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Global Wafer Dicing Knife Market Research Report 2025
Synopsis
Global Wafer Dicing Knife market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Wafer Dicing Knife market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Dicing Knife market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
DISCO Corporation
Penn Engineering
K&S
UKAM
Ceiba
Inseto China
Advanced Dicing Technologies(ADT)
SivaShankar.S
Kadco Ceramics
Sales & Service Incorporated
NDC International
Segment by Type
Hard Knife
Soft Knife
Segment by Application
Semiconductor Packaging and Testing
Integrated Circuit
Discrete Device
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Wafer Dicing Knife report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Global Wafer Dicing Knife market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Wafer Dicing Knife market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Dicing Knife market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
DISCO Corporation
Penn Engineering
K&S
UKAM
Ceiba
Inseto China
Advanced Dicing Technologies(ADT)
SivaShankar.S
Kadco Ceramics
Sales & Service Incorporated
NDC International
Segment by Type
Hard Knife
Soft Knife
Segment by Application
Semiconductor Packaging and Testing
Integrated Circuit
Discrete Device
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Wafer Dicing Knife report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Wafer Dicing Knife Market Overview
1.1 Product Definition
1.2 Wafer Dicing Knife Segment by Type
1.2.1 Global Wafer Dicing Knife Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Hard Knife
1.2.3 Soft Knife
1.3 Wafer Dicing Knife Segment by Application
1.3.1 Global Wafer Dicing Knife Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor Packaging and Testing
1.3.3 Integrated Circuit
1.3.4 Discrete Device
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Dicing Knife Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Dicing Knife Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Dicing Knife Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Dicing Knife Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Dicing Knife Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Dicing Knife Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Dicing Knife, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Dicing Knife Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Dicing Knife Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Dicing Knife, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Dicing Knife, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Dicing Knife, Date of Enter into This Industry
2.9 Wafer Dicing Knife Market Competitive Situation and Trends
2.9.1 Wafer Dicing Knife Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Dicing Knife Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Dicing Knife Production by Region
3.1 Global Wafer Dicing Knife Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Dicing Knife Production Value by Region (2018-2029)
3.2.1 Global Wafer Dicing Knife Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Dicing Knife by Region (2024-2029)
3.3 Global Wafer Dicing Knife Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Dicing Knife Production by Region (2018-2029)
3.4.1 Global Wafer Dicing Knife Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Dicing Knife by Region (2024-2029)
3.5 Global Wafer Dicing Knife Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Dicing Knife Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Dicing Knife Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Dicing Knife Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Dicing Knife Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Dicing Knife Production Value Estimates and Forecasts (2018-2029)
4 Wafer Dicing Knife Consumption by Region
4.1 Global Wafer Dicing Knife Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Dicing Knife Consumption by Region (2018-2029)
4.2.1 Global Wafer Dicing Knife Consumption by Region (2018-2023)
4.2.2 Global Wafer Dicing Knife Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Dicing Knife Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Dicing Knife Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Dicing Knife Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Dicing Knife Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Dicing Knife Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Dicing Knife Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Dicing Knife Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Dicing Knife Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Dicing Knife Production by Type (2018-2029)
5.1.1 Global Wafer Dicing Knife Production by Type (2018-2023)
5.1.2 Global Wafer Dicing Knife Production by Type (2024-2029)
5.1.3 Global Wafer Dicing Knife Production Market Share by Type (2018-2029)
5.2 Global Wafer Dicing Knife Production Value by Type (2018-2029)
5.2.1 Global Wafer Dicing Knife Production Value by Type (2018-2023)
