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Synopsis
Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.
The global Semiconductor Packaging Equipment market size is expected to reach US$ 9357.4 million by 2029, growing at a CAGR of 6.0% from 2023 to 2029. The market is mainly driven by the significant applications of Semiconductor Packaging Equipment in various end use industries. The expanding demands from the Manufacturer of Integrated Devices and Packaged Semiconductor Assembly, are propelling Semiconductor Packaging Equipment market. Chip Bonding Equipment, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Inspection and Cutting Equipment segment is estimated at % CAGR for the next seven-year period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Semiconductor Packaging Equipment, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Semiconductor Packaging Equipment market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Semiconductor Packaging Equipment market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Semiconductor Packaging Equipment sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Semiconductor Packaging Equipment covered in this report include Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, Tokyo Seimitsu, ChipMos, Greatek, Hua Hong and Jiangsu Changjiang Electronics Technology, etc.
The global Semiconductor Packaging Equipment market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
- Applied Materials
- ASM Pacific Technology
- Kulicke and Soffa Industries
- Tokyo Electron Limited
- Tokyo Seimitsu
- ChipMos
- Greatek
- Hua Hong
- Jiangsu Changjiang Electronics Technology
- Lingsen Precision
- Nepes
- Tianshui Huatian
- Unisem
- Veeco/CNT
Global Semiconductor Packaging Equipment market, by region:
- North America (U.S., Canada, Mexico)
- Europe (Germany, France, UK, Italy, etc.)
- Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
- South America (Brazil, etc.)
- Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Semiconductor Packaging Equipment market, Segment by Type:
- Chip Bonding Equipment
- Inspection and Cutting Equipment
- Packaging equipment
- Wire bonding equipment
- Electroplating equipment
- Other
Global Semiconductor Packaging Equipment market, by Application
- Manufacturer of Integrated Devices
- Packaged Semiconductor Assembly
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Semiconductor Packaging Equipment manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Semiconductor Packaging Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index
1 Semiconductor Packaging Equipment Market Overview
1.1 Semiconductor Packaging Equipment Product Overview
1.2 Semiconductor Packaging Equipment Market Segment by Type
1.2.1 Chip Bonding Equipment
1.2.2 Inspection and Cutting Equipment
1.2.3 Packaging equipment
1.2.4 Wire bonding equipment
1.2.5 Electroplating equipment
1.2.6 Other
1.3 Global Semiconductor Packaging Equipment Market Size by Type
1.3.1 Global Semiconductor Packaging Equipment Market Size Overview by Type (2018-2029)
1.3.2 Global Semiconductor Packaging Equipment Historic Market Size Review by Type (2018-2023)
1.3.3 Global Semiconductor Packaging Equipment Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Semiconductor Packaging Equipment Sales Breakdown by Type (2018-2023)
1.4.2 Europe Semiconductor Packaging Equipment Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Semiconductor Packaging Equipment Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Semiconductor Packaging Equipment Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Semiconductor Packaging Equipment Sales Breakdown by Type (2018-2023)
2 Global Semiconductor Packaging Equipment Market Competition by Company
2.1 Global Top Players by Semiconductor Packaging Equipment Sales (2018-2023)
2.2 Global Top Players by Semiconductor Packaging Equipment Revenue (2018-2023)
2.3 Global Top Players by Semiconductor Packaging Equipment Price (2018-2023)
2.4 Global Top Manufacturers Semiconductor Packaging Equipment Manufacturing Base Distribution, Sales Area, Product Type
2.5 Semiconductor Packaging Equipment Market Competitive Situation and Trends
2.5.1 Semiconductor Packaging Equipment Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Semiconductor Packaging Equipment Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Packaging Equipment as of 2022)
2.7 Date of Key Manufacturers Enter into Semiconductor Packaging Equipment Market
2.8 Key Manufacturers Semiconductor Packaging Equipment Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Semiconductor Packaging Equipment Status and Outlook by Region
3.1 Global Semiconductor Packaging Equipment Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Packaging Equipment Historic Market Size by Region
3.2.1 Global Semiconductor Packaging Equipment Sales in Volume by Region (2018-2023)
3.2.2 Global Semiconductor Packaging Equipment Sales in Value by Region (2018-2023)
