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Global Wafer Bumping Market Research Report 2025

Global Wafer Bumping Market Research Report 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1688938

No of Pages : 109

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Synopsis
Wafer bumping technology can provide significant performance, form factor and cost advantages in a semiconductor package. Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device. Solder bump composition and dimension depends on a number of factors such as form factor, cost and the electrical, mechanical and thermal performance requirements of the semiconductor device.

The global Wafer Bumping market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report aims to provide a comprehensive presentation of the global market for Wafer Bumping, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bumping.

Report Scope

The Wafer Bumping market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Bumping market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Wafer Bumping companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

ASE Global

Fujitsu

Amkor Technology

Samsung

Maxell

JCET Group

Chipmore Technology

ChipMOS TECHNOLOGIES

NEPES

Tianshui Huatian Technology

Chipbond

Union Semiconductor (Hefei)

TI

International Micro Industries

Raytek Semiconductor

Jiangsu CAS Microelectronics Integration

KYEC

Shinko Electric Industries

LB Semicon

Tongfu Microelectronics

MacDermid Alpha Electronics Solutions

Powertech Technology

Faraday Technology Corporation

Siliconware Precision Industries

SFA Semicon

Winstek Semiconductor

Semi-Pac Inc

Unisem Group

Segment by Type

Copper Pillar Bumping

Solder Bumping

Gold Bumping

Others (Nickel Plated Copper/Tin)

Segment by Application

8 Inch

12 Inch

Others

By Region

North America

United States

Canada

Europe

Germany

France

UK

Italy

Russia

Nordic Countries

Rest of Europe

Asia-Pacific

China

Japan

South Korea

Southeast Asia

India

Australia

Rest of Asia

Latin America

Mexico

Brazil

Rest of Latin America

Middle East & Africa

Turkey

Saudi Arabia

UAE

Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.

Chapter 3: Detailed analysis of Wafer Bumping companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 12: The main points and conclusions of the report.
Index
1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Wafer Bumping Market Size Growth Rate by Type: 2019 VS 2023 VS 2030

1.2.2 Copper Pillar Bumping

1.2.3 Solder Bumping

1.2.4 Gold Bumping

1.2.5 Others (Nickel Plated Copper/Tin)

1.3 Market by Application

1.3.1 Global Wafer Bumping Market Growth by Application: 2019 VS 2023 VS 2030

1.3.2 8 Inch

1.3.3 12 Inch

1.3.4 Others

1.4 Study Objectives

1.5 Years Considered

1.6 Years Considered

2 Global Growth Trends

2.1 Global Wafer Bumping Market Perspective (2019-2030)

2.2 Wafer Bumping Growth Trends by Region

2.2.1 Global Wafer Bumping Market Size by Region: 2019 VS 2023 VS 2030

2.2.2 Wafer Bumping Historic Market Size by Region (2019-2024)

2.2.3 Wafer Bumping Forecasted Market Size by Region (2025-2030)

2.3 Wafer Bumping Market Dynamics

2.3.1 Wafer Bumping Industry Trends

2.3.2 Wafer Bumping Market Drivers

2.3.3 Wafer Bumping Market Challenges

2.3.4 Wafer Bumping Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Wafer Bumping Players by Revenue

3.1.1 Global Top Wafer Bumping Players by Revenue (2019-2024)

3.1.2 Global Wafer Bumping Revenue Market Share by Players (2019-2024)

3.2 Global Wafer Bumping Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Players Covered: Ranking by Wafer Bumping Revenue

3.4 Global Wafer Bumping Market Concentration Ratio

3.4.1 Global Wafer Bumping Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Wafer Bumping Revenue in 2023

3.5 Wafer Bumping Key Players Head office and Area Served

3.6 Key Players Wafer Bumping Product Solution and Service

3.7 Date of Enter into Wafer Bumping Market

3.8 Mergers & Acquisitions, Expansion Plans

4 Wafer Bumping Breakdown Data by Type

4.1 Global Wafer Bumping Historic Market Size by Type (2019-2024)

4.2 Global Wafer Bumping Forecasted Market Size by Type (2025-2030)

5 Wafer Bumping Breakdown Data by Application

5.1 Global Wafer Bumping Historic Market Size by Application (2019-2024)

5.2 Global Wafer Bumping Forecasted Market Size by Application (2025-2030)

6 North America

6.1 North America Wafer Bumping Market Size (2019-2030)

6.2 North America Wafer Bumping Market Growth Rate by Country: 2019 VS 2023 VS 2030

6.3 North America Wafer Bumping Market Size by Country (2019-2024)

6.4 North America Wafer Bumping Market Size by Country (2025-2030)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Wafer Bumping Market Size (2019-2030)

