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IC Advanced Packaging-Global Market Insights and Sales Trends 2025
Synopsis
Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and meet form-factor, power, cost, and electrical performance requirements.
The global IC Advanced Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of IC Advanced Packaging in various end use industries. The expanding demands from the Logic, Imaging and Optoelectronics, Memory and MEMS/Sensors, are propelling IC Advanced Packaging market. 3D, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 2.5D segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for IC Advanced Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global IC Advanced Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global IC Advanced Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, IC Advanced Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of IC Advanced Packaging covered in this report include Abel, Samsung, Toshiba, Intel, Amkor, MAK, Optocap, ASE and Changing Electronics Technology, etc.
The global IC Advanced Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Abel
Samsung
Toshiba
Intel
Amkor
MAK
Optocap
ASE
Changing Electronics Technology
STMicroelectronics
EKSS Microelectronics
Global IC Advanced Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global IC Advanced Packaging market, Segment by Type:
3D
2.5D
Global IC Advanced Packaging market, by Application
Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Power
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of IC Advanced Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and meet form-factor, power, cost, and electrical performance requirements.
The global IC Advanced Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of IC Advanced Packaging in various end use industries. The expanding demands from the Logic, Imaging and Optoelectronics, Memory and MEMS/Sensors, are propelling IC Advanced Packaging market. 3D, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 2.5D segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for IC Advanced Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global IC Advanced Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global IC Advanced Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, IC Advanced Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of IC Advanced Packaging covered in this report include Abel, Samsung, Toshiba, Intel, Amkor, MAK, Optocap, ASE and Changing Electronics Technology, etc.
The global IC Advanced Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Abel
Samsung
Toshiba
Intel
Amkor
MAK
Optocap
ASE
Changing Electronics Technology
STMicroelectronics
EKSS Microelectronics
Global IC Advanced Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global IC Advanced Packaging market, Segment by Type:
3D
2.5D
Global IC Advanced Packaging market, by Application
Logic
Imaging and Optoelectronics
Memory
MEMS/Sensors
LED
Power
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of IC Advanced Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of IC Advanced Packaging
1.1 IC Advanced Packaging Market Overview
1.1.1 IC Advanced Packaging Product Scope
1.1.2 IC Advanced Packaging Market Status and Outlook
1.2 Global IC Advanced Packaging Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global IC Advanced Packaging Market Size by Region (2018-2029)
1.4 Global IC Advanced Packaging Historic Market Size by Region (2018-2023)
1.5 Global IC Advanced Packaging Market Size Forecast by Region (2024-2029)
1.6 Key Regions, IC Advanced Packaging Market Size (2018-2029)
1.6.1 North America IC Advanced Packaging Market Size (2018-2029)
1.6.2 Europe IC Advanced Packaging Market Size (2018-2029)
1.6.3 Asia-Pacific IC Advanced Packaging Market Size (2018-2029)
1.6.4 Latin America IC Advanced Packaging Market Size (2018-2029)
1.6.5 Middle East & Africa IC Advanced Packaging Market Size (2018-2029)
2 IC Advanced Packaging Market by Type
2.1 Introduction
2.1.1 3D
2.1.2 2.5D
2.2 Global IC Advanced Packaging Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global IC Advanced Packaging Historic Market Size by Type (2018-2023)
2.2.2 Global IC Advanced Packaging Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America IC Advanced Packaging Revenue Breakdown by Type (2018-2029)
2.3.2 Europe IC Advanced Packaging Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific IC Advanced Packaging Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America IC Advanced Packaging Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa IC Advanced Packaging Revenue Breakdown by Type (2018-2029)
3 IC Advanced Packaging Market Overview by Application
3.1 Introduction
