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MEMS Packaging-Global Market Insights and Sales Trends 2025
Synopsis
MEMS Packaging is a method of protecting microelectromechanical system (MEMS) devices from the environment by means of physical enclosures.
The global MEMS Packaging market size is expected to reach US$ 85640 million by 2029, growing at a CAGR of 10.1% from 2023 to 2029. The market is mainly driven by the significant applications of MEMS Packaging in various end use industries. The expanding demands from the Automotive, Mobile Phones, Consumer Electronics and Medical Systems, are propelling MEMS Packaging market. Inertial Sensors Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Optical Sensors Packaging segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for MEMS Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global MEMS Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global MEMS Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, MEMS Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of MEMS Packaging covered in this report include ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., Texas Instruments Incorporated., Taiwan Semiconductor Manufacturing Company Limited, MEMSCAP and Orbotech Ltd., etc.
The global MEMS Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ChipMos Technologies Inc.
AAC Technologies Holdings Inc.
Bosch Sensortec GmbH
Infineon Technologies AG
Analog Devices, Inc.
Texas Instruments Incorporated.
Taiwan Semiconductor Manufacturing Company Limited
MEMSCAP
Orbotech Ltd.
TDK Corporation
Global MEMS Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global MEMS Packaging market, Segment by Type:
Inertial Sensors Packaging
Optical Sensors Packaging
Environmental Sensors Packaging
Ultrasonic Sensors Packaging
Others
Global MEMS Packaging market, by Application
Automotive
Mobile Phones
Consumer Electronics
Medical Systems
Industrial
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of MEMS Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
MEMS Packaging is a method of protecting microelectromechanical system (MEMS) devices from the environment by means of physical enclosures.
The global MEMS Packaging market size is expected to reach US$ 85640 million by 2029, growing at a CAGR of 10.1% from 2023 to 2029. The market is mainly driven by the significant applications of MEMS Packaging in various end use industries. The expanding demands from the Automotive, Mobile Phones, Consumer Electronics and Medical Systems, are propelling MEMS Packaging market. Inertial Sensors Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Optical Sensors Packaging segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for MEMS Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global MEMS Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global MEMS Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, MEMS Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of MEMS Packaging covered in this report include ChipMos Technologies Inc., AAC Technologies Holdings Inc., Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., Texas Instruments Incorporated., Taiwan Semiconductor Manufacturing Company Limited, MEMSCAP and Orbotech Ltd., etc.
The global MEMS Packaging market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
ChipMos Technologies Inc.
AAC Technologies Holdings Inc.
Bosch Sensortec GmbH
Infineon Technologies AG
Analog Devices, Inc.
Texas Instruments Incorporated.
Taiwan Semiconductor Manufacturing Company Limited
MEMSCAP
Orbotech Ltd.
TDK Corporation
Global MEMS Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global MEMS Packaging market, Segment by Type:
Inertial Sensors Packaging
Optical Sensors Packaging
Environmental Sensors Packaging
Ultrasonic Sensors Packaging
Others
Global MEMS Packaging market, by Application
Automotive
Mobile Phones
Consumer Electronics
Medical Systems
Industrial
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of MEMS Packaging companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of MEMS Packaging
1.1 MEMS Packaging Market Overview
1.1.1 MEMS Packaging Product Scope
1.1.2 MEMS Packaging Market Status and Outlook
1.2 Global MEMS Packaging Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global MEMS Packaging Market Size by Region (2018-2029)
1.4 Global MEMS Packaging Historic Market Size by Region (2018-2023)
1.5 Global MEMS Packaging Market Size Forecast by Region (2024-2029)
1.6 Key Regions, MEMS Packaging Market Size (2018-2029)
1.6.1 North America MEMS Packaging Market Size (2018-2029)
1.6.2 Europe MEMS Packaging Market Size (2018-2029)
1.6.3 Asia-Pacific MEMS Packaging Market Size (2018-2029)
1.6.4 Latin America MEMS Packaging Market Size (2018-2029)
1.6.5 Middle East & Africa MEMS Packaging Market Size (2018-2029)
2 MEMS Packaging Market by Type
2.1 Introduction
2.1.1 Inertial Sensors Packaging
2.1.2 Optical Sensors Packaging
2.1.3 Environmental Sensors Packaging
2.1.4 Ultrasonic Sensors Packaging
2.1.5 Others
2.2 Global MEMS Packaging Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global MEMS Packaging Historic Market Size by Type (2018-2023)
2.2.2 Global MEMS Packaging Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America MEMS Packaging Revenue Breakdown by Type (2018-2029)
2.3.2 Europe MEMS Packaging Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific MEMS Packaging Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America MEMS Packaging Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa MEMS Packaging Revenue Breakdown by Type (2018-2029)
3 MEMS Packaging Market Overview by Application
3.1 Introduction
3.1.1 Automotive
3.1.2 Mobile Phones
3.1.3 Consumer Electronics
3.1.4 Medical Systems
3.1.5 Industrial
3.1.6 Others
3.2 Global MEMS Packaging Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global MEMS Packaging Historic Market Size by Application (2018-2023)
3.2.2 Global MEMS Packaging Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America MEMS Packaging Revenue Breakdown by Application (2018-2029)
3.3.2 Europe MEMS Packaging Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific MEMS Packaging Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America MEMS Packaging Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa MEMS Packaging Revenue Breakdown by Application (2018-2029)