7.2 Europe Wafer Bumping Market Growth Rate by Country: 2019 VS 2023 VS 2030

7.3 Europe Wafer Bumping Market Size by Country (2019-2024)

7.4 Europe Wafer Bumping Market Size by Country (2025-2030)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Wafer Bumping Market Size (2019-2030)

8.2 Asia-Pacific Wafer Bumping Market Growth Rate by Region: 2019 VS 2023 VS 2030

8.3 Asia-Pacific Wafer Bumping Market Size by Region (2019-2024)

8.4 Asia-Pacific Wafer Bumping Market Size by Region (2025-2030)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Wafer Bumping Market Size (2019-2030)

9.2 Latin America Wafer Bumping Market Growth Rate by Country: 2019 VS 2023 VS 2030

9.3 Latin America Wafer Bumping Market Size by Country (2019-2024)

9.4 Latin America Wafer Bumping Market Size by Country (2025-2030)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Wafer Bumping Market Size (2019-2030)

10.2 Middle East & Africa Wafer Bumping Market Growth Rate by Country: 2019 VS 2023 VS 2030

10.3 Middle East & Africa Wafer Bumping Market Size by Country (2019-2024)

10.4 Middle East & Africa Wafer Bumping Market Size by Country (2025-2030)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 ASE Global

11.1.1 ASE Global Company Detail

11.1.2 ASE Global Business Overview

11.1.3 ASE Global Wafer Bumping Introduction

11.1.4 ASE Global Revenue in Wafer Bumping Business (2019-2024)

11.1.5 ASE Global Recent Development

11.2 Fujitsu

11.2.1 Fujitsu Company Detail

11.2.2 Fujitsu Business Overview

11.2.3 Fujitsu Wafer Bumping Introduction

11.2.4 Fujitsu Revenue in Wafer Bumping Business (2019-2024)

11.2.5 Fujitsu Recent Development

11.3 Amkor Technology

11.3.1 Amkor Technology Company Detail

11.3.2 Amkor Technology Business Overview

11.3.3 Amkor Technology Wafer Bumping Introduction

11.3.4 Amkor Technology Revenue in Wafer Bumping Business (2019-2024)

11.3.5 Amkor Technology Recent Development

11.4 Samsung

11.4.1 Samsung Company Detail

11.4.2 Samsung Business Overview

11.4.3 Samsung Wafer Bumping Introduction

11.4.4 Samsung Revenue in Wafer Bumping Business (2019-2024)

11.4.5 Samsung Recent Development

11.5 Maxell

11.5.1 Maxell Company Detail

11.5.2 Maxell Business Overview

11.5.3 Maxell Wafer Bumping Introduction

11.5.4 Maxell Revenue in Wafer Bumping Business (2019-2024)

11.5.5 Maxell Recent Development

11.6 JCET Group

11.6.1 JCET Group Company Detail

11.6.2 JCET Group Business Overview

11.6.3 JCET Group Wafer Bumping Introduction

11.6.4 JCET Group Revenue in Wafer Bumping Business (2019-2024)

11.6.5 JCET Group Recent Development

11.7 Chipmore Technology

11.7.1 Chipmore Technology Company Detail

11.7.2 Chipmore Technology Business Overview

11.7.3 Chipmore Technology Wafer Bumping Introduction

11.7.4 Chipmore Technology Revenue in Wafer Bumping Business (2019-2024)

11.7.5 Chipmore Technology Recent Development

11.8 ChipMOS TECHNOLOGIES

11.8.1 ChipMOS TECHNOLOGIES Company Detail

11.8.2 ChipMOS TECHNOLOGIES Business Overview

11.8.3 ChipMOS TECHNOLOGIES Wafer Bumping Introduction

11.8.4 ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Business (2019-2024)

