The Market Reports

Synopsis
The global market for SiC Wafer Thinning Equipment was estimated to be worth US$ 114 million in 2024 and is forecast to a readjusted size of US$ 338 million by 2031 with a CAGR of 17.1% during the forecast period 2025-2031.
Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
This report only studies Silicon Carbide Wafer Thinning Equipment.
The global SiC Wafer Thinning Equipment market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.
The global key manufacturers of SiC Wafer Thinning Equipment include Disco, TSD, etc. In 2023, the global top five players had a share approximately 81% in terms of revenue.
Among different types of SiC wafer thinning equipment, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.
Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.
Market Driving Factors
Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.
Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.
Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.
Market Restraints
Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.
Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.
Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.
This report aims to provide a comprehensive presentation of the global market for SiC Wafer Thinning Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of SiC Wafer Thinning Equipment by region & country, by Type, and by Application.
The SiC Wafer Thinning Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Thinning Equipment.
Market Segmentation
By Company
Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N
Segment by Type
Full-Automatic
Semi-Automatic
Segment by Application
6 Inch and Below
8 Inch and Above
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of SiC Wafer Thinning Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of SiC Wafer Thinning Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of SiC Wafer Thinning Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index