The Market Reports

Synopsis
The global market for Metal and Hard Mask Etch System was estimated to be worth US$ 1616 million in 2024 and is forecast to a readjusted size of US$ 3689 million by 2031 with a CAGR of 12.7% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Metal and Hard Mask Etch System cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
An etch system shapes the thin film into a desired patterns using liquid chemicals, reaction gases or ion chemical reaction. An etch system is used in manufacturing lines for semiconductors and other electronic devices. This report mainly covers metal etch and hard mask etch system market.
North America have a larger market share which account for nearly 70%, followed by Japan and Asia-Pacific region. The world TOP 5 players in the Metal and Hard Mask Etch System market are Lam Research, Applied Materials, Hitachi High-tech, Tokyo Electron and Oxford Instruments, which account for more than 65% of the total market share.
Analysis of market driving factors
1. Technology node shrinkage and process upgrade
Demand background: As chip manufacturing processes advance to 3nm and below, traditional photoresist masks are difficult to meet the requirements of line width control (<10nm) and aspect ratio (>50:1).
Technology driver: Hard mask etching systems have become key supporting equipment for extreme ultraviolet lithography (EUV) and double patterning processes through high selectivity and plasma resistance.
2. Explosion of demand for 5G/AIoT and high-performance computing
Market demand: The demand for high-frequency and low-power chips in scenarios such as 5G base stations, AI accelerators, and autonomous driving has surged. Process requirements: Copper interconnect layer: Hard mask ensures the layout accuracy of copper wires and reduces resistance and signal delay. Low dielectric constant (Low-K) materials: Hard mask protects porous ultra-low K dielectrics from plasma damage.
3. Policy support and accelerated domestic substitution
Global policy: US CHIPS Act: Invest $52 billion to support local semiconductor manufacturing, including hard mask material research and development. EU Chip Act: The goal is to increase the share of European chip production capacity to 20% by 2030. China's domestic substitution: policy-driven: The second phase of the National Integrated Circuit Industry Investment Fund (Big Fund) focuses on supporting the localization of etching equipment.
4. Expansion of emerging application fields
Advanced packaging:
TSV (Through Silicon Via): Hard masks are used for high-density vertical interconnection to increase the communication bandwidth between chips.
Fan-Out packaging: Hard masks enable high-precision redistribution layer (RDL) etching.
Third-generation semiconductors:
SiC/GaN devices: Hard masks solve the problem of hard material etching and improve device withstand voltage and switching speed.
5. Industry chain integration and cost optimization
Vertical integration: Leading companies (such as Lam Research) cover the entire process from hard mask material development to etching equipment manufacturing, shortening the R&D cycle.
Cost reduction: Optimize etching parameters (such as power, pressure, gas flow) through AI, reduce consumables consumption, and reduce the cost of single wafers.
3. Market trends and prospects
Technical direction:
High-K hard mask: using materials such as HfO₂ to further reduce thickness to <10nm.
Self-assembled hard mask: using block copolymers to achieve line width control below 5nm.
AI-driven process: optimizing etching uniformity through machine learning and improving yield to more than 99%.
As the core equipment of semiconductor manufacturing, the market demand for metal and hard mask etching systems is jointly driven by the shrinking of technology nodes, the outbreak of 5G/AIoT, policy support and the expansion of emerging application fields. In the future, with the deep integration of industrial chain integration and AI technology, this field will develop in the direction of higher precision, lower cost and more intelligence, providing key support for the upgrading of the global semiconductor industry.
This report aims to provide a comprehensive presentation of the global market for Metal and Hard Mask Etch System, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Metal and Hard Mask Etch System by region & country, by Type, and by Application.
The Metal and Hard Mask Etch System market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Metal and Hard Mask Etch System.
Market Segmentation
By Company
Lam Research
Applied Materials
Hitachi High-tech
Tokyo Electron
Oxford Instruments
NAURA Technology Group
SPTS Technologies Ltd.
AMEC
Ulvac
Samco
Plasma Therm
Segment by Type
Silicon Etch Equipment
Dielectric Etch Equipment
Metal Etch Equipment
Hard Mask Etch Equipment
Segment by Application
Front End of Line (FEOL)
Back End of Line (BEOL)
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Metal and Hard Mask Etch System manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Metal and Hard Mask Etch System in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Metal and Hard Mask Etch System in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index