11.8.5 ChipMOS TECHNOLOGIES Recent Development

11.9 NEPES

11.9.1 NEPES Company Detail

11.9.2 NEPES Business Overview

11.9.3 NEPES Wafer Bumping Introduction

11.9.4 NEPES Revenue in Wafer Bumping Business (2019-2024)

11.9.5 NEPES Recent Development

11.10 Tianshui Huatian Technology

11.10.1 Tianshui Huatian Technology Company Detail

11.10.2 Tianshui Huatian Technology Business Overview

11.10.3 Tianshui Huatian Technology Wafer Bumping Introduction

11.10.4 Tianshui Huatian Technology Revenue in Wafer Bumping Business (2019-2024)

11.10.5 Tianshui Huatian Technology Recent Development

11.11 Chipbond

11.11.1 Chipbond Company Detail

11.11.2 Chipbond Business Overview

11.11.3 Chipbond Wafer Bumping Introduction

11.11.4 Chipbond Revenue in Wafer Bumping Business (2019-2024)

11.11.5 Chipbond Recent Development

11.12 Union Semiconductor (Hefei)

11.12.1 Union Semiconductor (Hefei) Company Detail

11.12.2 Union Semiconductor (Hefei) Business Overview

11.12.3 Union Semiconductor (Hefei) Wafer Bumping Introduction

11.12.4 Union Semiconductor (Hefei) Revenue in Wafer Bumping Business (2019-2024)

11.12.5 Union Semiconductor (Hefei) Recent Development

11.13 TI

11.13.1 TI Company Detail

11.13.2 TI Business Overview

11.13.3 TI Wafer Bumping Introduction

11.13.4 TI Revenue in Wafer Bumping Business (2019-2024)

11.13.5 TI Recent Development

11.14 International Micro Industries

11.14.1 International Micro Industries Company Detail

11.14.2 International Micro Industries Business Overview

11.14.3 International Micro Industries Wafer Bumping Introduction

11.14.4 International Micro Industries Revenue in Wafer Bumping Business (2019-2024)

11.14.5 International Micro Industries Recent Development

11.15 Raytek Semiconductor

11.15.1 Raytek Semiconductor Company Detail

11.15.2 Raytek Semiconductor Business Overview

11.15.3 Raytek Semiconductor Wafer Bumping Introduction

11.15.4 Raytek Semiconductor Revenue in Wafer Bumping Business (2019-2024)

11.15.5 Raytek Semiconductor Recent Development

11.16 Jiangsu CAS Microelectronics Integration

11.16.1 Jiangsu CAS Microelectronics Integration Company Detail

11.16.2 Jiangsu CAS Microelectronics Integration Business Overview

11.16.3 Jiangsu CAS Microelectronics Integration Wafer Bumping Introduction

11.16.4 Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Business (2019-2024)

