The Market Reports

Synopsis
The global market for Silver Sintering Paste was estimated to be worth US$ 186 million in 2024 and is forecast to a readjusted size of US$ 269 million by 2031 with a CAGR of 5.3% during the forecast period 2025-2031.
Silver Sintering Paste is a kind of high silver-filled die attach paste, which can achieve ultra-high thermal conductivity. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times. It can be applied to printing or dispensing processes, which can ensure higher thermal conductivity in lead frame and LED packaging applications. Silver Sintering Die-Attach Materials is mainly nano silver pastes, which is designed for die-attach bonding, especially for power semiconductors like SiC (Silicon Carbide) and GaN (Gallium Nitride). Nano silver pastes are gaining popularity as die-attach materials due to their ability to bond at low temperatures and their suitability for applications requiring high operating temperatures, where traditional solder materials may not be ideal.
Heraeus Electronics, Kyocera, Indium, Alpha Assembly Solutions, Namics, Henkel, Nihon Handa, Bando Chemical Industries, Advanced Joining Technology and NBE Tech are the key manufactures in the global Silver Sintering Paste market. Among them, Heraeus Electronics is the largest manufacturer, its revenue share of global market exceeds 32% in 2023. The market concentration is high, top five players accounted for about 82% of the world's revenue share.
Manufacturers of Silver Sintering Paste are mainly concentrated in North America, Japan and China. As China's influence in the global electronics manufacturing industry continues to grow, Chinese companies are also actively developing and promoting silver sintered materials, especially in high-growth areas such as electric vehicles and 5G communication equipment. Chinese manufacturers are gradually narrowing the technological gap with Japan. Companies in other countries (such as Germany) are also developing technology in this field, but their market share is relatively small.
This report aims to provide a comprehensive presentation of the global market for Silver Sintering Paste, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Silver Sintering Paste by region & country, by Type, and by Application.
The Silver Sintering Paste market size, estimations, and forecasts are provided in terms of sales volume (Kg) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Silver Sintering Paste.
Market Segmentation
By Company
Heraeus Electronics
Kyocera
Indium
Alpha Assembly Solutions
Henkel
Namics
Advanced Joining Technology
Shenzhen Facemoore Technology
TANAKA Precious Metals
Nihon Superior
Nihon Handa
NBE Tech
Sumitomo Bakelite
Celanese
Solderwell Advanced Materials
Guangzhou Xianyi Electronic Technology
ShareX (Zhejiang) New Material Technology
Bando Chemical Industries
Shenzhen Jufeng Solder
Segment by Type
Pressure Sintering
Pressure-less Sintering
Segment by Application
Power Semiconductor Device
RF Power Device
High Performance LED
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Silver Sintering Paste manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Silver Sintering Paste in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Silver Sintering Paste in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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