3.2.3 Global Semiconductor Packaging Equipment Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Semiconductor Packaging Equipment Forecasted Market Size by Region
3.3.1 Global Semiconductor Packaging Equipment Sales in Volume by Region (2024-2029)
3.3.2 Global Semiconductor Packaging Equipment Sales in Value by Region (2024-2029)
3.3.3 Global Semiconductor Packaging Equipment Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Semiconductor Packaging Equipment by Application
4.1 Semiconductor Packaging Equipment Market Segment by Application
4.1.1 Manufacturer of Integrated Devices
4.1.2 Packaged Semiconductor Assembly
4.2 Global Semiconductor Packaging Equipment Market Size by Application
4.2.1 Global Semiconductor Packaging Equipment Market Size Overview by Application (2018-2029)
4.2.2 Global Semiconductor Packaging Equipment Historic Market Size Review by Application (2018-2023)
4.2.3 Global Semiconductor Packaging Equipment Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Semiconductor Packaging Equipment Sales Breakdown by Application (2018-2023)
4.3.2 Europe Semiconductor Packaging Equipment Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Semiconductor Packaging Equipment Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Semiconductor Packaging Equipment Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Semiconductor Packaging Equipment Sales Breakdown by Application (2018-2023)
5 North America Semiconductor Packaging Equipment by Country
5.1 North America Semiconductor Packaging Equipment Historic Market Size by Country
5.1.1 North America Semiconductor Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Semiconductor Packaging Equipment Sales in Volume by Country (2018-2023)
5.1.3 North America Semiconductor Packaging Equipment Sales in Value by Country (2018-2023)
5.2 North America Semiconductor Packaging Equipment Forecasted Market Size by Country
5.2.1 North America Semiconductor Packaging Equipment Sales in Volume by Country (2024-2029)
5.2.2 North America Semiconductor Packaging Equipment Sales in Value by Country (2024-2029)
6 Europe Semiconductor Packaging Equipment by Country
6.1 Europe Semiconductor Packaging Equipment Historic Market Size by Country
6.1.1 Europe Semiconductor Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Semiconductor Packaging Equipment Sales in Volume by Country (2018-2023)
6.1.3 Europe Semiconductor Packaging Equipment Sales in Value by Country (2018-2023)
6.2 Europe Semiconductor Packaging Equipment Forecasted Market Size by Country
6.2.1 Europe Semiconductor Packaging Equipment Sales in Volume by Country (2024-2029)
6.2.2 Europe Semiconductor Packaging Equipment Sales in Value by Country (2024-2029)
7 Asia-Pacific Semiconductor Packaging Equipment by Region
7.1 Asia-Pacific Semiconductor Packaging Equipment Historic Market Size by Region
7.1.1 Asia-Pacific Semiconductor Packaging Equipment Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Semiconductor Packaging Equipment Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Semiconductor Packaging Equipment Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Semiconductor Packaging Equipment Forecasted Market Size by Region
7.2.1 Asia-Pacific Semiconductor Packaging Equipment Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Semiconductor Packaging Equipment Sales in Value by Region (2024-2029)
8 Latin America Semiconductor Packaging Equipment by Country
8.1 Latin America Semiconductor Packaging Equipment Historic Market Size by Country
8.1.1 Latin America Semiconductor Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Semiconductor Packaging Equipment Sales in Volume by Country (2018-2023)
8.1.3 Latin America Semiconductor Packaging Equipment Sales in Value by Country (2018-2023)
8.2 Latin America Semiconductor Packaging Equipment Forecasted Market Size by Country
8.2.1 Latin America Semiconductor Packaging Equipment Sales in Volume by Country (2024-2029)
8.2.2 Latin America Semiconductor Packaging Equipment Sales in Value by Country (2024-2029)
9 Middle East and Africa Semiconductor Packaging Equipment by Country
9.1 Middle East and Africa Semiconductor Packaging Equipment Historic Market Size by Country
9.1.1 Middle East and Africa Semiconductor Packaging Equipment Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Semiconductor Packaging Equipment Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Semiconductor Packaging Equipment Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Semiconductor Packaging Equipment Forecasted Market Size by Country
9.2.1 Middle East and Africa Semiconductor Packaging Equipment Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Semiconductor Packaging Equipment Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Applied Materials
10.1.1 Applied Materials Company Information
10.1.2 Applied Materials Introduction and Business Overview
