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Semiconductor Assembly and Packaging Services-Global Market Insights and Sales Trends 2025
Synopsis
Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.
The global Semiconductor Assembly and Packaging Services market size is expected to reach US$ 8553.4 million by 2029, growing at a CAGR of 4.1% from 2023 to 2029. The market is mainly driven by the significant applications of Semiconductor Assembly and Packaging Services in various end use industries. The expanding demands from the Telecommunications, Automotive, Aerospace and Defense and Medical Devices, are propelling Semiconductor Assembly and Packaging Services market. Assembly Services, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Packaging Services segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Semiconductor Assembly and Packaging Services, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Semiconductor Assembly and Packaging Services market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Semiconductor Assembly and Packaging Services market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Semiconductor Assembly and Packaging Services sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Semiconductor Assembly and Packaging Services covered in this report include Advanced Semiconductor Engineering (ASE), Amkor Technology, Intel, Samsung Electronics, SPIL and TSMC, etc.
The global Semiconductor Assembly and Packaging Services market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Intel
Samsung Electronics
SPIL
TSMC
Global Semiconductor Assembly and Packaging Services market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Assembly and Packaging Services market, Segment by Type:
Assembly Services
Packaging Services
Global Semiconductor Assembly and Packaging Services market, by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Semiconductor Assembly and Packaging Services companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.
The global Semiconductor Assembly and Packaging Services market size is expected to reach US$ 8553.4 million by 2029, growing at a CAGR of 4.1% from 2023 to 2029. The market is mainly driven by the significant applications of Semiconductor Assembly and Packaging Services in various end use industries. The expanding demands from the Telecommunications, Automotive, Aerospace and Defense and Medical Devices, are propelling Semiconductor Assembly and Packaging Services market. Assembly Services, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Packaging Services segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Semiconductor Assembly and Packaging Services, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Semiconductor Assembly and Packaging Services market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Semiconductor Assembly and Packaging Services market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Semiconductor Assembly and Packaging Services sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Semiconductor Assembly and Packaging Services covered in this report include Advanced Semiconductor Engineering (ASE), Amkor Technology, Intel, Samsung Electronics, SPIL and TSMC, etc.
The global Semiconductor Assembly and Packaging Services market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Advanced Semiconductor Engineering (ASE)
Amkor Technology
Intel
Samsung Electronics
SPIL
TSMC
Global Semiconductor Assembly and Packaging Services market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Assembly and Packaging Services market, Segment by Type:
Assembly Services
Packaging Services
Global Semiconductor Assembly and Packaging Services market, by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Semiconductor Assembly and Packaging Services companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Semiconductor Assembly and Packaging Services
1.1 Semiconductor Assembly and Packaging Services Market Overview
1.1.1 Semiconductor Assembly and Packaging Services Product Scope
1.1.2 Semiconductor Assembly and Packaging Services Market Status and Outlook
1.2 Global Semiconductor Assembly and Packaging Services Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Semiconductor Assembly and Packaging Services Market Size by Region (2018-2029)
1.4 Global Semiconductor Assembly and Packaging Services Historic Market Size by Region (2018-2023)
1.5 Global Semiconductor Assembly and Packaging Services Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Semiconductor Assembly and Packaging Services Market Size (2018-2029)
1.6.1 North America Semiconductor Assembly and Packaging Services Market Size (2018-2029)
1.6.2 Europe Semiconductor Assembly and Packaging Services Market Size (2018-2029)
1.6.3 Asia-Pacific Semiconductor Assembly and Packaging Services Market Size (2018-2029)
1.6.4 Latin America Semiconductor Assembly and Packaging Services Market Size (2018-2029)
1.6.5 Middle East & Africa Semiconductor Assembly and Packaging Services Market Size (2018-2029)
2 Semiconductor Assembly and Packaging Services Market by Type
2.1 Introduction
2.1.1 Assembly Services
2.1.2 Packaging Services
2.2 Global Semiconductor Assembly and Packaging Services Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Semiconductor Assembly and Packaging Services Historic Market Size by Type (2018-2023)