11.16.5 Jiangsu CAS Microelectronics Integration Recent Development

11.17 KYEC

11.17.1 KYEC Company Detail

11.17.2 KYEC Business Overview

11.17.3 KYEC Wafer Bumping Introduction

11.17.4 KYEC Revenue in Wafer Bumping Business (2019-2024)

11.17.5 KYEC Recent Development

11.18 Shinko Electric Industries

11.18.1 Shinko Electric Industries Company Detail

11.18.2 Shinko Electric Industries Business Overview

11.18.3 Shinko Electric Industries Wafer Bumping Introduction

11.18.4 Shinko Electric Industries Revenue in Wafer Bumping Business (2019-2024)

11.18.5 Shinko Electric Industries Recent Development

11.19 LB Semicon

11.19.1 LB Semicon Company Detail

11.19.2 LB Semicon Business Overview

11.19.3 LB Semicon Wafer Bumping Introduction

11.19.4 LB Semicon Revenue in Wafer Bumping Business (2019-2024)

11.19.5 LB Semicon Recent Development

11.20 Tongfu Microelectronics

11.20.1 Tongfu Microelectronics Company Detail

11.20.2 Tongfu Microelectronics Business Overview

11.20.3 Tongfu Microelectronics Wafer Bumping Introduction

11.20.4 Tongfu Microelectronics Revenue in Wafer Bumping Business (2019-2024)

11.20.5 Tongfu Microelectronics Recent Development

11.21 MacDermid Alpha Electronics Solutions

11.21.1 MacDermid Alpha Electronics Solutions Company Detail

11.21.2 MacDermid Alpha Electronics Solutions Business Overview

11.21.3 MacDermid Alpha Electronics Solutions Wafer Bumping Introduction

11.21.4 MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Business (2019-2024)

11.21.5 MacDermid Alpha Electronics Solutions Recent Development

11.22 Powertech Technology

11.22.1 Powertech Technology Company Detail

11.22.2 Powertech Technology Business Overview

11.22.3 Powertech Technology Wafer Bumping Introduction

11.22.4 Powertech Technology Revenue in Wafer Bumping Business (2019-2024)

11.22.5 Powertech Technology Recent Development

11.23 Faraday Technology Corporation

11.23.1 Faraday Technology Corporation Company Detail

11.23.2 Faraday Technology Corporation Business Overview

11.23.3 Faraday Technology Corporation Wafer Bumping Introduction

11.23.4 Faraday Technology Corporation Revenue in Wafer Bumping Business (2019-2024)

11.23.5 Faraday Technology Corporation Recent Development

11.24 Siliconware Precision Industries

11.24.1 Siliconware Precision Industries Company Detail

11.24.2 Siliconware Precision Industries Business Overview

11.24.3 Siliconware Precision Industries Wafer Bumping Introduction

11.24.4 Siliconware Precision Industries Revenue in Wafer Bumping Business (2019-2024)

11.24.5 Siliconware Precision Industries Recent Development

11.25 SFA Semicon

11.25.1 SFA Semicon Company Detail

11.25.2 SFA Semicon Business Overview

11.25.3 SFA Semicon Wafer Bumping Introduction

11.25.4 SFA Semicon Revenue in Wafer Bumping Business (2019-2024)

11.25.5 SFA Semicon Recent Development

11.26 Winstek Semiconductor

11.26.1 Winstek Semiconductor Company Detail

11.26.2 Winstek Semiconductor Business Overview

11.26.3 Winstek Semiconductor Wafer Bumping Introduction

11.26.4 Winstek Semiconductor Revenue in Wafer Bumping Business (2019-2024)

11.26.5 Winstek Semiconductor Recent Development

11.27 Semi-Pac Inc

11.27.1 Semi-Pac Inc Company Detail

11.27.2 Semi-Pac Inc Business Overview

11.27.3 Semi-Pac Inc Wafer Bumping Introduction

11.27.4 Semi-Pac Inc Revenue in Wafer Bumping Business (2019-2024)

11.27.5 Semi-Pac Inc Recent Development

11.28 Unisem Group

11.28.1 Unisem Group Company Detail

11.28.2 Unisem Group Business Overview

11.28.3 Unisem Group Wafer Bumping Introduction

11.28.4 Unisem Group Revenue in Wafer Bumping Business (2019-2024)

11.28.5 Unisem Group Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.2 Data Source

13.2 Disclaimer

13.3 Author Details
List of Tables
List of Tables

Table 1. Global Wafer Bumping Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030

Table 2. Key Players of Copper Pillar Bumping

Table 3. Key Players of Solder Bumping

Table 4. Key Players of Gold Bumping

Table 5. Key Players of Others (Nickel Plated Copper/Tin)

Table 6. Global Wafer Bumping Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030

Table 7. Global Wafer Bumping Market Size by Region (US$ Million): 2019 VS 2023 VS 2030

Table 8. Global Wafer Bumping Market Size by Region (2019-2024) & (US$ Million)

Table 9. Global Wafer Bumping Market Share by Region (2019-2024)

Table 10. Global Wafer Bumping Forecasted Market Size by Region (2025-2030) & (US$ Million)

Table 11. Global Wafer Bumping Market Share by Region (2025-2030)

Table 12. Wafer Bumping Market Trends

Table 13. Wafer Bumping Market Drivers

Table 14. Wafer Bumping Market Challenges

Table 15. Wafer Bumping Market Restraints

Table 16. Global Wafer Bumping Revenue by Players (2019-2024) & (US$ Million)

Table 17. Global Wafer Bumping Market Share by Players (2019-2024)