5.2.2 Global Wafer Dicing Knife Production Value by Type (2024-2029)
5.2.3 Global Wafer Dicing Knife Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Dicing Knife Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Dicing Knife Production by Application (2018-2029)
6.1.1 Global Wafer Dicing Knife Production by Application (2018-2023)
6.1.2 Global Wafer Dicing Knife Production by Application (2024-2029)
6.1.3 Global Wafer Dicing Knife Production Market Share by Application (2018-2029)
6.2 Global Wafer Dicing Knife Production Value by Application (2018-2029)
6.2.1 Global Wafer Dicing Knife Production Value by Application (2018-2023)
6.2.2 Global Wafer Dicing Knife Production Value by Application (2024-2029)
6.2.3 Global Wafer Dicing Knife Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Dicing Knife Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DISCO Corporation
7.1.1 DISCO Corporation Wafer Dicing Knife Corporation Information
7.1.2 DISCO Corporation Wafer Dicing Knife Product Portfolio
7.1.3 DISCO Corporation Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DISCO Corporation Main Business and Markets Served
7.1.5 DISCO Corporation Recent Developments/Updates
7.2 Penn Engineering
7.2.1 Penn Engineering Wafer Dicing Knife Corporation Information
7.2.2 Penn Engineering Wafer Dicing Knife Product Portfolio
7.2.3 Penn Engineering Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Penn Engineering Main Business and Markets Served
7.2.5 Penn Engineering Recent Developments/Updates
7.3 K&S
7.3.1 K&S Wafer Dicing Knife Corporation Information
7.3.2 K&S Wafer Dicing Knife Product Portfolio
7.3.3 K&S Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.3.4 K&S Main Business and Markets Served
7.3.5 K&S Recent Developments/Updates
7.4 UKAM
7.4.1 UKAM Wafer Dicing Knife Corporation Information
7.4.2 UKAM Wafer Dicing Knife Product Portfolio
7.4.3 UKAM Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.4.4 UKAM Main Business and Markets Served
7.4.5 UKAM Recent Developments/Updates
7.5 Ceiba
7.5.1 Ceiba Wafer Dicing Knife Corporation Information
7.5.2 Ceiba Wafer Dicing Knife Product Portfolio
7.5.3 Ceiba Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Ceiba Main Business and Markets Served
7.5.5 Ceiba Recent Developments/Updates
7.6 Inseto China
7.6.1 Inseto China Wafer Dicing Knife Corporation Information
7.6.2 Inseto China Wafer Dicing Knife Product Portfolio
7.6.3 Inseto China Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Inseto China Main Business and Markets Served
7.6.5 Inseto China Recent Developments/Updates
7.7 Advanced Dicing Technologies(ADT)
7.7.1 Advanced Dicing Technologies(ADT) Wafer Dicing Knife Corporation Information
7.7.2 Advanced Dicing Technologies(ADT) Wafer Dicing Knife Product Portfolio
7.7.3 Advanced Dicing Technologies(ADT) Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Advanced Dicing Technologies(ADT) Main Business and Markets Served
7.7.5 Advanced Dicing Technologies(ADT) Recent Developments/Updates
7.8 SivaShankar.S
7.8.1 SivaShankar.S Wafer Dicing Knife Corporation Information
7.8.2 SivaShankar.S Wafer Dicing Knife Product Portfolio
7.8.3 SivaShankar.S Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.8.4 SivaShankar.S Main Business and Markets Served
7.7.5 SivaShankar.S Recent Developments/Updates
7.9 Kadco Ceramics
7.9.1 Kadco Ceramics Wafer Dicing Knife Corporation Information
7.9.2 Kadco Ceramics Wafer Dicing Knife Product Portfolio
7.9.3 Kadco Ceramics Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Kadco Ceramics Main Business and Markets Served
7.9.5 Kadco Ceramics Recent Developments/Updates
7.10 Sales & Service Incorporated
7.10.1 Sales & Service Incorporated Wafer Dicing Knife Corporation Information
7.10.2 Sales & Service Incorporated Wafer Dicing Knife Product Portfolio
7.10.3 Sales & Service Incorporated Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Sales & Service Incorporated Main Business and Markets Served
7.10.5 Sales & Service Incorporated Recent Developments/Updates
7.11 NDC International
7.11.1 NDC International Wafer Dicing Knife Corporation Information
7.11.2 NDC International Wafer Dicing Knife Product Portfolio
7.11.3 NDC International Wafer Dicing Knife Production, Value, Price and Gross Margin (2018-2023)
7.11.4 NDC International Main Business and Markets Served
7.11.5 NDC International Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Dicing Knife Industry Chain Analysis
8.2 Wafer Dicing Knife Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Dicing Knife Production Mode & Process
8.4 Wafer Dicing Knife Sales and Marketing
8.4.1 Wafer Dicing Knife Sales Channels
8.4.2 Wafer Dicing Knife Distributors
8.5 Wafer Dicing Knife Customers
9 Wafer Dicing Knife Market Dynamics
9.1 Wafer Dicing Knife Industry Trends
9.2 Wafer Dicing Knife Market Drivers
9.3 Wafer Dicing Knife Market Challenges
9.4 Wafer Dicing Knife Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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