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Semiconductor Chip Packaging-Global Market Insights and Sales Trends 2025
Synopsis
The global Semiconductor Chip Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Semiconductor Chip Packaging in various end use industries. The expanding demands from the Telecommunications, Automotive, Aerospace and Defense and Medical Devices, are propelling Semiconductor Chip Packaging market. Fan-Out Wafer-Level Packaging (FO WLP), one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Fan-In Wafer-Level Packaging (FI WLP) segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Semiconductor Chip Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Semiconductor Chip Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Semiconductor Chip Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Semiconductor Chip Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Semiconductor Chip Packaging covered in this report include Applied Materials, ASM Pacific Technology, Kulicke & Soffa Industries, TEL and Tokyo Seimitsu, etc.
The global Semiconductor Chip Packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
Global Semiconductor Chip Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Chip Packaging market, Segment by Type:
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Global Semiconductor Chip Packaging market, by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Semiconductor Chip Packaging manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Semiconductor Chip Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Semiconductor Chip Packaging market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Semiconductor Chip Packaging in various end use industries. The expanding demands from the Telecommunications, Automotive, Aerospace and Defense and Medical Devices, are propelling Semiconductor Chip Packaging market. Fan-Out Wafer-Level Packaging (FO WLP), one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Fan-In Wafer-Level Packaging (FI WLP) segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Semiconductor Chip Packaging, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Semiconductor Chip Packaging market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Semiconductor Chip Packaging market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Semiconductor Chip Packaging sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Semiconductor Chip Packaging covered in this report include Applied Materials, ASM Pacific Technology, Kulicke & Soffa Industries, TEL and Tokyo Seimitsu, etc.
The global Semiconductor Chip Packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
Global Semiconductor Chip Packaging market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Chip Packaging market, Segment by Type:
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Global Semiconductor Chip Packaging market, by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Semiconductor Chip Packaging manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Semiconductor Chip Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Semiconductor Chip Packaging Market Overview
1.1 Semiconductor Chip Packaging Product Overview
1.2 Semiconductor Chip Packaging Market Segment by Type
1.2.1 Fan-Out Wafer-Level Packaging (FO WLP)
1.2.2 Fan-In Wafer-Level Packaging (FI WLP)
1.2.3 Flip Chip (FC)
1.2.4 2.5D/3D
1.3 Global Semiconductor Chip Packaging Market Size by Type
1.3.1 Global Semiconductor Chip Packaging Market Size Overview by Type (2018-2029)
1.3.2 Global Semiconductor Chip Packaging Historic Market Size Review by Type (2018-2023)
1.3.3 Global Semiconductor Chip Packaging Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Semiconductor Chip Packaging Sales Breakdown by Type (2018-2023)
1.4.2 Europe Semiconductor Chip Packaging Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Semiconductor Chip Packaging Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Semiconductor Chip Packaging Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Semiconductor Chip Packaging Sales Breakdown by Type (2018-2023)
2 Global Semiconductor Chip Packaging Market Competition by Company
2.1 Global Top Players by Semiconductor Chip Packaging Sales (2018-2023)
2.2 Global Top Players by Semiconductor Chip Packaging Revenue (2018-2023)
2.3 Global Top Players by Semiconductor Chip Packaging Price (2018-2023)
2.4 Global Top Manufacturers Semiconductor Chip Packaging Manufacturing Base Distribution, Sales Area, Product Type
2.5 Semiconductor Chip Packaging Market Competitive Situation and Trends
2.5.1 Semiconductor Chip Packaging Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Semiconductor Chip Packaging Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Chip Packaging as of 2022)
2.7 Date of Key Manufacturers Enter into Semiconductor Chip Packaging Market
2.8 Key Manufacturers Semiconductor Chip Packaging Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Semiconductor Chip Packaging Status and Outlook by Region
3.1 Global Semiconductor Chip Packaging Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Chip Packaging Historic Market Size by Region
3.2.1 Global Semiconductor Chip Packaging Sales in Volume by Region (2018-2023)
3.2.2 Global Semiconductor Chip Packaging Sales in Value by Region (2018-2023)
3.2.3 Global Semiconductor Chip Packaging Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Semiconductor Chip Packaging Forecasted Market Size by Region
3.3.1 Global Semiconductor Chip Packaging Sales in Volume by Region (2024-2029)
3.3.2 Global Semiconductor Chip Packaging Sales in Value by Region (2024-2029)
3.3.3 Global Semiconductor Chip Packaging Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Semiconductor Chip Packaging by Application
4.1 Semiconductor Chip Packaging Market Segment by Application
4.1.1 Telecommunications
4.1.2 Automotive
4.1.3 Aerospace and Defense
4.1.4 Medical Devices
4.1.5 Consumer Electronics
4.1.6 Other
4.2 Global Semiconductor Chip Packaging Market Size by Application
4.2.1 Global Semiconductor Chip Packaging Market Size Overview by Application (2018-2029)