Table 18. Global Top Wafer Bumping Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping as of 2023)

Table 19. Ranking of Global Top Wafer Bumping Companies by Revenue (US$ Million) in 2023

Table 20. Global 5 Largest Players Market Share by Wafer Bumping Revenue (CR5 and HHI) & (2019-2024)

Table 21. Key Players Headquarters and Area Served

Table 22. Key Players Wafer Bumping Product Solution and Service

Table 23. Date of Enter into Wafer Bumping Market

Table 24. Mergers & Acquisitions, Expansion Plans

Table 25. Global Wafer Bumping Market Size by Type (2019-2024) & (US$ Million)

Table 26. Global Wafer Bumping Revenue Market Share by Type (2019-2024)

Table 27. Global Wafer Bumping Forecasted Market Size by Type (2025-2030) & (US$ Million)

Table 28. Global Wafer Bumping Revenue Market Share by Type (2025-2030)

Table 29. Global Wafer Bumping Market Size by Application (2019-2024) & (US$ Million)

Table 30. Global Wafer Bumping Revenue Market Share by Application (2019-2024)

Table 31. Global Wafer Bumping Forecasted Market Size by Application (2025-2030) & (US$ Million)

Table 32. Global Wafer Bumping Revenue Market Share by Application (2025-2030)

Table 33. North America Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 34. North America Wafer Bumping Market Size by Country (2019-2024) & (US$ Million)

Table 35. North America Wafer Bumping Market Size by Country (2025-2030) & (US$ Million)

Table 36. Europe Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 37. Europe Wafer Bumping Market Size by Country (2019-2024) & (US$ Million)

Table 38. Europe Wafer Bumping Market Size by Country (2025-2030) & (US$ Million)

Table 39. Asia-Pacific Wafer Bumping Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030

Table 40. Asia-Pacific Wafer Bumping Market Size by Region (2019-2024) & (US$ Million)

Table 41. Asia-Pacific Wafer Bumping Market Size by Region (2025-2030) & (US$ Million)

Table 42. Latin America Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 43. Latin America Wafer Bumping Market Size by Country (2019-2024) & (US$ Million)

Table 44. Latin America Wafer Bumping Market Size by Country (2025-2030) & (US$ Million)

Table 45. Middle East & Africa Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 46. Middle East & Africa Wafer Bumping Market Size by Country (2019-2024) & (US$ Million)

Table 47. Middle East & Africa Wafer Bumping Market Size by Country (2025-2030) & (US$ Million)

Table 48. ASE Global Company Detail

Table 49. ASE Global Business Overview

Table 50. ASE Global Wafer Bumping Product

Table 51. ASE Global Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 52. ASE Global Recent Development

Table 53. Fujitsu Company Detail

Table 54. Fujitsu Business Overview

Table 55. Fujitsu Wafer Bumping Product

Table 56. Fujitsu Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 57. Fujitsu Recent Development

Table 58. Amkor Technology Company Detail

Table 59. Amkor Technology Business Overview

Table 60. Amkor Technology Wafer Bumping Product

Table 61. Amkor Technology Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 62. Amkor Technology Recent Development

Table 63. Samsung Company Detail

Table 64. Samsung Business Overview

Table 65. Samsung Wafer Bumping Product

Table 66. Samsung Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 67. Samsung Recent Development

Table 68. Maxell Company Detail

Table 69. Maxell Business Overview

Table 70. Maxell Wafer Bumping Product

Table 71. Maxell Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 72. Maxell Recent Development

Table 73. JCET Group Company Detail

Table 74. JCET Group Business Overview

Table 75. JCET Group Wafer Bumping Product

Table 76. JCET Group Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 77. JCET Group Recent Development

Table 78. Chipmore Technology Company Detail

Table 79. Chipmore Technology Business Overview

Table 80. Chipmore Technology Wafer Bumping Product

Table 81. Chipmore Technology Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 82. Chipmore Technology Recent Development

Table 83. ChipMOS TECHNOLOGIES Company Detail

Table 84. ChipMOS TECHNOLOGIES Business Overview

Table 85. ChipMOS TECHNOLOGIES Wafer Bumping Product

Table 86. ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 87. ChipMOS TECHNOLOGIES Recent Development

