The Market Reports

Synopsis
The global market for MIS Substrate was estimated to be worth US$ 98 million in 2024 and is forecast to a readjusted size of US$ 227 million by 2031 with a CAGR of 12.2% during the forecast period 2025-2031.
MIS is the latest technology touted with the potential to replace traditional Lead-frame packages and BGA substrates. The use of build-up technology and breakaway from the conventional polymer core enables MIS technology to produce ultra fine-line/space capabilities.
Molded Interconnect Substrate (MIS) can be seen as a kind of pre-mold lead frame or coreless substrate, it can compatible with QFN,LGA ,BGA ,SIP packages and applicable widely in IC packaging Process such as WB,FC and SMT.
Currently the key players of MIS Substrates include Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS. PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates. The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.
In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.
Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.
This report aims to provide a comprehensive presentation of the global market for MIS Substrate, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of MIS Substrate by region & country, by Type, and by Application.
The MIS Substrate market size, estimations, and forecasts are provided in terms of sales volume (Million Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding MIS Substrate.
Market Segmentation
By Company
PPt
MiSpak Technology
QDOS
Segment by Type
Multi-layer MIS
Single-layer MIS
Segment by Application
Power IC
RF/5G
Fingerprint Sensor
OIS (Optical Image Stablization)
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of MIS Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of MIS Substrate in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of MIS Substrate in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index