4 MEMS Packaging Competition Analysis by Players
4.1 Global MEMS Packaging Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in MEMS Packaging as of 2022)
4.3 Date of Key Players Enter into MEMS Packaging Market
4.4 Global Top Players MEMS Packaging Headquarters and Area Served
4.5 Key Players MEMS Packaging Product Solution and Service
4.6 Competitive Status
4.6.1 MEMS Packaging Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 ChipMos Technologies Inc.
5.1.1 ChipMos Technologies Inc. Profile
5.1.2 ChipMos Technologies Inc. Main Business
5.1.3 ChipMos Technologies Inc. MEMS Packaging Products, Services and Solutions
5.1.4 ChipMos Technologies Inc. MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.1.5 ChipMos Technologies Inc. Recent Developments
5.2 AAC Technologies Holdings Inc.
5.2.1 AAC Technologies Holdings Inc. Profile
5.2.2 AAC Technologies Holdings Inc. Main Business
5.2.3 AAC Technologies Holdings Inc. MEMS Packaging Products, Services and Solutions
5.2.4 AAC Technologies Holdings Inc. MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.2.5 AAC Technologies Holdings Inc. Recent Developments
5.3 Bosch Sensortec GmbH
5.3.1 Bosch Sensortec GmbH Profile
5.3.2 Bosch Sensortec GmbH Main Business
5.3.3 Bosch Sensortec GmbH MEMS Packaging Products, Services and Solutions
5.3.4 Bosch Sensortec GmbH MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.3.5 Infineon Technologies AG Recent Developments
5.4 Infineon Technologies AG
5.4.1 Infineon Technologies AG Profile
5.4.2 Infineon Technologies AG Main Business
5.4.3 Infineon Technologies AG MEMS Packaging Products, Services and Solutions
5.4.4 Infineon Technologies AG MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.4.5 Infineon Technologies AG Recent Developments
5.5 Analog Devices, Inc.
5.5.1 Analog Devices, Inc. Profile
5.5.2 Analog Devices, Inc. Main Business
5.5.3 Analog Devices, Inc. MEMS Packaging Products, Services and Solutions
5.5.4 Analog Devices, Inc. MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.5.5 Analog Devices, Inc. Recent Developments
5.6 Texas Instruments Incorporated.
5.6.1 Texas Instruments Incorporated. Profile
5.6.2 Texas Instruments Incorporated. Main Business
5.6.3 Texas Instruments Incorporated. MEMS Packaging Products, Services and Solutions
5.6.4 Texas Instruments Incorporated. MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.6.5 Texas Instruments Incorporated. Recent Developments
5.7 Taiwan Semiconductor Manufacturing Company Limited
5.7.1 Taiwan Semiconductor Manufacturing Company Limited Profile
5.7.2 Taiwan Semiconductor Manufacturing Company Limited Main Business
5.7.3 Taiwan Semiconductor Manufacturing Company Limited MEMS Packaging Products, Services and Solutions
5.7.4 Taiwan Semiconductor Manufacturing Company Limited MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.7.5 Taiwan Semiconductor Manufacturing Company Limited Recent Developments
5.8 MEMSCAP
5.8.1 MEMSCAP Profile
5.8.2 MEMSCAP Main Business
5.8.3 MEMSCAP MEMS Packaging Products, Services and Solutions
5.8.4 MEMSCAP MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.8.5 MEMSCAP Recent Developments
5.9 Orbotech Ltd.
5.9.1 Orbotech Ltd. Profile
5.9.2 Orbotech Ltd. Main Business
5.9.3 Orbotech Ltd. MEMS Packaging Products, Services and Solutions
5.9.4 Orbotech Ltd. MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.9.5 Orbotech Ltd. Recent Developments
5.10 TDK Corporation
5.10.1 TDK Corporation Profile
5.10.2 TDK Corporation Main Business
5.10.3 TDK Corporation MEMS Packaging Products, Services and Solutions
5.10.4 TDK Corporation MEMS Packaging Revenue (US$ Million) & (2018-2023)
5.10.5 TDK Corporation Recent Developments
6 North America
6.1 North America MEMS Packaging Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe MEMS Packaging Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific MEMS Packaging Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America MEMS Packaging Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa MEMS Packaging Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 MEMS Packaging Market Dynamics
11.1 MEMS Packaging Industry Trends
11.2 MEMS Packaging Market Drivers
11.3 MEMS Packaging Market Challenges
11.4 MEMS Packaging Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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