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Global Wafer Gicing Tape Market Research Report 2025
Synopsis
Wafer Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication.
The global Wafer Gicing Tape market was valued at US$ 201 million in 2023 and is anticipated to reach US$ 278.2 million by 2030, witnessing a CAGR of 4.8% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Wafer Gicing Tape, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Gicing Tape.
Report Scope
The Wafer Gicing Tape market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Gicing Tape market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Gicing Tape manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Semiconductor Equipment Corporation
Segment by Type
Polyolefin (PO)
Polyvinyl Chloride (PVC)
Polyethylene Terephthalate (PET)
Other
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Gicing Tape manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Gicing Tape by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Gicing Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Wafer Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication.
The global Wafer Gicing Tape market was valued at US$ 201 million in 2023 and is anticipated to reach US$ 278.2 million by 2030, witnessing a CAGR of 4.8% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Wafer Gicing Tape, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Gicing Tape.
Report Scope
The Wafer Gicing Tape market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Gicing Tape market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Gicing Tape manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Semiconductor Equipment Corporation
Segment by Type
Polyolefin (PO)
Polyvinyl Chloride (PVC)
Polyethylene Terephthalate (PET)
Other
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Gicing Tape manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Gicing Tape by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Gicing Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Wafer Gicing Tape Market Overview
1.1 Product Definition
1.2 Wafer Gicing Tape Segment by Type
1.2.1 Global Wafer Gicing Tape Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Polyolefin (PO)
1.2.3 Polyvinyl Chloride (PVC)
1.2.4 Polyethylene Terephthalate (PET)
1.2.5 Other
1.3 Wafer Gicing Tape Segment by Application
1.3.1 Global Wafer Gicing Tape Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IDMs
1.3.3 OSAT
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Gicing Tape Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Wafer Gicing Tape Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Wafer Gicing Tape Production Estimates and Forecasts (2019-2030)
1.4.4 Global Wafer Gicing Tape Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Gicing Tape Production Market Share by Manufacturers (2019-2024)
2.2 Global Wafer Gicing Tape Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Wafer Gicing Tape, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Wafer Gicing Tape Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Gicing Tape Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Wafer Gicing Tape, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Gicing Tape, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Gicing Tape, Date of Enter into This Industry
2.9 Wafer Gicing Tape Market Competitive Situation and Trends
2.9.1 Wafer Gicing Tape Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Gicing Tape Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Gicing Tape Production by Region
3.1 Global Wafer Gicing Tape Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Wafer Gicing Tape Production Value by Region (2019-2030)
3.2.1 Global Wafer Gicing Tape Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Wafer Gicing Tape by Region (2025-2030)
3.3 Global Wafer Gicing Tape Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Wafer Gicing Tape Production by Region (2019-2030)
3.4.1 Global Wafer Gicing Tape Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Wafer Gicing Tape by Region (2025-2030)
3.5 Global Wafer Gicing Tape Market Price Analysis by Region (2019-2024)
3.6 Global Wafer Gicing Tape Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Gicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Wafer Gicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Wafer Gicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Wafer Gicing Tape Production Value Estimates and Forecasts (2019-2030)
4 Wafer Gicing Tape Consumption by Region
4.1 Global Wafer Gicing Tape Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Wafer Gicing Tape Consumption by Region (2019-2030)
4.2.1 Global Wafer Gicing Tape Consumption by Region (2019-2024)
4.2.2 Global Wafer Gicing Tape Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Wafer Gicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Wafer Gicing Tape Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Gicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Wafer Gicing Tape Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Gicing Tape Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Wafer Gicing Tape Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Gicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Wafer Gicing Tape Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Gicing Tape Production by Type (2019-2030)
5.1.1 Global Wafer Gicing Tape Production by Type (2019-2024)
5.1.2 Global Wafer Gicing Tape Production by Type (2025-2030)
5.1.3 Global Wafer Gicing Tape Production Market Share by Type (2019-2030)
5.2 Global Wafer Gicing Tape Production Value by Type (2019-2030)
5.2.1 Global Wafer Gicing Tape Production Value by Type (2019-2024)
5.2.2 Global Wafer Gicing Tape Production Value by Type (2025-2030)
5.2.3 Global Wafer Gicing Tape Production Value Market Share by Type (2019-2030)