10.1.3 Applied Materials Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Applied Materials Semiconductor Packaging Equipment Products Offered
10.1.5 Applied Materials Recent Development
10.2 ASM Pacific Technology
10.2.1 ASM Pacific Technology Company Information
10.2.2 ASM Pacific Technology Introduction and Business Overview
10.2.3 ASM Pacific Technology Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.2.4 ASM Pacific Technology Semiconductor Packaging Equipment Products Offered
10.2.5 ASM Pacific Technology Recent Development
10.3 Kulicke and Soffa Industries
10.3.1 Kulicke and Soffa Industries Company Information
10.3.2 Kulicke and Soffa Industries Introduction and Business Overview
10.3.3 Kulicke and Soffa Industries Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Kulicke and Soffa Industries Semiconductor Packaging Equipment Products Offered
10.3.5 Kulicke and Soffa Industries Recent Development
10.4 Tokyo Electron Limited
10.4.1 Tokyo Electron Limited Company Information
10.4.2 Tokyo Electron Limited Introduction and Business Overview
10.4.3 Tokyo Electron Limited Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Tokyo Electron Limited Semiconductor Packaging Equipment Products Offered
10.4.5 Tokyo Electron Limited Recent Development
10.5 Tokyo Seimitsu
10.5.1 Tokyo Seimitsu Company Information
10.5.2 Tokyo Seimitsu Introduction and Business Overview
10.5.3 Tokyo Seimitsu Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Tokyo Seimitsu Semiconductor Packaging Equipment Products Offered
10.5.5 Tokyo Seimitsu Recent Development
10.6 ChipMos
10.6.1 ChipMos Company Information
10.6.2 ChipMos Introduction and Business Overview
10.6.3 ChipMos Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.6.4 ChipMos Semiconductor Packaging Equipment Products Offered
10.6.5 ChipMos Recent Development
10.7 Greatek
10.7.1 Greatek Company Information
10.7.2 Greatek Introduction and Business Overview
10.7.3 Greatek Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Greatek Semiconductor Packaging Equipment Products Offered
10.7.5 Greatek Recent Development
10.8 Hua Hong
10.8.1 Hua Hong Company Information
10.8.2 Hua Hong Introduction and Business Overview
10.8.3 Hua Hong Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Hua Hong Semiconductor Packaging Equipment Products Offered
10.8.5 Hua Hong Recent Development
10.9 Jiangsu Changjiang Electronics Technology
10.9.1 Jiangsu Changjiang Electronics Technology Company Information
10.9.2 Jiangsu Changjiang Electronics Technology Introduction and Business Overview
10.9.3 Jiangsu Changjiang Electronics Technology Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Jiangsu Changjiang Electronics Technology Semiconductor Packaging Equipment Products Offered
10.9.5 Jiangsu Changjiang Electronics Technology Recent Development
10.10 Lingsen Precision
10.10.1 Lingsen Precision Company Information
10.10.2 Lingsen Precision Introduction and Business Overview
10.10.3 Lingsen Precision Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Lingsen Precision Semiconductor Packaging Equipment Products Offered
10.10.5 Lingsen Precision Recent Development
10.11 Nepes
10.11.1 Nepes Company Information
10.11.2 Nepes Introduction and Business Overview
10.11.3 Nepes Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Nepes Semiconductor Packaging Equipment Products Offered
10.11.5 Nepes Recent Development
10.12 Tianshui Huatian
10.12.1 Tianshui Huatian Company Information
10.12.2 Tianshui Huatian Introduction and Business Overview
10.12.3 Tianshui Huatian Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.12.4 Tianshui Huatian Semiconductor Packaging Equipment Products Offered
10.12.5 Tianshui Huatian Recent Development
10.13 Unisem
10.13.1 Unisem Company Information
10.13.2 Unisem Introduction and Business Overview
10.13.3 Unisem Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.13.4 Unisem Semiconductor Packaging Equipment Products Offered
10.13.5 Unisem Recent Development
10.14 Veeco/CNT
10.14.1 Veeco/CNT Company Information
10.14.2 Veeco/CNT Introduction and Business Overview
10.14.3 Veeco/CNT Semiconductor Packaging Equipment Sales, Revenue and Gross Margin (2018-2023)
10.14.4 Veeco/CNT Semiconductor Packaging Equipment Products Offered
10.14.5 Veeco/CNT Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Semiconductor Packaging Equipment Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Semiconductor Packaging Equipment Industrial Chain Analysis
11.4 Semiconductor Packaging Equipment Market Dynamics
11.4.1 Semiconductor Packaging Equipment Industry Trends
11.4.2 Semiconductor Packaging Equipment Market Drivers
11.4.3 Semiconductor Packaging Equipment Market Challenges
11.4.4 Semiconductor Packaging Equipment Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Semiconductor Packaging Equipment Distributors
12.3 Semiconductor Packaging Equipment Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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