The Market Reports

Synopsis
The global market for Laser Grooving Equipment for Semiconductor was estimated to be worth US$ 468 million in 2024 and is forecast to a readjusted size of US$ 810 million by 2031 with a CAGR of 9.2% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Laser Grooving Equipment for Semiconductor cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Laser grooving equipment for semiconductor is a kind of machine that through laser scribing, remove the Low-k substances in the wafer saw track and the coating formed by the metal wiring layer in advance, thereby reducing the occurrence of chip defects and improving chip production efficiency in the subsequent blade dicing process.
The Laser Grooving Equipment for Semiconductor market has shown strong growth momentum in recent years, mainly benefiting from the rapid development of the semiconductor industry and the increased demand for precision manufacturing processes. With the increase in chip integration, traditional blade-wheel scribing technology can no longer meet the processing requirements of low-k dielectric wafers. Laser grooving technology, due to its non-contact processing characteristics, can effectively avoid film cracking and shedding, and has become the preferred process in the field of advanced packaging. The Asia-Pacific region occupies a dominant position, accounting for approximately 70% in 2024. Among them, China dominates photovoltaic and consumer electronics demand, while Japan and South Korea focus on high-end chip manufacturing.
At present, the global laser grooving equipment for semiconductor market is mainly dominated by international manufacturers such as DISCO, ASMPT and EO Technics, with a combined market share of more than 71%. With the advancement of localization, domestic manufacturers such as Dr Laser and Huagong Laser have made significant progress in technology research and development and market expansion, gradually narrowing the gap with international leading companies.
Laser grooving equipment for semiconductors is widely used in solar cell, integrated circuits and other fields. In the solar industry, it is mainly used for back electrode grooving and heterojunction precision processing of PERC and HJT cells, accounting for about 35% in 2024. This equipment is gradually penetrating into emerging fields such as MEMS sensors, quantum chips and optical communication devices.
In the future, with the further popularization of fields such as 5G, artificial intelligence, and the Internet of Things, the market demand for Laser Grooving Equipment is expected to continue to grow. At the same time, technological progress and innovation will drive the improvement of equipment performance, reduce production costs, and improve production efficiency. In addition, the demand for environmental protection and sustainable development will also prompt companies to develop more energy-saving and environmentally friendly equipment. Overall, the Laser Grooving Equipment market has broad prospects and will usher in more opportunities and challenges in the next few years.
This report aims to provide a comprehensive presentation of the global market for Laser Grooving Equipment for Semiconductor, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Laser Grooving Equipment for Semiconductor by region & country, by Type, and by Application.
The Laser Grooving Equipment for Semiconductor market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Laser Grooving Equipment for Semiconductor.
Market Segmentation
By Company
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering
Segment by Type
Fully Automatic
Semi-automatic
Segment by Application
Semiconductor Wafer
Solar Cells
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Laser Grooving Equipment for Semiconductor manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Laser Grooving Equipment for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Laser Grooving Equipment for Semiconductor in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index