4.2.2 Global Semiconductor Chip Packaging Historic Market Size Review by Application (2018-2023)
4.2.3 Global Semiconductor Chip Packaging Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Semiconductor Chip Packaging Sales Breakdown by Application (2018-2023)
4.3.2 Europe Semiconductor Chip Packaging Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Semiconductor Chip Packaging Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Semiconductor Chip Packaging Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Semiconductor Chip Packaging Sales Breakdown by Application (2018-2023)
5 North America Semiconductor Chip Packaging by Country
5.1 North America Semiconductor Chip Packaging Historic Market Size by Country
5.1.1 North America Semiconductor Chip Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Semiconductor Chip Packaging Sales in Volume by Country (2018-2023)
5.1.3 North America Semiconductor Chip Packaging Sales in Value by Country (2018-2023)
5.2 North America Semiconductor Chip Packaging Forecasted Market Size by Country
5.2.1 North America Semiconductor Chip Packaging Sales in Volume by Country (2024-2029)
5.2.2 North America Semiconductor Chip Packaging Sales in Value by Country (2024-2029)
6 Europe Semiconductor Chip Packaging by Country
6.1 Europe Semiconductor Chip Packaging Historic Market Size by Country
6.1.1 Europe Semiconductor Chip Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Semiconductor Chip Packaging Sales in Volume by Country (2018-2023)
6.1.3 Europe Semiconductor Chip Packaging Sales in Value by Country (2018-2023)
6.2 Europe Semiconductor Chip Packaging Forecasted Market Size by Country
6.2.1 Europe Semiconductor Chip Packaging Sales in Volume by Country (2024-2029)
6.2.2 Europe Semiconductor Chip Packaging Sales in Value by Country (2024-2029)
7 Asia-Pacific Semiconductor Chip Packaging by Region
7.1 Asia-Pacific Semiconductor Chip Packaging Historic Market Size by Region
7.1.1 Asia-Pacific Semiconductor Chip Packaging Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Semiconductor Chip Packaging Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Semiconductor Chip Packaging Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Semiconductor Chip Packaging Forecasted Market Size by Region
7.2.1 Asia-Pacific Semiconductor Chip Packaging Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Semiconductor Chip Packaging Sales in Value by Region (2024-2029)
8 Latin America Semiconductor Chip Packaging by Country
8.1 Latin America Semiconductor Chip Packaging Historic Market Size by Country
8.1.1 Latin America Semiconductor Chip Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Semiconductor Chip Packaging Sales in Volume by Country (2018-2023)
8.1.3 Latin America Semiconductor Chip Packaging Sales in Value by Country (2018-2023)
8.2 Latin America Semiconductor Chip Packaging Forecasted Market Size by Country
8.2.1 Latin America Semiconductor Chip Packaging Sales in Volume by Country (2024-2029)
8.2.2 Latin America Semiconductor Chip Packaging Sales in Value by Country (2024-2029)
9 Middle East and Africa Semiconductor Chip Packaging by Country
9.1 Middle East and Africa Semiconductor Chip Packaging Historic Market Size by Country
9.1.1 Middle East and Africa Semiconductor Chip Packaging Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Semiconductor Chip Packaging Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Semiconductor Chip Packaging Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Semiconductor Chip Packaging Forecasted Market Size by Country
9.2.1 Middle East and Africa Semiconductor Chip Packaging Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Semiconductor Chip Packaging Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Applied Materials
10.1.1 Applied Materials Company Information
10.1.2 Applied Materials Introduction and Business Overview
10.1.3 Applied Materials Semiconductor Chip Packaging Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Applied Materials Semiconductor Chip Packaging Products Offered
10.1.5 Applied Materials Recent Development
10.2 ASM Pacific Technology
10.2.1 ASM Pacific Technology Company Information
10.2.2 ASM Pacific Technology Introduction and Business Overview
10.2.3 ASM Pacific Technology Semiconductor Chip Packaging Sales, Revenue and Gross Margin (2018-2023)
10.2.4 ASM Pacific Technology Semiconductor Chip Packaging Products Offered
10.2.5 ASM Pacific Technology Recent Development
10.3 Kulicke & Soffa Industries
10.3.1 Kulicke & Soffa Industries Company Information
10.3.2 Kulicke & Soffa Industries Introduction and Business Overview
10.3.3 Kulicke & Soffa Industries Semiconductor Chip Packaging Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Kulicke & Soffa Industries Semiconductor Chip Packaging Products Offered
10.3.5 Kulicke & Soffa Industries Recent Development
10.4 TEL
10.4.1 TEL Company Information
10.4.2 TEL Introduction and Business Overview
10.4.3 TEL Semiconductor Chip Packaging Sales, Revenue and Gross Margin (2018-2023)
10.4.4 TEL Semiconductor Chip Packaging Products Offered
10.4.5 TEL Recent Development
10.5 Tokyo Seimitsu
10.5.1 Tokyo Seimitsu Company Information
10.5.2 Tokyo Seimitsu Introduction and Business Overview
10.5.3 Tokyo Seimitsu Semiconductor Chip Packaging Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Tokyo Seimitsu Semiconductor Chip Packaging Products Offered
10.5.5 Tokyo Seimitsu Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Semiconductor Chip Packaging Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Semiconductor Chip Packaging Industrial Chain Analysis
11.4 Semiconductor Chip Packaging Market Dynamics
11.4.1 Semiconductor Chip Packaging Industry Trends
11.4.2 Semiconductor Chip Packaging Market Drivers
11.4.3 Semiconductor Chip Packaging Market Challenges
11.4.4 Semiconductor Chip Packaging Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Semiconductor Chip Packaging Distributors
12.3 Semiconductor Chip Packaging Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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