3.1.1 Logic
3.1.2 Imaging and Optoelectronics
3.1.3 Memory
3.1.4 MEMS/Sensors
3.1.5 LED
3.1.6 Power
3.2 Global IC Advanced Packaging Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global IC Advanced Packaging Historic Market Size by Application (2018-2023)
3.2.2 Global IC Advanced Packaging Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America IC Advanced Packaging Revenue Breakdown by Application (2018-2029)
3.3.2 Europe IC Advanced Packaging Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific IC Advanced Packaging Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America IC Advanced Packaging Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa IC Advanced Packaging Revenue Breakdown by Application (2018-2029)
4 IC Advanced Packaging Competition Analysis by Players
4.1 Global IC Advanced Packaging Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in IC Advanced Packaging as of 2022)
4.3 Date of Key Players Enter into IC Advanced Packaging Market
4.4 Global Top Players IC Advanced Packaging Headquarters and Area Served
4.5 Key Players IC Advanced Packaging Product Solution and Service
4.6 Competitive Status
4.6.1 IC Advanced Packaging Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Abel
5.1.1 Abel Profile
5.1.2 Abel Main Business
5.1.3 Abel IC Advanced Packaging Products, Services and Solutions
5.1.4 Abel IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.1.5 Abel Recent Developments
5.2 Samsung
5.2.1 Samsung Profile
5.2.2 Samsung Main Business
5.2.3 Samsung IC Advanced Packaging Products, Services and Solutions
5.2.4 Samsung IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.2.5 Samsung Recent Developments
5.3 Toshiba
5.3.1 Toshiba Profile
5.3.2 Toshiba Main Business
5.3.3 Toshiba IC Advanced Packaging Products, Services and Solutions
5.3.4 Toshiba IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.3.5 Intel Recent Developments
5.4 Intel
5.4.1 Intel Profile
5.4.2 Intel Main Business
5.4.3 Intel IC Advanced Packaging Products, Services and Solutions
5.4.4 Intel IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.4.5 Intel Recent Developments
5.5 Amkor
5.5.1 Amkor Profile
5.5.2 Amkor Main Business
5.5.3 Amkor IC Advanced Packaging Products, Services and Solutions
5.5.4 Amkor IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.5.5 Amkor Recent Developments
5.6 MAK
5.6.1 MAK Profile
5.6.2 MAK Main Business
5.6.3 MAK IC Advanced Packaging Products, Services and Solutions
5.6.4 MAK IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.6.5 MAK Recent Developments
5.7 Optocap
5.7.1 Optocap Profile
5.7.2 Optocap Main Business
5.7.3 Optocap IC Advanced Packaging Products, Services and Solutions
5.7.4 Optocap IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.7.5 Optocap Recent Developments
5.8 ASE
5.8.1 ASE Profile
5.8.2 ASE Main Business
5.8.3 ASE IC Advanced Packaging Products, Services and Solutions
5.8.4 ASE IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.8.5 ASE Recent Developments
5.9 Changing Electronics Technology
5.9.1 Changing Electronics Technology Profile
5.9.2 Changing Electronics Technology Main Business
5.9.3 Changing Electronics Technology IC Advanced Packaging Products, Services and Solutions
5.9.4 Changing Electronics Technology IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.9.5 Changing Electronics Technology Recent Developments
5.10 STMicroelectronics
5.10.1 STMicroelectronics Profile
5.10.2 STMicroelectronics Main Business
5.10.3 STMicroelectronics IC Advanced Packaging Products, Services and Solutions
5.10.4 STMicroelectronics IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.10.5 STMicroelectronics Recent Developments
5.11 EKSS Microelectronics
5.11.1 EKSS Microelectronics Profile
5.11.2 EKSS Microelectronics Main Business
5.11.3 EKSS Microelectronics IC Advanced Packaging Products, Services and Solutions
5.11.4 EKSS Microelectronics IC Advanced Packaging Revenue (US$ Million) & (2018-2023)
5.11.5 EKSS Microelectronics Recent Developments
6 North America
6.1 North America IC Advanced Packaging Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe IC Advanced Packaging Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific IC Advanced Packaging Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America IC Advanced Packaging Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa IC Advanced Packaging Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 IC Advanced Packaging Market Dynamics
11.1 IC Advanced Packaging Industry Trends
11.2 IC Advanced Packaging Market Drivers
11.3 IC Advanced Packaging Market Challenges
11.4 IC Advanced Packaging Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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