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Integrated Circuit Packaging-Global Market Insights and Sales Trends 2025
Synopsis
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits.
The global Integrated Circuit Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Integrated Circuit Packaging in various end use industries. The expanding demands from the Analog Circuits, Digital Circuits, RF Circuits and Sensors, are propelling Integrated Circuit Packaging market. Metal, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Ceramics segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Integrated Circuit Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Integrated Circuit Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Integrated Circuit Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Integrated Circuit Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Integrated Circuit Packaging covered in this report include Ibiden, STATS ChipPAC, Linxens, Toppan Photomasks, AMKOR, ASE, Cadence Design Systems, Atotech Deutschland GmbH and SHINKO, etc.
The global Integrated Circuit Packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Ibiden
STATS ChipPAC
Linxens
Toppan Photomasks
AMKOR
ASE
Cadence Design Systems
Atotech Deutschland GmbH
SHINKO
Global Integrated Circuit Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Integrated Circuit Packaging market, Segment by Type:
Metal
Ceramics
Glass
Global Integrated Circuit Packaging market, by Application
Analog Circuits
Digital Circuits
RF Circuits
Sensors
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Integrated Circuit Packaging manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Integrated Circuit Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
An integrated circuit package has the sole purpose of protecting and maintaining one or more integrated circuits.
The global Integrated Circuit Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Integrated Circuit Packaging in various end use industries. The expanding demands from the Analog Circuits, Digital Circuits, RF Circuits and Sensors, are propelling Integrated Circuit Packaging market. Metal, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Ceramics segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Integrated Circuit Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Integrated Circuit Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Integrated Circuit Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Integrated Circuit Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Integrated Circuit Packaging covered in this report include Ibiden, STATS ChipPAC, Linxens, Toppan Photomasks, AMKOR, ASE, Cadence Design Systems, Atotech Deutschland GmbH and SHINKO, etc.
The global Integrated Circuit Packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Ibiden
STATS ChipPAC
Linxens
Toppan Photomasks
AMKOR
ASE
Cadence Design Systems
Atotech Deutschland GmbH
SHINKO
Global Integrated Circuit Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Integrated Circuit Packaging market, Segment by Type:
Metal
Ceramics
Glass
Global Integrated Circuit Packaging market, by Application
Analog Circuits
Digital Circuits
RF Circuits
Sensors
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Integrated Circuit Packaging manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Integrated Circuit Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Integrated Circuit Packaging Market Overview
1.1 Integrated Circuit Packaging Product Overview
1.2 Integrated Circuit Packaging Market Segment by Type
1.2.1 Metal
1.2.2 Ceramics
1.2.3 Glass
1.3 Global Integrated Circuit Packaging Market Size by Type
1.3.1 Global Integrated Circuit Packaging Market Size Overview by Type (2018-2029)
1.3.2 Global Integrated Circuit Packaging Historic Market Size Review by Type (2018-2023)
1.3.3 Global Integrated Circuit Packaging Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Integrated Circuit Packaging Sales Breakdown by Type (2018-2023)
1.4.2 Europe Integrated Circuit Packaging Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Integrated Circuit Packaging Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Integrated Circuit Packaging Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Integrated Circuit Packaging Sales Breakdown by Type (2018-2023)
2 Global Integrated Circuit Packaging Market Competition by Company
2.1 Global Top Players by Integrated Circuit Packaging Sales (2018-2023)
2.2 Global Top Players by Integrated Circuit Packaging Revenue (2018-2023)
2.3 Global Top Players by Integrated Circuit Packaging Price (2018-2023)
2.4 Global Top Manufacturers Integrated Circuit Packaging Manufacturing Base Distribution, Sales Area, Product Type
2.5 Integrated Circuit Packaging Market Competitive Situation and Trends
2.5.1 Integrated Circuit Packaging Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Integrated Circuit Packaging Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Integrated Circuit Packaging as of 2022)
2.7 Date of Key Manufacturers Enter into Integrated Circuit Packaging Market
2.8 Key Manufacturers Integrated Circuit Packaging Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Integrated Circuit Packaging Status and Outlook by Region
3.1 Global Integrated Circuit Packaging Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Integrated Circuit Packaging Historic Market Size by Region
3.2.1 Global Integrated Circuit Packaging Sales in Volume by Region (2018-2023)
3.2.2 Global Integrated Circuit Packaging Sales in Value by Region (2018-2023)
3.2.3 Global Integrated Circuit Packaging Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Integrated Circuit Packaging Forecasted Market Size by Region
3.3.1 Global Integrated Circuit Packaging Sales in Volume by Region (2024-2029)
3.3.2 Global Integrated Circuit Packaging Sales in Value by Region (2024-2029)
3.3.3 Global Integrated Circuit Packaging Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Integrated Circuit Packaging by Application
4.1 Integrated Circuit Packaging Market Segment by Application
4.1.1 Analog Circuits
4.1.2 Digital Circuits
4.1.3 RF Circuits
4.1.4 Sensors
4.1.5 Others
4.2 Global Integrated Circuit Packaging Market Size by Application
4.2.1 Global Integrated Circuit Packaging Market Size Overview by Application (2018-2029)
4.2.2 Global Integrated Circuit Packaging Historic Market Size Review by Application (2018-2023)
4.2.3 Global Integrated Circuit Packaging Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Integrated Circuit Packaging Sales Breakdown by Application (2018-2023)