2.2.2 Global Semiconductor Assembly and Packaging Services Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Semiconductor Assembly and Packaging Services Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Semiconductor Assembly and Packaging Services Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Semiconductor Assembly and Packaging Services Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Semiconductor Assembly and Packaging Services Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Semiconductor Assembly and Packaging Services Revenue Breakdown by Type (2018-2029)
3 Semiconductor Assembly and Packaging Services Market Overview by Application
3.1 Introduction
3.1.1 Telecommunications
3.1.2 Automotive
3.1.3 Aerospace and Defense
3.1.4 Medical Devices
3.1.5 Consumer Electronics
3.1.6 Other
3.2 Global Semiconductor Assembly and Packaging Services Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Semiconductor Assembly and Packaging Services Historic Market Size by Application (2018-2023)
3.2.2 Global Semiconductor Assembly and Packaging Services Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Semiconductor Assembly and Packaging Services Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Semiconductor Assembly and Packaging Services Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Semiconductor Assembly and Packaging Services Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Semiconductor Assembly and Packaging Services Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Semiconductor Assembly and Packaging Services Revenue Breakdown by Application (2018-2029)
4 Semiconductor Assembly and Packaging Services Competition Analysis by Players
4.1 Global Semiconductor Assembly and Packaging Services Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Assembly and Packaging Services as of 2022)
4.3 Date of Key Players Enter into Semiconductor Assembly and Packaging Services Market
4.4 Global Top Players Semiconductor Assembly and Packaging Services Headquarters and Area Served
4.5 Key Players Semiconductor Assembly and Packaging Services Product Solution and Service
4.6 Competitive Status
4.6.1 Semiconductor Assembly and Packaging Services Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Advanced Semiconductor Engineering (ASE)
5.1.1 Advanced Semiconductor Engineering (ASE) Profile
5.1.2 Advanced Semiconductor Engineering (ASE) Main Business
5.1.3 Advanced Semiconductor Engineering (ASE) Semiconductor Assembly and Packaging Services Products, Services and Solutions
5.1.4 Advanced Semiconductor Engineering (ASE) Semiconductor Assembly and Packaging Services Revenue (US$ Million) & (2018-2023)
5.1.5 Advanced Semiconductor Engineering (ASE) Recent Developments
5.2 Amkor Technology
5.2.1 Amkor Technology Profile
5.2.2 Amkor Technology Main Business
5.2.3 Amkor Technology Semiconductor Assembly and Packaging Services Products, Services and Solutions
5.2.4 Amkor Technology Semiconductor Assembly and Packaging Services Revenue (US$ Million) & (2018-2023)
5.2.5 Amkor Technology Recent Developments
5.3 Intel
5.3.1 Intel Profile
5.3.2 Intel Main Business
5.3.3 Intel Semiconductor Assembly and Packaging Services Products, Services and Solutions
5.3.4 Intel Semiconductor Assembly and Packaging Services Revenue (US$ Million) & (2018-2023)
5.3.5 Samsung Electronics Recent Developments
5.4 Samsung Electronics
5.4.1 Samsung Electronics Profile
5.4.2 Samsung Electronics Main Business
5.4.3 Samsung Electronics Semiconductor Assembly and Packaging Services Products, Services and Solutions
5.4.4 Samsung Electronics Semiconductor Assembly and Packaging Services Revenue (US$ Million) & (2018-2023)
5.4.5 Samsung Electronics Recent Developments
5.5 SPIL
5.5.1 SPIL Profile
5.5.2 SPIL Main Business
5.5.3 SPIL Semiconductor Assembly and Packaging Services Products, Services and Solutions
5.5.4 SPIL Semiconductor Assembly and Packaging Services Revenue (US$ Million) & (2018-2023)
5.5.5 SPIL Recent Developments
5.6 TSMC
5.6.1 TSMC Profile
5.6.2 TSMC Main Business
5.6.3 TSMC Semiconductor Assembly and Packaging Services Products, Services and Solutions
5.6.4 TSMC Semiconductor Assembly and Packaging Services Revenue (US$ Million) & (2018-2023)
5.6.5 TSMC Recent Developments
6 North America
6.1 North America Semiconductor Assembly and Packaging Services Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Semiconductor Assembly and Packaging Services Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor Assembly and Packaging Services Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Semiconductor Assembly and Packaging Services Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor Assembly and Packaging Services Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Semiconductor Assembly and Packaging Services Market Dynamics
11.1 Semiconductor Assembly and Packaging Services Industry Trends
11.2 Semiconductor Assembly and Packaging Services Market Drivers
11.3 Semiconductor Assembly and Packaging Services Market Challenges
11.4 Semiconductor Assembly and Packaging Services Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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