The Market Reports

Synopsis
The global market for High Precision TGV Laser Equipment was estimated to be worth US$ 26.6 million in 2024 and is forecast to a readjusted size of US$ 55.5 million by 2031 with a CAGR of 7.3% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on High Precision TGV Laser Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
High Precision TGV (Through Glass Via) Laser Equipment is specialized machinery used for manufacturing and processing microelectronics, particularly in the production of Through Glass Via (TGV) technology. TGV is a method of creating vertical electrical connections through glass substrates, which is essential for advanced packaging in semiconductor and optoelectronic applications.
TGV hole-forming technology needs to take into account the requirements of cost, speed and quality. The challenge is that it needs to meet a series of requirements such as high speed, high precision, narrow pitch, smooth sidewalls, good verticality and low cost. For many years, many research works in the industry and academia have been committed to the development of low-cost, fast and scalable hole-forming technology. Generally speaking, TGV can be made by sandblasting, photosensitive glass, focused discharge, plasma etching, electrochemical method, laser induced etching and other technologies. So far, laser induced etching has obvious advantages and has been applied. It is expected to stand out in hole-forming technology, making laser etching equipment one of the core equipment of hole-forming process. This process first uses laser technology to preset small holes on the glass wafer, and then puts the glass wafer into a HF solution containing 8% to 15% mass concentration, and the temperature of this solution is maintained at 20°C to 40°C. Then, the container is placed in an ultrasonic device and the device is turned on, and the device emits 40KHz ultrasonic waves. During the etching time of 60 to 120 minutes, the small holes on the glass wafer are etched with HF solution until the required diameter is reached. After the etching is completed, the glass wafer is removed and cleaned with deionized water. Finally, the aperture and permeability of the glass through hole are tested to ensure the process quality.
In terms of product types, wafer-level packaging occupies an important position, and it is expected that the share will reach 52.14% in 2031. At the same time, in terms of application, the share of semiconductors in 2024 is about 60.56%, and the CAGR in the next few years is about 5.13%. In addition to traditional semiconductors and electronics, equipment will be expanded to self-driving cars, 5G communications, biomedicine and transparent displays. It is expected that display panel applications will gradually occupy a larger market in the future.
High-precision TGV (Through Glass Via, glass through hole) laser equipment is a key equipment in the fields of semiconductors, display panels, MEMS (micro-electromechanical systems) and advanced packaging. With the continuous breakthroughs in technology and the growth of market demand, TGV equipment will play an increasingly important role in the field of high-end manufacturing. In terms of international market share and ranking, the main manufacturers are LPKF, 4JET, EKSPLA, TRUMPF, Philoptics, etc. The top five manufacturers in 2024 account for about 87.21% of the international market.
In terms of domestic market share and ranking, the main manufacturers in the Chinese market are LPKF, 4JET, EKSPLA, TRUMPF, Philoptics, etc. The top five manufacturers in 2024 account for about 88.01% of the domestic market. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market. Domestic companies are expected to achieve overtaking in this field and become important players in the global market. China will become the fastest growing market, benefiting from policy support (such as the "14th Five-Year Plan") and technological breakthroughs of local companies (such as Deer Laser's deep hole processing equipment). It is expected that the proportion of China's market size in the world will increase significantly in 2031. North America and Europe focus on high-end application upgrades, such as high-performance computing chip packaging.
This report aims to provide a comprehensive presentation of the global market for High Precision TGV Laser Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of High Precision TGV Laser Equipment by region & country, by Type, and by Application.
The High Precision TGV Laser Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding High Precision TGV Laser Equipment.
Market Segmentation
By Company
LPKF
Delphi Laser
GH Laser
HSET
INTE Laser
E&R Engineering
Philoptics
DR Laser
LasTop Tech
4JET
Huagong Laser
RENA
Lyric
Segment by Type
Wafer Level Packaging
Panel-Level Packaging
Segment by Application
Semiconductor
Display
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of High Precision TGV Laser Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of High Precision TGV Laser Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of High Precision TGV Laser Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index