4.3.2 Europe Integrated Circuit Packaging Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Integrated Circuit Packaging Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Integrated Circuit Packaging Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Integrated Circuit Packaging Sales Breakdown by Application (2018-2023)
5 North America Integrated Circuit Packaging by Country
5.1 North America Integrated Circuit Packaging Historic Market Size by Country
5.1.1 North America Integrated Circuit Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Integrated Circuit Packaging Sales in Volume by Country (2018-2023)
5.1.3 North America Integrated Circuit Packaging Sales in Value by Country (2018-2023)
5.2 North America Integrated Circuit Packaging Forecasted Market Size by Country
5.2.1 North America Integrated Circuit Packaging Sales in Volume by Country (2024-2029)
5.2.2 North America Integrated Circuit Packaging Sales in Value by Country (2024-2029)
6 Europe Integrated Circuit Packaging by Country
6.1 Europe Integrated Circuit Packaging Historic Market Size by Country
6.1.1 Europe Integrated Circuit Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Integrated Circuit Packaging Sales in Volume by Country (2018-2023)
6.1.3 Europe Integrated Circuit Packaging Sales in Value by Country (2018-2023)
6.2 Europe Integrated Circuit Packaging Forecasted Market Size by Country
6.2.1 Europe Integrated Circuit Packaging Sales in Volume by Country (2024-2029)
6.2.2 Europe Integrated Circuit Packaging Sales in Value by Country (2024-2029)
7 Asia-Pacific Integrated Circuit Packaging by Region
7.1 Asia-Pacific Integrated Circuit Packaging Historic Market Size by Region
7.1.1 Asia-Pacific Integrated Circuit Packaging Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Integrated Circuit Packaging Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Integrated Circuit Packaging Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Integrated Circuit Packaging Forecasted Market Size by Region
7.2.1 Asia-Pacific Integrated Circuit Packaging Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Integrated Circuit Packaging Sales in Value by Region (2024-2029)
8 Latin America Integrated Circuit Packaging by Country
8.1 Latin America Integrated Circuit Packaging Historic Market Size by Country
8.1.1 Latin America Integrated Circuit Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Integrated Circuit Packaging Sales in Volume by Country (2018-2023)
8.1.3 Latin America Integrated Circuit Packaging Sales in Value by Country (2018-2023)
8.2 Latin America Integrated Circuit Packaging Forecasted Market Size by Country
8.2.1 Latin America Integrated Circuit Packaging Sales in Volume by Country (2024-2029)
8.2.2 Latin America Integrated Circuit Packaging Sales in Value by Country (2024-2029)
9 Middle East and Africa Integrated Circuit Packaging by Country
9.1 Middle East and Africa Integrated Circuit Packaging Historic Market Size by Country
9.1.1 Middle East and Africa Integrated Circuit Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Integrated Circuit Packaging Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Integrated Circuit Packaging Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Integrated Circuit Packaging Forecasted Market Size by Country
9.2.1 Middle East and Africa Integrated Circuit Packaging Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Integrated Circuit Packaging Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Ibiden
10.1.1 Ibiden Company Information
10.1.2 Ibiden Introduction and Business Overview
10.1.3 Ibiden Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Ibiden Integrated Circuit Packaging Products Offered
10.1.5 Ibiden Recent Development
10.2 STATS ChipPAC
10.2.1 STATS ChipPAC Company Information
10.2.2 STATS ChipPAC Introduction and Business Overview
10.2.3 STATS ChipPAC Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.2.4 STATS ChipPAC Integrated Circuit Packaging Products Offered
10.2.5 STATS ChipPAC Recent Development
10.3 Linxens
10.3.1 Linxens Company Information
10.3.2 Linxens Introduction and Business Overview
10.3.3 Linxens Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Linxens Integrated Circuit Packaging Products Offered
10.3.5 Linxens Recent Development
10.4 Toppan Photomasks
10.4.1 Toppan Photomasks Company Information
10.4.2 Toppan Photomasks Introduction and Business Overview
10.4.3 Toppan Photomasks Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Toppan Photomasks Integrated Circuit Packaging Products Offered
10.4.5 Toppan Photomasks Recent Development
10.5 AMKOR
10.5.1 AMKOR Company Information
10.5.2 AMKOR Introduction and Business Overview
10.5.3 AMKOR Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.5.4 AMKOR Integrated Circuit Packaging Products Offered
10.5.5 AMKOR Recent Development
10.6 ASE
10.6.1 ASE Company Information
10.6.2 ASE Introduction and Business Overview
10.6.3 ASE Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.6.4 ASE Integrated Circuit Packaging Products Offered
10.6.5 ASE Recent Development
10.7 Cadence Design Systems
10.7.1 Cadence Design Systems Company Information
10.7.2 Cadence Design Systems Introduction and Business Overview
10.7.3 Cadence Design Systems Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Cadence Design Systems Integrated Circuit Packaging Products Offered
10.7.5 Cadence Design Systems Recent Development
10.8 Atotech Deutschland GmbH
10.8.1 Atotech Deutschland GmbH Company Information
10.8.2 Atotech Deutschland GmbH Introduction and Business Overview
10.8.3 Atotech Deutschland GmbH Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Atotech Deutschland GmbH Integrated Circuit Packaging Products Offered
10.8.5 Atotech Deutschland GmbH Recent Development
10.9 SHINKO
10.9.1 SHINKO Company Information
10.9.2 SHINKO Introduction and Business Overview
10.9.3 SHINKO Integrated Circuit Packaging Sales, Revenue and Gross Margin (2018-2023)
10.9.4 SHINKO Integrated Circuit Packaging Products Offered
10.9.5 SHINKO Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Integrated Circuit Packaging Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Integrated Circuit Packaging Industrial Chain Analysis
11.4 Integrated Circuit Packaging Market Dynamics
11.4.1 Integrated Circuit Packaging Industry Trends
11.4.2 Integrated Circuit Packaging Market Drivers
11.4.3 Integrated Circuit Packaging Market Challenges
11.4.4 Integrated Circuit Packaging Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Integrated Circuit Packaging Distributors
12.3 Integrated Circuit Packaging Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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