor Equipment Recent Developments/Updates
7.10 Shenzhen Tensun Precision Equipment
7.10.1 Shenzhen Tensun Precision Equipment Wafer Blade Dicers Corporation Information
7.10.2 Shenzhen Tensun Precision Equipment Wafer Blade Dicers Product Portfolio
7.10.3 Shenzhen Tensun Precision Equipment Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Shenzhen Tensun Precision Equipment Main Business and Markets Served
7.10.5 Shenzhen Tensun Precision Equipment Recent Developments/Updates
7.11 Zhengzhou Qisheng Precision Manufacturing
7.11.1 Zhengzhou Qisheng Precision Manufacturing Wafer Blade Dicers Corporation Information
7.11.2 Zhengzhou Qisheng Precision Manufacturing Wafer Blade Dicers Product Portfolio
7.11.3 Zhengzhou Qisheng Precision Manufacturing Wafer Blade Dicers Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Zhengzhou Qisheng Precision Manufacturing Main Business and Markets Served
7.11.5 Zhengzhou Qisheng Precision Manufacturing Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Blade Dicers Industry Chain Analysis
8.2 Wafer Blade Dicers Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Blade Dicers Production Mode & Process
8.4 Wafer Blade Dicers Sales and Marketing
8.4.1 Wafer Blade Dicers Sales Channels
8.4.2 Wafer Blade Dicers Distributors
8.5 Wafer Blade Dicers Customers
9 Wafer Blade Dicers Market Dynamics
9.1 Wafer Blade Dicers Industry Trends
9.2 Wafer Blade Dicers Market Drivers
9.3 Wafer Blade Dicers Market Challenges
9.4 Wafer Blade Dicers Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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