Table 88. NEPES Company Detail

Table 89. NEPES Business Overview

Table 90. NEPES Wafer Bumping Product

Table 91. NEPES Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 92. NEPES Recent Development

Table 93. Tianshui Huatian Technology Company Detail

Table 94. Tianshui Huatian Technology Business Overview

Table 95. Tianshui Huatian Technology Wafer Bumping Product

Table 96. Tianshui Huatian Technology Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 97. Tianshui Huatian Technology Recent Development

Table 98. Chipbond Company Detail

Table 99. Chipbond Business Overview

Table 100. Chipbond Wafer Bumping Product

Table 101. Chipbond Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 102. Chipbond Recent Development

Table 103. Union Semiconductor (Hefei) Company Detail

Table 104. Union Semiconductor (Hefei) Business Overview

Table 105. Union Semiconductor (Hefei) Wafer Bumping Product

Table 106. Union Semiconductor (Hefei) Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 107. Union Semiconductor (Hefei) Recent Development

Table 108. TI Company Detail

Table 109. TI Business Overview

Table 110. TI Wafer Bumping Product

Table 111. TI Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 112. TI Recent Development

Table 113. International Micro Industries Company Detail

Table 114. International Micro Industries Business Overview

Table 115. International Micro Industries Wafer Bumping Product

Table 116. International Micro Industries Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 117. International Micro Industries Recent Development

Table 118. Raytek Semiconductor Company Detail

Table 119. Raytek Semiconductor Business Overview

Table 120. Raytek Semiconductor Wafer Bumping Product

Table 121. Raytek Semiconductor Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 122. Raytek Semiconductor Recent Development

Table 123. Jiangsu CAS Microelectronics Integration Company Detail

Table 124. Jiangsu CAS Microelectronics Integration Business Overview

Table 125. Jiangsu CAS Microelectronics Integration Wafer Bumping Product

Table 126. Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 127. Jiangsu CAS Microelectronics Integration Recent Development

Table 128. KYEC Company Detail

Table 129. KYEC Business Overview

Table 130. KYEC Wafer Bumping Product

Table 131. KYEC Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 132. KYEC Recent Development

Table 133. Shinko Electric Industries Company Detail

Table 134. Shinko Electric Industries Business Overview

Table 135. Shinko Electric Industries Wafer Bumping Product

Table 136. Shinko Electric Industries Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 137. Shinko Electric Industries Recent Development

Table 138. LB Semicon Company Detail

Table 139. LB Semicon Business Overview

Table 140. LB Semicon Wafer Bumping Product

Table 141. LB Semicon Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 142. LB Semicon Recent Development

Table 143. Tongfu Microelectronics Company Detail

Table 144. Tongfu Microelectronics Business Overview

Table 145. Tongfu Microelectronics Wafer Bumping Product

Table 146. Tongfu Microelectronics Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 147. Tongfu Microelectronics Recent Development

Table 148. MacDermid Alpha Electronics Solutions Company Detail

Table 149. MacDermid Alpha Electronics Solutions Business Overview

Table 150. MacDermid Alpha Electronics Solutions Wafer Bumping Product

Table 151. MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 152. MacDermid Alpha Electronics Solutions Recent Development

Table 153. Powertech Technology Company Detail

Table 154. Powertech Technology Business Overview

Table 155. Powertech Technology Wafer Bumping Product

Table 156. Powertech Technology Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 157. Powertech Technology Recent Development

Table 158. Faraday Technology Corporation Company Detail

Table 159. Faraday Technology Corporation Business Overview

Table 160. Faraday Technology Corporation Wafer Bumping Product

Table 161. Faraday Technology Corporation Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 162. Faraday Technology Corporation Recent Development

Table 163. Siliconware Precision Industries Company Detail

Table 164. Siliconware Precision Industries Business Overview

Table 165. Siliconware Precision Industries Wafer Bumping Product

Table 166. Siliconware Precision Industries Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 167. Siliconware Precision Industries Recent Development

Table 168. SFA Semicon Company Detail

Table 169. SFA Semicon Business Overview

Table 170. SFA Semicon Wafer Bumping Product

Table 171. SFA Semicon Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 172. SFA Semicon Recent Development