5.3 Global Wafer Gicing Tape Price by Type (2019-2030)
6 Segment by Application
6.1 Global Wafer Gicing Tape Production by Application (2019-2030)
6.1.1 Global Wafer Gicing Tape Production by Application (2019-2024)
6.1.2 Global Wafer Gicing Tape Production by Application (2025-2030)
6.1.3 Global Wafer Gicing Tape Production Market Share by Application (2019-2030)
6.2 Global Wafer Gicing Tape Production Value by Application (2019-2030)
6.2.1 Global Wafer Gicing Tape Production Value by Application (2019-2024)
6.2.2 Global Wafer Gicing Tape Production Value by Application (2025-2030)
6.2.3 Global Wafer Gicing Tape Production Value Market Share by Application (2019-2030)
6.3 Global Wafer Gicing Tape Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Furukawa
7.1.1 Furukawa Wafer Gicing Tape Corporation Information
7.1.2 Furukawa Wafer Gicing Tape Product Portfolio
7.1.3 Furukawa Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Furukawa Main Business and Markets Served
7.1.5 Furukawa Recent Developments/Updates
7.2 Nitto Denko
7.2.1 Nitto Denko Wafer Gicing Tape Corporation Information
7.2.2 Nitto Denko Wafer Gicing Tape Product Portfolio
7.2.3 Nitto Denko Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nitto Denko Main Business and Markets Served
7.2.5 Nitto Denko Recent Developments/Updates
7.3 Mitsui Corporation
7.3.1 Mitsui Corporation Wafer Gicing Tape Corporation Information
7.3.2 Mitsui Corporation Wafer Gicing Tape Product Portfolio
7.3.3 Mitsui Corporation Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Mitsui Corporation Main Business and Markets Served
7.3.5 Mitsui Corporation Recent Developments/Updates
7.4 Lintec Corporation
7.4.1 Lintec Corporation Wafer Gicing Tape Corporation Information
7.4.2 Lintec Corporation Wafer Gicing Tape Product Portfolio
7.4.3 Lintec Corporation Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Lintec Corporation Main Business and Markets Served
7.4.5 Lintec Corporation Recent Developments/Updates
7.5 Sumitomo Bakelite
7.5.1 Sumitomo Bakelite Wafer Gicing Tape Corporation Information
7.5.2 Sumitomo Bakelite Wafer Gicing Tape Product Portfolio
7.5.3 Sumitomo Bakelite Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Sumitomo Bakelite Main Business and Markets Served
7.5.5 Sumitomo Bakelite Recent Developments/Updates
7.6 Denka Company
7.6.1 Denka Company Wafer Gicing Tape Corporation Information
7.6.2 Denka Company Wafer Gicing Tape Product Portfolio
7.6.3 Denka Company Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Denka Company Main Business and Markets Served
7.6.5 Denka Company Recent Developments/Updates
7.7 Pantech Tape
7.7.1 Pantech Tape Wafer Gicing Tape Corporation Information
7.7.2 Pantech Tape Wafer Gicing Tape Product Portfolio
7.7.3 Pantech Tape Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Pantech Tape Main Business and Markets Served
7.7.5 Pantech Tape Recent Developments/Updates
7.8 Ultron Systems
7.8.1 Ultron Systems Wafer Gicing Tape Corporation Information
7.8.2 Ultron Systems Wafer Gicing Tape Product Portfolio
7.8.3 Ultron Systems Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Ultron Systems Main Business and Markets Served
7.7.5 Ultron Systems Recent Developments/Updates
7.9 NEPTCO
7.9.1 NEPTCO Wafer Gicing Tape Corporation Information
7.9.2 NEPTCO Wafer Gicing Tape Product Portfolio
7.9.3 NEPTCO Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.9.4 NEPTCO Main Business and Markets Served
7.9.5 NEPTCO Recent Developments/Updates
7.10 Nippon Pulse Motor
7.10.1 Nippon Pulse Motor Wafer Gicing Tape Corporation Information
7.10.2 Nippon Pulse Motor Wafer Gicing Tape Product Portfolio
7.10.3 Nippon Pulse Motor Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Nippon Pulse Motor Main Business and Markets Served
7.10.5 Nippon Pulse Motor Recent Developments/Updates
7.11 Loadpoint Limited
7.11.1 Loadpoint Limited Wafer Gicing Tape Corporation Information
7.11.2 Loadpoint Limited Wafer Gicing Tape Product Portfolio
7.11.3 Loadpoint Limited Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Loadpoint Limited Main Business and Markets Served
7.11.5 Loadpoint Limited Recent Developments/Updates
7.12 AI Technology
7.12.1 AI Technology Wafer Gicing Tape Corporation Information
7.12.2 AI Technology Wafer Gicing Tape Product Portfolio
7.12.3 AI Technology Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.12.4 AI Technology Main Business and Markets Served
7.12.5 AI Technology Recent Developments/Updates
7.13 Minitron Electronic
7.13.1 Minitron Electronic Wafer Gicing Tape Corporation Information
7.13.2 Minitron Electronic Wafer Gicing Tape Product Portfolio
7.13.3 Minitron Electronic Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Minitron Electronic Main Business and Markets Served
7.13.5 Minitron Electronic Recent Developments/Updates
7.14 Semiconductor Equipment Corporation
7.14.1 Semiconductor Equipment Corporation Wafer Gicing Tape Corporation Information
7.14.2 Semiconductor Equipment Corporation Wafer Gicing Tape Product Portfolio
7.14.3 Semiconductor Equipment Corporation Wafer Gicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Semiconductor Equipment Corporation Main Business and Markets Served
7.14.5 Semiconductor Equipment Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Gicing Tape Industry Chain Analysis
8.2 Wafer Gicing Tape Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Gicing Tape Production Mode & Process
8.4 Wafer Gicing Tape Sales and Marketing
8.4.1 Wafer Gicing Tape Sales Channels
8.4.2 Wafer Gicing Tape Distributors
8.5 Wafer Gicing Tape Customers
9 Wafer Gicing Tape Market Dynamics
9.1 Wafer Gicing Tape Industry Trends
9.2 Wafer Gicing Tape Market Drivers
9.3 Wafer Gicing Tape Market Challenges
9.4 Wafer Gicing Tape Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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