The Market Reports

Synopsis

The global market for NEV IGBT Modules Heatsink was estimated to be worth US$ 313 million in 2024 and is forecast to a readjusted size of US$ 1245 million by 2031 with a CAGR of 22.1% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on NEV IGBT Modules Heatsink cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

NEV IGBT modules heatsink refers to a thermal management component specifically designed to dissipate the heat generated by IGBT (Insulated Gate Bipolar Transistor) modules used in New Energy Vehicles (NEVs). These heatsinks ensure the stable operation of power electronics such as inverters, DC-DC converters, and onboard chargers by effectively transferring heat away from the semiconductor junctions to maintain safe operating temperatures.

In new energy vehicles (NEVs), IGBT modules are widely adopted as core power devices in the powertrain system. Their efficient operation relies heavily on effective thermal management, with the heatsink playing a critical role in ensuring the reliability, longevity, and overall performance of the IGBT module and the vehicle.

Currently, mainstream IGBT heatsink substrates are mainly categorized into flat-base and pin-fin types. Flat-base heatsinks feature smooth surfaces, typically made from high-thermal-conductivity aluminum alloys or copper. These are attached to the IGBT module via press-fitting or bolts, ensuring close contact for efficient heat conduction.

Characterized by simple structure and low manufacturing cost, flat-base heatsinks are suitable for low thermal density applications, such as hybrid vehicle power modules and on-board chargers (OBCs).

In contrast, pin-fin heatsinks employ densely arranged metal pins or columns to enhance heat exchange through liquid or air cooling. They are particularly suited for high-current, high heat-flux scenarios. Key power components such as motor control units (MCUs), motor controllers, and main inverter systems typically use pin-fin structures combined with cold plates to achieve high-performance thermal dissipation.

From an application standpoint, these heatsinks are widely used in motor controllers (MCUs), DC/AC inverters, OBC charging modules, and DC/DC converters in battery electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). As NEVs evolve toward higher voltage and greater power output, IGBT modules are becoming increasingly integrated, imposing new demands on heatsinks for lightweight construction, compact design, and efficient thermal conductivity.

Looking ahead, with SiC devices gradually replacing traditional IGBTs, further improvements in thermal resistance control and structural compatibility are expected. This will drive the broader adoption of liquid cooling and hybrid cooling technologies in NEVs. As the demand for high-voltage, high-frequency, and high-power-density IGBT modules continues to rise, modular and integrated heatsink designs are becoming the trend, advancing toward lightweight, highly integrated structures with multi-channel flow paths.

This report aims to provide a comprehensive presentation of the global market for NEV IGBT Modules Heatsink, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of NEV IGBT Modules Heatsink by region & country, by Type, and by Application.

The NEV IGBT Modules Heatsink market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding NEV IGBT Modules Heatsink.

Market Segmentation

By Company

• Jentech Precision Industrial
• Amulaire Thermal Tech
• Semikron
• Dana
• Miba Group
• Wieland Microcool
• Advanced Thermal Solutions
• Senior Flexonics
• HuangShan Googe
• Kunshan Gootage Thermal Technology
• Zhejiang Panyoo Technology
• Heatsink Advanced Materials

Segment by Type

• Flat-base Heat Sink
• Pin-fin Heat Sink

Segment by Application

• EV
• HEV

Segment by Region

• North America: United States, Canada, and Mexico
• Europe: United Kingdom, Germany, France, Spain, Italy, and Rest of Europe
• Asia Pacific: China, India, Japan, Australia, South Korea, and Rest of Asia Pacific
• Middle East & Africa: Saudi Arabia, South Africa, and Rest of MEA
• Latin America: Brazil, Argentina, and Rest of Latin America

*If you need a regional or country-specific version, or customized segmentation, we can tailor the report to your requirements.