Table 173. Winstek Semiconductor Company Detail

Table 174. Winstek Semiconductor Business Overview

Table 175. Winstek Semiconductor Wafer Bumping Product

Table 176. Winstek Semiconductor Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 177. Winstek Semiconductor Recent Development

Table 178. Semi-Pac Inc Company Detail

Table 179. Semi-Pac Inc Business Overview

Table 180. Semi-Pac Inc Wafer Bumping Product

Table 181. Semi-Pac Inc Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 182. Semi-Pac Inc Recent Development

Table 183. Unisem Group Company Detail

Table 184. Unisem Group Business Overview

Table 185. Unisem Group Wafer Bumping Product

Table 186. Unisem Group Revenue in Wafer Bumping Business (2019-2024) & (US$ Million)

Table 187. Unisem Group Recent Development

Table 188. Research Programs/Design for This Report

Table 189. Key Data Information from Secondary Sources

Table 190. Key Data Information from Primary Sources

List of Figures

Figure 1. Global Wafer Bumping Market Size Comparison by Type (2024-2030) & (US$ Million)

Figure 2. Global Wafer Bumping Market Share by Type: 2023 VS 2030

Figure 3. Copper Pillar Bumping Features

Figure 4. Solder Bumping Features

Figure 5. Gold Bumping Features

Figure 6. Others (Nickel Plated Copper/Tin) Features

Figure 7. Global Wafer Bumping Market Size Comparison by Application (2024-2030) & (US$ Million)

Figure 8. Global Wafer Bumping Market Share by Application: 2023 VS 2030

Figure 9. 8 Inch Case Studies

Figure 10. 12 Inch Case Studies

Figure 11. Others Case Studies

Figure 12. Wafer Bumping Report Years Considered

Figure 13. Global Wafer Bumping Market Size (US$ Million), Year-over-Year: 2019-2030

Figure 14. Global Wafer Bumping Market Size, (US$ Million), 2019 VS 2023 VS 2030

Figure 15. Global Wafer Bumping Market Share by Region: 2023 VS 2030

Figure 16. Global Wafer Bumping Market Share by Players in 2023

Figure 17. Global Top Wafer Bumping Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping as of 2023)

Figure 18. The Top 10 and 5 Players Market Share by Wafer Bumping Revenue in 2023

Figure 19. North America Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 20. North America Wafer Bumping Market Share by Country (2019-2030)

Figure 21. United States Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 22. Canada Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 23. Europe Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 24. Europe Wafer Bumping Market Share by Country (2019-2030)

Figure 25. Germany Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 26. France Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 27. U.K. Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 28. Italy Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 29. Russia Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 30. Nordic Countries Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 31. Asia-Pacific Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 32. Asia-Pacific Wafer Bumping Market Share by Region (2019-2030)

Figure 33. China Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 34. Japan Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 35. South Korea Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 36. Southeast Asia Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 37. India Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 38. Australia Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 39. Latin America Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 40. Latin America Wafer Bumping Market Share by Country (2019-2030)

Figure 41. Mexico Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 42. Brazil Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 43. Middle East & Africa Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 44. Middle East & Africa Wafer Bumping Market Share by Country (2019-2030)

Figure 45. Turkey Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 46. Saudi Arabia Wafer Bumping Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 47. ASE Global Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 48. Fujitsu Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 49. Amkor Technology Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 50. Samsung Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 51. Maxell Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 52. JCET Group Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 53. Chipmore Technology Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 54. ChipMOS TECHNOLOGIES Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 55. NEPES Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 56. Tianshui Huatian Technology Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 57. Chipbond Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 58. Union Semiconductor (Hefei) Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 59. TI Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 60. International Micro Industries Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 61. Raytek Semiconductor Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 62. Jiangsu CAS Microelectronics Integration Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 63. KYEC Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 64. Shinko Electric Industries Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 65. LB Semicon Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 66. Tongfu Microelectronics Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 67. MacDermid Alpha Electronics Solutions Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 68. Powertech Technology Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 69. Faraday Technology Corporation Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 70. Siliconware Precision Industries Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 71. SFA Semicon Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 72. Winstek Semiconductor Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 73. Semi-Pac Inc Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 74. Unisem Group Revenue Growth Rate in Wafer Bumping Business (2019-2024)

Figure 75. Bottom-up and Top-down Approaches for This Report

Figure 76. Data Triangulation

Figure 77. Key Executives Interviewed

Published By : QY Research

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