The Market Reports

Synopsis
The global market for IC Package Substrates was estimated to be worth US$ 16460 million in 2024 and is forecast to a readjusted size of US$ 30010 million by 2031 with a CAGR of 8.9% during the forecast period 2025-2031.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.
Surging Demand for Advanced Processors in AI and High-Performance Computing (HPC): The proliferation of artificial intelligence (AI) applications and HPC has escalated the need for sophisticated processors. These processors require advanced IC substrates to ensure efficient performance and reliability.
Expansion of Data Centers and Cloud Computing Services: The global increase in data centers and cloud services necessitates high-performance IC substrates to support robust server and storage solutions, driving market growth.
Advancements in 5G and Emerging 6G Technologies: The rollout of 5G networks and the anticipation of 6G have heightened the demand for advanced IC substrates capable of supporting faster and more efficient data transmission.
Miniaturization and Heterogeneous Integration in Electronics: The trend toward smaller, more complex electronic devices has led to increased adoption of heterogeneous integration. Advanced IC substrates are essential in accommodating multiple chips within compact designs.
Growth in Automotive Electronics: The automotive industry's shift toward electric vehicles (EVs) and autonomous driving technologies has amplified the need for advanced IC substrates to support complex electronic systems within vehicles.
Emergence of Internet of Things (IoT) Devices: The expanding IoT landscape requires efficient and compact IC substrates to facilitate connectivity and functionality across a myriad of devices.
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of IC Package Substrates by region & country, by Type, and by Application.
The IC Package Substrates market size, estimations, and forecasts are provided in terms of sales volume (K Sqm) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates.
Market Segmentation
By Company
Ibiden
Kinsus Interconnect Technology
Unimicron
Shinko Electric Industries
Semco
Simmtech
Nanya
Kyocera
LG Innotek
AT&S
ASE
Daeduck
Shennan Circuit
Zhen Ding Technology
KCC (Korea Circuit Company)
ACCESS
Shenzhen Fastprint Circuit Tech
AKM Meadville
Toppan Printing
Segment by Type
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Others
Segment by Application
Automotive
Mobile Electronics
PC (Tablet, Laptop)
Medical
Industrial
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of IC Package Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of IC Package Substrates in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of IC Package Substrates in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index